CN103429061A - Empty-belly heat pipe radiator - Google Patents
Empty-belly heat pipe radiator Download PDFInfo
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- CN103429061A CN103429061A CN201310397273XA CN201310397273A CN103429061A CN 103429061 A CN103429061 A CN 103429061A CN 201310397273X A CN201310397273X A CN 201310397273XA CN 201310397273 A CN201310397273 A CN 201310397273A CN 103429061 A CN103429061 A CN 103429061A
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Abstract
The invention relates to an empty-belly heat pipe radiator which comprises a condenser and a heat taking device mother board in contact with a heat source. The condenser is placed on the heat taking device mother board and is directly connected with the heat taking device mother board. The condenser and the heat taking device mother board are both of a hollow structure. The condenser comprises a plurality of hollow fins. The heat taking device mother board is provided with two surfaces, wherein one surface is in direct contact with a smooth plane of the heat source, a plurality of blind holes for the heat source to be mounted are formed in a heat taking device, and the hollow fins and the hollow heat taking device mother board are filled with working media of phase changing materials for radiating. A carbon nano-tube can be added in the phase changing materials to increase heat conducting capacity, cavities of the hollow fins are communicated with a cavity of the heat taking device mother board, the fins and the mother board are integrally formed into an integral structure, a plurality of micro groove groups are formed in the heat taking device mother board, and accordingly the radiating effect of the radiator on the heat source is improved, or for simplicity, the micro groove groups are not arranged, and planes or other curved faces are used.
Description
Technical field
The present invention relates to a kind of Novel efficient heat radiator, be specially adapted to that caloric value is large and heat-sinking capability is inadequate, be subject to again the high-power electronic component of bulk constraint, as igbt, igct etc.And led, tec, cpu, the devices such as gpu.This radiator is changed traditional solid fin radiator and is adopted hollow fin radiator, and helps with the microflute technology, the composite Nano technology, and the multinomial new technologies such as gravity assisted heat pipe technology, therefore be referred to as heat-pipe radiator on an empty stomach.With the conventional planar gravity force heat pipe radiator, compare, its thermal resistance is its 1/5th left and right only.Thereby, under the radiating condition of equal volume, its heat-sinking capability has improved 95 40 percent to percent left and right.
Background technology
As everyone knows, such as Switching Power Supply, variable frequency power supply, IGBT, IGCT and LED, TEC, the energy consumption of the high power devices such as GPU is higher.Wherein only few a part of electric energy is converted into useful power and can serves for the mankind, as light of led etc.And most energy consumption becomes heat energy, if these dissipation of heats are not gone out, device can't work.Therefore, efficient radiator plays vital effect for the service behaviour of high power device.
Modern heat dissipation technology commonly used mainly contains: Natural Heat Convection, install the fan forced heat radiation additional, liquid-cooling heat radiation, heat pipe heat radiation, semiconductor refrigeration radiating etc.The thermal resistance of Natural Heat Convection mode is large, and heat transfer property is poor, and when the device heat density is greater than 0.08W/cm2, this cooling means can not meet actual requirement.Usually have to adopt the mode application reluctantly that strengthens heat sink size.And that the radiating mode that installs fan additional takes up space is larger, noise is also large, has often limited its application.Liquid cooling heat radiation system is more complicated, and its life-span is subject to the restriction of water pump packing circle, once cooling fluid leaks outside, can soak wiring board, and reliability is difficult to guarantee.Heat pipe is as a kind of high-performance heat transfer components, the heat transmission is very fast, but because the fin heat resistance of radiator is larger, heat-sinking capability does not catch up with and is difficult to reach good effect, and have the core hot pipe technique directly to be applied in the heat radiation of high power device also to exist, manufacturing cost is high, volume is doted on greatly, the shortcomings such as processing difficulties, be unfavorable for the marketization of product.Semiconductor refrigerating easily produces the cold junction dewfall, causes main plate short, and refrigerating efficiency is low, and consumed power is larger.Therefore, develop a kind of high power device and moderate cost of can be applicable to, volume is little, and efficient, it is particularly urgent that the new radiator that reliability is high seems.
Current widely used radiating mode has: A, fin type radiator shown in Fig. 1, mainly that highly heat-conductive material (as aluminium section bar or copper) extrusion modling is formed to fin 4, then fin is gone out the dissipation of heat of thermal source 1 by natural convection air, or increases the forced air cooling measure to improve radiating effect.B, plane heat-pipe radiator as shown in Figure 2.Its fin is the solid metal materials such as copper aluminium, and hollow plane heat pipe substrate is connected.Above-mentioned radiator is in the process that heat is derived, and contact heat resistance 2 is larger, and the temperature of heater is often high tens degrees centigrade and even tens degrees centigrade than the temperature of fin.And the temperature that semiconductor PN can bear is wished not higher than 65 ℃.Generally believe in the world, during higher than this temperature, every increase is 5 ℃, and can shorten one times device lifetime, and reliability will obviously reduce.Therefore, people wish to develop a kind of radiator overall dimensions that neither increase, and also do not increase the high-efficiency radiator of heatsink weight.
Summary of the invention
In order to improve the radiating effect of radiator to high power device, the applicant has invented a kind of empty stomach heat-pipe radiator by research for many years.Described radiator comprises condenser, the heat collector motherboard contacted with thermal source.Condenser is positioned on the heat collector motherboard and directly connects with it.It is characterized in that: described condenser and heat collector motherboard are hollow structure, and condenser comprises the fin of a plurality of hollows.Described heat collector motherboard has two surfaces, and one of them surface is the smooth flat in direct contact heat source, and is provided with a plurality of blind holes that thermal source is installed on heat collector.Another surface is the surface of plane or microflute shape, in the fin of the plurality of hollow and heat collector motherboard cavity, is filled with the working medium for phase-change heat.
The fin cavity of the plurality of hollow and the cavity of heat collector motherboard are structure as a whole.Be provided with a plurality of microflutes that adapt with hollow fin in described heat collector motherboard, hollow fin is incorporated in this holding tank, and the sidewall of hollow fin bottom is connected with the sidewall of this motherboard holding tank respectively.The working medium of wherein said heat radiation is phase-change material, in order further to improve radiating effect, can also in phase-change material, add CNT (carbon nano-tube); Described phase-change material comprises distilled water, methyl alcohol, acetone, the HFC cold-producing medium, and calcium chloride, calcium nitrate, manganese nitrate, the multiple working medium such as sodium sulphate, choose the wherein combination of one or more according to actual requirement.Wherein said heat collector motherboard bottom comprises a plurality of machine works, section bar extrusion, etching, microflutes that the technology such as forging and stamping form, or plane or other curved surfaces of utilizing of employing.The material of described fin and motherboard comprises the nonmetallic materials of aluminium, copper and other high-thermal conductive metal materials or high heat conduction.Described thermal source comprises the electronic devices and components of the plurality of specifications models such as high-power LED, TEC, IGBT, IGCT, and the chip that needs distribute heat in addition, as cpu, and gpu etc.Number and the size of described fin are not particularly limited, and can need to arrange according to the reality heat radiation.
The present invention also provides a kind of method of heat-pipe radiator on an empty stomach of manufacturing.
Said method comprising the steps of: the first step: select high thermal conductivity materials to make the condenser of a plurality of hollow fin groups of radiator and the heat collector motherboard of hollow, by welding or bonding or other ways structure that forms as one for described condenser and heat collector motherboard.And draw one and be convenient to clean, vacuumize the small pipeline of filling working medium.Also can adopt that extraordinary die casting moulding or other modes are disposable is made of one condenser and motherboard.Second step: the cavity to fin condenser inwall and heat collector motherboard hollow is cleaned, and it is carried out to passivation.The 3rd step: the cavity of fin condenser and heat collector motherboard hollow is evacuated.The 4th step: fill with working medium in the cavity of fin condenser and heat collector motherboard hollow.The 5th step: the radiator outer surface is carried out to anodic oxidation, electrophoretic coating or other protecting metallic surface treatment measures.Described working medium also can be added the phase-change material that contains CNT (carbon nano-tube).
Empty stomach heat-pipe radiator of the present invention is on the basis that does not increase radiator overall dimensions and weight, hollow fin condenser and hollow heat collector motherboard are shaped to the integrative-structure that cavity is interconnected, also can microflute be set in the bottom of this heat collector motherboard, further to improve the heat-sinking capability of filling gravity cooling phase-change medium in this cavity, thereby improved the radiating efficiency to high power device.
The accompanying drawing explanation
Fig. 1: common radiator;
Fig. 2: plane heat-pipe radiator;
Fig. 3: the basic functional principle schematic diagram of gravity assisted heat pipe;
Fig. 4: gravity force heat pipe radiator;
Fig. 5: empty stomach heat-pipe radiator;
Fig. 6: conical finned is heat-pipe radiator on an empty stomach;
Fig. 7: rectangular fin is heat-pipe radiator on an empty stomach;
Fig. 8: Round fin is heat-pipe radiator on an empty stomach;
Fig. 9: the influence curve figure of input power to the LED surface temperature of three kinds of different radiator assemblings;
Figure 10: the influence curve figure of ambient temperature to the LED surface temperature of three kinds of different radiator assemblings;
Figure 11: the manufacture method schematic diagram of empty stomach heat-pipe radiator;
Figure 12-Figure 16: a kind of finished figure of empty stomach heat-pipe radiator.
1: thermal source, 2: contact heat resistance, 3: motherboard, 4: fin, 5: working medium, 6: holding tank, 3-1: evaporation section, 3-2: adiabatic section, 3-3: condensation segment, 3-4: shell, 3-5: heat release, 3-6: steam, 3-7: withdrawing fluid, 3-8: heat absorption, 11-1: microflute group, 11-2: for vacuumizing, be filled with the pipeline of working medium.
Specific embodiment
At first introduce the present invention's heat-pipe radiator on an empty stomach in conjunction with specification and accompanying drawing.As shown in Figure 3, it is a kind of efficient plane gravity force heat pipe radiator that relies on gravity to return liquid to the basic functional principle of described radiator, and the heat transfer direction is irreversible.The working media savings of gravity assisted heat pipe is in the bottom of heat pipe package 3-4, and evaporation section 3-1 is in the heat pipe Lower Half, and the section of condensing 3-3 is at the first half of heat pipe, and adiabatic section 3-2 is in centre.Working medium is evaporated absorbed the heat that thermal source supplies with by heat absorption 3-8 at evaporation section after.Steam 3-6 upwards flows, and behind adiabatic section, gives low-temperature receiver heat release 3-5 in the section of condensing by the latent heat of vaporization, thereby condenses into liquid.Condensation water is because the effect of gravity forms withdrawing fluid 3-7, and withdrawing fluid 3-7 is back to the Lower Half evaporation section and completes a duty cycle.Continuously circulate by working medium, the heat of Lower Half thermal source is passed to continuously to the low-temperature receiver of the first half.
The applicant has developed novel heat-pipe radiator according to above-mentioned principle.In one embodiment, this novel heat pipe radiator is plane gravity force heat pipe radiator as shown in Figure 4.Described gravity force heat pipe radiator comprises the fin 4 of N hollow and the heat collector motherboard 3 contacted with thermal source 1.Be full of the heat-conducting work medium 5 that comprises phase-change material in the fin that wherein highly heat-conductive material of hollow forms, as distilled water, methyl alcohol, acetone, HFC cold-producing medium, calcium chloride, calcium nitrate, manganese nitrate, one or more in the multiple working medium such as sodium sulphate.In order further to improve radiating efficiency, can in phase-change material, add CNT (carbon nano-tube).N the holding tank 6 adapted with hollow fin arranged in motherboard 3, and hollow fin is incorporated in this holding tank, and the sidewall of hollow fin 4 contacts with bottom with the sidewall of holding tank respectively with bottom, and larger heat radiation contact area is arranged.Than the common fin radiator as attached Fig. 1 and 2, heat-pipe radiator is in the process of heat radiation on an empty stomach, not only can as common radiator, rely on 4 pairs of thermals source 1 of fin to be dispelled the heat, the more important thing is that the working medium 5 in hollow fin inside, in the heat radiation process, phase transformation has occurred, therefore the heat that the heat that can take away is taken away than the common plane heat-pipe radiator that only relies on the fin heat radiation is more, temperature is higher, and heat transfer temperature difference is lower.So the heat-sinking capability of heat-pipe radiator is better than the radiating effect of common plane heat-pipe radiator on an empty stomach.
For the integrated level (that is to say in the situation that do not increase the size of radiator) that improves radiator and thermal source and the heat-sinking capability that further improves novel heat pipe radiator, the applicant has invented heat-pipe radiator on an empty stomach, this empty stomach heat-pipe radiator has been concentrated the microflute technology, hot pipe technique, nanometer technology, the low thermal resistance technology.
In conjunction with Figure of description 5 and 11, this empty stomach heat-pipe radiator is described.Described empty stomach heat-pipe radiator comprises heat collector motherboard 3, comprises the working medium 5 of phase change medium material, condenser fin 4.Heat collector motherboard 3 has two surfaces, the smooth flat in one of them surperficial direct contact heat source 1, and wherein thermal source can be the high power devices such as LED, TEC, IGBT, IGCT, or cpu, the gpu chip.Heat collector motherboard 3 adopts and comprises that copper, aluminium or other metal material form, and is provided with the blind hole of being convenient to install thermal source on heat collector.In order to increase the contact area of heat collector motherboard and working medium, on another surface of heat collector motherboard, utilize the microflute technology to form several microflutes group 11-1.Phase-change material requires depending on the actual temperature of thermal source 1.Condenser is the N group fin structure with hollow, and there is no particular limitation for the concrete geometry of the medial surface of described hollow fin 4, can be triangular pyramidal, rectangle, and circular or other any suitable shape, as shown in Figure of description 6-8.Wherein accompanying drawing 6 is conical finned, and accompanying drawing 7 is square type fin, and accompanying drawing 8 is Round fin, and its lateral surface is designed to the wing of various shapes.The belly of fin is hollow, thereby its thermal resistance is starkly lower than common fin type radiator.
Than the plane gravity force heat pipe radiator, integral body of the one-body molded formation of condenser fin 4 of the heat collector motherboard 3 of the hollow of heat-pipe radiator and whole hollow on an empty stomach, by fin with together with the cavity of motherboard is interconnected, as shown in Figure 5.Also there is the accommodating groove that holds fin 46 as shown in Figure 4 in heat collector motherboard 3.The contact area of the contact area rate gravity force heat pipe radiator internal working medium liquid of heat-pipe radiator internal working medium liquid and inner surface of tube wall and inner surface of tube wall is much larger on an empty stomach, therefore the heat that the heat force of gravity heat-pipe radiator that can take away is taken away is more, surface temperature is higher, heat transfer temperature difference is larger, so stronger than plane gravity force heat pipe radiator of heat-pipe radiator heat-sinking capability on an empty stomach.
Comparative example
In order to illustrate that empty stomach heat-pipe radiator of the present invention has higher radiating efficiency, existing empty stomach heat-pipe radiator in Fig. 5 and the common radiator in Fig. 1,2 and plane heat-pipe radiator are compared.
The thermal resistance of radiator=contact heat resistance R
1+ heat radiation motherboard thermal resistance R+fin heat resistance R.Just generally speaking, R
1=10%R is total, R
2=10%R
Always, fin heat resistance=80% R
Always.Therefrom can find out, the thermal resistance of fin becomes the biggest factor that affects radiator heat-dissipation efficiency, and the structure of fin is directly determining the size of its thermal resistance.As can be seen from above: R
1a=R
1b=R
1cR
2aR
2bR
2CR
3aR
3bR
3cAnd the applicant obtains through measuring and calculating according to a large amount of analysis of experimental data: R
3c=R
3b1/4=R
3a1/6; Wherein: R
1aFor the contact heat resistance of common radiator in Fig. 1, R
1bFor the contact heat resistance of common plane heat-pipe radiator in Fig. 2, R
1cContact heat resistance for empty stomach heat-pipe radiator in Fig. 5; R
2aThermal resistance for common radiator motherboard in Fig. 1; R
2bThermal resistance for common plane heat-pipe radiator motherboard in Fig. 2; R
2cThermal resistance for empty stomach heat-pipe radiator motherboard in Fig. 5; R
3aThermal resistance for common radiator fin in Fig. 1; R
3bThermal resistance for common plane heat-pipe radiator fin in Fig. 2; R
3cThermal resistance for empty stomach heat-pipe radiator fin in Fig. 5.
The applicant by concrete experiment by the heat sink applications in accompanying drawing 1,2,5 in great power LED is dispelled the heat, the high-powered LED lamp of three kinds of radiators shown in accompanying drawing 1,2,5 has been installed respectively, under different ambient temperatures and different input power condition, the test result of corresponding surface temperature is as shown in Fig. 9-10.From Fig. 9, can learn, when ambient temperature is set as 30 ℃, under different input power, the temperature of the common radiator of Fig. 1 and the contact-making surface of high-powered LED lamp is all higher, the temperature of the empty stomach heat-pipe radiator in Fig. 5 and the contact-making surface of high-powered LED lamp is lower, and the contact-making surface temperature of the plane heat-pipe radiator in Fig. 2 falls between; LED lamp surface temperature raises along with the increase of the heating power of LED lamp, but uses the degree varies sample of the surface temperature rising of different radiator LED lamps.The temperature increasing degree of the empty stomach heat-pipe radiator contact-making surface in Fig. 5 is less, and the common radiator in Fig. 1 is larger with the temperature increasing degree of contact-making surface, and the plane heat-pipe radiator contact-making surface temperature in Fig. 4 occupy between the two; The radiating effect of heat-pipe radiator is better on an empty stomach.
From Figure 10, can learn, when the input power of high-powered LED lamp is made as 14W, along with the rising of ambient temperature, the surface temperature of high-powered LED lamp also raises, and the surface temperature increasing degree of applying different radiator LED lamps is substantially the same.At the equivalent environment temperature, the temperature of the contact-making surface of the common radiator in Fig. 1 and LED lamp is all higher, and in Fig. 5, the temperature of the contact-making surface of empty stomach heat-pipe radiator and LED lamp is all lower, and the plane heat-pipe radiator in Fig. 4 falls between.Therefore on an empty stomach heat-pipe radiator can make great power LED work in lower temperature, and the change of ambient temperature is also had to better adaptability.
Now in conjunction with Figure of description 11, describe the present invention's manufacture method of heat-pipe radiator on an empty stomach in detail.At first select the materials processing of high thermal conductivities such as aluminium or copper to form the hollow fin condenser of radiator and the heat collector motherboard of hollow, again by welding or bonding or other ways structure that forms as one for described condenser and heat collector motherboard, and draw one and be convenient to clean, vacuumize, the pipeline 11-2 of filling working medium, also can adopt that extraordinary die casting moulding or similar fashion are disposable makes one by condenser fin and motherboard; Especially, it should be noted that, in order further to improve heat-sinking capability, be preferably on the heat collector motherboard and utilize the microflute technology that a plurality of microflute group 11-1 are set, and in fin condenser, fin number or size can be determined with space size according to actual needs, then clean the cavity of fin condenser and heat collector motherboard hollow with highly pressurised liquid, and to being evacuated after its passivation, then tank annotates appropriate working medium, preferably mixes the nano carbon tube material of some to improve radiating effect again.Finally again the radiator outer surface is carried out to anodic oxidation, electrophoretic coating or take other safeguard procedures, can be made into the empty stomach heat-pipe radiator finished product of the present invention as shown in Figure 12-16.
The more conventional plane of empty stomach heat-pipe radiator manufacture craft of the present invention heat-pipe radiator complexity, but greatly reduce the fin heat resistance that has radiator now; The more unidimensional common plane heat-pipe radiator of its heat-sinking capability has improved 40%～95%; In limit heat-flow density, there is unrivaled heat dispersion in the industry, the change of ambient temperature is had to better adaptability.By above-mentioned conclusion, can be expected, this novel empty stomach heat-pipe radiator will be widely used with higher cost performance, stable and efficient heat exchange property.
Claims (10)
1. a heat-pipe radiator on an empty stomach, comprise condenser and the heat collector motherboard contacted with thermal source, described condenser is positioned on the heat collector motherboard and directly connects with it, it is characterized in that: described condenser and heat collector motherboard are hollow structure, and described condenser comprises the fin of a plurality of hollows, described heat collector motherboard has two surfaces, the smooth flat in one of them surperficial direct contact heat source, and on heat collector, be provided with for a plurality of blind holes of thermal source are installed, be filled with the working medium for phase-change heat in the heat collector motherboard of the fin of the plurality of hollow and hollow.
2. radiator as claimed in claim 1, is characterized in that: the mutual UNICOM of cavity of the fin cavity of the plurality of hollow and the heat collector motherboard of hollow, the overall structure that wherein this fin and heat collector motherboard are formed in one and form.
3. radiator as claimed in claim 1, it is characterized in that: be provided with a plurality of holding tanks that adapt with hollow fin in described heat collector motherboard, hollow fin is incorporated in this holding tank, and the sidewall of hollow fin contacts with bottom with the sidewall of this motherboard holding tank respectively with bottom.
4. described radiator as arbitrary as claim 1-3, it is characterized in that: the working medium of wherein said heat radiation comprises phase-change material.
5. radiator as claimed in claim 4, it is characterized in that: the working medium of described heat radiation also comprises CNT (carbon nano-tube).
6. radiator as claimed in claim 4, it is characterized in that: described phase-change material comprises any one in distilled water, methyl alcohol, acetone, HFC cold-producing medium, calcium chloride, calcium nitrate, sodium sulphate and manganese nitrate.
7. radiator as claimed in claim 2 is characterized in that: wherein said heat collector motherboard bottom comprises having a plurality of microflutes that utilize the microflute technology to form, or the curved surface of plane or other shapes.
8. radiator as claimed in claim 4, it is characterized in that: the material of described fin and motherboard comprises aluminium, copper and other thermal conductive metallic materials and heat conduction nonmetallic materials, described thermal source comprises high-power LED, TEC, IGBT, IGCT, and all heating elements that need heat radiation in addition, heat radiation need to limit according to reality for described fin number and size.
9. manufacture the method for heat-pipe radiator on an empty stomach for one kind, it is characterized in that: said method comprising the steps of:
The first step: select high thermal conductivity materials to form a plurality of hollow fin condensers of radiator and the heat collector motherboard of hollow, by condenser and the heat collector structure that forms as one, and draw one and be convenient to cleaning, vacuumize the pipeline of tank working medium;
Second step: the cavity to fin condenser inwall and heat collector motherboard hollow is cleaned, and it is carried out to passivation;
The 3rd step: the cavity of fin condenser and heat collector motherboard hollow is evacuated;
The 4th step: fill with working medium in the cavity of fin condenser and heat collector motherboard hollow;
The 5th step: the radiator outer surface is carried out to anodic oxidation or electrophoretic coating processing.
10. the method for heat-pipe radiator on an empty stomach of manufacturing as claimed in claim 9, it is characterized in that: the heat collector motherboard cavity of the plurality of hollow fin cavity and hollow is interconnected, this fin and motherboard are structure as a whole, the form as one technique of structure of described condenser and heat collector template comprises welding, bonding, or utilizes extraordinary die casting to become one structure.
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| CN104600188A (en) * | 2014-12-30 | 2015-05-06 | 东莞市高能磁电技术有限公司 | Combined effective cooling device |
| CN104936419A (en) * | 2015-06-09 | 2015-09-23 | 廖婕 | Radiator for communication equipment |
| CN105101751A (en) * | 2015-07-03 | 2015-11-25 | 浙江嘉熙光电设备制造有限公司 | Thermal superconductive gilled radiator and manufacturing method therefor |
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| CN109803518B (en) * | 2019-02-28 | 2023-10-03 | 常州恒创热管理有限公司 | Plate type heat pipe |
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