CN205692856U - Upside-down mounting lens type metal basal board LED encapsulation structure - Google Patents
Upside-down mounting lens type metal basal board LED encapsulation structure Download PDFInfo
- Publication number
- CN205692856U CN205692856U CN201620543845.XU CN201620543845U CN205692856U CN 205692856 U CN205692856 U CN 205692856U CN 201620543845 U CN201620543845 U CN 201620543845U CN 205692856 U CN205692856 U CN 205692856U
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- metallic plate
- upside
- type metal
- encapsulation structure
- down mounting
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Abstract
The utility model discloses a kind of upside-down mounting lens type metal basal board LED encapsulation structure, it is characterized in that: include the first metallic plate, the second metallic plate, LED wafer, convex lens, insulant filling slot is set between the first metallic plate and the second metallic plate, fill insulant in insulant filling slot, LED wafer connects the first metallic plate and the second metallic plate respectively by two legs, and convex lens covers LED wafer.This utility model thermal diffusivity is good, and encapsulation is convenient.
Description
Technical field
This utility model relates to a kind of LED encapsulation structure, belongs to LED technical field.
Background technology
LED is a photoelectric cell, and in its work process, the electric energy of only 10%-40% is converted into luminous energy, remaining electric energy
Nearly all it is converted into heat energy, makes the temperature of LED raise.LED intensification is the main cause of LED performance degradation and inefficacy.
In great power LED, heat radiation is a big problem, and as being not added with cooling measure, then the wick temperature of great power LED can be anxious
Speed rises, and when its temperature is increased beyond maximum allowable temperature (usually 150 DEG C), great power LED can damage because of overheated.
In order to make the convenient heat radiation of LED, LED module has one piece of substrate, and substrate is provided with LED light-emitting component, generally, substrate
For ceramic substrate or metal basal board.Owing to producing substantial amounts of heat when LED light-emitting component works, therefore, substrate needs possess
Good heat conduction, heat-sinking capability.Because of the reason for convenience of heat radiation, copper base has been applied in LED industry, but existing skill
The metal basal board of art is all the substrate as whole LED module, makes insulating barrier and line layer on metallic substrates, then at circuit
On layer, LED chip installed by some glue, and prior art solves heat dissipation problem from the angle of LED module substrate, improves radiating effect.But
Prior art does not solve the heat dissipation problem of LED chip point glue installation place.
Utility model content
In order to improve LED radiating effect further, postponing LED service life, it is saturating that this utility model provides a kind of upside-down mounting
Mirror metal basal board LED encapsulation structure, it uses metal basal board as the support of LED wafer, is favorably improved LED heat radiation effect
Really.
This utility model is realized by following technical proposals.
A kind of upside-down mounting lens type metal basal board LED encapsulation structure, it is characterised in that: include the first metallic plate, the second metal
Plate, LED wafer, convex lens, arrange insulant filling slot, insulant filling slot between the first metallic plate and the second metallic plate
Interior fill insulant, LED wafer connects the first metallic plate and the second metallic plate respectively by two legs, and convex lens covers
LED wafer.
Further preferably, convex lens spreads over the first metallic plate and the second metallic plate to both sides.
Further preferably, the upper surface of the first metallic plate and the second metallic plate is respectively equipped with groove, and groove contributes to convex lens
Mirror and the first metallic plate and the second metallic plate are firmly bonded.
Further preferably, described first metallic plate and the second metallic plate highly consistent, the right side of the first metallic plate is
Irregular, the left side of the second metallic plate is irregular, the right side of the first metallic plate and the left side of the second metallic plate
Between formed insulant filling slot.
Further preferably, the first metallic plate lower left corner arranges gap slot, and the lower right corner of the second metallic plate arranges gap slot.
Technique effect of the present utility model: use metal basal board to support LED wafer, it is possible to auxiliary LED wafer dispels the heat, simultaneously
First metallic plate and the second metallic plate are also as two electrodes of LED wafer, and the mode using convex lens to cover LED wafer is sent out
Light so that LED chip is connected more convenient with LED module substrate.This utility model unit cost is low, lumen cost
Low, high-density array, high heat conduction, Ultrathin packaging can be realized, the LED of single product can be selected as required to encapsulate quantity.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present utility model.
Detailed description of the invention
Further illustrate this utility model below in conjunction with the accompanying drawings.
As it is shown in figure 1, a kind of upside-down mounting lens type metal basal board LED encapsulation structure, including first metallic plate the 1, second metal
Plate 2, LED wafer 3, convex lens 5, arrange insulant filling slot, insulant between the first metallic plate 1 and the second metallic plate 2
Fill insulant in filling slot, LED wafer 3 connects the first metallic plate 1 and the second metallic plate 2 respectively by two legs 4, convex
Lens 5 cover LED wafer 3.
More particularly, convex lens 5 spreads over the first metallic plate 1 and the second metallic plate 2 to both sides.More particularly,
The upper surface of the first metallic plate 1 is provided with groove, and the upper surface of the second metallic plate 2 is provided with groove, because being provided with groove-like figure,
The first metallic plate 1 and the second metallic plate 2 and the adhesion of convex lens 5 can be increased, improve the stability of LED structure.
More particularly, described first metallic plate 1 is highly consistent with the second metallic plate 2, the right side of the first metallic plate 1
Being irregular, the left side of the second metallic plate 2 is irregular, the right side of the first metallic plate 1 and a left side for the second metallic plate 2
Between end face, fill insulant forms insulating barrier.The left side of the first metallic plate 1 and the second metallic plate 2 is irregular, can
Increase insulating barrier and the first metallic plate 1 and adhesion of the second metallic plate 2.
The material of described first metallic plate 1 and the second metallic plate 2 is copper.First metallic plate 1 and the second metallic plate 2 not only rise
To thermolysis, also as electrode.
More particularly, first metallic plate 1 lower left corner arranges gap slot, and the lower right corner of the second metallic plate 2 arranges gap slot,
It is easy to follow-up LED module packaging.
Claims (5)
1. a upside-down mounting lens type metal basal board LED encapsulation structure, it is characterised in that: include the first metallic plate, the second metallic plate,
LED wafer, convex lens, arrange insulant filling slot, in insulant filling slot between the first metallic plate and the second metallic plate
Fill insulant, LED wafer connects the first metallic plate and the second metallic plate respectively by two legs, and convex lens covers LED
Wafer.
Upside-down mounting lens type metal basal board LED encapsulation structure the most according to claim 1, it is characterised in that: convex lens is to two
While spread over the first metallic plate and the second metallic plate.
Upside-down mounting lens type metal basal board LED encapsulation structure the most according to claim 1, it is characterised in that: the first metallic plate
It is respectively equipped with groove with the upper surface of the second metallic plate.
Upside-down mounting lens type metal basal board LED encapsulation structure the most according to claim 1, it is characterised in that: described first gold medal
Belonging to the highly consistent of plate and the second metallic plate, the right side of the first metallic plate is irregular, and the left side of the second metallic plate is
Irregular, form insulant filling slot between right side and the left side of the second metallic plate of the first metallic plate.
Upside-down mounting lens type metal basal board LED encapsulation structure the most according to claim 1, it is characterised in that: the first metallic plate
The lower left corner arranges gap slot, and the lower right corner of the second metallic plate arranges gap slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620543845.XU CN205692856U (en) | 2016-06-07 | 2016-06-07 | Upside-down mounting lens type metal basal board LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620543845.XU CN205692856U (en) | 2016-06-07 | 2016-06-07 | Upside-down mounting lens type metal basal board LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205692856U true CN205692856U (en) | 2016-11-16 |
Family
ID=57259931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620543845.XU Expired - Fee Related CN205692856U (en) | 2016-06-07 | 2016-06-07 | Upside-down mounting lens type metal basal board LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205692856U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110447110A (en) * | 2017-08-25 | 2019-11-12 | 惠州科锐半导体照明有限公司 | Multiple LED light source lens designs in integration packaging |
| CN112382715A (en) * | 2020-10-15 | 2021-02-19 | 泉州三安半导体科技有限公司 | Light emitting device |
-
2016
- 2016-06-07 CN CN201620543845.XU patent/CN205692856U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110447110A (en) * | 2017-08-25 | 2019-11-12 | 惠州科锐半导体照明有限公司 | Multiple LED light source lens designs in integration packaging |
| CN112382715A (en) * | 2020-10-15 | 2021-02-19 | 泉州三安半导体科技有限公司 | Light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161116 Termination date: 20170607 |