CN105870301A - LED (Light Emitting Diode) optical engine packaging structure and processing method thereof - Google Patents
LED (Light Emitting Diode) optical engine packaging structure and processing method thereof Download PDFInfo
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- CN105870301A CN105870301A CN201610408267.3A CN201610408267A CN105870301A CN 105870301 A CN105870301 A CN 105870301A CN 201610408267 A CN201610408267 A CN 201610408267A CN 105870301 A CN105870301 A CN 105870301A
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- 238000003672 processing method Methods 0.000 title abstract description 5
- 230000003287 optical effect Effects 0.000 title abstract 4
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 7
- 230000008023 solidification Effects 0.000 claims description 7
- 239000012779 reinforcing material Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910017435 S2 In Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 99
- 239000002356 single layer Substances 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 3
- 230000007547 defect Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000005619 thermoelectricity Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
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- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED (Light Emitting Diode) optical engine packaging structure and a processing method thereof. The LED optical engine packaging structure comprises a lower substrate and a multi-layer circuit board, wherein the multi-layer circuit board comprises upper conducting layers and insulating sheets; the upper surface of the lower substrate comprises a circuit zone and an empty zone; the circuit zone is provided with lower-layer conducting circuits; the upper conducting layers, the insulating sheets, the lower-layer conducting circuits and the lower substrate are sequentially connected and fixed from top to bottom; a first through hole is formed in a position where the multi-layer circuit board corresponds to the empty zone; second through holes are formed in the multi-layer circuit board; the upper conducting layers are provided with preset devices; the preset devices are electrically connected with the upper conducting layers; an LED chip is arranged in the first through hole; the LED chip is electrically connected with upper-layer conducting circuits and/or the lower-layer conducting circuits. The LED optical engine packaging structure and the processing method thereof, disclosed by the invention, have the advantages that a double-layer conducting circuit layer in heat and electricity separation is manufactured, and the defects of high heat conduction but with a single-layer circuit and a multi-layer circuit board but with a low heat conduction coefficient of a conventional conducting circuit layer are changed.
Description
Technical field
The present invention relates to LED encapsulation structure field, particularly relate to a kind of LED light engine encapsulation
Structure and processing method thereof.
Background technology
As conventional light source, semiconductor light-emitting-diode (LED) the most also can produce
Heat amount, how much it depends on the luminous efficiency of entirety.Power up outside under energy, electronics
With the radiation recombination generation electroluminescent in hole, the light radiated near PN junction also need through
Semiconductor medium and the encapsulation medium of crossing wafer itself just can arrive at the external world.Combination current injects effect
Rate, radioluminescence quantum efficiency, wafer exterior light extraction efficiency etc., final probably only have
The input electric energy of 30%-40% is converted into luminous energy, and the energy of remaining 60%-70% is mainly with non-spoke
The form of the lattice vibration penetrating compound generation converts heat energy, so how solves the heat radiation of LED
Problem becomes the key technology of the LED making high reliability low light attenuation.
General, LED chip is to divide at thermoelectricity with the bonded adhesives hydropexis with high thermal conductivity
From line layer on, focus separate line layer be usually aluminum/cuprio line layer or pottery baseline
Road floor, the heat being beneficial to LED chip generation is quickly uploaded from the circuit basic unit of high heat conduction
It is delivered on the heat-dissipating casing of light fixture.
LED light engine is that LED drive power and LED are integrated in one piece of circuit
On layer, such technology changes traditional LED and drives the fraud separated with LED
End.The photo engine technology of optoelectronic integration, eliminates heaviness, and very large LED drives, with
It is beneficial to the ting model of light fixture, lightening design.
Floor role in photo engine LED product in LED line road is: on the one hand it has electricity
The circuit that gas connects, so that the wire on mains current via line layer is input to LED and drives
On galvanic electricity source, electric current exports suitable electric current via line layer through the process of LED drive power
On wire be delivered in LED chip so that LED energy normal luminous；Another
Aspect line layer is the aluminum matter heat-dissipating casing that the heat that LED chip is produced is delivered to light fixture
On, finally it is dispersed in air.
