CN205692857U - A kind of LED light engine encapsulating structure - Google Patents
A kind of LED light engine encapsulating structure Download PDFInfo
- Publication number
- CN205692857U CN205692857U CN201620560676.0U CN201620560676U CN205692857U CN 205692857 U CN205692857 U CN 205692857U CN 201620560676 U CN201620560676 U CN 201620560676U CN 205692857 U CN205692857 U CN 205692857U
- Authority
- CN
- China
- Prior art keywords
- circuit
- conductive layer
- upper conductive
- circuit board
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED light engine encapsulating structure, including going to a grassroots level and multilayer circuit board；Multilayer circuit board includes conductive layer and insulating trip, and the upper surface gone to a grassroots level includes circuit region and is empty district, and circuit region is provided with underlying conductive circuit；Upper conductive layer, insulating trip, underlying conductive circuit and going to a grassroots level is sequentially connected with fixing from top to bottom；The position that multilayer circuit board is corresponding with being empty district is provided with the first through hole；Multilayer circuit board is provided with the second through hole；Upper conductive layer is provided with default device, presets device and is electrically connected with upper conductive layer, is provided with LED chip in the first through hole, and LED chip is electrically connected with Upper conductive circuit and/or underlying conductive circuit.The utility model has the advantage of and make the bilayer conductive line layer that a kind of thermoelectricity separates, change the high heat conduction of routine but only monolayer circuit, multilayer circuit board but the low drawback of heat conductivity.
Description
Technical field
This utility model relates to LED encapsulation structure field, particularly relates to a kind of LED light engine encapsulating structure.
Background technology
As conventional light source, semiconductor light-emitting-diode (LED) the most also can produce heat, and how much it depends on
In overall luminous efficiency.Power up outside under energy, the radiation recombination generation electroluminescent in electronics and hole, attached at PN junction
The light closely radiated also needs semiconductor medium and encapsulation medium through wafer itself just can arrive at the external world.Combination current injects
Efficiency, radioluminescence quantum efficiency, wafer exterior light extraction efficiency etc., the input electric energy of final general only 30%-40% turns
Turning to luminous energy, the form of the lattice vibration that the energy of remaining 60%-70% mainly occurs with non-radiative recombination converts heat energy, so
The heat dissipation problem how solving LED becomes the key technology of the LED making high reliability low light attenuation.
General, LED chip is with having the bonded adhesives hydropexis of high thermal conductivity on the line layer that thermoelectricity separates, focus
Separate line layer be usually aluminum/cuprio line layer or ceramic base line layer, be beneficial to LED chip produce heat quickly from
It is delivered on the heat-dissipating casing of light fixture in the circuit basic unit of high heat conduction.
LED light engine is that LED drive power and LED are integrated on one piece of line layer, and such technology changes
The LED having become traditional drives the drawback separated with LED.The photo engine technology of optoelectronic integration, eliminates heaviness, large
Big LED drives, and is beneficial to the ting model of light fixture, lightening design.
Floor role in photo engine LED product in LED line road is: on the one hand it has the circuit of electrical connection, permissible
Wire on mains current via line layer is input in LED drive power, and electric current exports through the process of LED drive power
The suitably wire on electric current via line layer is delivered in LED chip so that LED energy normal luminous；On the other hand
Line layer is that the heat that LED chip is produced is delivered on the aluminum matter heat-dissipating casing of light fixture, is finally dispersed in air.
At present the LED of most conventional is that luminescent device drives, with LED power, the technology separated because luminescent device with
It is to separate that LED power drives, and floor input in LED line road has been the electric current that outside drive processes is good.
But at the photo engine of integration, because there being LED drive power, it to be processed into applicable LED to the civil power of input
The electric current of luminescent device exports to luminescent device again.Because there being the electric current to civil power to process, relate to the conversion of electric current, typically
LED drive circuit complicated and changeable, and the LED monolayer line layer of routine can not meet demand, because the crossing one another of complexity
Wiring can destroy the normal work of LED drive power, so general LED drive power is to use 2 layers or above circuit
Layer, computer main board or cell phone mainboard that we are common are all 2 layers or the line layers of the above number of plies used.
