CN205900594U - High insulating LED photo engine packaging structure of high heat conduction - Google Patents
High insulating LED photo engine packaging structure of high heat conduction Download PDFInfo
- Publication number
- CN205900594U CN205900594U CN201620865741.0U CN201620865741U CN205900594U CN 205900594 U CN205900594 U CN 205900594U CN 201620865741 U CN201620865741 U CN 201620865741U CN 205900594 U CN205900594 U CN 205900594U
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- CN
- China
- Prior art keywords
- heat conduction
- led
- circuit
- wiring board
- bonding
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a high insulating LED photo engine packaging structure of high heat conduction and preparation method, this packaging structure include radiator, heat -conducting glue, circuit board, the fixed glue of heat conduction, protection silica gel, bonding line, LED driver chip, and the heat -conducting glue is located between the bottom and radiator of circuit board, the top of circuit board is equipped with a groove, LED driver chip through heat conduction fixed glue fixed mounting in the inslot, circuit board top surface is equipped with gilding copper foil circuit, and this gilding copper foil circuit plywood passes through bonding line and LED driver chip circuit connection, and protection silica gel is located in the space that LED driver chip, bonding line and circuit board formed for LED driver chip and bonding line are not exposed.
Description
Technical field
This utility model is related to package structure for LED field, more particularly, to package structure for LED.
Background technology
Led photo engine is formed by the led driving power supply being arranged on wiring board and led luminescent device.In current led
In the making of photo engine, led driving power supply commonly uses packaged integrated circuit, completes by smt technique to assemble.Typically come
Say, be all using smt technique, led integrated circuit to be fixed in the circuit board, complete circuit function.But this wiring board is by putting down
The rigidity to support wiring board for the whole aluminium substrate, intermediate layer is nonconducting filler, and upper strata is copper foil circuit layer.As figure
Shown in 1, led driving chip 6 is encapsulated on the right angle with a pin 12 and fixes this led driving chip with heat conduction fixing glue
6, then set up led driving chip 6 with bonding line 5 and be connected with the circuit of the pin 12 on support 14, periphery colloid makes one
Individual housing protects internal circuit, that is to say integrated circuit.Using smt technique, this integrated circuit is fixed on a circuit in application end
On plate, complete circuit function, this wiring board lower floor is smooth aluminium substrate, intermediate layer is nonconducting implant, and upper strata is
Three layers of composition of Copper Foil, thus set up circuit connect.The passage of the radiating of this structure is led driving chip 6- heat conduction fixing glue 2-
Support 14- insulation filler 13- aluminium sheet 9- heat-conducting glue 7- radiator 8, this heat dissipation channel will lead to heat transfer through six kinds of materials
Path length, impact radiating.In addition, the heat conductivility of insulation filler 13 is bad, further result in the radiating of led driving chip 6
Performance is bad.And adopt other to arrive the preferable megohmite insulant of heat conductivity, such as diamond, but this material manufacture difficulty big or from
So boundary is rare, and practicality is fewer, and the commercial economy not possessing use is worth.
When led driving chip works, internal mos manages ceaselessly switch, can produce substantial amounts of heat it is necessary to incite somebody to action
Unnecessary heat spreader out it is ensured that the material of internal drive chip not affected by the high temperature occur electric property change, its
Heat dissipation channel is longer, is unfavorable for radiating, thus leading to IC interior temperature too high, works long hours so that product and its not
Stable.
In addition, led driving chip is packaged into integrated circuit first, then to using smt technique, integrated circuit is being put
It is placed on wiring board, the package casing of this integrated circuit mostly is black, and impact led photo engine goes out light quality.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model there are provided a kind of high insulation of high heat conduction
Led photo engine encapsulating structure, it can solve the problem that the problem under the low thermal conductivity of led photo engine encapsulating structure in prior art.
The purpose of this utility model employs the following technical solutions realization:
This utility model provides a kind of led photo engine encapsulating structure of the high insulation of high heat conduction, including radiator, heat conduction
Glue, wiring board, heat conduction fixing glue, protection silica gel, bonding line, led chip and gold-plated copper foil circuit；Wherein heat-conducting glue is located at line
Between the bottom of road plate and radiator top, the top of described wiring board is provided with a groove, and led chip is fixed by heat conduction fixing glue
It is installed in described groove, the top surface of described wiring board is provided with gold-plated copper foil circuit, this gold-plated copper foil circuit passes through bonding line
It is electrically connected with led driving chip, protect silica gel in the space that led driving chip, bonding line and wiring board are formed,
Make led driving chip and bonding line not exposed.
Preferably, described wiring board is ceramic circuit-board.
Preferably, described bonding line is bonding gold thread, bonding alloy line, linking copper wire and is bonded one of aluminum steel.
Compared to existing technology, the beneficial effects of the utility model are: this utility model directly by led driving chip located at
So that the heat dissipation channel of led driving chip is shorter, heat transfer path is less on one application circuit plate, that is to say led driving chip
Heat dispersion more preferable.In addition, this wiring board also adopts ceramic circuit-board, ceramic circuit-board has the spy of high insulation high heat conduction
Property, therefore do not need to add insulation filler between assist side and radiator, further reduce the path of heat transfer.Separately
Outward, the shell of this led driving chip is using transparent or white silica gel, is not as black housing used in prior art, no
Influence whether the luminous mass of led driving chip.
Brief description
The profile of a kind of existing led photo engine encapsulating structure that Fig. 1 provides for this utility model；
The profile of the embodiment that Fig. 2 provides for this utility model.
In figure: 1, wiring board；2nd, heat conduction fixing glue；3rd, gold-plated copper foil circuit laminate；4th, protect silica gel；5th, bonding line；6、
Led driving chip；7th, heat-conducting glue；8th, radiator；9th, aluminium sheet；11st, black protective housing；12nd, pin；13rd, insulation filler；
14th, support.
Specific embodiment
Below, in conjunction with accompanying drawing and specific embodiment, this utility model is described further:
As shown in Fig. 2 the utility model discloses a kind of led photo engine encapsulating structure of the high insulation of high heat conduction, it includes
One wiring board 1, led driving chip 6 and radiator 8, the bottom of described wiring board 1 and described radiator 8 pass through heat-conducting glue 7 even
Connect, the top of described wiring board 1 offers a groove, and described led driving chip 6 is installed in described groove by fixing glue, this is solid
Determining glue is heat conduction fixing glue 2, and outer the placing of assist side 1 is provided with gold-plated copper foil circuit laminate 3, this gold-plated copper foil circuit layer
Plate 3 is electrically connected with led driving chip 6 by bonding line 5.It is provided with the top of led driving chip 6 and wiring board 1, groove
Protection silica gel 4, so that led driving chip 6, bonding line 5, heat conduction fixing glue 2 etc. are in an airtight space, this guarantor
Shield silica gel 4 plays the effect of protection to led driving chip 6 and bonding line 5.So, after led driving chip 6 generates heat, its heat
The process of amount transmission is exactly led driving chip 6- heat conduction fixing glue-wiring board 1- heat-conducting glue 7- radiator 8, its heat transfer path
The shortest.In addition, wiring board 1 adopts ceramic circuit-board, its heat conductivity 25w/m.k, than conventional pcb plate heat conductivity at least
Improve more than 8 times, therefore this led its heat conductivility of photo engine encapsulating structure is more preferable.Described wiring board 1 also can be using other gold
Belong to wiring board.Described bonding line 5 can be bonding gold thread, bonding alloy line, linking copper wire or bonding aluminum steel etc..
This utility model is directly led driving chip to be encapsulated on ceramic circuit-board, eliminates unnecessary shelf layer, contracting
The short passage of heat, heat transfer path shortens.Ceramic wafer has the feature of high insulating property it is not necessary to as metal basal board simultaneously
Add insulating barrier to be electrically insulated, further shorten heat transfer path.This utility model uses transparent or white protection silicon
Glue is protecting led driving chip, more much better than black protective housing used in prior art.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various
Corresponding change and deformation, and all these change and deformation all should belong to the protection of this utility model claim
Within the scope of.
Claims (3)
1. a kind of led photo engine encapsulating structure of the high insulation of high heat conduction is it is characterised in that include radiator, heat-conducting glue, circuit
Plate, heat conduction fixing glue, protection silica gel, bonding line, led chip；Wherein heat-conducting glue is located at the bottom of wiring board and radiator top
Between, the top of described wiring board is provided with a groove, and led chip is fixedly installed in described groove by heat conduction fixing glue, described line
The top surface of road plate is provided with gold-plated copper foil circuit, and this gold-plated copper foil circuit is passed through bonding line and is electrically connected with led driving chip,
Protection silica gel is in the space that led driving chip, bonding line and wiring board are formed so that led driving chip and key
Zygonema is not exposed.
2. the led photo engine encapsulating structure of the high insulation of high heat conduction as claimed in claim 1 is it is characterised in that described wiring board is
Ceramic circuit-board.
3. the led photo engine encapsulating structure of the high insulation of high heat conduction as claimed in claim 1 is it is characterised in that described bonding line is
One of bonding gold thread, bonding alloy line, linking copper wire and bonding aluminum steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620865741.0U CN205900594U (en) | 2016-08-10 | 2016-08-10 | High insulating LED photo engine packaging structure of high heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620865741.0U CN205900594U (en) | 2016-08-10 | 2016-08-10 | High insulating LED photo engine packaging structure of high heat conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205900594U true CN205900594U (en) | 2017-01-18 |
Family
ID=57781813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620865741.0U Active CN205900594U (en) | 2016-08-10 | 2016-08-10 | High insulating LED photo engine packaging structure of high heat conduction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205900594U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
-
2016
- 2016-08-10 CN CN201620865741.0U patent/CN205900594U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098919A (en) * | 2016-08-10 | 2016-11-09 | 广州硅能照明有限公司 | High-thermal-conductivity and high-insulation LED light engine packaging structure and preparation method |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 510000 Room 201, building A4, No. 11, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong Patentee after: Silicon energy photoelectric semiconductor (Guangzhou) Co.,Ltd. Address before: 510000 second floor, building A4, No. 11, Kaiyuan Avenue, Science City, Guangzhou Development Zone, Guangzhou, Guangdong Patentee before: GUANGZHOU LEDTEEN OPTOELECTRONICS Co.,Ltd. |