CN209708967U - A kind of LED light module - Google Patents
A kind of LED light module Download PDFInfo
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- CN209708967U CN209708967U CN201822096931.2U CN201822096931U CN209708967U CN 209708967 U CN209708967 U CN 209708967U CN 201822096931 U CN201822096931 U CN 201822096931U CN 209708967 U CN209708967 U CN 209708967U
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- ceramic wafer
- metal plate
- circuit
- led light
- light module
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Abstract
The utility model discloses a kind of LED light modules, including LED chip, ceramic wafer, metal plate, wherein, LED chip is mounted on the upper surface of ceramic wafer, the surface of metal plate is equipped with groove, and ceramic wafer is mounted in groove, and the lower surface of ceramic wafer has the coat of metal, ceramic wafer is connected by the coat of metal with the reeded one side of metal plate, and the another side of metal plate connects radiator.Since ceramic wafer, metal plate and radiator are directly connected to, there is better heat dissipation effect, in addition the circuit on ceramic wafer is single circuit, also being capable of preferably save the cost.
Description
Technical field
The utility model relates to LED encapsulation fields, more specifically to a kind of LED light module.
Background technique
The key problem of light emitting diode (LED) light-source encapsulation technology is heat dissipation.The efficiency of heat dissipation or say by heat dissipation imitate
The node temperature for the LED that rate determines directly affects luminous efficiency and the service life of LED.The especially big light source of power density, also
It is the light source of high-power small size, amount of heat results from the region of very little.How by heat dispersion, transmission, away from hair
The LED chip of heat, is the key that LED light source manufacturing technology.First critical point of LED chip heat dissipation is circuit board substrate, that is,
The object directly contacted with chip.Circuit board substrate mainly provides three functions: (1) providing mechanical branch for frangible delicate chip
Support；(2) electrically driven (operated) route is provided for LED chip；(3) path of heat transfer is provided for LED chip.It is certain in addition to that should have
Mechanical strength, electrical isolation and higher heating conduction outside, the material and structure of circuit board substrate should also with chip keep heat it is swollen
Swollen matching.Commercial cost is also key factor in need of consideration.
Ceramics are usually utilized to the substrate as LED chip circuit board, because ceramics electrical isolation, thermally conductive good, thermal expansion system
The matching of several and LED chip.The common ceramics of circuit substrate have aluminium oxide and aluminium nitride, and thermal coefficient respectively may be about 30 watt/meter *
Degree and 270 watt/meter * degree.The thermal expansion coefficient of aluminium oxide and aluminium nitride respectively may be about 7 × 10-6/ K and 4.5 × 10-6/ K, oxidation
Aluminium and aluminium nitride and the thermal expansion coefficient of LED chip are close.But ceramics are crisp, are easily broken off or are crushed.In addition ceramics especially nitrogen
Change aluminium, it is expensive.
Light emitting module this is defined herein as, the LED chip for the column matrix that is arranged in rows on circuit boards.Chip lines up ranks
The reason is that in order to generate area source.In particular for the ultraviolet source module of solidified glue, ink in industrial production, radiation energy
Density requirements are high, and many luminescence chips are arranged compactly in together.A large amount of heat results from the area of very little.Light emitting module
Circuit board substrate function first is that the heat of chip is distributed in substrate, then be transmitted in radiator by substrate.For
The high radiator of energy density is usually the air-cooled radiator of water cooling or heat pipe connection.Light emitting module circuit board substrate and radiator
Interface connection it is extremely important, be directly related to the further transmission of heat.The boundary of light emitting module circuit board substrate and radiator
Face is usually heat-conducting cream.Interface, which closely connects, is completed by the machine screws tightened.In industrialized production, machine screws is twisted
It obtains and tightly will cause very much the broken of ceramic substrate；But it twists not tight enough, and the interface defective tightness of substrate and radiator may be made,
Influence passing through for hot-fluid.
The technological deficiency of existing light emitting module circuit board substrate is as follows:
The light emitting module of existing commercial product mainly uses the structure and manufacturing technology of two kinds of circuit boards.The first: lamp
Pearl/board structure.LED chip is first packaged into lamp bead, every lamp bead 1 or several chips.Then many lamp beads are assembled in
On one piece of metal-based circuit board.
Fig. 1 is the structural schematic diagram of a lamp bead.Ceramic wafer 11 makees the substrate of LED chip 13, and ceramic wafer 11 can be nitrogen
Change aluminium etc., there is upper layer circuit 14 in upper surface, and there is lower circuit 15 in lower surface.Ceramic wafer 11 has the connection of upper and lower level power on circuitry hole 12
Upper layer circuit 14 and lower circuit 15.There are also thermal land 16, LED chips 13 to pass through optical lens 17 for the lower surface of ceramic wafer 11
Encapsulation.
Fig. 2 shows that many lamp beads 21 are pasted on one piece of circuit substrate 24.Circuit board is metal-based circuit board, divides three layers:
Here is metal plate 24, generally copper or aluminium；Metal plate 24 is above electric insulation layer 23, and generally resin and ceramic powder is compound
Material；It is circuit layer (circuit board 22) on electric insulation layer 23, is copper.Pass through welded connecting between lamp bead 21 and circuit board 22.Electricity
The articulamentum of road plate 22 and radiator 27 is heat-conducting cream 25；Heat-conducting cream can be permanent bonded adhesives (thermal set) or
It is grease type bridging agent, close interfacial contact is maintained by machine screws.This structure and manufacturing method are current industry
Mainstream.The disadvantage is that heating conduction is not good enough, be also greatly improved leeway.Heating conduction is imperfect the reason is that passage of heat
On material level it is too many, every layer material all generates thermal resistance.The especially insulating layer of metal-based circuit board, resin and ceramics mixing
Body composition insulating layer thermal coefficient it is generally advisable to namely 3 DEG C/watt/meter, it is clear that the electric insulation layer of circuit board is heat passage
Bottleneck.
For the heating conduction for improving the above structure, there is second of structure in industry: chip/substrate (chip on
board,COB).About chip/board structure, there are two kinds of imaginations.A kind of idea is to remove ceramic layer, by direct chip attachment
On metal-based circuit board.The problem of this idea is the thermal expansion coefficient of chip, generally 5 × 10-6/DEG C, and metallic copper
Thermal expansion coefficient is 18.3 × 10-6/ DEG C, it mismatches, and the electric insulation layer of metal-based circuit board still causes the bottle of heat transfer
Neck.Another idea is to remove metal-based circuit board, and as shown in Figure 3, all LED chips 33 are directly arranged on ceramic wafer 31,
Circuit board 32 is also disposed on ceramic wafer 31, and circuit is no longer arranged in the lower surface of ceramic wafer 31, and ceramic wafer 31 is pacified by screw 35
On radiator 37, heat-conducting cream 34 is filled between ceramic wafer 31 and radiator 37.Different from the encapsulating structure of the first, chip
It is not to be respectively adhered on many small potsherds, all chips are pasted on one piece of big ceramic wafer.Originally in Metal Substrate electricity
Driving circuit on the plate of road is also transplanted on big ceramic wafer.Obviously such to improve the layer for reducing material in thermal conduction path
It is secondary, the electric insulation layer of metal-based circuit board and thermally conductive bottleneck therein is especially eliminated, the thermal conductivity of structure is substantially improved
Energy.Taking cost into account, there is increased part, the part being also reduced.What cost was reduced is partly due to eliminate Metal Substrate
Circuit board, ceramic wafer become single sided circuits by double-sided circuit, eliminate and lead needed for upper and lower circuit layer on ceramic wafer in order to connect
Electric hole.The cost of drilling technology in ceramic circuit board is very high.Increase the drive circuit for being partly due to metal-based circuit board
Divide and be transplanted on ceramic wafer, therefore the size of ceramic wafer increases.But a critical defect of this structure is to tighten screw
Dynamics grasp bad, will lead to the broken of ceramic wafer.
