CN206892796U - Laptop heat-dissipation component - Google Patents
Laptop heat-dissipation component Download PDFInfo
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- CN206892796U CN206892796U CN201720713324.9U CN201720713324U CN206892796U CN 206892796 U CN206892796 U CN 206892796U CN 201720713324 U CN201720713324 U CN 201720713324U CN 206892796 U CN206892796 U CN 206892796U
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- heat
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- accessory body
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Abstract
The utility model discloses a kind of laptop heat-dissipation component, including：Heat radiator body, radiating accessory body and heat transfer component, the heat radiator body is arranged in lower house, radiating accessory body is arranged in upper shell, the heat transfer component is fixedly connected with the heat radiator body and the radiating accessory body, the radiating accessory body is received the partial heat that the heat radiator body passes over and radiated by the heat transfer component.Pass through heat transfer component, the partial heat for the heat radiator body being arranged in lower house is delivered to radiating accessory body, new area of dissipation is provided using the upper shell of notebook, increase overall heat dissipation area, strengthen radiating effect, chip temperature is reduced, while improves notebook computer surface temperature, gives more preferable Consumer's Experience.
Description
Technical field
It the utility model is related to notebook computer field, more particularly to a kind of laptop heat-dissipation component.
Background technology
As the improvement of people's living standards, requirement more and more higher of the people to electronic product.Relative to desktop computer, notes
It is many convenient that this computer (notebook) is brought to the work and life of people.With the fast development of notebook computer, pen
This is more and more frivolous for note, accommodates the heat dissipation equipments such as fan without dimensional space or thickness space；Traditional wind can not used
On the premise of fan radiating, the area of dissipation and thickness of common fin are all restricted, and its area of dissipation does not reach cooling requirements,
Cause chip cooling bad and directly influence the performance of chip；Further, the surface temperature of notebook lower house obtains
Reduced less than a greater degree of.
Utility model content
To solve the above problems, the utility model proposes a kind of laptop heat-dissipation component, it can be effectively reduced including pen
Remember the temperature of this inside chip and notebook lower shell surface.
Laptop heat-dissipation component provided by the utility model includes：Heat radiator body, radiating accessory body and heat transfer component, it is described
Heat radiator body is arranged in lower house, and radiating accessory body is arranged in upper shell, the heat transfer component and the heat radiator body and
The radiating accessory body is fixedly connected, and the radiating accessory body is received the heat radiator body and passed over by the heat transfer component
Partial heat and radiated.
The beneficial effects of the utility model：By heat transfer component, by the part for the heat radiator body being arranged in lower house
Heat transfer, because radiating accessory body is arranged in upper shell, new radiating surface is provided using the upper shell of notebook to radiating accessory body
Product, increase overall heat dissipation area, strengthen radiating effect, reduce chip temperature, while improve notebook computer surface temperature, give
More preferable Consumer's Experience.
Brief description of the drawings
Fig. 1 is position view (perspective of the laptop heat-dissipation component in notebook computer in the utility model embodiment 1
Figure).
Fig. 2 is sectional view of the laptop heat-dissipation component in lower house in the utility model embodiment 1.
Fig. 3 is sectional view of the laptop heat-dissipation component in upper shell in the utility model embodiment 1.
Fig. 4 is a kind of schematic diagram of laptop heat-dissipation component in the utility model embodiment 1.
Fig. 5 is another schematic diagram of laptop heat-dissipation component in the utility model embodiment 1.
Fig. 6 is S type heat pipe structure schematic diagrames in the utility model embodiment 2.
Fig. 7 is position view (perspective of the laptop heat-dissipation component in notebook computer in the utility model embodiment 2
Figure).
Embodiment
With reference to embodiment and compare accompanying drawing the utility model is described in further detail, it should be emphasised that
It is, what the description below was merely exemplary, rather than in order to limit the scope of the utility model and its application.
In the utility model, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. term should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected, it is right
For one of ordinary skill in the art, it can understand that specific in the utility model of above-mentioned term containing as the case may be
Justice.
