CN207967045U - One kind being based on ceramic substrate packaged high-power LED light source - Google Patents
One kind being based on ceramic substrate packaged high-power LED light source Download PDFInfo
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- CN207967045U CN207967045U CN201820157536.8U CN201820157536U CN207967045U CN 207967045 U CN207967045 U CN 207967045U CN 201820157536 U CN201820157536 U CN 201820157536U CN 207967045 U CN207967045 U CN 207967045U
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Abstract
The utility model discloses one kind being based on ceramic substrate packaged high-power LED light source,Including fixed pedestal,Heat-dissipating aluminium plate is installed on fixed pedestal,Aluminum nitride ceramic substrate is fixed on heat-dissipating aluminium plate,If being supported by ltcc substrate by bar rectangle copper post at the top of aluminium nitride ceramics base,Aluminium nitride ceramics base is fixed with LED chip by insulating heat-conductive glue-line,Positive plate and negative plate are installed in LED chip,The inside of ltcc substrate is equipped with positive line layer and anode circuit layer,Heat when LED chip works on its lamp body,In luminous heat transfer to aluminum nitride ceramic substrate,Heat on LED core plate electrode and circuit is successively from ltcc substrate,Rectangle copper post and heat conduction silicone are transmitted on aluminium nitride substrate,Then it is dissipated in heat transfer to heat-dissipating aluminium plate,LED life is long,It shines more stable,The design of through-hole considerably increases the heat dissipation area of aluminium sheet,It is more that aluminium sheet carries heat,Multiple LED chips can be installed on aluminum nitride ceramic substrate,Suitable for high-power LED light source.
Description
Technical field
The utility model is related to LED light source domains, specially a kind of to be based on ceramic substrate packaged high-power LED light source.
Background technology
With the continuous improvement of LED chip power, the heat dissipation problem that great power LED is faced is also more serious.With white heat
Temperature unlike lamp, halogen tungsten lamp increases non-but not increases efficiency, and junction temperature rising can significantly decline efficiency, higher junction temperature
Device light output but will be made obviously to decay at any time, and make service life reduction.It is long, efficient excellent that LED life can thus be lost
Point.Due to the height of junction temperature of chip directly influences LED light extraction efficiency, coloration drift out with the parameters such as device lifetime, how to improve
Packaging heat-sinking capability reduces chip temperature as the key technique solved is badly in need of in high power LED structure design.
Using area source technology, heat dissipation problem can be preferably solved.Compared with direct insertion and SMD encapsulation technologies, area source
Encapsulation can not only save space, simplify packaging operation, and can also directly be radiated by substrate, to have more efficient heat
Transfer mode.In addition, area source encapsulation does not need Reflow Soldering, so as to avoid high temperature from damaging chip；Simultaneously as
It is simple for process, also reduce cost.
But existing LED light source has the following defects：
(1) most of LED light sources in the market due to power it is larger, so many LED chips are concentrated in together, LED
That light source itself is heat sink is small, thermal capacitance is small, and complicated, and in production, efficiency is low and quality abnormal easily occurs, and LED product is logical
It is often that plurality of LEDs chip is welded on aluminium or copper base and arranges in pairs or groups corresponding radiator again to radiate to LED, thereby results in lamps and lanterns
It is complicated, volume is relatively large, cost is high；
(2) there are many at present using aluminium oxide ceramic substrate to LED light source heat-dissipating, and when LED chip work,
The heat of generation is generally divided into three kinds：Body self-heating cooking, the current heating to emit light and heat with telegraph circuit, and ceramic substrate is general only
It contacts, therefore the heat transfer of the luminous heat of LED chip and ontology can only be walked, LED chip with LED chip bottom surface and side
On circuit fever can not transmit or dissipate well, to make circuit be easy to burn or make the electrode pads in LED chip
Melt, to cause the open circuit of LED light source.
Invention content
In order to overcome the shortcomings of that prior art, the utility model provide a kind of based on ceramic substrate packaged high-power
LED light source, heat when LED chip works on its lamp body, in luminous heat transfer to aluminum nitride ceramic substrate, LED chip
Heat on electrode and circuit is transmitted to from ltcc substrate, rectangle copper post and heat conduction silicone on aluminium nitride substrate successively, then
It is dissipated in heat transfer to heat-dissipating aluminium plate, LED life is long, shines more stable, and the design of through-hole considerably increases dissipating for aluminium sheet
Hot area, aluminium sheet carrying heat is more, and multiple LED chips can be installed on aluminum nitride ceramic substrate, is suitable for high-power LED light source,
It can effectively solve the problem that the problem of background technology proposes.
Technical solution adopted by the utility model to solve its technical problems is：
One kind being based on ceramic substrate packaged high-power LED light source, including fixed pedestal, is fixedly mounted on the fixed pedestal
There is heat-dissipating aluminium plate, aluminum nitride ceramic substrate is fixed on the heat-dissipating aluminium plate；
It is equipped with several square grooves and light-source encapsulation slot at the top of the aluminum nitride ceramic substrate, square is inserted in the square groove
Shape copper post, the rectangle copper post top described in several are supported by ltcc substrate, are led by insulation in the light-source encapsulation slot jointly
Hot glue layer is fixed with LED chip；
Positive plate and negative plate are installed, the inside of the ltcc substrate passes through two line slots point in the LED chip
Positive line layer and anode circuit layer be not installed, the positive plate and negative plate by gold thread respectively with positive line layer and
Anode circuit layer is connected.
Further, horizontal on the heat-dissipating aluminium plate to be equipped with several through-holes, light is installed on the aluminum nitride ceramic substrate
Source lens.
Further, the ltcc substrate is connected by adhesive glue with rectangle copper post, and the ltcc substrate bottom end passes through
Heat conduction silicone is connected with aluminum nitride ceramic substrate.
Further, the ltcc substrate is equipped with several chip slots, and the LED chip is plugged in chip slot.
Compared with prior art, the utility model has the beneficial effects that：
(1) heat when LED chip work of the utility model on its lamp body is directly delivered on aluminum nitride ceramic substrate,
The luminous heat of LED chip is transmitted to by insulating heat-conductive glue-line on aluminum nitride ceramic substrate, and on LED core plate electrode and circuit
Heat be transmitted on aluminium nitride substrate from ltcc substrate, rectangle copper post and heat conduction silicone successively, aluminium nitride substrate finally will
Heat transfer is on heat-dissipating aluminium plate, and to pass various heats in LED chip well, LED life is long, shines more
Stablize；
(2) design of through-hole considerably increases the heat dissipation area of aluminium sheet on the heat-dissipating aluminium plate of the utility model, and through-hole with
Contacting external air is quickly dissipated out of its side and through-hole in the heat of wind brushed on lower aluminum sheet, to carry significantly
High radiating efficiency, the heat dissipation capacity of aluminium sheet is more in the unit interval, and the heat of carrying is also just more, makes to pacify on aluminum nitride ceramic substrate
More LED chips are filled, high-power LED light source is suitable for, it is simple in structure, it is at low cost.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model.
Figure label：
1- fixed pedestals；2- heat-dissipating aluminium plates；3- aluminum nitride ceramic substrates；4- rectangle copper posts；5-LTCC substrates；6- insulation is led
Hot glue layer；7-LED chips；8- gold threads；9- through-holes；10- heat conduction silicones；11- light lens；12- adhesive glues；
301- square grooves；302- light-source encapsulation slots；
501- anode line layers；502- anode circuit layers；503- chip slots；
701- positive plates；702- negative plates.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
As shown in Figure 1, the utility model, which provides one kind, being based on ceramic substrate packaged high-power LED light source, including fixation
Pedestal 1, is installed with heat-dissipating aluminium plate 2 on the fixed pedestal 1, horizontal on the heat-dissipating aluminium plate 2 to be equipped with several through-holes 9, leads to
The design in hole 9 increases the heat dissipation area of heat-dissipating aluminium plate 2, and radiation aluminium is saved under the strength conditions for not influencing heat-dissipating aluminium plate 2
The material and quality of plate 2, heat can quickly come out out of the side of heat-dissipating aluminium plate 2 and through-hole 9, through-hole 9 and lateral limiting sulcus
It is logical, if in the case where there is wind, when in wind to through-hole 9, the radiating efficiency of heat-dissipating aluminium plate 2 can be greatly improved.