2 functions of photo engine module: provide circuit to connect and transmission heat；Although what general thermoelectricity separated basic unit leads
Hot coefficient ＞ 25W/M.K, but the wiring board that general thermoelectricity separates only has a sandwich circuit layer, it is impossible to meet some needs cloth many
The complicated circuit of sandwich circuit；And energy of the prior art meets the heat conduction of multilayer circuit board of complicated circuit of needs multilayer wiring
Coefficient only only has 1.0W/M.K, here it is why on multilayer line mainboard CPU heater members must add fan and help
Heat radiation is.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of LED light engine encapsulating structure,
It can realize multilayer wiring, and has good heat conductivity.
In order to achieve the above object, the technical scheme that this utility model is used is as follows:
A kind of LED light engine encapsulating structure, including going to a grassroots level and multilayer circuit board；Multilayer circuit board include insulating trip and
Having the upper conductive layer of Upper conductive circuit, the upper surface gone to a grassroots level includes circuit region and is empty district, and circuit region is provided with lower floor
Conducting wire；Upper conductive layer, insulating trip, underlying conductive circuit and going to a grassroots level is sequentially connected with fixing from top to bottom；Multilayer circuit board
The position corresponding with being empty district is provided with and the first through hole being empty district's size and mate and sequentially pass through upper conductive layer and insulating trip；
Multilayer circuit board is provided with some connection underlying conductive circuits and sequentially passes through the second through hole of conductive layer and insulating trip；On lead
Electric layer is provided with default device, presets device and upper conductive layer and is electrically connected with, and is provided with LED chip in the first through hole, LED chip with
Upper conductive circuit and/or underlying conductive circuit are electrically connected with；It is provided with for connecting Upper conductive circuit in described second through hole
Connecting line with underlying conductive circuit.
As preferably, multilayer circuit board also includes that solder mask, described solder mask are covered on conductive layer.Solder mask is permissible
Conductive layer is made to avoid oxidized.
As preferably, in the second through hole, it is filled with insulant.Insulant is used for protecting connecting line.
As preferably, described connecting line is bonding line.
As preferably, going to a grassroots level as whiteware plate, underlying conductive circuit is the conductive silver paste of solidification.Whiteware plate can
To reduce the light absorbing LED, make LED light source brighter.
As preferably, upper conductive layer is the copper foil layer being etched with Upper conductive circuit.
Compared to existing technology, the beneficial effects of the utility model are:
Realize the bilayer conductive line layer structure that a kind of thermoelectricity separates, change the high heat conduction of routine but only single-layer wire
Road, multilayer circuit board but the low drawback of heat conductivity.
Accompanying drawing explanation
Fig. 1 is the generalized section of LED light engine encapsulating structure of the present utility model；
Fig. 2 is the top view gone to a grassroots level of the present utility model.
In figure: 01, go to a grassroots level；02, underlying conductive circuit；020, it is empty district；03, insulating trip；04, upper conductive layer；05, pre-
If device；06, LED chip；07, solder mask；08, connecting line；09, insulant；10, the second through hole；11, the first through hole.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, this utility model is described further:
A kind of LED light engine encapsulating structure, as it is shown in figure 1, include going to a grassroots level 01, multilayer circuit board, preset device 05 and
LED chip 06；Multilayer circuit board be fixed on go to a grassroots level 01 end face；Described 01 end face of going to a grassroots level is provided with underlying conductive circuit 02,
And at multilayer circuit board with go to a grassroots level between 01；
Described 01 ceramic wafer that can be but not limited to sinter, preferably whiteware plate of going to a grassroots level, whiteware plate
The light absorbing LED can be reduced, make LED light source brighter；Described underlying conductive circuit 02 can be but not limited to leading of solidification
Electro-hydraulic body, is preferably the conduction composite silver slurry of half solidification shape；Described conducting liquid toasts 12 by the temperature of more than 800 degrees Celsius
Hour it is solidified into underlying conductive circuit 02, and forms ceramic circuit-board；The thickness of described underlying conductive circuit 02 is 20um；Described
Going to a grassroots level 01 can also be aluminium lamination or layers of copper, and underlying conductive circuit 02 is printed on by etching goes to a grassroots level on 01.
Go to a grassroots level described in as in figure 2 it is shown, 01 upper surface include circuit region and be empty district 020, described underlying conductive circuit
02 is fixed on circuit region；The described district 020 that is empty is for circular or square.
Described multilayer circuit board includes solder mask 07, upper conductive layer 04 and the insulating trip 03 being sequentially connected with from top to bottom；Institute
State conductive layer 04 and the size of insulating trip 03 all with go to a grassroots level 01 identical；Described insulating trip 03 is at reinforcing material impregnating resin
The compound inslation film of reason, described reinforcing material can be but not limited to electronic glass-fiber cloth；Described insulating trip 03 has caking property；
Described insulating trip 03 thickness is 0.1mm-0.5mm.
Described upper conductive layer 04 can be but not limited to copper foil layer, preferably thickness more than the copper foil layer of 15um, described on
Upper conductive circuit it is etched with on conductive layer 04；Described solder mask 07 is covered on the district needing electric insulation on conductive layer 04
Territory, described solder mask 07 powers on Gold plated Layer for nickel dam, and described electroless nickel layer thickness is 03um, and described layer gold thickness is 0.1um, resistance
Layer 07 is used for avoiding conductive layer 04 oxidized.
Position corresponding with being empty district 020 on described multilayer circuit board is provided with and be empty that district 020 size is mated first
Through hole 11, described first through hole 11 sequentially passes through solder mask 07, upper conductive layer 04 and insulating trip 03；Presetting at multilayer circuit board
Position is provided with some second through holes 10, and described second through hole 10 sequentially passes through solder mask 07, upper conductive layer 04 and insulating trip 03,
Several second through holes 10 are looped around the first through hole 11 around；Described first through hole 11 is used for placing LED chip 06；Described
Two through holes 10 are used for connecting underlying conductive circuit 02；Described second through hole 10 is the manhole of diameter of 1 mm-3 mm.
Presetting device 05 and be arranged on the predeterminated position of conductive layer 04, LED chip 06 is located in the first through hole 11；LED core
Sheet 06 be fixed on go to a grassroots level 01 be empty district 020；Described default device 05 includes driving element；Described LED chip 06 is with default
Device 05 is all electrically connected with Upper conductive circuit；LED chip 06 is electrically connected with Upper conductive circuit；LED chip 06 is permissible
Circuit design according to concrete operations is optionally electrically connected with Upper conductive circuit and/or underlying conductive circuit 02；Described
It is provided with connecting line 08 in second through hole 10, is used for connecting Upper conductive circuit and underlying conductive circuit 02；Described first through hole 11
Inside it is provided with connecting line 08, is used for connecting LED chip 06 and Upper conductive circuit；Described connecting line 08 can be but not limited to bonding
Line.
Insulant 09 it is filled with, the insulant 09 connection in protection the second through hole 10 in described second through hole 10
Line 08；Described insulant 09 can be but not limited to silica gel.
Operationally, the heat that LED chip 06 is distributed when working is by 01 conduction of going to a grassroots level for LED light engine encapsulating structure
To outside.
This utility model utilizes the line layer technology of preparing of ceramic wafer and aluminum base/cuprio, makes the height that a kind of thermoelectricity separates
The bilayer conductive line layer of thermal conductivity, heat conductivity of the present utility model can reach 25W/M.k, than general 1.0W/M.K heat conduction
The bilayer conductive line layer of coefficient improves 25 times；This utility model combines the high heat conduction conduction technique of thermoelectricity split circuit layer
With the manufacturing technology of multilayer circuit board, change routine high heat conducting circuit layer but the most only monolayer circuit or multilayer line
The drawback of plate still low thermal conductive wire coefficient.
This utility model includes following features:
1) double-deck line construction makes the LED drive power wiring of complexity be possibly realized, and LED driver circuit will not be made to exist
Intersection conflict.
2) thermoelectricity isolating construction, LED is directly bonded on aluminium lamination/copper wire or lower floor's line layer of high thermal conductivity coefficient, can
It is delivered on the radiator of outside with the heat easily LED produced.
3) double-deck line layout structure, the wire laying mode of Multilayer vertical, solving monolayer line layer needs big circuit
Area.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various
Corresponding change and deformation, and all these change and deformation all should belong to the protection of this utility model claim
Within the scope of.