Embodiment 1
As shown in figure 1, notebook computer generally includes upper shell 100 and lower house 200, the front installation of upper shell 100
There is LED display 101, printed circuit-board assembly (PCBA) piece 201 is installed, cpu chip 202 is fixedly mounted in lower house 200
In on PCBA pieces 201, the front of lower house is also equipped with keyboard (not shown), leads between upper shell 100 and lower house 200
The first connecting mechanism for rotating 300 is crossed to connect；Dotted line is represented as internal structure in Fig. 1.
The laptop heat-dissipation component that the present embodiment provides includes heat radiator body 400, radiating accessory body 500 and heat transfer component
600, heat radiator body 400 is arranged in lower house 200, and radiating accessory body is arranged in upper shell 100, and heat transfer component 600 is with dissipating
Hot body 400 is fixedly connected with radiating accessory body 500.Heat radiator body 400 dissipates a part of heat；Radiating accessory body 500 passes through heat
Transferring element 600, receive the partial heat that heat radiator body 400 passes over and radiated.
Specifically, positional structure of the radiating component in lower house is as shown in Fig. 2 heat radiator body 400 is locked in PCBA pieces 201
On, and be bonded with cpu chip 202, in order to preferably improve the temperature of chip, the area of its heat radiator body 400 is more than PCBA
The area of piece 201；One end of heat transfer structure 600 is fixedly connected with heat radiator body 400.Position of the radiating component in upper shell
Structure as shown in figure 3, radiating accessory body 500 be arranged on LCD display 101 behind, and with LCD display be separated by it is certain away from
From preferably apart from more than LCD display 0.2mm.Radiate accessory body 500 and upper casing can be determined in actual conditions as the case may be
The position relationship on internal surface, first, radiating accessory body 500 is directly embedded in the inner surface of upper shell 100, directly inlay its radiating
Effect is more preferable, and the heating temperature such as cpu chip can reduce rapidly, but inlays temperature shadow of the upper shell by radiating accessory body of position
Sound can cause the slightly biased height of temperature.Second, retention gap between radiating accessory body 500 and the inner surface of upper shell 100, is protected with inner surface
Gap is stayed, it is first-class that its radiating effect is not embedded in inner surface directly, but due to the effect in gap, position corresponding to upper shell is not
Directly it can be influenceed by the temperature of radiating accessory body, it is more preferable so as to the surface temperature of notebook upper shell.
Radiating component as described above, as shown in figure 4, its heat transfer structure is fixedly connected with heat radiator body, radiating accessory body
When, its heat transfer structure and heat radiator body, the area for the accessory body that radiates have overlapping, using such a mode, pass through area
It is overlapping, quickly the partial heat in heat radiator body can be delivered on radiating accessory body, be more beneficial for the Quick diffusing of heat,
So as to reduce the temperature of cpu chip and notebook computer surface.It is understood that as shown in figure 5, heat transfer structure and radiating
Body, radiating accessory body are fixedly connected, and can also not have area overlapping, using such a mode, although its heat transfer effect is not so good as Fig. 4
Shown structure, but the partial heat in heat radiator body can be similarly delivered on radiating accessory body.
Typically using copper coin, temperature-uniforming plate, aluminium sheet etc. is included, its thickness can be accomplished for heat radiator body 400 and radiating accessory body 500
It is very thin, reach 0.3-1.5mm, compared to traditional heat-dissipating piece 6-15mm thickness, can effectively reduce notebook lower house
Gross thickness so that notebook computer is more frivolous, also completely avoid noise caused by fan and sound quality problem.In order that dissipate
Thermal effect is more preferable, and area of dissipation is the bigger the better, and preferably its area and upper and lower casing is area matched.Heat biography in the present embodiment
Pass part 600 and use graphene, graphite flake, copper foil etc., because graphene, graphite flake and copper foil etc. have bent attribute,
It can followed by the rotation of the first connecting mechanism for rotating 300 and rotate.In addition, heat transfer component can be 2, two graphite
Alkene/graphite flake/copper foil is oppositely arranged, and the both sides with heat radiator body and the accessory body that radiates are attached respectively, so as to further speed up
Heat transference efficiency.