Summary of the invention
1. technical problems to be solved
High for weak heat-dissipating existing in the prior art, processing cost, installation when, be easy to cause ceramic wafer broken etc. and asks
Topic, the utility model provide a kind of LED light module, and good heat dissipation may be implemented in it, and the processing is simple, and at low cost and installation is steady
Determine secured and other effects.
2. technical solution
The purpose of this utility model is achieved through the following technical solutions.
A kind of LED light module, including LED chip, ceramic wafer, metal plate, wherein LED chip is fixed on ceramic wafer,
The one side of metal plate is equipped with groove, and ceramic wafer is mounted in the groove of metal plate, and the another side of ceramic wafer connects metal plate, gold
Belong to plate to be directly connected on a heat sink, there is no thermally conductive bottleneck in the passage of heat, better heating conduction can be obtained.The utility model
It is connect by metal plate and radiator etc., without punching on ceramic wafer, avoids ceramic wafer stress broken.
Further, the ceramic wafer being mounted in groove is concordant with metal sheet surface, in order to later period installation.
Further, the material of metal plate is copper or plating nickel on surface or copper-plated aluminium.It is compared with aluminium, makees metal with copper
Plate, heat-conducting effect are more preferable.It is of course also possible to metal plate is made of the aluminium of plating nickel on surface, but the heating conduction of aluminium is slightly poor, heat dissipation
Effect is slightly poor.
Further, ceramic wafer with a thickness of 0.2mm-1mm.When the thickness of ceramic wafer is in 0.5mm, can obtain best
Heat dissipation effect.
Further, the upper surface of ceramic wafer is provided with circuit.Two sides are all designed and are had above and below ceramic wafer in the prior art
The structure of the odt circuit of circuit is compared, and the structure that only design has single circuit in the side of ceramic wafer does not need connection upper and lower level
The conductive through hole of circuit can be effectively reduced cost, while avoid and punch on ceramic wafer.
Further, the non-recessed portion of metal plate has insulating coating, is provided with circuit on insulating coating.This is practical new
Type can will be arranged on ceramic wafer the high circuit of cooling requirements, on a metal plate by the low circuit setting of cooling requirements, mention
Space-efficient greatly improves radiating efficiency.
Further, it is connected between the circuit on the circuit and metal plate on ceramic wafer by Zero-ohm resistor.Certain zero
Ohmic resistance can also be replaced with copper conductor.
Further, the lower surface of ceramic wafer has the coat of metal, the lower surface of ceramic wafer and the groove surfaces of metal plate
Contact.Relatively good heat dissipation effect can be obtained in this way.
Further, the lower surface of ceramic wafer is connected by solder(ing) paste with metal plate.Ceramic wafer and gold are connected with solder(ing) paste
Relatively good heat dissipation effect can be obtained by belonging to plate.
The non-recessed place of metal plate is equipped with through-hole, and the metal plate is fixed by screws on radiator.It avoids existing
There is screw in technology to beat the problem of be easy to causeing ceramic wafer to rupture on ceramic wafer.
Further, the through-hole on the metal plate is 4.
3. beneficial effect
Compared with the prior art, utility model has the advantages that
(1) good heat conductivity.The first relatively aforementioned structure, chip are pasted on ceramic wafer, and ceramic wafer is welded on metal
On plate, metal plate is directly connected on a heat sink, does not have thermally conductive bottleneck in the passage of heat.
(2) manufacturing cost is low.The first structure relatively above-mentioned, ceramic wafer are single circuit structures, are not connected up and down
The conductive through hole of layer circuit；Second of structure relatively above-mentioned, being reduced with material for ceramic wafer are replaced by lower-cost metal
Plate, totle drilling cost reduce.
(3) relatively aforementioned second of structure avoids destruction of the stress generated when machine screws is tightened to ceramic wafer, because
It is twisted on a metal plate for screw.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the luminous lamp bead of single LED chip package；
Fig. 2 is the first mode of existing light emitting module structure: lamp bead/substrate light emitting module and the heat dissipation being installed on it
The schematic diagram of the section structure of device；
Fig. 3 is second of mode of existing light emitting module structure: chip/substrate light emitting module and the heat dissipation being installed on it
The schematic diagram of the section structure of device；
Fig. 4 is the schematic diagram of the section structure of the utility model and the radiator being installed on it；
Fig. 5 is the stereoscopic schematic diagram of the utility model；
Fig. 6 is the top view of the utility model；
Fig. 7 is the side view of the utility model.
