CN106933314A - The built-in radiator of notebook - Google Patents
The built-in radiator of notebook Download PDFInfo
- Publication number
- CN106933314A CN106933314A CN201611272572.0A CN201611272572A CN106933314A CN 106933314 A CN106933314 A CN 106933314A CN 201611272572 A CN201611272572 A CN 201611272572A CN 106933314 A CN106933314 A CN 106933314A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- fin
- heat
- notebook
- dissipation base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000010992 reflux Methods 0.000 claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229940056319 ferrosoferric oxide Drugs 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Abstract
A kind of built-in radiator of notebook, including heat pipe, fin, fan, and it is arranged on the heat dissipation base on notebook mainboard, the heat pipe is the seal metal tube to form circulation loop, the liquid heat transfer medium for accounting for heat pipe volume 50%~70% is provided with the heat pipe, the heat pipe section is welded on the surface of heat dissipation base, the fin is arranged on the side or the back side of notebook frame, and fin is set on heat pipe and welds together with heat pipe, the fan is arranged on the side of fin, and the exhaust outlet of fan faces fin, also being connected with the heat pipe makes the circulating pump of liquid heat transfer medium recycle stream, and circulating pump is located on fin to the reflux line between heat dissipation base.The present invention is combined with liquid is cold using air-cooled, and with more preferable capacity of heat transmission, more heats of conduction that can be as far as possible big in limited room and time ensure that the stable operation of notebook.
Description
Technical field
The present invention relates to notebook and heat sink technology field, and in particular to a kind of built-in radiator of notebook.
Background technology
During working with notebook computer, caloric value essentially from cpu chip, display card chip, hard disk and board chip set, wherein
Cpu chip and display card chip are maximum origin of heat, and wherein the origin of heat of more than half is that they exhale.Use
During, notebook is narrow and small because of its inner space, easily gathers heat and internal temperature is further raised, and 45 degree or so is pen
Remember this normal working temperature, most stable of working condition can be brought；60 degree or so, can be clearly felt that computer is seriously hot,
And there is the phenomenon for reacting interim card, although can now use, should also consider heat dissipation problem；When CPU or video card temperature are super
When crossing 80 degree, if continuing to allow computer work, gently then crash, heavy then chip burns to be scrapped.
At present, notebook computer radiating device relies primarily on unidirectional heat pipe combination fan and is radiated, and it receives notebook volume
Limitation, radiating effect is less desirable, in particular with people to the portable demand of notebook, it is necessary to notebook be made it is thinner more
It is light, and performance is more excellent.Limited notebook inner space is accomplished by preferably radiating, and the chip such as cpu chip for using
Dominant frequency is higher, better with performance, but its caloric value can be bigger.
Therefore, the heat dissipation problem of notebook computer, it is less and less towards volume largely to constrain notebook computer, property
Can higher and higher development.
The content of the invention
The present invention is in order to solve the above-mentioned technical problem that prior art is present, there is provided one kind solves laptop heat-dissipation not
Foot, may be such that notebook to miniaturization, the built-in radiator of the notebook developed towards thinning.
To achieve the above object, the invention provides a kind of built-in radiator of notebook, including heat pipe, fin, wind
Fan and the heat dissipation base being arranged on notebook mainboard, the heat pipe is the seal metal tube to form circulation loop, described
The liquid heat transfer medium for accounting for heat pipe volume 50%~70% is provided with heat pipe, the heat pipe section is welded on the surface of heat dissipation base
On, the fin is arranged on the side or the back side of notebook frame, and fin is set on heat pipe and is welded on heat pipe
Together, the fan is arranged on the side of fin, and the exhaust outlet of fan faces fin, is also connected with the heat pipe
The circulating pump of liquid heat transfer medium recycle stream, and circulating pump is set to be located on fin to the reflux line between heat dissipation base.
Used as the preferred technical solution of the present invention, the material of the heat pipe is copper or aluminium, and the heat pipe is shaped as circle
Or flat.
Used as the preferred technical solution of the present invention, the heat dissipation base includes CPU heat dissipation bases and video card heat dissipation base.
Used as the preferred technical solution of the present invention, the quantity of the heat pipe is one or more, when heat pipe quantity is many
When, many heat pipes are both connected on same circulating pump.
The built-in radiator of notebook of the invention can reach following beneficial effect：
The built-in radiator of notebook of the invention, by including heat pipe, fin, fan and being arranged on notebook
Heat dissipation base on mainboard, the heat pipe is the seal metal tube to form circulation loop, is provided with the heat pipe and accounts for heat pipe appearance
The liquid heat transfer medium of product 50%~70%, the heat pipe section is welded on the surface of heat dissipation base, and the fin is set
It is set on heat pipe and welds together with heat pipe in the side or the back side of notebook frame, and fin, the fan is set
Exhaust outlet in the side of fin, and fan faces fin, and being also connected with the heat pipe follows liquid heat transfer medium
The circulating pump of circulation, and circulating pump is on fin to the reflux line between heat dissipation base so that the present invention is using air-cooled
It is combined with liquid is cold, with more preferable capacity of heat transmission, can try one's best the big more heat of conduction in limited room and time
Amount so that notebook can ensure that the stable operation of notebook using high primary frequency and with the cpu chip of radiating requirements high,
Development of the notebook to miniaturization can also be met.
Brief description of the drawings
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
The structural representation of the embodiment that Fig. 1 is provided for the built-in radiator of notebook of the present invention.
In figure：1st, circulating pump, 2, fan, 3, fin, 4, CPU heat dissipation bases, 5, video card heat dissipation base, 6, heat pipe.
The object of the invention is realized, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
The structural representation of the embodiment that Fig. 1 is provided for the built-in radiator of notebook of the present invention, as shown in figure 1, pen
Remember that this built-in radiator includes heat pipe 6, fin 3, fan 2 and the heat dissipation base being arranged on notebook mainboard, it is described
Heat pipe 6 is to be provided with the liquid for accounting for the volume 50%~70% of heat pipe 6 in the seal metal tube for forming circulation loop, the heat pipe 6
Heat transfer medium, the part of the heat pipe 6 is welded on the surface of heat dissipation base, and the fin 3 is arranged on the side of notebook frame
Face or the back side, and fin 3 is set on heat pipe 6 and welds together with heat pipe 6, the fan 2 is arranged on the side of fin 3
Face, and the exhaust outlet of fan 2 faces fin 3, being also connected with the heat pipe 6 makes the circulation of liquid heat transfer medium recycle stream
Pump 1, and circulating pump 1 is on fin 3 to the reflux line between heat dissipation base.
In specific implementation, the material of the heat pipe 6 is copper or aluminium, and the heat pipe 6 is shaped as circular or flat.It is described
The composition of liquid heat transfer medium includes that water and ferroso-ferric oxide are felt puzzled particle.
In specific implementation, the heat dissipation base includes CPU heat dissipation bases 4 and video card heat dissipation base 5.
In specific implementation, the quantity of the heat pipe 6 is one or more, when the quantity of heat pipe 6 is many, many heat pipes 6
It is both connected on same circulating pump 1.
Allow those skilled in the art to more fully understand and realize technical scheme, the present embodiment is explained in detail below
Operation principle.
Liquid heat transfer medium in heat pipe 6 and heat pipe 6 its effect is can fast and efficiently by heat from one section of biography of pipe
To the other end, heat pipe 6 utilizes heat transfer, liquid heat transfer medium to utilize the circulation of evaporation and the condensation of liquid by modes such as heats,
The heat that cpu chip on notebook mainboard or display card chip are produced is transmitted on fin 3.
The effect of fan 2 is the circulation for accelerating air, forces the heat around substitution fin 3 empty with outside cold air
Gas, reaches the temperature for reducing the surrounding air of fin 3, the temperature lowered on fin 3 is reached, to ensure radiating effect.
Fin 3 is the final part of laptop heat-dissipation structure, is fixed against the blowing of fan 2, by the sky around fin 3
Gas heat is transmitted in the air outside notebook.In general, the bigger radiating effect of the area of fin 3 is better, specific real
Needed during applying according to laptop case selection rational in infrastructure.
In order to be able to quickly reach on whole radiating surface heat, fin 3 generally uses metal material and has certain
Thickness, make full use of its thermal conductive resin, in order to take into account and weight, the optimal selection of fin 3 is aluminum or aluminum alloy product.
It is combined with air-cooled present invention employs liquid is cold, the cold critically important benefit of liquid is exactly the big thermal capacity of liquid, temperature rise
Slowly, when CPU has the accidents such as large-scale computing, spike may break through the temperature upper limit of CPU moment.And liquid is cold then can be by
This spike is filtered out well.Bigger benefit be conducive to mainboard chip to ensure when there is accident will not moment
Burn CPU, it is ensured that the safety of CPU, be conducive to the use of high-end high primary frequency cpu chip.
Although the foregoing describing specific embodiment of the invention, those skilled in the art should be appreciated that this
It is merely illustrative of, various changes or modifications can be made to present embodiment, without departing from principle of the invention and essence,
Protection scope of the present invention is only limited by the claims that follow.
Claims (4)
1. the built-in radiator of a kind of notebook, it is characterised in that including heat pipe, fin, fan and be arranged on notebook
Heat dissipation base on mainboard, the heat pipe is the seal metal tube to form circulation loop, is provided with the heat pipe and accounts for heat pipe appearance
The liquid heat transfer medium of product 50%~70%, the heat pipe section is welded on the surface of heat dissipation base, and the fin is set
It is set on heat pipe and welds together with heat pipe in the side or the back side of notebook frame, and fin, the fan is set
Exhaust outlet in the side of fin, and fan faces fin, and being also connected with the heat pipe follows liquid heat transfer medium
The circulating pump of circulation, and circulating pump is on fin to the reflux line between heat dissipation base.
2. according to the built-in radiator of the notebook described in claim 1, it is characterised in that the material of the heat pipe be copper or
Aluminium, the heat pipe is shaped as circular or flat.
3. according to the built-in radiator of the notebook described in claim 1, it is characterised in that the heat dissipation base dissipates including CPU
Hot base and video card heat dissipation base.
4. according to the built-in radiator of any described notebook of claims 1 to 3, it is characterised in that the quantity of the heat pipe
It is one or more, when heat pipe quantity is many, many heat pipes are both connected on same circulating pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611272572.0A CN106933314A (en) | 2016-12-29 | 2016-12-29 | The built-in radiator of notebook |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611272572.0A CN106933314A (en) | 2016-12-29 | 2016-12-29 | The built-in radiator of notebook |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106933314A true CN106933314A (en) | 2017-07-07 |
Family
ID=59444115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611272572.0A Pending CN106933314A (en) | 2016-12-29 | 2016-12-29 | The built-in radiator of notebook |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106933314A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894885A (en) * | 2021-01-29 | 2021-06-04 | 重庆特斯联智慧科技股份有限公司 | Intelligent robot heat dissipation structure and heat dissipation method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040057205A1 (en) * | 2002-09-19 | 2004-03-25 | Wen-Hsiang Chen | Heat dissipation apparatus |
| CN201413489Y (en) * | 2009-04-21 | 2010-02-24 | 联想(北京)有限公司 | Cooling system and a computer provided with same |
| CN201716645U (en) * | 2010-05-13 | 2011-01-19 | 陈士虎 | Built-in radiator for notebook computer |
| CN202771350U (en) * | 2012-07-20 | 2013-03-06 | 张晓飞 | Water-circulation heat-dissipation device of notebook computer |
| CN105652991A (en) * | 2015-12-29 | 2016-06-08 | 湖南长城银河科技有限公司 | Laptop cooling device and laptop |
| CN205721610U (en) * | 2016-05-25 | 2016-11-23 | 王建 | Notebook computer integral heat radiator |
| CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
-
2016
- 2016-12-29 CN CN201611272572.0A patent/CN106933314A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040057205A1 (en) * | 2002-09-19 | 2004-03-25 | Wen-Hsiang Chen | Heat dissipation apparatus |
| CN201413489Y (en) * | 2009-04-21 | 2010-02-24 | 联想(北京)有限公司 | Cooling system and a computer provided with same |
| CN201716645U (en) * | 2010-05-13 | 2011-01-19 | 陈士虎 | Built-in radiator for notebook computer |
| CN202771350U (en) * | 2012-07-20 | 2013-03-06 | 张晓飞 | Water-circulation heat-dissipation device of notebook computer |
| CN105652991A (en) * | 2015-12-29 | 2016-06-08 | 湖南长城银河科技有限公司 | Laptop cooling device and laptop |
| CN205721610U (en) * | 2016-05-25 | 2016-11-23 | 王建 | Notebook computer integral heat radiator |
| CN106648000A (en) * | 2016-12-27 | 2017-05-10 | 上海豊恒信息科技有限公司 | Built-in radiator of notebook computer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894885A (en) * | 2021-01-29 | 2021-06-04 | 重庆特斯联智慧科技股份有限公司 | Intelligent robot heat dissipation structure and heat dissipation method |
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Legal Events
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|---|---|---|---|
| DD01 | Delivery of document by public notice |
Addressee: Zhu Xiaying Document name: Notification of Acceptance of Patent Application |
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| DD01 | Delivery of document by public notice | ||
| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: SHANGHAI LIHENG INFORMATION TECHNOLOGY CO.,LTD. Person in charge of patents Document name: Notice of First Examination Opinion |
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| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: SHANGHAI LIHENG INFORMATION TECHNOLOGY CO.,LTD. Person in charge of patents Document name: Deemed withdrawal notice |
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| DD01 | Delivery of document by public notice | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170707 |
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| WD01 | Invention patent application deemed withdrawn after publication |