Embodiment 2
Compared with Example 1, its heat transfer component 600 is heat pipe, and the shape of heat conducting pipe, size can be according to being actually needed
It is customized.As shown in fig. 6, a kind of S types heat pipe, including the first heat transfer unit 601, the second heat transfer unit 602, connection the
Second connecting mechanism for rotating 603 of one heat transfer unit and the second heat transfer unit.Second connecting mechanism for rotating, 603 specific bag again
Include mandrel and core retainer plate, one in both mandrel and core retainer plate is connected with the one of the first heat transfer unit 601, and another is with the
The one of two heat transfer unit 602 is connected.
Heat pipe is a kind of structure of high heat-transfer performance, is typically made up of shell, liquid-sucking core and end cap, inside heat pipe is pumped into
Negative pressure state, appropriate liquid is filled with, this boiling point of liquid is low, readily volatilized, and tube wall has liquid-sucking core, and it is by capillary-porous material
Form.Heat pipe one end is evaporation ends, and other end is condensation end, and when one section of heat pipe is heated, the liquid in capillary light steams rapidly
Hair, steam flows to the other end under small pressure, and discharges heat, and regelation is into liquid, and liquid is again along porous material
Material flows back to evaporator section by the effect of capillary force, and so circulation is more than, and heat reaches the other end by heat pipe one end, and this circulation is fast
What speed was carried out, heat, which can be conducted continuously, to be come.
The placement location of heat pipe and its radiating component in notebook as described above is as shown in fig. 7, it includes two institutes
Heat pipe is stated, two heat pipes be arranged in parallel, are fixedly connected with heat radiator body and radiating accessory body homonymy.First heat transfer unit 601 with
Heat radiator body 400 is fixedly connected, and has the overlapping of large area with heat radiator body 400；Second heat transfer unit 602 and radiating accessory body
500 are fixedly connected and have the overlapping of large area with radiating accessory body 500；Pass through the overlapping of large area so that heat transfer effect is faster.
Connect the second rotary connection structure 603 of the first heat transfer unit 601 and the second heat transfer unit 602, its axle center and the first rotation
Turn that the axle center of attachment structure 300 is consistent so that notebook upper shell relative to lower house when rotated, its structure that radiates
Also follower rotates part.
Except S types heat pipe structure as described above, can also be：First heat transfer unit and the second heat transfer unit are work
Font structure, and be nested together by connecting mechanism for rotating.Connecting mechanism for rotating except mandrel as described above and core retainer plate structure,
Can also be that table chain such as is hinged rotary structure.
Two heat pipes be arranged in parallel, can also be with radiating in addition to being fixedly connected with heat radiator body and radiating accessory body homonymy
Body is fixedly connected with the heteropleural of radiating accessory body.Two heat pipes can also be oppositely arranged, respectively with heat radiator body and radiating accessory body
Both sides are attached.Can also be four heat pipes, it is relatively parallel two-by-two, it is oppositely arranged two-by-two, so as to further speed up heat transfer
Efficiency.
Above content is to combine specific/preferred embodiment further detailed description of the utility model, no
It can assert that specific implementation of the present utility model is confined to these explanations.For the common skill of the utility model art
For art personnel, without departing from the concept of the premise utility, it can also make to the embodiment that these have been described
Some replacements or modification, and these are substituted or variant should all be considered as belonging to the scope of protection of the utility model.
Claims (10)
- A kind of 1. laptop heat-dissipation component, it is characterised in that including：Heat radiator body, radiating accessory body and heat transfer component, it is described to dissipate Hot body is arranged in lower house, and radiating accessory body is arranged in upper shell, the heat transfer component and the heat radiator body and institute State radiating accessory body to be fixedly connected, the radiating accessory body receives what the heat radiator body passed over by the heat transfer component Partial heat is simultaneously radiated.
