CN105135921A - Superconductive temperature-even type structural-heat-resistance-free cooler - Google Patents
Superconductive temperature-even type structural-heat-resistance-free cooler Download PDFInfo
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- CN105135921A CN105135921A CN201510503597.6A CN201510503597A CN105135921A CN 105135921 A CN105135921 A CN 105135921A CN 201510503597 A CN201510503597 A CN 201510503597A CN 105135921 A CN105135921 A CN 105135921A
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Abstract
The invention discloses a superconductive temperature-even type structural-heat-resistance-free cooler. The superconductive temperature-even type structural-heat-resistance-free cooler comprises a temperature-even type heat conducting cavity and a plurality of cooling fins. The multiple cooling fins are arranged on the temperature-even type heat conducting cavity. A plurality of minuteness flow guide grooves are formed in the temperature-even type heat conducting cavity. The temperature-even type heat conducting cavity is filled with condensing media. The temperature-even type heat conducting cavity and the multiple cooling fins are integrally formed. A heat source can be directly installed on the superconductive temperature-even type structural-heat-resistance-free cooler, the structural heat resistance can not be caused by connection between the parts, and the superconductive function is achieved. The superconductive temperature-even type structural-heat-resistance-free cooler can rapidly conduct heat, and the overall temperature of the cooler is basically coincident; and in addition, the superconductive temperature-even type structural-heat-resistance-free cooler is small in overall weight, convenient to machine and install, low in cost and wide in application range, the angle of the cooler can be adjusted according to the installation direction of the heat source, and limitation by the installation direction can be avoided.
Description
Technical field
The present invention relates to radiating device technical field, particularly a kind of superconductive temperature equalizing formula amorphousness thermal resistance radiator.
background technology
Radiator of the prior art often heat conduction is slow, and radiator integral temperature is inconsistent, and the radiator each several part temperature difference is large; Often need in heat source body of the prior art to be arranged on heat transfer device by fixed head, form structural thermal resistance, cause heat dispersion poor, and the work always continued due to heat source body, add that product is formed by connecting by heat carrier and radiator in the past, cause the temperature of structural thermal resistance to increase, the regional temperature of structural thermal resistance is high, compromises the service life of heat source body body.
Summary of the invention
The object of the present invention is to provide the superconductive temperature equalizing formula amorphousness thermal resistance radiator that a kind of structure is simple, easy to process, easy for installation, dispel the heat ultrafast, cost is low.
The technical solution realizing the object of the invention is:
A kind of superconductive temperature equalizing formula amorphousness thermal resistance radiator, it is characterized in that: comprise uniform temperature type thermal conductive cavity and several radiating fins, described uniform temperature type thermal conductive cavity is provided with several radiating fins, and be provided with some fine guiding gutters in uniform temperature type thermal conductive cavity, uniform temperature type thermal conductive cavity is built with cooling medium; Described uniform temperature type thermal conductive cavity is one-body molded with several radiating fins.
Preferably, described uniform temperature type thermal conductive cavity is U-shaped uniform temperature type thermal conductive cavity, and both sides and the bottom of U-shaped uniform temperature type thermal conductive cavity are equipped with several radiating fins.
Preferably, described uniform temperature type thermal conductive cavity is straight type uniform temperature type thermal conductive cavity, and the side of straight type uniform temperature type thermal conductive cavity is provided with several radiating fins.
Preferably, described uniform temperature type thermal conductive cavity is provided with installing hole, and heat source body is fixed on uniform temperature type thermal conductive cavity by installing hole.
Preferably, described uniform temperature type thermal conductive cavity and several radiating fins all adopt Heat Conduction Material to make.
Preferably, described cooling medium can adopt pure water, methyl alcohol, acetone, activity liquid metals etc. or other media.
The present invention compared with prior art, its remarkable advantage: heat source body can be directly installed on radiator by superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention, because of the connection between parts, can not form structural thermal resistance, realize superconduction function; Superconductive temperature equalizing formula amorphousness thermal resistance radiator energy quick conductive of the present invention, radiator integral temperature is basically identical; And superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention adopt heat carrier and radiator one-body molded, realize amorphousness thermal resistance, overall weight is light, easy to process, cost is low, easy to use, applied range, heat source body angle-adjustable also can realize quick conductive and heat radiation, extend service life of heat source body, be widely used in variously needing on radiating element, as LED lamp, computer etc.
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Accompanying drawing explanation
Fig. 1 is the structural representation that superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention adopts U-shaped samming chamber.
Fig. 2 is the left view that superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention adopts U-shaped samming chamber.
Fig. 3 is the structural representation that superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention adopts straight type samming chamber.
Fig. 4 is the right view that superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention adopts straight type samming chamber.
Detailed description of the invention
Embodiment 1: as depicted in figs. 1 and 2, a kind of superconductive temperature equalizing formula amorphousness thermal resistance radiator, comprise uniform temperature type thermal conductive cavity and several radiating fins 1, described uniform temperature type thermal conductive cavity is U-shaped uniform temperature type thermal conductive cavity 3, the both sides of U-shaped uniform temperature type thermal conductive cavity 3 and bottom are equipped with several radiating fins 1, be provided with some fine guiding gutters 2 in U-shaped uniform temperature type thermal conductive cavity 3, U-shaped uniform temperature type thermal conductive cavity 3 inner bottom part is equipped with cooling medium; Described U-shaped uniform temperature type thermal conductive cavity 3 is one-body molded with several radiating fins 1; The bottom surface of described U-shaped uniform temperature type thermal conductive cavity 3 is provided with installing hole, is fixed on U-shaped uniform temperature type thermal conductive cavity 3 by heat source body 5 by installing hole; Wherein, U-shaped uniform temperature type thermal conductive cavity 3 and several radiating fins 1 can adopt aluminium, copper or aluminium alloy or other Heat Conduction Materials to make; Cooling medium can be pure water, methyl alcohol, acetone, activity liquid metals or other media; Be provided with some fine guiding gutters 2 in described U-shaped uniform temperature type thermal conductive cavity 3, when cooling medium changes into liquid state by gaseous state, liquid can by fine guiding gutter and gravity reflux.
Embodiment 2: a kind of superconductive temperature equalizing formula amorphousness thermal resistance radiator, comprise uniform temperature type thermal conductive cavity and several radiating fins 1, described uniform temperature type thermal conductive cavity is straight type uniform temperature type thermal conductive cavity 4, the side of straight type uniform temperature type thermal conductive cavity 4 is provided with several radiating fins 1, the another side of straight type uniform temperature type thermal conductive cavity 4 is provided with installing hole, and heat source body 5 is fixed on uniform temperature type thermal conductive cavity by installing hole; Be provided with some fine guiding gutters 2 in straight type uniform temperature type thermal conductive cavity 4, straight type uniform temperature type thermal conductive cavity 4 is built with cooling medium; Described straight type uniform temperature type thermal conductive cavity 4 is one-body molded with several radiating fins 1; Wherein, straight type uniform temperature type thermal conductive cavity 4 and several radiating fins 1 can adopt aluminium, copper or aluminium alloy or other Heat Conduction Materials to make; Cooling medium is pure water, methyl alcohol, acetone, activity liquid metals or other media; Be provided with some fine guiding gutters 2 in described straight type uniform temperature type thermal conductive cavity 4, when cooling medium changes into liquid state by gaseous state, liquid can by fine guiding gutter and gravity reflux.
The operation principle of superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention:
Heat source body is directly installed on radiator by superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention, because of the connection between parts, can not form structural thermal resistance, realize superconduction function, superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention passes through uniform temperature type thermal conductive cavity built with cooling medium, cooling medium is stored in uniform temperature type thermal conductive cavity by liquid form, when heat source body works, produce heat energy, make the liquid cooling medium existed, heat becomes high-temperature gas, cooling medium fast upward motion, realize superconduction function, when the cooling medium fast upward motion of gaseous state, when the cooling medium of high-temperature gas runs into radiating fin heat radiation, high-temperature gas is lowered the temperature, namely meet cold meeting and make high-temperature gas liquefy material again, moved downward by the fine guiding gutter in samming chamber and be back to heat source body place, whole process cooling medium becomes gaseous state by liquid state, again by the continuous circulation of gaseous state liquefy, the heat energy that heat source body is produced is derived fast, shed fast by radiating fin, achieve radiator energy quick conductive, heat radiation, make radiator integral temperature consistent.
In sum, heat source body can be directly installed on radiator by superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention, because of the connection between parts, can not form structural thermal resistance, realize superconduction function; Superconductive temperature equalizing formula amorphousness thermal resistance Heat Sink A heat sink energy quick conductive of the present invention, radiator integral temperature is basically identical; And superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention adopt heat carrier and radiator one-body molded, realize amorphousness thermal resistance, overall weight is light, easy to use, applied range, heat source body angle-adjustable also can realize quick conductive and heat radiation, extends the service life of heat source body, be widely used in variously needing on radiating element, as LED lamp, computer etc.; In superconductive temperature equalizing formula amorphousness thermal resistance radiator of the present invention, uniform temperature type thermal conductive cavity can adopt difformity, can be the difform uniform temperature type thermal conductive cavities such as U-shaped, straight type, " it " type.
Except the above embodiments, other embodiments do not stated also should within protection scope of the present invention; Specific embodiment as herein described is only to the explanation for example of the present invention's spirit, those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines; Although be described through specific term herein, but do not get rid of the possibility using other terms, use these terms to be only used to describe and explain essence of the present invention easily, the restriction that they are construed to any one additional is all contrary with spirit of the present invention.
Claims (6)
1. a superconductive temperature equalizing formula amorphousness thermal resistance radiator, it is characterized in that: comprise uniform temperature type thermal conductive cavity and several radiating fins (1), described uniform temperature type thermal conductive cavity is provided with several radiating fins (1), be provided with some fine guiding gutters (2) in uniform temperature type thermal conductive cavity, uniform temperature type thermal conductive cavity is built with cooling medium; Described uniform temperature type thermal conductive cavity is one-body molded with several radiating fins (1).
2. superconductive temperature equalizing formula amorphousness thermal resistance radiator according to claim 1, it is characterized in that: described uniform temperature type thermal conductive cavity is U-shaped uniform temperature type thermal conductive cavity (3), both sides and the bottom of U-shaped uniform temperature type thermal conductive cavity (3) are equipped with several radiating fins (1).
3. superconductive temperature equalizing formula amorphousness thermal resistance radiator according to claim 1, is characterized in that: described uniform temperature type thermal conductive cavity is straight type uniform temperature type thermal conductive cavity (4), and the side of straight type uniform temperature type thermal conductive cavity (4) is provided with several radiating fins (1).
4. superconductive temperature equalizing formula amorphousness thermal resistance radiator according to claim 1, it is characterized in that: described uniform temperature type thermal conductive cavity is provided with installing hole, heat source body (5) is fixed on uniform temperature type thermal conductive cavity by installing hole.
5. superconductive temperature equalizing formula amorphousness thermal resistance radiator according to claim 1, is characterized in that: described uniform temperature type thermal conductive cavity and several radiating fins (1) all adopt Heat Conduction Material to make.
6. superconductive temperature equalizing formula amorphousness thermal resistance radiator according to claim 1, is characterized in that: described cooling medium is pure water, methyl alcohol, acetone or activity metal liquid medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510503597.6A CN105135921A (en) | 2015-08-17 | 2015-08-17 | Superconductive temperature-even type structural-heat-resistance-free cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510503597.6A CN105135921A (en) | 2015-08-17 | 2015-08-17 | Superconductive temperature-even type structural-heat-resistance-free cooler |
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| CN105135921A true CN105135921A (en) | 2015-12-09 |
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| CN201510503597.6A Pending CN105135921A (en) | 2015-08-17 | 2015-08-17 | Superconductive temperature-even type structural-heat-resistance-free cooler |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11351769A (en) * | 1998-06-12 | 1999-12-24 | Furukawa Electric Co Ltd:The | Heat sink |
| CN101437381A (en) * | 2007-08-16 | 2009-05-20 | 苏州天宁换热器有限公司 | Heat radiator |
| CN101510533A (en) * | 2009-03-24 | 2009-08-19 | 赵耀华 | Novel microelectronic device radiator |
| CN201569340U (en) * | 2009-09-30 | 2010-09-01 | 广东德豪润达电气股份有限公司 | Flat heating pipe type heat dissipater |
| CN201590980U (en) * | 2009-11-24 | 2010-09-22 | 李运宇 | Radiator |
| CN103429061A (en) * | 2013-09-04 | 2013-12-04 | 中山佳一电子技术有限公司 | Empty-belly heat pipe radiator |
| CN204042816U (en) * | 2014-08-30 | 2014-12-24 | 杭州桑帝照明电器有限公司 | A kind of LED radiator based on vapor chamber heat dissipation technology |
| CN205425917U (en) * | 2015-08-17 | 2016-08-03 | 吴德坚 | Superconductive samming formula amorphousness thermal resistance radiator |
-
2015
- 2015-08-17 CN CN201510503597.6A patent/CN105135921A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11351769A (en) * | 1998-06-12 | 1999-12-24 | Furukawa Electric Co Ltd:The | Heat sink |
| CN101437381A (en) * | 2007-08-16 | 2009-05-20 | 苏州天宁换热器有限公司 | Heat radiator |
| CN101510533A (en) * | 2009-03-24 | 2009-08-19 | 赵耀华 | Novel microelectronic device radiator |
| CN201569340U (en) * | 2009-09-30 | 2010-09-01 | 广东德豪润达电气股份有限公司 | Flat heating pipe type heat dissipater |
| CN201590980U (en) * | 2009-11-24 | 2010-09-22 | 李运宇 | Radiator |
| CN103429061A (en) * | 2013-09-04 | 2013-12-04 | 中山佳一电子技术有限公司 | Empty-belly heat pipe radiator |
| CN204042816U (en) * | 2014-08-30 | 2014-12-24 | 杭州桑帝照明电器有限公司 | A kind of LED radiator based on vapor chamber heat dissipation technology |
| CN205425917U (en) * | 2015-08-17 | 2016-08-03 | 吴德坚 | Superconductive samming formula amorphousness thermal resistance radiator |
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Application publication date: 20151209 |
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