The LED of most conventional is that luminescent device drives, with LED power, the skill separated at present
Art, separates because luminescent device drives with LED power, and LED line road floor just inputs
It it has been the electric current that outside drive processes is good.
But at the photo engine of integration, because there being LED drive power, it will be to input
Civil power is processed into the electric current of applicable LED and exports to luminescent device again.Because there have to be right
The electric current of civil power processes, and relates to the conversion of electric current, and general LED drive circuit is complicated
Changeable, and the LED monolayer line layer of routine can not meet demand, because complexity is mutual
The wiring intersected can destroy the normal work of LED drive power, so general LED drives
Power supply is to use 2 layers or above line layer, computer main board that we are common or cell phone mainboard
It is all 2 layers or the line layer of the above number of plies used.
2 functions of photo engine module: provide circuit to connect and transmission heat；Although it is the hottest
Electrically separated basic unit heat conductivity ＞ 25W/M.K, but the wiring board that general thermoelectricity separates
Only one sandwich circuit layer, it is impossible to meet the complicated circuit of some needs cloth multilayer lines；And it is existing
Energy in technology meets the heat conductivity of the multilayer circuit board of the complicated circuit of needs multilayer wiring
Only only have 1.0W/M.K, here it is why on multilayer line mainboard CPU heating
Device must add fan and help heat radiation.
Summary of the invention
In order to overcome the deficiencies in the prior art, an object of the present invention is to provide a kind of LED
Photo engine encapsulating structure, it can realize multilayer wiring, and have good heat conductivity.
The two of the purpose of the present invention are to provide a kind of LED light engine encapsulation process method, its
Multilayer wiring can be realized, and there is good heat conductivity.
One of in order to achieve the above object, the technical solution adopted in the present invention is as follows:
A kind of LED light engine encapsulating structure, including going to a grassroots level and multilayer circuit board；Many layer lines
Road plate includes insulating trip and has the upper conductive layer of Upper conductive circuit, the upper surface gone to a grassroots level
Including circuit region and be empty district, circuit region is provided with underlying conductive circuit；Upper conductive layer, insulation
Sheet, underlying conductive circuit and going to a grassroots level is sequentially connected with fixing from top to bottom；Multilayer circuit board with put
Position corresponding to dead zone is provided with and is empty district's size and mates and sequentially pass through upper conductive layer and absolutely
First through hole of embolium；Multilayer circuit board is provided with some connection underlying conductive circuits and passes through successively
Put on the second through hole of conductive layer and insulating trip；Upper conductive layer is provided with default device, presets device
Part is electrically connected with upper conductive layer, is provided with LED chip in the first through hole, and LED chip is with upper
Layer conducting wire and/or underlying conductive circuit are electrically connected with；Be provided with in described second through hole for
Connect Upper conductive circuit and the connecting line of underlying conductive circuit.
As preferably, multilayer circuit board also includes that solder mask, described solder mask are covered on conduction
On layer.It is oxidized that solder mask can make conductive layer avoid.
As preferably, in the second through hole, it is filled with insulant.Insulant is used for protecting connection
Line.
As preferably, described connecting line is bonding line.
As preferably, going to a grassroots level as whiteware plate, underlying conductive circuit is the conductive silver of solidification
Slurry.Whiteware plate can reduce the light absorbing LED, makes LED light source brighter.
As preferably, upper conductive layer is the copper foil layer being etched with Upper conductive circuit.