Aluminum nitride ceramic substrate 3 is fixed on the heat-dissipating aluminium plate 2, aluminum nitride ceramic substrate 3 shines LED chip 7
The heat of heat, the heat of ontology and electrode passes to heat-dissipating aluminium plate 2, is obtained to make the heat in LED chip 7 distribute speed
To rapid promotion, LED light source service life is long, more stable.
Aluminum nitride ceramic substrate 3 is made by aluminium nitride ceramics, and aluminium nitride ceramics is a kind of novel electronic ceramics material
Material, due to thermal conductivity is high, linear expansion coefficient is matched with silicon, good mechanical property, excellent electrical properties and the overall merits such as nontoxic,
It is considered as optimal baseplate material, the heat sinking benefit of aluminum nitride ceramic substrate 3 is notable, and then LED chip 7 can be substantially improved
Service life.
3 top of the aluminum nitride ceramic substrate is equipped with several square grooves 301 and light-source encapsulation slot 302, the square groove 301
It is inside inserted with rectangle copper post 4, the bottom end of rectangle copper post 4 only has 1-2mm apart from the top surface of heat-dissipating aluminium plate 2, to make ltcc substrate 5
On heat can quickly be reached on heat-dissipating aluminium plate 2 across aluminium nitride substrate 3, improve the ltcc substrate 5 i.e. heat of circuit board
Amount, speed is distributed to substantially increase the heat of electrode of LED chip 7, and the solder joint on electrode is not easy to melt, and LED chip 7 is sent out
Light is more stable, and 4 top of rectangle copper post described in several is supported by ltcc substrate 5 jointly.
The ltcc substrate 5 is connected by adhesive glue 12 with rectangle copper post 4, top surface and the ltcc substrate 5 of rectangle copper post 4
It is in direct contact, the heat on ltcc substrate 5 can quickly, be directly transmitted in rectangle copper post 4, and rate of heat transfer is fast, ltcc substrate 5
On heat transfer velocity it is fast.
5 bottom end of the ltcc substrate is connected by heat conduction silicone 10 with aluminum nitride ceramic substrate 3, does not pass through rectangle copper
The heat on ltcc substrate 5 that column 4 transfers away, which is transmitted to from heat conduction silicone 10 on aluminum nitride ceramic substrate 3, increases LTCC bases
The heat dissipation area and radiating efficiency of plate 5, and ltcc substrate 5 is tightly secured on aluminum nitride ceramic substrate 3 by heat conduction silicone 10,
Heat conduction silicone 10 also has elasticity, is hardly damaged when ltcc substrate 5 or LED chip 7 being made to be under pressure.
The ltcc substrate 5 is equipped with several chip slots 503, and the LED chip 7 is plugged in chip slot 503, LED core
The top of piece 7 is pierced by chip slot 503, so that the light that LED chip is sent out is not stopped by ltcc substrate 5, and 7 bottom of LED chip
The heat in portion and luminous heat can be more easily transmitted on silicon nitride ceramic substrate 3.
Preferably：5 full name low-temperature co-fired ceramic substrate of ltcc substrate, compared with other integrated technologies, ltcc substrate 5 has
Many merits：The flexibility of circuit design can be increased, be adapted to high current and high-temperature stability requirement, standby than common
The more excellent heat conductivity of PCB circuit boards, the heat dissipation design for greatly optimizing electronic equipment, reliability are high, can be applied to
Adverse circumstances extend the service life of LED light source.
LED chip 7 is fixed with by insulating heat-conductive glue-line 6 in the light-source encapsulation slot 302, is installed in the LED chip 7
There are positive plate 701 and negative plate 702, the inside of the ltcc substrate 5 to be separately installed with positive line layer by two line slots
501 and anode circuit layer 502, positive line layer 501 and anode circuit layer 502 are mutually isolated, do not interfere with each other, the positive plate
701 and negative plate 702 be connected respectively with positive line layer 501 and anode circuit layer 502 by gold thread 8.
Electrode adstante febre in LED chip 7, the heat in LED chip 7 are transmitted to positive and negative line layer by gold thread 8
In, then line layer transfers heat to ltcc substrate 5.LECC substrates 5 have good thermal conductivity, it is by two line layers
Most of heat is transmitted to from rectangle copper post 4 on aluminum nitride ceramic substrate 3, and remaining a part of heat is transmitted from heat conduction silicone 10
Onto aluminum nitride ceramic substrate 3, the electrode heat in LED chip 7 is enable soon to be distributed, radiating efficiency is high.
7 bottom end of LED chip is in direct contact with silicon nitride ceramic substrate 3, increases contact area, and the ontology of LED chip 7 dissipates
Thermal velocity is faster.When LED chip 7 works, the heat that the light that sends out distributes passes to silicon nitride ceramic substrate from insulating heat-conductive glue-line 6
Plate 3, and the heat that 7 bottom body of LED chip is sent out directly is directly delivered to silicon nitride ceramic substrate 3 from 7 bottom of LED chip
On, to make the radiating efficiency of LED chip 7, faster 7 service life of LED chip is long.
Light lens 11 are installed on the aluminum nitride ceramic substrate 1, light lens 11 cover in all LED chips 7, and
11 top of light lens is the arc surface to raise up, and light lens 11 can play the protective effect to LED chip 7, also can
The light that LED chip 7 is sent out is set more to concentrate, to keep the light efficiency higher of LED chip, the light that LED light source is sent out more bright.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing in the equivalent requirements of the claims will be fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
Claims (4)
1. one kind being based on ceramic substrate packaged high-power LED light source, including fixed pedestal (1), it is characterised in that：The fixed base
It is installed with heat-dissipating aluminium plate (2) on seat (1), aluminum nitride ceramic substrate (3) is fixed on the heat-dissipating aluminium plate (2)；
Several square grooves (301) and light-source encapsulation slot (302), the square groove are equipped at the top of the aluminum nitride ceramic substrate (3)
(301) it is inserted with rectangle copper post (4) in, rectangle copper post (4) top described in several is supported by ltcc substrate (5), institute jointly
It states in light-source encapsulation slot (302) and LED chip (7) is fixed with by insulating heat-conductive glue-line (6)；
Positive plate (701) and negative plate (702) are installed, the inside of the ltcc substrate (5) passes through on the LED chip (7)
Two line slots are separately installed with positive line layer (501) and anode circuit layer (502), the positive plate (701) and negative plate
(702) it is connected respectively with positive line layer (501) and anode circuit layer (502) by gold thread (8).
2. according to claim 1 a kind of based on ceramic substrate packaged high-power LED light source, it is characterised in that：It is described to dissipate
It is horizontal on hot aluminium sheet (2) to be equipped with several through-holes (9), light lens (11) are installed on the aluminum nitride ceramic substrate (3).
3. according to claim 1 a kind of based on ceramic substrate packaged high-power LED light source, it is characterised in that：It is described
Ltcc substrate (5) is connected by adhesive glue (12) with rectangle copper post (4), and ltcc substrate (5) bottom end passes through heat conductive silica gel
Layer (10) is connected with aluminum nitride ceramic substrate (3).
4. according to claim 1 a kind of based on ceramic substrate packaged high-power LED light source, it is characterised in that：It is described
Ltcc substrate (5) is equipped with several chip slots (503), and the LED chip (7) is plugged in chip slot (503).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820157536.8U CN207967045U (en) | 2018-01-30 | 2018-01-30 | One kind being based on ceramic substrate packaged high-power LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820157536.8U CN207967045U (en) | 2018-01-30 | 2018-01-30 | One kind being based on ceramic substrate packaged high-power LED light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207967045U true CN207967045U (en) | 2018-10-12 |
Family
ID=63734306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820157536.8U Expired - Fee Related CN207967045U (en) | 2018-01-30 | 2018-01-30 | One kind being based on ceramic substrate packaged high-power LED light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207967045U (en) |
-
2018
- 2018-01-30 CN CN201820157536.8U patent/CN207967045U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181012 Termination date: 20210130 |
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| CF01 | Termination of patent right due to non-payment of annual fee |