- 2. laptop heat-dissipation component as claimed in claim 1, it is characterised in that the heat radiator body include copper coin, temperature-uniforming plate, One or more in aluminium sheet；The radiating accessory body includes the one or more in aluminium sheet, copper coin, temperature-uniforming plate；The heat transfer Part includes the one or more in graphene, graphite flake, copper foil, heat pipe.
- 3. laptop heat-dissipation component as claimed in claim 2, it is characterised in that one end of the heat pipe and the heat radiator body Be fixedly connected and have with the heat radiator body it is overlapping, the other end with it is described radiating accessory body be fixedly connected and with it is described radiating accessory body have Overlapping, the centre of the heat pipe is the second connecting mechanism for rotating, and the rotary shaft of second connecting mechanism for rotating is with being connected upper casing The rotary shaft of first connecting mechanism for rotating of body and lower house is overlapping.
- 4. laptop heat-dissipation component as claimed in claim 3, it is characterised in that the shape of the heat pipe includes S types.
- 5. laptop heat-dissipation component as claimed in claim 3, it is characterised in that second connecting mechanism for rotating includes mandrel And core retainer plate.
- 6. laptop heat-dissipation component as claimed in claim 1, it is characterised in that the heat radiator body is fixed on PCBA pieces, And it is bonded with cpu chip.
- 7. laptop heat-dissipation component as claimed in claim 1, it is characterised in that the radiating accessory body is arranged on behind LCD, And the inner surface of the upper shell is embedded in, the distance of the radiating accessory body and the LCD is more than 0.2mm.
- 8. laptop heat-dissipation component as claimed in claim 1, it is characterised in that it is described radiating accessory body be arranged on LCD with it is described Between upper shell inner surface, the radiating accessory body is not bonded with the inner surface of the upper shell, and is more than with the distance of the LCD 0.2mm。
- 9. laptop heat-dissipation component as claimed in claim 1, it is characterised in that described comprising two heat transfer components Two heat transfer components be arranged in parallel, are fixedly connected respectively with the heat radiator body and the radiating accessory body homonymy or heteropleural.
- 10. laptop heat-dissipation component as claimed in claim 1, it is characterised in that described comprising two heat transfer components Two heat transfer components are oppositely arranged, and the both sides with the heat radiator body and the radiating accessory body are attached respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720713324.9U CN206892796U (en) | 2017-06-19 | 2017-06-19 | Laptop heat-dissipation component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720713324.9U CN206892796U (en) | 2017-06-19 | 2017-06-19 | Laptop heat-dissipation component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206892796U true CN206892796U (en) | 2018-01-16 |
Family
ID=61316089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720713324.9U Active CN206892796U (en) | 2017-06-19 | 2017-06-19 | Laptop heat-dissipation component |
Country Status (1)
| Country | Link |
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| CN (1) | CN206892796U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108304049A (en) * | 2017-06-19 | 2018-07-20 | 广西三创科技有限公司 | Laptop heat-dissipation component |
| CN108966599A (en) * | 2018-08-03 | 2018-12-07 | 英业达科技有限公司 | Heat pipe heat and portable electronic devices with this heat pipe heat |
| CN109862762A (en) * | 2019-04-08 | 2019-06-07 | 英业达科技有限公司 | Radiating module and portable electronic devices |
| WO2021057581A1 (en) * | 2019-09-29 | 2021-04-01 | 华为技术有限公司 | Electronic device |
-
2017
- 2017-06-19 CN CN201720713324.9U patent/CN206892796U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108304049A (en) * | 2017-06-19 | 2018-07-20 | 广西三创科技有限公司 | Laptop heat-dissipation component |
| CN108966599A (en) * | 2018-08-03 | 2018-12-07 | 英业达科技有限公司 | Heat pipe heat and portable electronic devices with this heat pipe heat |
| CN109862762A (en) * | 2019-04-08 | 2019-06-07 | 英业达科技有限公司 | Radiating module and portable electronic devices |
| WO2021057581A1 (en) * | 2019-09-29 | 2021-04-01 | 华为技术有限公司 | Electronic device |
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