CN207294673U - A kind of heat conduction and heat radiation adhesive tape - Google Patents
A kind of heat conduction and heat radiation adhesive tape Download PDFInfo
- Publication number
- CN207294673U CN207294673U CN201721200568.3U CN201721200568U CN207294673U CN 207294673 U CN207294673 U CN 207294673U CN 201721200568 U CN201721200568 U CN 201721200568U CN 207294673 U CN207294673 U CN 207294673U
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- China
- Prior art keywords
- layer
- heat
- high temperature
- temperature resistant
- adhesive tape
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Abstract
The utility model discloses a kind of heat conduction and heat radiation adhesive tape.Including：Release film layer, the release film layer upper end is equipped with the first high temperature resistant adhesive layer, the first high temperature resistant adhesive layer upper end is equipped with graphite linings, the graphite linings upper end is equipped with the second high temperature resistant adhesive layer, the second high temperature resistant adhesive layer upper end is equipped with electro-magnetic screen layer, the electro-magnetic screen layer upper end is equipped with double layer substrates, and the double layer substrates upper end is equipped with the 3rd high temperature resistant adhesive layer, and the 3rd high temperature resistant adhesive layer upper end is equipped with infra-red radiation thermal dispersant coatings.A kind of heat conduction and heat radiation adhesive tape of the utility model is radiated using graphite progress heat transfer and infra-red radiation, while have also been devised electro-magnetic screen layer, has the advantages that high heat transfer efficiency, conduction and rate of heat dispation are fast, effectively limit electromagnetic radiation.
Description
Technical field
It the utility model is related to tape technology field, more particularly to a kind of heat conduction and heat radiation adhesive tape.
Background technology
With the development of science and technology lightening trend is presented in electronic product, electronic component refers to that size is less and less, works
Efficiency and working strength are increasing, cause produce heat it is increasing, requirement of the electronic component to heat dissipation effect is increasingly
Height, therefore efficiently solve heat dissipation problem and become the key technology that must solve of electronic equipment.
The adhesive tape for electronic product is mainly that will conduct the heat on adhesive tape according to cross-ventilation currently on the market
Disperse, for the narrow and small electronic product in inner space, since air draught is limited, cause radiating efficiency relatively low.Through retrieving,
The grant number of Chinese granted patent is：CN 204999844 U；Denomination of invention：Heat dissipation adhesive tape, using metal foil as base material, in the base
Heat-conducting glue is coated with below material, the heat radiation being made of nano silicon dioxide and silicones is coated with above the base material
Material, using the active heat removal mode of infra-red radiation, has good heat dissipation effect.But the product is only provided with one layer of heat conduction
Glue carries out the transmission of heat, causes adhesive tape heat-transfer effect imperfect.
Utility model content
The utility model is intended to solve at least some of the technical problems in related technologies.For this reason, this reality
It is to propose a kind of heat conduction and heat radiation adhesive tape with a new purpose, which is dissipated by the capacity of heat transmission and infra-red radiation of graphite
The heat-sinking capability of hot coating spreads the heat transmission of electronic component, reaches the effect of cooling.
According to a kind of heat-conducting glue band of the utility model embodiment, including：Release film layer, the release film layer upper end are equipped with
First high temperature resistant adhesive layer, the first high temperature resistant adhesive layer upper end are equipped with graphite linings, and it is resistance to that the graphite linings upper end is equipped with second
High temperature adhesive layer, the second high temperature resistant adhesive layer upper end are equipped with electro-magnetic screen layer, and the electro-magnetic screen layer upper end is equipped with bilayer
Base material, the double layer substrates upper end are equipped with the 3rd high temperature resistant adhesive layer, and the 3rd high temperature resistant adhesive layer upper end is equipped with infrared spoke
Thermal dispersant coatings are penetrated, the double layer substrates are made of copper foil and aluminium foil, and the copper foil lower end connects with the second high temperature resistant adhesive layer
Touch, the aluminium foil upper end is contacted with the 3rd high temperature resistant adhesive layer, and the infra-red radiation thermal dispersant coatings are by titanium dioxide, dioxy
SiClx and silicones composition.
In some embodiments of the utility model, the release film layer is using made by PET material.
In other embodiments of the utility model, the electromagnetic shielding layer thickness is 8-15 μm.
In other embodiments of the utility model, the double layer substrates thickness is 20-50 μm.
In other embodiments of the utility model, copper foil and aluminum foil thickness ratio are 1 in the double layer substrates:2.
In other embodiments of the utility model, the infra-red radiation thermal dispersant coatings thickness is 10-18 μm.
Beneficial effect in the utility model is：Graphite linings are equipped with adhesive tape, the heat that can produce electronic component is fast
Speed is transferred to double layer substrates, and double layer substrates are made of copper foil and aluminium foil, and the thermal conductivity of copper is 401W/mK, the thermal conductivity of aluminium
For 237W/mK, there is the heat transfer efficiency of higher using the compound single aluminium foil of double layer substrates ratio of copper foil and aluminium foil, make heat more
Fast is transferred to infra-red radiation heat dissipating layer, and infra-red radiation heat dissipating layer is made of titanium dioxide, silica and silicones, by red
The mode of external radiation goes out the heat diffusion transmitted, than traditional heat dissipation speed for having higher by cross-ventilation diffusion heat
Rate, especially for the heat dissipation advantage with bigger for the electronic product with small space, while the adhesive tape is additionally provided with electricity
Magnetic masking layer, can effectively limit the radiation of the electromagnetic wave of electronic component generation.The utility model is imitated by the high heat conduction of graphite
The high cooling efficiency of rate and infra-red radiation heat dissipating layer, the heat diffusion that electronic component produces can quickly be gone out, be suitable for
It is various to require heat conduction and heat radiation high electronic product.
Brief description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
New embodiment is used to explain the utility model together, does not form the limitation to the utility model.In the accompanying drawings：
Fig. 1 be the utility model proposes a kind of heat conduction and heat radiation adhesive tape structure diagram.
Fig. 2 be the utility model proposes a kind of heat conduction and heat radiation adhesive tape in double layer substrates structure diagram.
In figure：1- release film layers, the first high temperature resistants of 2- adhesive layer, 3- graphite linings, the second high temperature resistants of 4- adhesive layer, 5- electromagnetism
Shielded layer, 6- double layer substrates, 601- copper foils, 602- aluminium foils, the 3rd high temperature resistant adhesive layers of 7-, 8- infra-red radiation heat dissipating layers.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
The example of the embodiment is shown in the drawings, wherein same or similar label represents identical or class from beginning to end
As element or there is same or like element.The embodiments described below with reference to the accompanying drawings are exemplary, purport
For explaining the utility model, and it is not intended that limitation to the utility model.
In the description of the utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " suitable
The orientation or position relationship of the instruction such as hour hands ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " are based on orientation shown in the drawings
Or position relationship, be for only for ease of description the utility model and simplify and describe, rather than instruction or imply signified device or
Element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limit to the utility model
System.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the utility model, " multiple " are meant that two or two
More than, unless otherwise specifically defined.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be
Mechanically connect or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, can be two
The interaction relationship of connection or two elements inside element.For the ordinary skill in the art, can basis
Concrete condition understands concrete meaning of the above-mentioned term in the utility model.
Reference Fig. 1-2, a kind of heat conduction and heat radiation adhesive tape, including：Release film layer 1,1 upper end of release film layer are equipped with the first high temperature resistant
Adhesive layer 2,2 upper end of the first high temperature resistant adhesive layer are equipped with graphite linings 3, and 3 upper end of graphite linings is equipped with the second high temperature resistant adhesive layer 4, the
Two high temperature resistant adhesive layers, 4 upper end is equipped with electro-magnetic screen layer 5, and 5 upper end of electro-magnetic screen layer is equipped with double layer substrates 6,6 upper end of double layer substrates
Equipped with the 3rd high temperature resistant adhesive layer 7,7 upper end of the 3rd high temperature resistant adhesive layer is equipped with infra-red radiation thermal dispersant coatings 8, double layer substrates 6 by
Copper foil 601 and aluminium foil 602 are formed, and 601 lower end of copper foil is contacted with the second high temperature resistant adhesive layer 4,602 upper end of aluminium foil and the 3rd resistance to height
Warm adhesive layer 7 contacts, and infra-red radiation thermal dispersant coatings 8 are made of titanium dioxide, silica and silicones；Release film layer 1 uses
Made by PET material；6 thickness of double layer substrates is 20-50 μm；It is 8-15 μm to be electromagnetically shielded layer thickness；Copper foil in double layer substrates 6
601 with 602 thickness ratio of aluminium foil be 1:2；8 thickness of infra-red radiation thermal dispersant coatings is 10-18 μm.
Adhesive tape, which is equipped with graphite linings 3, to be quickly transferred to double layer substrates 6, double layer substrates by the heat that electronic component produces
6 are made of copper foil 601 and aluminium foil 602, and the thermal conductivity of copper is 401W/mK, and the thermal conductivity of aluminium is 237W/mK, using copper foil
601 and the compound single aluminium foil of double layer substrates ratio of aluminium foil 602 there is the heat transfer efficiency of higher, heat is transferred to faster infrared
Heat loss through radiation layer 8, infra-red radiation heat dissipating layer 8 is made of titanium dioxide, silica and silicones, by way of infra-red radiation
The heat diffusion transmitted is gone out, it is especially right than traditional rate of heat dispation for having higher by cross-ventilation diffusion heat
The heat dissipation advantage with bigger for the electronic product with small space, while adhesive tape is additionally provided with electro-magnetic screen layer 5, can
The effectively radiation for the electromagnetic wave that limitation electronic component produces.
In the utility model, unless otherwise clearly defined and limited, fisrt feature is "above" or "below" second feature
Can be that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, first is special
Sign second feature " on ", " top " and " above " can be fisrt feature directly over second feature or oblique upper, or only
Represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be with
Be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height and be less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
State and may not refer to the same embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be
Combined in an appropriate manner in any one or more embodiments or example.
The above, is only the preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
- A kind of 1. heat conduction and heat radiation adhesive tape, it is characterised in that including：Release film layer, the release film layer upper end are equipped with the first resistance to height Warm adhesive layer, the first high temperature resistant adhesive layer upper end are equipped with graphite linings, and the graphite linings upper end is equipped with the second high temperature resistant gluing Layer, the second high temperature resistant adhesive layer upper end are equipped with electro-magnetic screen layer, and the electro-magnetic screen layer upper end is equipped with double layer substrates, described Double layer substrates upper end is equipped with the 3rd high temperature resistant adhesive layer, and the 3rd high temperature resistant adhesive layer upper end is equipped with infra-red radiation heat-radiation coating Layer, the double layer substrates are made of copper foil and aluminium foil, and the copper foil lower end is contacted with the second high temperature resistant adhesive layer, the aluminium Paper tinsel upper end is contacted with the 3rd high temperature resistant adhesive layer, and the infra-red radiation thermal dispersant coatings are by titanium dioxide, silica and silicon Resin forms.
- A kind of 2. heat conduction and heat radiation adhesive tape according to claim 1, it is characterised in that：The release film layer uses PET material It is made.
- A kind of 3. heat conduction and heat radiation adhesive tape according to claim 1, it is characterised in that：The electromagnetic shielding layer thickness is 8-15 μm。
- A kind of 4. heat conduction and heat radiation adhesive tape according to claim 1, it is characterised in that：The double layer substrates thickness is 20-50 μ m。
- A kind of 5. heat conduction and heat radiation adhesive tape according to claim 1, it is characterised in that：Copper foil and aluminium foil in the double layer substrates Thickness ratio is 1:2.
- A kind of 6. heat conduction and heat radiation adhesive tape according to claim 1, it is characterised in that：The infra-red radiation thermal dispersant coatings thickness For 10-18 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721200568.3U CN207294673U (en) | 2017-09-18 | 2017-09-18 | A kind of heat conduction and heat radiation adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721200568.3U CN207294673U (en) | 2017-09-18 | 2017-09-18 | A kind of heat conduction and heat radiation adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207294673U true CN207294673U (en) | 2018-05-01 |
Family
ID=62442687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721200568.3U Expired - Fee Related CN207294673U (en) | 2017-09-18 | 2017-09-18 | A kind of heat conduction and heat radiation adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207294673U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408336A (en) * | 2019-09-06 | 2019-11-05 | 广东亚龙兴新材料有限公司 | The preparation method of antimagnetic thermally conductive one side glue |
| CN114437644A (en) * | 2021-12-31 | 2022-05-06 | 江苏吉腾新材料科技有限公司 | Composite heat dissipation shielding adhesive tape and preparation method thereof |
-
2017
- 2017-09-18 CN CN201721200568.3U patent/CN207294673U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408336A (en) * | 2019-09-06 | 2019-11-05 | 广东亚龙兴新材料有限公司 | The preparation method of antimagnetic thermally conductive one side glue |
| CN114437644A (en) * | 2021-12-31 | 2022-05-06 | 江苏吉腾新材料科技有限公司 | Composite heat dissipation shielding adhesive tape and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 Termination date: 20180918 |