CN207610584U - A kind of microchannel heat sink - Google Patents
A kind of microchannel heat sink Download PDFInfo
- Publication number
- CN207610584U CN207610584U CN201721540496.7U CN201721540496U CN207610584U CN 207610584 U CN207610584 U CN 207610584U CN 201721540496 U CN201721540496 U CN 201721540496U CN 207610584 U CN207610584 U CN 207610584U
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- China
- Prior art keywords
- evaporator
- fan
- heat sink
- microchannel
- medium
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Abstract
The utility model provides a kind of microchannel heat sink, including：Evaporator is embedded with microchannel, for absorbing heat, liquid medium is vaporized and generates gaseous medium；Steam pipe is connected to upper end of evaporator, for conveying gaseous medium；Fan is connect with steam pipe, and gaseous medium is liquefied as liquid medium and takes away the heat that liquefaction generates；And liquid pipe, one end are fixedly connected with cold air device, the other end is connected to the lower end of evaporator, and for the liquid medium in condenser to be back in evaporator, fan is the fan of microelectronic device.The medium in evaporator in the microchannel heat sink of the utility model takes away the amount of heat that chip operation generates by phase transformation cycle, ensures the long-play of chip, and extend the working life of chip, improves the stability of microelectronic device entirety.In addition, the fan in fan and microelectronic device in the device is same fan, no longer needs to addition and use condenser, save cost and installation space.
Description
Technical field
The utility model is related to a kind of radiators, and in particular to a kind of microchannel heat sink.
Background technology
There are three types of basic modes for heat transfer：Conduction, convection current and radiation.In the heat dissipation design of electronic equipment, with these
Some related laws of thermaltransmission mode are vital.
In order to carry out effective heat management work to electronic equipment, people have had numerous means, such as：Heat dissipation
Device, fan, air blower, cold plate.Thermal interface materials, fan case, temperature-difference refrigerating, heat exchanger, heat pipe and air-conditioning etc..
However in recent years, with the development of field of microelectronics, the frequency of cpu elements is higher and higher, the heat for the generation that works
Also rise therewith, electronic device long-time high-efficiency operation can not be made by the attainable heat exchange limit of forced-convection heat transfer institute,
Therefore heat pipe heat exchanging technology is more paid attention to by people.
Meanwhile micro-channel heat exchanger replaces traditional heat exchanger in fields such as air-conditioning, space flight with gesture like splitting a bamboo, it is existing
Also warp-wise field of microelectronics marches.But it is system compact that how it, which reaches, and highly integrated is still microchannel in microelectronics
Have in field solve a great problem.
Utility model content
The utility model is to carry out to solve the above-mentioned problems, and it is an object of the present invention to provide a kind of microchannel heat sink.
The utility model provides a kind of microchannel heat sink, has the feature that, including：Evaporator is embedded with
Liquid medium is vaporized for absorbing heat and generates gaseous medium by microchannel；Steam pipe is connected to upper end of evaporator, for defeated
Send gaseous medium；Fan is connect with steam pipe, and gaseous medium is liquefied as liquid medium and takes away the heat that liquefaction generates；With
And liquid pipe, one end are fixedly connected with cold air device, the other end is connected to the lower end of evaporator, is used for the liquid medium in condenser
It is back in evaporator, fan is the fan of microelectronic device.
In microchannel heat sink provided by the utility model, it can also have the feature that：Wherein, microchannel dissipates
Thermal is arranged by way of inlaying on chip.
In microchannel heat sink provided by the utility model, it can also have the feature that：Wherein, evaporator is also
With bottom, which is red copper, and the surface of red copper is smooth, and evaporator absorbs the heat that chip generates by red copper.
In microchannel heat sink provided by the utility model, it can also have the feature that：Wherein, liquid medium
For water, gaseous medium is vapor.
In microchannel heat sink provided by the utility model, it can also have the feature that：Wherein, fan passes through
Aluminium alloy card slot is fixed on above liquid pipe.
