CN203309836U - LED light source, backlight source and liquid crystal display device - Google Patents

Abstract

The utility model provides an LED light source, a backlight source and a liquid crystal display device, which belong to the technical field of light sources and can solve the problem of poor heat dissipation performance of LED light sources packaged directly on board in the prior art. The LED light source of the present utility model comprises: an LED chip for emitting light, a heat sink for conducting heat generated by the LED chip, and a circuit for driving the LED chip, and there is no arrangement between the LED chip and the heat sink The substrate, the radiator is made of ceramic material. Compared with the traditional LED light source, the LED light source of the utility model is directly fixed on the installation surface of the heat sink, and the substrate of the LED chip and the thermal conductive glue between the substrate and the heat sink are omitted, thereby improving the heat dissipation performance of the LED light source.

Description

A kind of LED light source, backlight source, liquid crystal display device

technical field

The utility model belongs to the technical field of light sources, in particular to an LED (light emitting diode) light source, a backlight source containing the LED light source and a liquid crystal display device. the

Background technique

The lighting device using LED as the light source has good energy-saving effect and long service life. With the popularization of high-power and high-integration LED light sources, the problem of how to improve the light efficiency and dissipate heat from the LED heat sink (radiator) in time is becoming more and more prominent. When the LED light source emits light, 80% of the power is emitted as heat energy. Poor heat dissipation will directly lead to the light decay of the LED light source. For example, when the temperature of the LED light source increases by 1 degree, the light decay is about 1%. At the same time, too high temperature directly leads to a shortened lifespan of the LED light source. Therefore, improving heat dissipation performance, improving light efficiency, and reducing cost are problems to be solved in the design of the LED light source. the

With the continuous development of LED light source technology, more and more products are packaged with LED chips on board (Chip On Board abbreviated as COB). As shown in Figure 1, the LED chip 5 is packaged on the LED substrate 7 on which the circuit 6 has been formed, and the substrate 7 conducts heat to the heat sink 4 through the thermal conductive glue 8. It needs to be conducted to the radiator 4 through the substrate 7 and the thermally conductive adhesive 8. The thermal conductivity of the substrate 7 and the thermally conductive adhesive 8 becomes the key factor affecting the heat dissipation of the LED chip 5 when it is working, and the thermally conductive adhesive 8 generally has a low thermal conductivity (generally 3w /m.k or less), its thermal conductivity is much smaller than that of metal or ceramics (greater than 16w/m.k), thus becoming the biggest bottleneck of heat dissipation. Therefore, reducing the thermal resistance between the LED chip 5 and the heat sink 4 becomes the key to improving the service life and reliability of the light source. the

Utility model content

The purpose of the utility model is to solve the problem of poor heat dissipation performance of the LED light source in the prior art that adopts the LED direct-mounted package on the board, and provide an LED light source with excellent heat dissipation performance. the

An embodiment of the technology of the present invention provides an LED light source, comprising: an LED chip for emitting light, a radiator for conducting heat generated by the LED chip, and a circuit for driving the LED chip, and the LED chip and No substrate is arranged between the radiators, and the radiators are made of ceramic materials. the

Preferably, the LED chip is arranged on the surface of the heat sink and is in contact with the surface of the heat sink. the

Further preferably, the circuit is arranged on the surface of the heat sink and is in contact with the surface of the heat sink. the

Another embodiment of the present invention also provides an LED light source, including: an LED chip for emitting light, a radiator for conducting heat generated by the LED chip, and a circuit for driving the LED chip, and the LED chip There is no substrate between the heat sink; the heat sink is made of metal material; a high thermal conductivity insulating layer is provided between the heat sink and the LED chip, and the circuit is arranged on the high thermal conductivity insulating layer superior. the

Preferably, the insulating layer with high thermal conductivity is provided with a through hole, and the LED chip is arranged in the through hole of the insulating layer with high thermal conductivity, and is in contact with the heat sink. the

Preferably, the LED chip is disposed on the high thermal conductivity insulating layer. the

In the LED light source of the present invention, the bottom of the radiator is a radiator made of metal or ceramic materials, and the upper part of the radiator is a mounting surface, which is fabricated on the mounting surface using conductive paste (precious metal paste or copper paste, etc.) circuit, so as to realize the installation of LED chips. the

The beneficial effects of the LED light source of the utility model are: by integrating the LED chip and the heat sink, the heat transfer efficiency of the LED chip to the heat sink is improved, and the reliability of the product is improved; in addition, the heat sink can be made of ceramics as a whole , The power supply is placed in the radiator, and the insulation is played by ceramics, which improves the safety of the product. the

The object of the present utility model also includes providing a backlight source, which includes the above-mentioned LED light source. the

The object of the present utility model also includes providing a liquid crystal display device, which includes the above-mentioned backlight source. the

Since the backlight source and the liquid crystal display device include the above-mentioned LED light source, the products have high reliability and long service life. the

Description of drawings

Fig. 1 is a schematic structural diagram of an LED light source in the prior art. the

Fig. 2 is a schematic structural diagram of the LED light source in Embodiment 1 of the present utility model. the

Fig. 3 is a schematic structural diagram of the LED light source in Embodiment 2 of the present utility model. the

Fig. 4 is a schematic structural diagram of the LED light source in Embodiment 2 of the present utility model. the

Among them: 1. Silica gel; 2. Wire; 3. Dam; 4. Radiator; 5. LED chip; 6. Circuit; 7. Substrate; 8. Thermal adhesive; 9. High thermal conductivity insulating layer; the

Detailed ways

In order to enable those skilled in the art to better understand the technical solution of the utility model, the utility model will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. the

Example 1

As shown in Figure 2, this embodiment provides an LED light source, including: an LED chip 5 for emitting light, a radiator 4 for conducting heat generated by the LED chip 5, and a circuit 6 for driving the LED chip 5, No substrate is provided between the LED chip and the heat sink, on the contrary, the LED chip 5 is in direct contact with the heat sink 4 . the

Wherein: the radiator 4 is located at the lower part of the LED light source, the radiator 4 is made of ceramic material, the radiator 4 is in direct contact with the heat-generating LED chip 5, and the surface where the radiator 4 is in contact with the LED chip 5 is the mounting surface;

The circuit 6 is fabricated on the above-mentioned mounting surface. Preferably, the circuit 6 can also be made by sintering after forming the pattern of the circuit 6 on the above-mentioned mounting surface using conductive paste (precious metal paste or copper paste, etc.); preferably Yes, the circuit 6 can also be made by etching after ceramic metallization (such as ceramic copper clad or ceramic sputtering);

Preferably, the LED light source also includes:

The dam 3 is provided with a dam 3 on the periphery of the mounting surface of the radiator 4, which is used to prevent the silica gel 1 from overflowing when it is injected, and the silica gel can be used to fix the LED chip 5; preferably, the silica gel contains a mixed phosphor . the

The wire 2, the LED chip 5 is connected to the circuit 6 through the wire 2, preferably, the wire 2 is a gold wire. the

In this embodiment, since the radiator 4 is made of ceramic material and has high insulation, the power supply can be installed in the radiator 4, thereby improving the electrical safety performance of the product. the

Compared with the traditional LED light source, the LED light source with the above structure is directly fixed on the mounting surface of the heat sink 4 (the LED chip 5 is in direct contact with the heat sink 4), and the substrate 7 of the LED chip and the connection between the substrate 7 and the heat sink 4 are omitted. The heat-conducting adhesive 8 between them improves the heat dissipation performance of the LED light source. the

Example 2

As shown in Figure 3, this embodiment provides an LED light source, including: an LED chip 5 for emitting light, a heat sink 4 for conducting heat generated by the LED chip 5, and a circuit for driving the LED chip 5, so No substrate is arranged between the LED chip and the radiator. the

The radiator 4 is located at the lower part of the LED light source, and the radiator 4 is made of metal material;

A high thermal conductivity insulating layer 9 is provided between the radiator 4 and the LED chip 5,

The surface of the heat sink 4 facing the heat-generating LED chip 5 is the installation surface, and a high thermal conductivity insulating layer 9 is also provided on the installation surface;

LED chips 5 are arranged on the high thermal conductivity insulating layer 9 according to the needs of specific scenarios; preferably, the high thermal conductivity insulating layer 9 is made of high thermal conductivity and high insulation materials (such as ceramics, glass, etc.); preferably, as shown in Figure 4 As shown, a through hole 10 corresponding to the LED chip 5 is reserved in the high thermal conductivity insulating layer 9, and the LED chip 5 is arranged in the through hole 10 to directly contact the surface of the heat sink 4;

The circuit 6 is covered with copper foil to make the circuit 6 on the high thermal conductivity insulating layer 9;

Preferably, the LED light source also includes:

A dam 3 is provided around the mounting surface of the radiator 4 to prevent the silica gel 1 from overflowing when it is injected, and the silica gel can be used to fix the LED chip 5; preferably, the silica gel contains a mixed phosphor. the

The wire 2, the LED chip 5 is connected to the circuit 6 through the wire 2, preferably, the wire 2 is a gold wire. the

Compared with the traditional light source, the light source with the above structure is directly fixed on the mounting surface of the heat sink 4, or is arranged on the high thermal conductivity insulating layer 9, and the substrate 7 of the light source and the thermal conductive glue between the substrate 7 and the heat sink 4 are omitted. 8, thus improving the heat dissipation performance. the

The utility model arranges the LED chip 5 on the installation surface of the heat sink 4 or on the high thermal conductivity insulating layer 9, and the traditional LED light source by packaging the LED chip 5 on the ceramic substrate 7 or the aluminum substrate 7, and then installing The method on the heat sink 4 saves the substrate 7 and thermal conductive glue 8, so that the heat of the LED chip 5 can be quickly transferred to the heat sink 4, effectively reducing the thermal resistance, improving the life of the light source and the reliability of the product sex. the

It can be understood that the structure of the LED light source can adopt other forms, as long as the heat sink is in direct contact with the LED chip, or a high thermal conductivity insulating layer is provided between the two, all belong to the protection scope of the present invention; the high thermal conductivity insulating layer is the current If there is a technical category, other types of materials can be selected; the preparation method of the circuit is also in the prior art category, and other types of methods can be used to fabricate the circuit. the

Example 3

This embodiment provides a backlight source, which includes the above-mentioned LED light source. For example, the backlight source is mainly composed of the above-mentioned LED light source, a light guide plate, an optical module, structural parts and the like. the

Example 4

This embodiment provides a liquid crystal display device, and the liquid crystal display device includes the backlight source as described in the third embodiment. For example, the liquid crystal display device is mainly composed of a backlight source, a liquid crystal screen (panel), structural components (such as a frame, a back plate, etc.), a driving circuit, and the like. the

It can be understood that the above embodiments are only exemplary embodiments adopted to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present utility model, and these variations and improvements are also regarded as the protection scope of the present utility model. the

Claims (8)

1. LED light source comprises: for luminous LED chip, be used to conducting the radiator of the heat that LED chip produces, with the circuit for the driving LED chip, between described LED chip and described radiator, substrate is not set, it is characterized in that, described radiator is ceramic material.

2. LED light source as claimed in claim 1, is characterized in that, described LED chip is arranged at the surface of radiator, and with the Surface Contact of radiator.

3. LED light source as claimed in claim 2, is characterized in that, described circuit is arranged at the surface of described radiator, and with the Surface Contact of radiator.

4. LED light source comprises: for luminous LED chip, be used to conducting the radiator of the heat that LED chip produces, and, for the circuit of driving LED chip, between described LED chip and described radiator, substrate is not set; Described radiator is that metal material is made; It is characterized in that, between described radiator and described LED chip, be provided with the high heat conductive insulating layer, described circuit is arranged on described high heat conductive insulating layer.

5. LED light source as claimed in claim 4, is characterized in that, described high heat conductive insulating layer is provided with through hole, and described LED chip is arranged in the through hole of described high heat conductive insulating layer, contacts with described radiator.

6. LED light source as claimed in claim 5, is characterized in that, described LED chip is arranged on the high heat conductive insulating layer.

7. a backlight, is characterized in that, described backlight comprises: described LED light source as arbitrary as claim 1-6.

8. a liquid crystal indicator, is characterized in that, described liquid crystal indicator comprises: backlight as claimed in claim 7.

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