Figure label explanation:
In Fig. 1,11: ceramic wafer；12: upper and lower level circuit through-hole；13:LED chip；14: upper layer circuit；15: lower circuit；
16: thermal land；17: optical lens.
In Fig. 2,21: lamp bead；22: circuit board；23: electric insulation layer；24: metal plate；25: heat-conducting cream；26: screw；27:
Radiator.
In Fig. 3,31: ceramic wafer；32: circuit board；33:LED chip；34: heat-conducting cream；35: screw；36: lens；37: dissipating
Hot device.
In Fig. 4,41: metal plate；42: ceramic wafer；43:LED chip；45: heat-conducting cream；46: screw；47: lens；49: dissipating
Hot device.
In Fig. 5,41: metal plate；42: ceramic wafer；52: Zero-ohm resistor；53: groove；54: through-hole.
In Fig. 6,41: metal plate；42: ceramic wafer；51: Zero-ohm resistor pad；52: Zero-ohm resistor；54: through-hole.
In Fig. 7,41: metal plate；42: ceramic wafer；47: lens.
Specific embodiment
With reference to the accompanying drawings of the specification and specific embodiment, the utility model is described in detail.
Metal such as copper is seldom used as the circuit board substrate of LED chip, although its thermal coefficient is high, 400 watts/meter
Degree, mechanical strength is good, and price ceramics relatively are cheap very much, but it is conductive, and its thermal expansion coefficient 16.5x10-6/ K, much larger than half
The thermal expansion coefficient of conductor chip.The utility model combines the advantages of ceramics and metallic copper, and ceramics and brazing are connected together, are done
At the compound circuit board substrate of ceramics and copper.The insulating layer of metal-based circuit board, the insulation of resin and ceramic mixture composition
It is generally advisable to namely 3 watt/meter * degree for the thermal coefficient of layer, and the thermal coefficient of copper is about 400 watt/meter * degree in contrast.
Certainly, metal plate can also be made of other metals, be such as formed from aluminium, in contrast, the thermal coefficient of aluminium is about
It is 200 C/ watts/meter, heat-conducting effect is slightly poorer than copper, although the thermal coefficient of aluminium is low compared with copper, its specific gravity (2.73g/cm3) it is copper
Specific gravity (8.9g/cm3) about 1/3, the circuit board of production is lighter.But aluminium is difficult direct and ceramic welding, so specific
It needs to plate one layer of metal that can directly weld, such as nickel, copper on the surface of aluminium when implementation.
As shown in figs. 4-7, the circuit substrate of LED light module has two parts: ceramic wafer 42 and metal plate 41, metal plate 41
Upper surface be equipped with groove 53, ceramic wafer 42 is mounted in groove 53, and 42 upper surface of ceramic wafer is equipped with LED chip 43, ceramics
Circuit is provided on plate to be connected with LED chip 43.Foregoing circuit is single circuit, and the upper surface of ceramic wafer 42 is arranged in, ceramics
The lower surface of plate 42 does not have circuit, and there is no need to the perforation of the setting connection upper and lower circuit on ceramic wafer 42, thus can save
Cost.There is the coat of metal in the lower surface of ceramic wafer 42, is connected by the coat of metal with metal plate 41.Ceramic wafer 42 is installed
There are many kinds of the modes on metal plate 41, ceramic wafer 42 is welded on metal plate 41 by the utility model using solder(ing) paste, is made
Better heat-conducting effect can be obtained with solder(ing) paste.Fluted 53 on metal plate 41, ceramic wafer 42 is mounted in groove 53, groove
53 depth is slightly thicker than the thickness of ceramic wafer 42,41 flush of ceramic wafer 42 and metal plate being mounted in groove 53 in this way.
In the non-recessed part of metal plate 41, there is electric insulation coating layer, be provided with circuit on the insulating layer.Circuit on ceramic wafer 42 and
Circuit on metal plate 41 is connected by Zero-ohm resistor 52, in the specific implementation, can also replace zero with copper conductor
Ohmic resistance.The matched through-hole 54 of promising machine screws 46 on metal plate 41, using screw 46 by metal plate and radiator 49
It is attached.
Due to ceramics it is expensive, in order to save cost, when design circuit, can choose will part radiate want
Seeking high circuit design, cooling requirements not high circuit design in part is on metal plate 41 on ceramic wafer 42；It can certainly
Selection designs whole circuit designs on ceramic wafer 42 on metal plate 41 or all.
In the specific implementation, the groove 53 on metal plate 41 can be designed to that four edges are respectively less than corresponding metal plate 41
The side length of four edges can also be designed to the side of the side length of two of them parallel edges and two parallel edges of corresponding metal plate 41
Length is equal.
Manufacturing process is: (1) manufacturing ceramic circuit board and metallic circuit respectively.(2) chip is pasted into (solder(ing) paste or silver
Glue) on ceramic circuit board, it embarks on journey in column.(3) ceramic circuit board is welded on metallic circuit with solder(ing) paste.(4) it connects
The Zero-ohm resistor and other electron component of ceramic circuit board and metallic circuit are welded on metallic circuit with solder(ing) paste.
(5) heat-conducting cream is applied on a heat sink, with machine screws in metallic circuit twist-on to radiator.
By taking 6 × 12 72 core ultraviolet leds light emitting modules as an example, one piece of 0.2mm- is inlayed in the metal plate 41 of 2.5mm thickness
The ceramic wafer 42 of the aluminium nitride of 1.0mm thickness, experiment show ceramic wafer 42 with a thickness of 0.5mm thickness when can obtain it is optimal dissipate
Thermal effect.There is the circuit trace of silver on 42 surface of ceramic wafer, is that silver is plated in ceramics using silk-screen printing silver paste, thick film firing technique
Plate surface.72 ultraviolet leds chips 43, using soldering tin technique, with the SnPb63 cream of -0.5 copper of -3 silver of 96.5 tin, fusing point is
219 DEG C, Reflow Soldering peak temperature is maintained at 250 DEG C, is pasted on the ceramic wafer 42 of aluminium nitride.Pass through the circuit trace of silver, LED
Chip is linked to be the structure of 6 and 12 strings.After ceramic wafer 42 and LED chip 43 thereon are packaged, ceramic wafer 42 is welded to metal
In the groove 53 of plate 41.The back side all surfaces of ceramic wafer 42 plate silver, silver-plated to use silk-screen printing silver paste, thick film firing technique
Production.The solder(ing) paste of welding is -42 tin of 58 bismuth, and fusing point is 138 DEG C.The peak temperature of Reflow Soldering is maintained at 160 DEG C.Metal plate 41
Groove 53 depth and ceramic wafer 42 thickness it is close, after installation, the surface of the surface of metal plate 41 and ceramic wafer 42 is flat
Together.It is coated with insulating layer on metal plate 41, is printed on circuit on insulating layer.The circuit on circuit and metal plate 41 on ceramic wafer 42
It is bridged and is completed by Zero-ohm resistor 52, Zero-ohm resistor pad 52 is provided on metal plate 41, the setting of Zero-ohm resistor 51 exists
On Zero-ohm resistor pad 52.
The reason of circuit on circuit and metal plate 41 on ceramic wafer 42 is connected using Zero-ohm resistor 51 is that can have
Effect reduces cost, naturally it is also possible to realize the connection between circuit using copper conductor.