Claims (6)
1. a LED light engine encapsulating structure, it is characterised in that include going to a grassroots level and multilayer circuit board；Multilayer circuit board includes
Having the upper conductive layer of insulating trip and Upper conductive circuit, the upper surface gone to a grassroots level includes circuit region and is empty district, circuit region
It is provided with underlying conductive circuit；Upper conductive layer, insulating trip, underlying conductive circuit and going to a grassroots level is sequentially connected with fixing from top to bottom；
The position that multilayer circuit board is corresponding with being empty district is provided with and is empty district's size and mates and sequentially pass through upper conductive layer and insulating trip
The first through hole；Multilayer circuit board is provided with some connection underlying conductive circuits and sequentially passes through the of conductive layer and insulating trip
Two through holes；Upper conductive layer is provided with default device, presets device and is electrically connected with upper conductive layer, is provided with LED core in the first through hole
Sheet, LED chip is electrically connected with Upper conductive circuit and/or underlying conductive circuit；It is provided with for connecting in described second through hole
Upper conductive circuit and the connecting line of underlying conductive circuit.
2. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that multilayer circuit board also includes solder mask, institute
State solder mask to be located on conductive layer.
3. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that be filled with insulant in the second through hole.
4. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that described connecting line is bonding line.
5. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that going to a grassroots level as whiteware plate, lower floor leads
Electric line is the conductive silver paste of solidification.
6. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that upper conductive layer is for being etched with Upper conductive
The copper foil layer of circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620560676.0U CN205692857U (en) | 2016-06-08 | 2016-06-08 | A kind of LED light engine encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620560676.0U CN205692857U (en) | 2016-06-08 | 2016-06-08 | A kind of LED light engine encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205692857U true CN205692857U (en) | 2016-11-16 |
Family
ID=57428102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620560676.0U Active CN205692857U (en) | 2016-06-08 | 2016-06-08 | A kind of LED light engine encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205692857U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870301A (en) * | 2016-06-08 | 2016-08-17 | 广州硅能照明有限公司 | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof |
| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
-
2016
- 2016-06-08 CN CN201620560676.0U patent/CN205692857U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870301A (en) * | 2016-06-08 | 2016-08-17 | 广州硅能照明有限公司 | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof |
| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105870301A (en) | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof | |
| CN102800636B (en) | Electronic component package and manufacturing method thereof | |
| CN108882538A (en) | Circuit board and preparation method thereof | |
| US20110287563A1 (en) | Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader | |
| CN102907183A (en) | Film system for LED applications | |
| CN102779808B (en) | Integrated circuit package and packaging methods | |
| TWI297537B (en) | Embedded metal heat sink for semiconductor device and method for manufacturing the same | |
| CN205692857U (en) | A kind of LED light engine encapsulating structure | |
| CN104582250A (en) | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof | |
| WO2023142487A1 (en) | Packaging module and preparation method therefor, and electronic device | |
| TW201246581A (en) | Integrated semiconductor solar cell package | |
| CN102098870A (en) | Composite printed circuit board (PCB) and manufacturing method thereof | |
| CN102781164B (en) | Novel special circuit board for LED (light-emitting diode) lighting fixture | |
| CN1708848A (en) | Thermal-conductive substrate package | |
| CN201986260U (en) | Composite PCB | |
| CN117153798B (en) | Packaging structure of power module | |
| JP2012231061A (en) | Electronic component module and manufacturing method of the same | |
| WO2010006475A1 (en) | A ceramic packaging substrate for the high power led | |
| TW201037803A (en) | Multi-layer packaging substrate, method for making the packaging substrate, and package structure of light-emitting semiconductor | |
| CN205900586U (en) | Multilayer LED photo engine structure | |
| CN203707127U (en) | COB packaging structure with low thermal resistance and high luminous efficiency | |
| CN109148411A (en) | Heat-radiating substrate and preparation method thereof | |
| CN102368529A (en) | Packaging structure of light source of high power LED | |
| WO2019100446A1 (en) | Cob packaging for embedding thermal protection ic and packaging method thereof | |
| CN105472870B (en) | The electrical integrated module of compound PCB, LED light and its manufacture method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |