CN203631589U - Inverted LED packaging structure and LED lamp strip - Google Patents
Inverted LED packaging structure and LED lamp strip Download PDFInfo
- Publication number
- CN203631589U CN203631589U CN201320614488.8U CN201320614488U CN203631589U CN 203631589 U CN203631589 U CN 203631589U CN 201320614488 U CN201320614488 U CN 201320614488U CN 203631589 U CN203631589 U CN 203631589U
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- China
- Prior art keywords
- led
- glass
- encapsulating structure
- type electrode
- lamp bar
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Led Device Packages (AREA)
Abstract
The utility model discloses an inverted LED packaging structure. The inverted LED packaging structure includes a glass substrate, at least one LED chip and a protective layer; the bottom of each LED chip is provided with an N electrode and a P electrode; the N electrodes and the P electrodes are respectively connected with one surface of the glass substrate; and the protective layer wraps the LED chips. According to the inverted LED packaging structure of the utility model, a light source of the LED packaging structure can be fully utilized, and all-direction light emission can be realized; and further, the glass substrate has high heat resistance, high temperature resistance and good heat dissipation performance, and therefore, the service life of an LED lamp strip can be prolonged to a certain extent.
Description
Technical field
The utility model relates to LED field, relates in particular to a kind of LED encapsulating structure and LED lamp bar of upside-down mounting.
Background technology
Existing LED lamp bar, because the power density of LED encapsulating structure is very high, this just needs the designer of LED encapsulating structure device and producer to be optimized meter to cooling system at aspects such as structure and materials.
Along with the exploitation gradually of high-power LED chip, also be developed for effectively discharging the hot technology that LED chip produces thereupon, in order more to improve the radiating efficiency of LED chip, the wiring board of encapsulation is made by metal material conventionally, for preventing producing short circuit in the time that LED chip is installed, on metal substrate, form after insulating barrier, by the circuit board being formed on insulating barrier, LED chip is installed, and is realized electrical connection by wire-bonded etc.
But therefore the poor thermal conductivity of the insulating barrier forming on metal substrate, even if used metal substrate also cannot avoid the problem that thermal conductivity is low.
Therefore, if the heat radiation of LED chip cannot normally realize, as a kind of LED chip of semiconductor device, because heat radiation wavelength changes, thereby the emission efficiency that produces yellowing phenomenon or light can reduce, and while at high temperature operation, the life-span of LED encapsulation may shorten, thereby to be improved be the core of encapsulating structure and technique to the structure that the heat that LED chip is produced dispels the heat.
And also great majority employing PCB wiring boards of the wiring board of current LED lamp bar, it does not have light transmission yet.Cannot accomplish that LED packaging body is omnibearing luminous.
Utility model content
The purpose of this utility model is encapsulating structure and the LED lamp bar of the LED that a kind of upside-down mounting is provided, and it can realize the luminous in all directions of LED.
For achieving the above object, the utility model is by the following technical solutions:
A LED encapsulating structure for upside-down mounting, comprising: substrate of glass, at least one LED chip and protective layer; Wherein the bottom of each LED chip is provided with N-type electrode and P type electrode, and described N-type electrode is connected with the one side of substrate of glass respectively with P type electrode; Described protective layer is wrapped on LED chip.
Preferably, described N-type electrode and P type electrode respectively by scolder be connected, eutectic connects or die bond connects and is connected with the one side of substrate of glass.
Preferably, the LED encapsulating structure of described upside-down mounting also comprises phosphor powder layer, and described phosphor powder layer is located between LED chip and protective layer.
Preferably, the LED encapsulating structure of described upside-down mounting also comprises phosphor powder layer, and described phosphor powder layer is located on substrate of glass another side.
A LED lamp bar for upside-down mounting, comprising: the LED encapsulating structure of multiple upside-down mountings and glass wiring board, and the LED encapsulating structure of described upside-down mounting comprises: substrate of glass, at least one LED chip and protective layer; Wherein the bottom of each LED chip is provided with N-type electrode and P type electrode, and described N-type electrode is connected with the one side of substrate of glass respectively with P type electrode; Described protective layer is wrapped on LED chip; The LED encapsulating structure of described each upside-down mounting is connected with the one side of described glass wiring board.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between each LED chip and protective layer.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located on the another side of glass wiring board.
Preferably, the end face of described LED lamp bar is also provided with protector plate for glass, and described protective layer is filled in the gap place between glass wiring board and protector plate for glass.
Preferably, described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED encapsulating structure.
Preferably, described LED encapsulating structure is fixed on glass wiring board by tin cream.
Preferably, described N-type electrode and P type electrode respectively by scolder be connected, eutectic connects or die bond connects and is connected with the one side of substrate of glass.
Preferably, above-mentioned arbitrary described LED lamp bar is filled with colloid between substrate of glass and glass wiring board.
The utility model adopts above technical scheme, by LED chip being encapsulated in substrate of glass and LED lamp strip adoption glass wiring board, so just can accomplish the omnibearing luminous of LED encapsulating structure, has improved the brightness of LED encapsulating structure; Another substrate of glass has higher heat-resisting and heat-resisting quantity, and it is in conjunction with the LED encapsulating structure of inverted structure, and the heat that LED chip is produced better more directly distributes by glass substrate and glass wiring board, has better heat dispersion.
Accompanying drawing explanation
Fig. 1 is the encapsulating structure schematic diagram of the LED of the utility model upside-down mounting;
Fig. 2 is the utility model LED lamp bar embodiment mono-structural representation;
Fig. 3 is the utility model LED lamp bar embodiment bis-structural representations;
Fig. 4 is the utility model LED lamp bar embodiment tri-structural representations;
Fig. 5 is the utility model LED lamp bar embodiment tetra-structural representations;
Fig. 6 is the utility model LED lamp bar embodiment five structural representations.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Example one:
As shown in Figure 1; the encapsulating structure of a kind of LED of upside-down mounting; it comprises: substrate of glass 1, LED chip 2 and a protective layer 4; wherein the bottom of each LED chip 2 is provided with N-type electrode 21 and P type electrode 22; described N-type electrode 21 and P type electrode 22 are fixed in the one side of substrate of glass 1 by scolder 3 respectively, and described protective layer 4 is wrapped on LED chip 2.In concrete application, described N-type electrode 21 also can be connected by eutectic respectively with P type electrode 22 or die bond connection is connected with the one side of substrate of glass 1.
As shown in Figure 2, the invention also discloses a kind of LED lamp bar of upside-down mounting, it comprises: glass wiring board 5; Be located at the LED encapsulating structure of the multiple upside-down mountings in glass wiring board 5 one sides: wherein every group of LED encapsulating structure comprises substrate of glass 1, a LED chip 2 and protective layer 4, wherein the bottom of each LED chip 2 is provided with N-type electrode 21 and P type electrode 22, described N-type electrode 21 and P type electrode 22 are fixed in the one side of substrate of glass 1 by scolder 3 respectively, and described protective layer 4 is wrapped on LED chip 2; It also comprises phosphor powder layer 6, and described phosphor powder layer 6 is located between LED chip 2 and protective layer 4, between substrate of glass 1 and glass wiring board 5, is filled with colloid 9.
In the present embodiment, between substrate of glass 1 and glass wiring board 5, can fill colloid 9 by bottom completion method, specifically can adopt one chemical glue (Main Ingredients and Appearance is epoxy resin) to fill carrying out bottom between substrate of glass 1 and glass wiring board 5, utilize the cured form of heating, make space, bottom large area fill up chemical glue, thereby reach the object of reinforcing, can strengthen like this anti-dropping capability of LED encapsulating structure and glass wiring board 5.
Embodiment bis-:
As shown in Figure 3, different from embodiment mono-, the LED lamp bar of embodiment bis-, its top at LED lamp bar is also provided with a protector plate for glass 8, and described protective layer 4 is filled in the gap place between glass wiring board and protector plate for glass 8.
Embodiment tri-:
As shown in Figure 4, different from embodiment mono-, the phosphor powder layer 6 in embodiment tri-is arranged on glass wiring board 5 on the face of LED encapsulating structure.
Embodiment tetra-:
As Fig. 5 shows; different from embodiment mono-is; LED lamp bar in embodiment tetra-; its top at LED lamp bar is also provided with a protector plate for glass 8; described protective layer 4 is filled in the gap place between glass wiring board 5 and protector plate for glass 8, and phosphor powder layer 6 is arranged on glass wiring board 5 and protector plate for glass 8 on the face of LED encapsulating structure.
Embodiment five:
As shown in Figure 6, different from embodiment mono-, the LED encapsulating structure of embodiment five, it is provided with two LED chips 2 on glass substrate 1.LED chip quantity on the utility model glass substrate 1 is not limited to two, the utility model is in concrete manufacturing process, can first in a substrate of glass, settle the LED chip of fixing many, then according to actual needs, this substrate of glass is divided into the LED encapsulating structure group of many groups, wherein the LED chip quantity on every group of LED encapsulating structure can need to determine according to practice.In the time that the LED chip quantity on every group of LED encapsulating structure is many, only need the head and the tail of this group LED encapsulating structure to be fixed just passable with glass wiring board, now, when LED chip quantity on every group of LED encapsulating structure is one relatively, reduce and needed fixing point, saved material and technique.
The utility model, by adopting substrate of glass 1, glass wiring board 5 and protector plate for glass 8, has been realized the omnibearing luminous of LED encapsulating structure, has improved the brightness of LED encapsulating structure; Glass wiring board has higher heat-resisting and heat-resisting quantity in addition, has extended to a certain extent the useful life of LED lamp bar.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (12)
1. a LED encapsulating structure for upside-down mounting, is characterized in that, comprising: substrate of glass, at least one LED chip and protective layer; Wherein the bottom of each LED chip is provided with N-type electrode and P type electrode, and described N-type electrode is connected with the one side of substrate of glass respectively with P type electrode; Described protective layer is wrapped on LED chip.
2. LED encapsulating structure according to claim 1, is characterized in that: described N-type electrode and P type electrode respectively by scolder be connected, eutectic connects or die bond connects and is connected with the one side of substrate of glass.
3. LED encapsulating structure according to claim 1, is characterized in that: the LED encapsulating structure of described upside-down mounting also comprises phosphor powder layer, and described phosphor powder layer is located between LED chip and protective layer.
4. LED encapsulating structure according to claim 1, is characterized in that: the LED encapsulating structure of described upside-down mounting also comprises phosphor powder layer, and described phosphor powder layer is located on substrate of glass another side.
5. a LED lamp bar for upside-down mounting, is characterized in that, comprising: the LED encapsulating structure of multiple upside-down mountings and glass wiring board, and the LED encapsulating structure of described upside-down mounting comprises: substrate of glass, at least one LED chip and protective layer; Wherein the bottom of each LED chip is provided with N-type electrode and P type electrode, and described N-type electrode is connected with the one side of substrate of glass respectively with P type electrode; Described protective layer is wrapped on LED chip; Wherein the LED encapsulating structure of each upside-down mounting is connected with the one side of described glass wiring board.
6. LED lamp bar according to claim 5, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between each LED chip and protective layer.
7. LED lamp bar according to claim 5, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located on the another side of glass wiring board.
8. LED lamp bar according to claim 5, is characterized in that: the end face of described LED lamp bar is also provided with protector plate for glass, described protective layer is filled in the gap place between glass wiring board and protector plate for glass.
9. LED lamp bar according to claim 8, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED encapsulating structure.
10. LED lamp bar according to claim 5, is characterized in that: described LED encapsulating structure is fixed on glass wiring board by tin cream.
11. LED encapsulating structures according to claim 5, is characterized in that: described N-type electrode is connected with the one side of substrate of glass by scolder, eutectic or die bond respectively with P type electrode.
12. according to the arbitrary described LED lamp bar of claim 5～11, it is characterized in that: between substrate of glass and glass wiring board, be filled with colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320614488.8U CN203631589U (en) | 2013-09-30 | 2013-09-30 | Inverted LED packaging structure and LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320614488.8U CN203631589U (en) | 2013-09-30 | 2013-09-30 | Inverted LED packaging structure and LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203631589U true CN203631589U (en) | 2014-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320614488.8U Expired - Fee Related CN203631589U (en) | 2013-09-30 | 2013-09-30 | Inverted LED packaging structure and LED lamp strip |
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| Country | Link |
|---|---|
| CN (1) | CN203631589U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105720174A (en) * | 2016-04-20 | 2016-06-29 | 漳州立达信光电子科技有限公司 | LED surface light source and preparation method thereof |
| WO2020160696A1 (en) * | 2019-02-10 | 2020-08-13 | 中山市蓝德电子有限公司 | Flexible led light bar |
| CN107039573B (en) * | 2016-02-04 | 2021-07-16 | 晶元光电股份有限公司 | Light-emitting element and method of manufacturing the same |
-
2013
- 2013-09-30 CN CN201320614488.8U patent/CN203631589U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107039573B (en) * | 2016-02-04 | 2021-07-16 | 晶元光电股份有限公司 | Light-emitting element and method of manufacturing the same |
| CN105720174A (en) * | 2016-04-20 | 2016-06-29 | 漳州立达信光电子科技有限公司 | LED surface light source and preparation method thereof |
| WO2020160696A1 (en) * | 2019-02-10 | 2020-08-13 | 中山市蓝德电子有限公司 | Flexible led light bar |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20180930 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |