CN201986260U - Composite PCB - Google Patents
Composite PCB Download PDFInfo
- Publication number
- CN201986260U CN201986260U CN2011200615277U CN201120061527U CN201986260U CN 201986260 U CN201986260 U CN 201986260U CN 2011200615277 U CN2011200615277 U CN 2011200615277U CN 201120061527 U CN201120061527 U CN 201120061527U CN 201986260 U CN201986260 U CN 201986260U
- Authority
- CN
- China
- Prior art keywords
- radiating
- heat
- circuit board
- colloid
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a composite PCB (printed circuit board), which is used for mounting high-power components and provided with a radiating structure. The composite PCB comprises a single-side bonding circuit board with a radiating baseplate bonded on the lower surface; through holes are formed on the circuit board and correspond to the mounting positions of the high-power components; and a radiating seat, formed by colloid, is arranged in each through hole, the heat conductivity of the colloid is higher than that of the circuit board, and the bottom surface of the radiating seat is bonded with the upper surface of the radiating baseplate. The heat of the components is directly transferred from the radiating seat to the radiating baseplate, so the radiating effect is good; meanwhile, the radiating seat is made of colloid, so the fracture of the electrode lead wire of the high-power components due to the heat expansion mismatch is avoided. The PCB is simple to manufacture and has a low cost.
Description
Technical field
The utility model relates to pcb board heat radiation field, especially a kind of compound pcb board that is used to install the band radiator structure of high performance components.
Background technology
The electronic product development trend is high-performance and miniaturization, in order to make the mounting semiconductor chip greater functionality, makes that accordingly chip power is increasing, and the heat that chip produces is also more and more; Or as the great power LED of power greater than the 1W level, present electro-optical efficiency is about 15%, and remaining 85% is converted into heat energy, and its heat dissipation problem is more outstanding; If these heats can not in time be discharged, can cause the semiconductor chip temperature too high, influence the stability and the life-span of chip; Therefore, how to the anxious problem that must solve in the development of high performance components heat radiation becoming electronic product.More general way is that high-power chip is installed on the pcb board of being with the metal sandwich (being the circuit board of metal substrate) at present, this structure has promoted the radiating effect of high-power chip to a certain extent, but, its defective is that the insulating barrier in this pcb board interlayer is the non-conductor of heat, and it can hinder the conduction of heat; On the other hand, the manufacture craft of this sandwich pcb board is very complicated, and cost is higher.
Summary of the invention
At the deficiency that the sandwich pcb board exists, the utility model provides a kind of making simple, low-cost, again the compound pcb board that can effectively dispel the heat to high performance components.
For achieving the above object, the technical solution adopted in the utility model is as follows:
OnePlant compound pcb board, comprise single face mounted board and the heat-radiating substrate that is bonded in described circuit board lower surface, the installation site of corresponding high performance components is provided with through hole on circuit board, the radiating seat that is formed greater than the colloid of pcb board by thermal conductivity is housed in this through hole, the bottom surface of this radiating seat and the upper surface of heat-radiating substrate bonding, and end face is concordant with the circuit board upper surface.
Further, described heat-radiating substrate is the fin or the semiconductor chilling plate of metal, ceramic material.
Further, the colloid that forms described radiating seat is heat-conducting glue, conductivity type silver slurry or tin slurry.
The beneficial effects of the utility model are: 1, only need boring on ordinary circuit board, paste heat-radiating substrate and fill colloid and just can be made into compound pcb board, cost of manufacture and the difficulty of comparing the sandwich pcb board have obvious reduction; 2, compare the sandwich pcb board, the heat radiation of high-power components is to be directly conducted to heat-radiating substrate from the radiating seat colloid on this compound pcb board, and the thermal conductivity of radiating seat colloid is higher than pcb board, so radiating effect is better than the sandwich pcb board; 3, because the radiating seat material is a colloid, so can not cause the contact conductor fracture between high performance components and the radiating seat because of thermal expansion mismatch.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described further:
Fig. 1 is the structural representation of a kind of compound pcb board of the utility model.
Embodiment
With reference to figure 1, a kind of compound pcb board, the circuit board 1 that comprises the single face mounted with electronic components, and be bonded in the heat-radiating substrate 3 of this circuit board 1 lower surface by adhesive layer 2, the material of this heat-radiating substrate 3 are heat conductivilitys such as the fin of metal, ceramic material or semiconductor chilling plate material preferably; The installation site of corresponding high performance components 5 is provided with through hole on circuit board 1, the radiating seat 4 that is formed greater than the colloid of circuit board 1 by thermal conductivity is housed in this through hole, and colloid is the materials that thermal conductivity is higher, hardening temperature is lower such as heat-conducting glue, conductivity type silver slurry or tin slurry; The upper surface bonding of the bottom surface of this radiating seat 4 and heat-radiating substrate 3, and end face is concordant with circuit board 1 upper surface.When high performance components 5 was installed, the pin of high performance components 5 was mounted on the circuit board 1, and package casing is close on the radiating seat 4 of colloid formation, and the heat of high performance components 5 directly conducts to heat-radiating substrate 3 from radiating seat 4.
Certainly, above embodiment just is explanation rather than restriction the utility model, the above only is preferred embodiment of the present utility model, so all equivalences of being done according to the described scheme of the utility model patent claim change or modify, is included in the utility model patent claim.
Claims (3)
1. compound pcb board, comprise the single face mounted board, it is characterized in that: also comprise the heat-radiating substrate that is bonded in described circuit board lower surface, the installation site of corresponding high performance components is provided with through hole on circuit board, the radiating seat that is formed greater than the colloid of circuit board by thermal conductivity is housed in this through hole, the bottom surface of this radiating seat and the upper surface of heat-radiating substrate bonding, and end face is concordant with the pcb board upper surface.
2. a kind of compound pcb board according to claim 1 is characterized in that: described heat-radiating substrate is the fin or the semiconductor chilling plate of metal, ceramic material.
3. a kind of compound pcb board according to claim 1 and 2 is characterized in that: the colloid that forms described radiating seat is heat-conducting glue, conductivity type silver slurry or tin slurry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200615277U CN201986260U (en) | 2011-03-10 | 2011-03-10 | Composite PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200615277U CN201986260U (en) | 2011-03-10 | 2011-03-10 | Composite PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201986260U true CN201986260U (en) | 2011-09-21 |
Family
ID=44613709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200615277U Expired - Fee Related CN201986260U (en) | 2011-03-10 | 2011-03-10 | Composite PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201986260U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324410A (en) * | 2011-10-20 | 2012-01-18 | 深圳市威怡电气有限公司 | Electronic component and heat radiation system |
| CN103200805A (en) * | 2013-04-03 | 2013-07-10 | 张家港市华力电子有限公司 | Heat radiation structure of electronic devices in sealed shell |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN110120292A (en) * | 2018-02-05 | 2019-08-13 | 台达电子企业管理（上海）有限公司 | The radiator structure of magnetic element and magnetic element with the radiator structure |
-
2011
- 2011-03-10 CN CN2011200615277U patent/CN201986260U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102324410A (en) * | 2011-10-20 | 2012-01-18 | 深圳市威怡电气有限公司 | Electronic component and heat radiation system |
| CN103200805A (en) * | 2013-04-03 | 2013-07-10 | 张家港市华力电子有限公司 | Heat radiation structure of electronic devices in sealed shell |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN110120292A (en) * | 2018-02-05 | 2019-08-13 | 台达电子企业管理（上海）有限公司 | The radiator structure of magnetic element and magnetic element with the radiator structure |
| US11469035B2 (en) | 2018-02-05 | 2022-10-11 | Delta Electronics (Shanghai) Co., Ltd | Heat dissipation structure for magnetic component and magnetic component having the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110921 Termination date: 20130310 |