Two in order to achieve the above object, the technical solution adopted in the present invention is as follows:
A kind of LED light engine encapsulation process method, comprises the steps:
S0, obtain one go to a grassroots level, conductive layer and an insulating trip on one, the upper surface bag gone to a grassroots level
Including circuit region and be empty district, described upper conductive layer is provided with Upper conductive circuit；
S1, print underlying conductive circuit at the circuit region gone to a grassroots level；
S2, upper conductive layer is fixed on insulating trip end face, forms multilayer circuit board；In many layer lines
Drill through one on the position that road plate is corresponding with being empty district mate with being empty district's size and sequentially pass through
Upper conductive layer and the first through hole of insulating trip；The predeterminated position of multilayer circuit board drill through some
For connecting underlying conductive circuit and sequentially passing through the second through hole of upper conductive layer and insulating trip；
S3, multilayer circuit board and going to a grassroots level is positioned, make the first through hole and be empty zone position
Corresponding；Multilayer circuit board is fixed as an entirety with going to a grassroots level；
S4, upper conductive layer predeterminated position install preset device, in the first through hole install
LED chip；Second through hole is provided for connect Upper conductive circuit and underlying conductive line
The connecting line on road.
As preferably, in S2, " upper conductive layer is fixed on insulating trip end face, forms multilamellar
Wiring board；" particularly as follows: conductive layer to be fixed on insulating trip end face, upper conductive layer is printed
Solder mask, forms multilayer circuit board.It is oxidized that solder mask can make conductive layer avoid.
As preferably, after performing S4, also comprise the steps: S5, in the second through hole
Fill the insulant for protecting connecting line.
As preferably, in described S0, described insulating trip is for be processed by reinforcing material impregnating resin
Composite insulation sheet.
Compared to existing technology, the beneficial effects of the present invention is:
Realize the bilayer conductive line layer structure that a kind of thermoelectricity separates, change the high heat conduction of routine
But only monolayer circuit, multilayer circuit board but the low drawback of heat conductivity.
Accompanying drawing explanation
Fig. 1 is the generalized section of the LED light engine encapsulating structure of the present invention；
Fig. 2 is the top view gone to a grassroots level of the present invention；
Fig. 3 is the flow chart of the LED light engine encapsulation process method of the present invention.
In figure: 01, go to a grassroots level；02, underlying conductive circuit；020, it is empty district；03, exhausted
Embolium；04, upper conductive layer；05, device is preset；06, LED chip；07, solder mask；
08, connecting line；09, insulant；10, the second through hole；11, the first through hole.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, the present invention is described further:
A kind of LED light engine encapsulating structure, as it is shown in figure 1, include going to a grassroots level 01, multilamellar
Wiring board, default device 05 and LED chip 06；Multilayer circuit board is fixed on goes to a grassroots level 01
End face；Described 01 end face of going to a grassroots level is provided with underlying conductive circuit 02, and is positioned at multilayer line
Plate and going to a grassroots level between 01；
Described 01 ceramic wafer that can be but not limited to sinter of going to a grassroots level, is preferably white pottery
Porcelain plate, whiteware plate can reduce the light absorbing LED, make LED light source brighter；Institute
State underlying conductive circuit 02 and can be but not limited to the conducting liquid of solidification, be preferably half solidification
The conduction composite silver slurry of shape；Described conducting liquid is toasted by the temperature of more than 800 degrees Celsius
Within 12 hours, it is solidified into underlying conductive circuit 02, and forms ceramic circuit-board；Described underlying conductive
The thickness of circuit 02 is 20um；Described going to a grassroots level 01 can also be aluminium lamination or layers of copper, under
Layer conducting wire 02 is printed on by etching goes to a grassroots level on 01.
Go to a grassroots level described in as in figure 2 it is shown, 01 upper surface include circuit region and be empty district 020,
Described underlying conductive circuit 02 is fixed on circuit region；The described district 020 that is empty is for circular or side
Shape.
Described multilayer circuit board includes the solder mask 07 being sequentially connected with from top to bottom, upper conductive layer
04 and insulating trip 03；The size of described upper conductive layer 04 and insulating trip 03 all with go to a grassroots level 01
Identical；The compound inslation film that described insulating trip 03 processes for reinforcing material impregnating resin, institute
State reinforcing material and can be but not limited to electronic glass-fiber cloth；Described insulating trip 03 has caking property；
Described insulating trip 03 thickness is 0.1mm-0.5mm.
Described upper conductive layer 04 can be but not limited to copper foil layer, preferably thickness more than 15um
Copper foil layer, described upper conductive layer 04 is etched with Upper conductive circuit；Described solder mask 07
Being covered on the region needing electric insulation on conductive layer 04, described solder mask 07 is on nickel dam
Plating layer gold, solder mask 07 is used for avoiding conductive layer 04 oxidized.
Position corresponding with being empty district 020 on described multilayer circuit board is provided with and is empty district 020
Size coupling the first through hole 11, described first through hole 11 sequentially pass through solder mask 07, on lead
Electric layer 04 and insulating trip 03；The predeterminated position of multilayer circuit board is provided with some second through holes
10, described second through hole 10 sequentially passes through solder mask 07, upper conductive layer 04 and insulating trip 03,
Several second through holes 10 are looped around the first through hole 11 around；Described first through hole 11 is used
In placing LED chip 06；Described second through hole 10 is used for connecting underlying conductive circuit 02；
Described second through hole 10 is the manhole of diameter of 1 mm-3 mm.
Presetting device 05 and be arranged on the predeterminated position of conductive layer 04, LED chip 06 is located at
In first through hole 11；LED chip 06 be fixed on go to a grassroots level 01 be empty district 020；Described
Preset device 05 and include driving element；Described LED chip 06 and default device 05 are all with upper
Layer conducting wire is electrically connected with；LED chip 06 is electrically connected with Upper conductive circuit；LED
Chip 06 can according to the circuit design of concrete operations optionally with Upper conductive circuit and/or
Underlying conductive circuit 02 is electrically connected with；It is provided with connecting line 08 in described second through hole 10, uses
In connecting Upper conductive circuit and underlying conductive circuit 02；The company of being provided with in described first through hole 11
Wiring 08, is used for connecting LED chip 06 and Upper conductive circuit；Described connecting line 08 can
To be but not limited to bonding line.
Being filled with insulant 09 in described second through hole 10, insulant 09 is used for protecting
Connecting line 08 in second through hole 10；Described insulant 09 can be but not limited to silica gel.
LED light engine encapsulating structure operationally, the heat that LED chip 06 is distributed when working
Measure by 01 conduction of going to a grassroots level to outside.
The invention discloses a kind of LED light engine encapsulation process method, comprise the steps:
Step 100, obtain one and go to a grassroots level conductive layer 04 and an insulating trip 03 on 01, one, under
The upper surface of basic unit 01 includes circuit region and is empty district 020；Go to a grassroots level 01 circuit region print
Underlying conductive circuit 02 processed；
Described 01 ceramic wafer that can be but not limited to sinter of going to a grassroots level, is preferably white pottery
Porcelain plate；Described underlying conductive circuit 02 can be but not limited to half solidification shape conductive liquid of solidification
Body, silk screen printing half solidification shape conducting liquid on ceramic wafer, to the pottery being provided with conducting liquid
Plate carries out the temperature of more than 800 degrees Celsius and toasts 12 hours, makes conducting liquid be solidified into lower floor
Conducting wire 02, forms ceramic circuit-board；The thickness of described underlying conductive circuit 02 is 20um；
Described going to a grassroots level 01 can also be aluminium lamination or layers of copper, and underlying conductive circuit 02 is by erosion
Marking is formed on goes to a grassroots level on 01；The described district 020 that is empty is for circular or square.
Step 200, on insulating trip 03, apply conductive layer 04, upper conductive layer 04 is electroplated
Solder mask 07, forms multilayer circuit board；Described solder mask 07 is located at conductive layer 04 to be needed
The region of electric insulation；
Described insulating trip 03 and upper conductive layer 04 all with go to a grassroots level 01 size identical；Described
The compound inslation film that insulating trip 03 processes for reinforcing material impregnating resin, described reinforcing material
Electronic glass-fiber cloth can be but not limited to；Described insulating trip 03 has caking property；Described insulation
Sheet 03 thickness is 0.1mm-0.5mm；
Described upper conductive layer 04 can be but not limited to copper foil layer, preferably thickness more than 15um
Copper foil layer, upper conductive layer 04 is etched with Upper conductive circuit；On compound inslation film
Apply the copper foil layer having etched Upper conductive circuit, formed and apply copper film；
Described solder mask 07 powers on Gold plated Layer for nickel dam, needs the most absolutely on upper conductive layer 04
The region electroless nickel layer of edge, powers on Gold plated Layer at nickel dam；Described electroless nickel layer thickness is 03um,
Described layer gold thickness is 0.1um, and solder mask 07 is used for avoiding conductive layer 04 oxidized.
On step 300, position corresponding with being empty district 020 on multilayer circuit board, drill through one
Individual be empty the first through hole 11 that district 020 size is mated, described first through hole 11 sequentially passes through
Solder mask 07, upper conductive layer 04 and insulating trip 03；Multilayer circuit board drills through several
Two through holes 10, described second through hole 10 sequentially passes through solder mask 07, upper conductive layer 04 and absolutely
Embolium 03；
Several second through holes 10 are all looped around the first through hole 11 around；Described first through hole
11 are used for placing LED chip 06；Described second through hole 10 is used for connecting underlying conductive circuit
02；Described second through hole 10 is the manhole of a diameter of 1mm-3mm；
Step 400, to multilayer circuit board with go to a grassroots level and 01 carry out laser positioning, make first to lead to
Hole 11 is corresponding with being empty position, district 020；By multilayer circuit board and 01 hot pressing synthesis one of going to a grassroots level
Individual entirety, forms the bilayer conductive circuit with Upper conductive circuit and underlying conductive circuit 02
Layer；
Step 500, on the predeterminated position of upper conductive layer 04 install preset device 05；?
In one through hole 11, LED chip 06 is installed, presets device 05 and be installed on conductive layer 04；
Described default device 05 includes driving element；Described LED chip 06 and default device
05 is all electrically connected with Upper conductive circuit；LED chip 06 electrically connects with Upper conductive circuit
Connect；LED chip 06 can according to the circuit design of concrete operations optionally with Upper conductive
Circuit and/or underlying conductive circuit 02 are electrically connected with.
Step 600, in the second through hole 10, connect Upper conductive circuit by connecting line 08
With underlying conductive circuit 02；To fill insulant 09 in the second through hole 10, to protect connection
Line 08；Described insulant 09 can be but not limited to silica gel；Described connecting line 08 is permissible
It is but not limited to bonding line.
The present invention utilizes the line layer technology of preparing of ceramic wafer and aluminum base/cuprio, makes a kind of heat
The bilayer conductive line layer of electrically separated high thermal conductivity, the heat conductivity of the present invention can reach
25W/M.k, improves 25 than the bilayer conductive line layer of general 1.0W/M.K heat conductivity
Times；Present invention incorporates the high heat conduction conduction technique of thermoelectricity split circuit layer and multilayer circuit board
Manufacturing technology, change routine high heat conducting circuit layer but the most only monolayer circuit or multilamellar
The drawback of wiring board still low thermal conductive wire coefficient.
The present invention includes following features:
1) double-deck line construction makes the LED drive power wiring of complexity be possibly realized, and will not make
There is intersection conflict in LED driver circuit.
2) thermoelectricity isolating construction, LED is directly bonded in aluminium lamination/copper wire or the lower floor of high thermal conductivity coefficient
On line layer, the heat that can easily LED be produced is delivered on the radiator of outside.
3) double-deck line layout structure, the wire laying mode of Multilayer vertical, solve monolayer line layer
Need big circuit area.
It will be apparent to those skilled in the art that can technical scheme as described above and structure
Think, make other various corresponding changes and deformation, and all these changes and deformation
Within all should belonging to the protection domain of the claims in the present invention.