The effect of utility model
Microchannel heat sink involved by the utility model, because being transported by the chip for absorbing microelectronic device
The heat generated when row, liquid medium carry out phase transformation by microchannel, and vaporization generates gaseous medium, into the vapour of evaporator upper end
Pipe carries out heat exchange by the fan of itself and surrounding air of microelectronic device, gaseous medium is liquefied as liquid medium, and
The heat that liquefaction generates is taken away by fan, the liquid medium for generation of liquefying is back to evaporator into liquid-in pipe, institute
With the medium in evaporator in the microchannel heat sink of the utility model takes away what chip operation generated by phase transformation cycle
Amount of heat, ensures the long-play of chip, and extends the working life of chip, improves the steady of microelectronic device entirety
It is qualitative.
In addition, the fan itself having in fan and microelectronic device in the microchannel heat sink of the utility model is
Same fan no longer needs to addition and uses condenser, saves cost and installation space.
In addition, steam pipe is arranged in upper end of evaporator, liquid pipe is connected to the lower end of evaporator, in this way can be to greatest extent
Ensure that into the medium of steam pipe be gaseous medium, and the medium for not generating phase transformation can absorb heat vaporization again.
In addition, by being embedded in microchannel in evaporator, heat exchange efficiency is improved, while increasing microchannel heat sink
The heat dissipation limit.
Description of the drawings
Fig. 1 is the structural schematic diagram of microchannel heat sink in the embodiments of the present invention；
Fig. 2 is the structural schematic diagram of microchannel heat sink in the embodiments of the present invention.
Specific implementation mode
In order to make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, with
Lower embodiment combination attached drawing is specifically addressed the utility model microchannel heat sink.
Fig. 1 is the structural schematic diagram of microchannel heat sink in the embodiments of the present invention, and Fig. 2 is the utility model
The structural schematic diagram of microchannel heat sink in embodiment.
As shown in Figure 1, 2, microchannel heat sink 100 is arranged by way of inlaying above chip, is used for microelectronics
Chip in equipment radiates, and has evaporator 10, steam pipe 20, fan 30 and liquid pipe 40.In the present embodiment, microelectronics
Equipment is computer.
Include bottom 11 and microchannel 12 in evaporator 10, inside accommodates liquid medium.Bottom 11 is red copper, the red copper
Surface it is smooth, bottom 11 is contacted with chip, absorbs the heat that is generated in high-speed cruising of chip, liquid medium bottom 11 with
And violent phase transformation is carried out in microchannel 12, i.e. vaporization generates gaseous medium.Gaseous medium is vapor, and liquid medium is water.
Steam pipe 20 is connect with the upper end of evaporator 10, and positioned at the top of the spatial position of evaporator 10, and vapor enters
In steam pipe 20.
Fan 30 is connect with steam pipe 20, the heat and surrounding air that vapor be liquefied as water, and liquefaction is generated
Carry out heat exchange.Fan 30 is the fan that computer itself has.
40 one end of liquid pipe is fixedly connected with fan 30, and one end is connected to the lower end of evaporator 10, by the water through passing through fan 30
It is back in evaporator 10.In the present embodiment, fan 30 is fixed on the upper end of liquid pipe 40 by aluminium alloy card slot 50.
The course of work of microchannel heat sink 100 is：When chip normally runs at high speed, to the purple of evaporator 10
The smooth surface of copper transmits a large amount of heat so that the liquid in evaporator 10 reaches boiling point, generates steam.Due to density
Variation, steam are upwardly into steam pipe 20 with microchannel 12, during which generate violent phase transformation, take away a large amount of heat.Due to vapour
The density contrast of pipe 20 and liquid medium and gaseous state combination person in liquid pipe 40, steam can flow into liquid pipe 40 all along steam pipe 20.
During this period, the heat in liquid pipe 40 is passed to air by the fan 30 in liquid pipe 40 by way of forced convertion, reduces liquid
The temperature of pipe 40.With the decline of temperature, the steam of Bottomhole pressure changes liquid again, since evaporator is flowed back in the effect of gravity
10 it is interior, the heat that generates when continuing to absorb chip operating vaporizes, carries out next cycle again later.
The effect of embodiment
Microchannel heat sink involved by the utility model, because being transported by the chip for absorbing microelectronic device
The heat generated when row, liquid medium carry out phase transformation by microchannel, and vaporization generates gaseous medium, into the vapour of evaporator upper end
Pipe carries out heat exchange by the fan of itself and surrounding air of microelectronic device, gaseous medium is liquefied as liquid medium, and
The heat that liquefaction generates is taken away by fan, the liquid medium for generation of liquefying is back to evaporator into liquid-in pipe, institute
With the medium in evaporator in the microchannel heat sink of the utility model takes away what chip operation generated by phase transformation cycle
Amount of heat, ensures the long-play of chip, and extends the working life of chip.
In addition, the fan itself having in fan and microelectronic device in the microchannel heat sink of the utility model is
Same fan no longer needs to addition and uses condenser, saves cost and installation space.
In addition, steam pipe is arranged in upper end of evaporator, liquid pipe is connected to the lower end of evaporator, in this way can be to greatest extent
Ensure that into the medium of steam pipe be gaseous medium, and the medium for not generating phase transformation can absorb heat vaporization again.
In addition, by being embedded in microchannel in evaporator, heat exchange efficiency is improved, while increasing microchannel heat sink
The heat dissipation limit.
In addition, the microchannel heat sink of the utility model is simple and practical, and low cost.
The above embodiment is the preferred case of the utility model, is not intended to limit the scope of protection of the utility model.
Claims (5)
1. a kind of microchannel heat sink radiates for the electronic chip to microelectronic device, which is characterized in that including：
Evaporator is embedded with microchannel, for absorbing heat, liquid medium is vaporized and generates gaseous medium；
Steam pipe is connected to the upper end of evaporator, for conveying the gaseous medium；
Fan is connect with the steam pipe, the heat band that the gaseous medium is liquefied as liquid medium and is generated the liquefaction
It walks；And
Liquid pipe, one end are fixedly connected with the fan, and the other end is connected to the lower end of the evaporator, and being used for will be in condenser
Liquid medium is back in the evaporator,
Wherein, the fan is the fan of the microelectronic device.
2. microchannel heat sink according to claim 1, it is characterised in that：
Wherein, the microchannel heat sink is arranged on the chip by way of inlaying.
3. microchannel heat sink according to claim 1, it is characterised in that：
Wherein, it is red copper that the evaporator, which also has bottom, the bottom, and the surface of the red copper is smooth, and the evaporator passes through
The red copper absorbs the heat that the chip generates.
4. microchannel heat sink according to claim 1, it is characterised in that：
Wherein, the liquid medium is water, and the gaseous medium is vapor.
5. microchannel heat sink according to claim 1, it is characterised in that：
Wherein, the fan is fixed on by aluminium alloy card slot above the liquid pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721540496.7U CN207610584U (en) | 2017-11-17 | 2017-11-17 | A kind of microchannel heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721540496.7U CN207610584U (en) | 2017-11-17 | 2017-11-17 | A kind of microchannel heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207610584U true CN207610584U (en) | 2018-07-13 |
Family
ID=62794615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721540496.7U Expired - Fee Related CN207610584U (en) | 2017-11-17 | 2017-11-17 | A kind of microchannel heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207610584U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111010847A (en) * | 2019-11-22 | 2020-04-14 | 广东工业大学 | Soaking plate type heat dissipation device |
| CN111741645A (en) * | 2020-05-26 | 2020-10-02 | 东南大学 | Heat dissipation device of wind turbine generator frequency converter |
| CN111750713A (en) * | 2020-05-15 | 2020-10-09 | 华北电力大学 | Vapor-liquid phase separation type loop heat pipe heat dissipation device with inserted porous membrane and working method thereof |
-
2017
- 2017-11-17 CN CN201721540496.7U patent/CN207610584U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111010847A (en) * | 2019-11-22 | 2020-04-14 | 广东工业大学 | Soaking plate type heat dissipation device |
| CN111010847B (en) * | 2019-11-22 | 2021-09-07 | 广东工业大学 | Soaking plate type heat dissipation device |
| CN111750713A (en) * | 2020-05-15 | 2020-10-09 | 华北电力大学 | Vapor-liquid phase separation type loop heat pipe heat dissipation device with inserted porous membrane and working method thereof |
| CN111741645A (en) * | 2020-05-26 | 2020-10-02 | 东南大学 | Heat dissipation device of wind turbine generator frequency converter |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180713 Termination date: 20181117 |