Such structure and the benefit of process flow are: (1) good heat conductivity.Chip is pasted on ceramic wafer, ceramic wafer
On a metal plate, metal plate is directly connected on a heat sink for welding.There is no thermally conductive bottleneck in the passage of heat.(2) manufacturing cost is low.Phase
To the first structure above-mentioned, ceramic wafer is single circuit structure, does not connect the conductive through hole of upper and lower level circuit.It makes pottery in brittleness
It is punched on porcelain plate and generally uses laser.The material for also needing filling conductive after punching and subsequent sintering.Processing cost is considerable.Even
More than the price of ceramic material itself.The area of second of structure relatively above-mentioned, ceramic wafer is reduced, and is alternatively metal plate.Pottery
The price of the price of porcelain, especially aluminium nitride is more much higher than metal plate.(3) stress pair generated when machine screws is tightened is avoided
The destruction of ceramic wafer, because screw is twisted on a metal plate.
Schematically the utility model is created above and embodiments thereof are described, description is not limiting,
Without departing substantially from the spirit or essential characteristics of the utility model, it can realize that this is practical new in other specific forms
Type.Shown in the drawings is also one of the embodiments of the present invention, and actual structure is not limited to this, claim
In any appended drawing reference should not limit the claims involved.So if those skilled in the art are opened by it
Show, in the case where not departing from this creation objective, not inventively design frame mode similar with the technical solution and
Embodiment should belong to the protection scope of this patent.In addition, one word of " comprising " is not excluded for other elements or step, before the component
"one" word be not excluded for including " multiple " element.The multiple element stated in claim to a product can also be by a member
Part is implemented through software or hardware.The first, the second equal words are used to indicate names, and are not offered as any specific suitable
Sequence.
Claims (9)
1. a kind of LED light module, including LED chip, ceramic wafer, it is characterised in that: further include metal plate, wherein the LED
Chip is mounted on the upper surface of ceramic wafer, and the surface of metal plate is equipped with groove, and ceramic wafer is mounted in the groove, the ceramics
The upper surface of plate is provided with circuit, and the lower surface of the ceramic wafer is not provided with circuit.
2. LED light module according to claim 1, it is characterised in that: be mounted on the upper surface of the ceramic wafer in groove
It is concordant with the upper surface of metal plate.
3. LED light module according to claim 1, it is characterised in that: the material of the metal plate is that copper or surface are plated
Nickel or copper-plated aluminium.
4. LED light module according to claim 1, it is characterised in that: the ceramic wafer with a thickness of 0.2mm-1mm.
5. LED light module according to claim 1, it is characterised in that: the non-recessed portion of the metal plate has
Insulating coating is provided with circuit on insulating coating.
6. LED light module according to claim 5, it is characterised in that: circuit and metal plate on the ceramic wafer
On circuit between connected by Zero-ohm resistor or copper conductor.
7. LED light module according to any claim from 1 to 6, it is characterised in that: under the ceramic wafer
Surface has the coat of metal, and the lower surface of the ceramic wafer is contacted with the groove surfaces of metal plate.
8. LED light module according to claim 7, it is characterised in that: the lower surface of ceramic wafer passes through solder(ing) paste and gold
Belong to plate connection.
9. LED light module according to any claim from 1 to 6, it is characterised in that: the metal plate
Non-recessed place is equipped with through-hole, and the metal plate is fixed by screws on radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822096931.2U CN209708967U (en) | 2018-12-13 | 2018-12-13 | A kind of LED light module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822096931.2U CN209708967U (en) | 2018-12-13 | 2018-12-13 | A kind of LED light module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209708967U true CN209708967U (en) | 2019-11-29 |
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ID=68637586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822096931.2U Active CN209708967U (en) | 2018-12-13 | 2018-12-13 | A kind of LED light module |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524374A (en) * | 2018-12-13 | 2019-03-26 | 麦科勒（滁州）新材料科技有限公司 | A kind of LED light module |
-
2018
- 2018-12-13 CN CN201822096931.2U patent/CN209708967U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109524374A (en) * | 2018-12-13 | 2019-03-26 | 麦科勒（滁州）新材料科技有限公司 | A kind of LED light module |
| CN109524374B (en) * | 2018-12-13 | 2024-03-12 | 麦科勒（滁州）新材料科技有限公司 | LED light-emitting module |
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