Claims (10)
1. a LED light engine encapsulating structure, it is characterised in that include going to a grassroots level and multilayer line
Plate；Multilayer circuit board includes the upper conductive layer with insulating trip and Upper conductive circuit,
The upper surface gone to a grassroots level includes circuit region and is empty district, and circuit region is provided with underlying conductive line
Road；Upper conductive layer, insulating trip, underlying conductive circuit and going to a grassroots level connects the most successively
Connect fixing；The position that multilayer circuit board is corresponding with being empty district is provided with and is empty district's size
Join and sequentially pass through the first through hole of conductive layer and insulating trip；Multilayer circuit board is provided with
Some connection underlying conductive circuits also sequentially pass through the second of conductive layer and insulating trip and lead to
Hole；Upper conductive layer is provided with default device, presets device and is electrically connected with upper conductive layer,
LED chip, LED chip and Upper conductive circuit and/or lower floor it is provided with in first through hole
Conducting wire is electrically connected with；It is provided with for connecting Upper conductive circuit in described second through hole
Connecting line with underlying conductive circuit.
2. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that many layer lines
Road plate also includes that solder mask, described solder mask are located on conductive layer.
3. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that second leads to
Insulant it is filled with in hole.
4. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that described company
Wiring is bonding line.
5. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that go to a grassroots level
For whiteware plate, underlying conductive circuit is the conductive silver paste of solidification.
6. LED light engine encapsulating structure as claimed in claim 1, it is characterised in that upper conduction
Layer is the copper foil layer being etched with Upper conductive circuit.
7. a LED light engine encapsulation process method, it is characterised in that comprise the steps:
S0, obtain one go to a grassroots level, conductive layer and an insulating trip on one, the upper surface bag gone to a grassroots level
Including circuit region and be empty district, described upper conductive layer is provided with Upper conductive circuit；
S1, print underlying conductive circuit at the circuit region gone to a grassroots level；
S2, upper conductive layer is fixed on insulating trip end face, forms multilayer circuit board；In many layer lines
Drill through one on the position that road plate is corresponding with being empty district mate with being empty district's size and pass through successively
Put on the first through hole of conductive layer and insulating trip；The predeterminated position of multilayer circuit board bores
Take some for connecting underlying conductive circuit and sequentially passing through the of upper conductive layer and insulating trip
Two through holes；
S3, multilayer circuit board and going to a grassroots level is positioned, make the first through hole and be empty zone position
Corresponding；Multilayer circuit board is fixed as an entirety with going to a grassroots level；
S4, upper conductive layer predeterminated position install preset device, in the first through hole install LED
Chip；Second through hole is provided for connect Upper conductive circuit and underlying conductive circuit
Connecting line.
8. LED light engine encapsulation process method as claimed in claim 7, it is characterised in that S2
In, " upper conductive layer is fixed on insulating trip end face, forms multilayer circuit board；" concrete
For: conductive layer is fixed on insulating trip end face, upper conductive layer is printed solder mask, shape
Become multilayer circuit board.
9. LED light engine encapsulation process method as claimed in claim 7, it is characterised in that
Also comprise the steps: S5 after performing S4, fill for the company of protection in the second through hole
The insulant of wiring.
10. LED light engine encapsulation process method as claimed in claim 7, it is characterised in that institute
Stating in S0, described insulating trip is the compound inslation processed by reinforcing material impregnating resin
Sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610408267.3A CN105870301A (en) | 2016-06-08 | 2016-06-08 | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610408267.3A CN105870301A (en) | 2016-06-08 | 2016-06-08 | LED (Light Emitting Diode) optical engine packaging structure and processing method thereof |
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| CN110300490A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive multilayer circuit board and preparation method thereof |
| CN110300489A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive double-layer circuit board and preparation method thereof |
| CN110300491A (en) * | 2018-03-24 | 2019-10-01 | 铜陵国展电子有限公司 | A kind of thermally conductive base double-layer circuit board and preparation method thereof |
| CN110473953A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | LED lamp panel |
| CN110473952A (en) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | Circuit LED support and LED |
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Application publication date: 20160817 |