CN203588992U - Hot end and cold end integrated heat dissipation structure for TEC chip - Google Patents
Hot end and cold end integrated heat dissipation structure for TEC chip Download PDFInfo
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- CN203588992U CN203588992U CN201320534859.1U CN201320534859U CN203588992U CN 203588992 U CN203588992 U CN 203588992U CN 201320534859 U CN201320534859 U CN 201320534859U CN 203588992 U CN203588992 U CN 203588992U
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Abstract
The utility model relates to the technical field of electronic element heat dissipation structures, and specifically relates to a hot end and cold end integrated heat dissipation structure for a TEC chip. The structure comprises the TEC chip, a hot end heat dissipation assembly and a cold end refrigeration assembly. The two ends of the TEC chip are a chip hot end and a chip cold end respectively. The hot end heat dissipation assembly is connected with the chip hot end, and the cold end refrigeration assembly is connected with the chip cold end. The hot end heat dissipation assembly includes a hot tube, a thermal conductive fixed substrate, heat dissipation fins and a fan which are sequentially arranged. The cold end refrigeration assembly includes a heat insulator and a heat radiator which are sequentially arranged. The chip hot end is arranged on one side of the heat insulator and contacts with the hot end of the hot tube. The chip cold end is arranged on the other side of the heat insulator and contacts with the heat radiator. The hot end and cold end integrated heat dissipation structure provided by the utility model has high heat dissipation and refrigeration efficiency, being applicable to large air conditioners or large refrigerators, and having a wide application range.
Description
Technical field
The utility model relates to electronic component heat radiating structure technical field, particularly relates to a kind of hot junction and cold junction integrated heat dissipation structure of TEC chip.
Background technology
Thermoelectric refrigerating unit is little owing to having volume, noiselessness, do not use cold coal, without environmental protection public hazards, life-span is long, can stand upside down or edge-on flexible use, and the advantages such as directionless restriction, therefore have very wide application, applied industry comprises military affairs, medical treatment, industry, current consumption product, scientific research and telecommunications industry etc.In actual life and work, there are many concrete application examples in thermoelectric refrigerating unit, for example, the refrigerator of family's when picnic F&B, guided missile or extremely accurate temperature control system above airborne vehicle, all applied thermoelectric refrigerating unit.
But, in prior art, the cold and hot end of the chip of thermoelectric refrigerating unit (being called for short TEC chip) is owing to generally adopting fin and forced air cooling heat transfer structure to carry out heat conduction, cause the heat radiation of TEC chip higher with refrigeration module thermal resistance, thereby make TEC chip have the shortcoming that energy conversion efficiency is low, its energy conversion efficiency is generally 40% ~ 50%.And the cold junction of existing TEC chip and the heat in hot junction are more concentrated, the refrigerating efficiency that causes dispelling the heat is low.Therefore, existing TEC chip also cannot be applied to large-size air conditioning or large-scale refrigerator.Even if certain applications are on the small refrigerator of storage food and beverage for TEC chip, but existing TEC chip is not good in the refrigeration of low-temperature zone.Therefore, the range of application of existing TEC chip is restricted, and makes it be difficult to large area on market and popularizes and promote.
Summary of the invention
The purpose of this utility model is to provide for weak point of the prior art a kind of hot junction and cold junction integrated heat dissipation structure of TEC chip, the hot junction of this TEC chip and cold junction integrated heat dissipation structure have advantages of that heat radiation refrigerating efficiency is high, therefore, the hot junction of this TEC chip and cold junction integrated heat dissipation structure can be applied to large-size air conditioning or large-scale refrigerator, applied range.
For achieving the above object, the utility model is achieved through the following technical solutions.
Hot junction and cold junction integrated heat dissipation structure that a kind of TEC chip is provided, comprise TEC chip, hot-side heat dissipation assembly and cold junction cooling assembly; The two ends of described TEC chip are respectively chip hot junction portion and chip cold end, and described hot-side heat dissipation assembly is connected with described chip hot junction portion, and described cold junction cooling assembly is connected with described chip cold end;
Described hot-side heat dissipation assembly comprises heat pipe, heat conduction fixing base, radiating fin and the fan setting gradually; The hot junction of described heat pipe is embedded in described heat conduction fixing base, and the cold junction of described heat pipe is nested in described radiating fin, and described fan is connected with described radiating fin;
Described cold junction cooling assembly comprises heat preservation member and the heat diffusion member setting gradually; Described TEC chip is embedded in described heat preservation member, and described chip hot junction portion is arranged at a side of described heat preservation member and touches with the hot junction of described heat pipe, and described chip cold end is arranged at the opposite side of described heat preservation member and touches with described heat diffusion member.
Described heat diffusion member comprises the second heat pipe, support heat conduction matrix, near-end refrigeration fin and the second fan; The cold junction of described the second heat pipe is embedded in described support heat conduction matrix and touches with described chip cold end, and described near-end refrigeration fin is connected with described support heat conduction matrix and is one-body molded; Described the second fan is connected with described near-end refrigeration fin.
Being shaped as of described the second heat pipe is U-shaped, and the two ends of the second U-shaped heat pipe are the hot junction of the second heat pipe; The hot junction of two described the second heat pipes is provided with far-end refrigeration fin, three fan and mounting plate; Described far-end refrigeration fin is fixed on described mounting plate, and described three fan is connected with described far-end refrigeration fin; The hot junction of described the second heat pipe is nested in described far-end refrigeration fin.
Described heat diffusion member comprises soaking plate, support heat-conducting substrate, refrigeration fin and the 4th fan connecting successively; One side of described soaking plate and described chip cold end touch, and the opposite side of described soaking plate is connected with described support heat-conducting substrate.
Described support heat-conducting substrate and described refrigeration fin are set to one-body molded.
Described heat diffusion member comprises support heat-conducting substrate, the second near-end refrigeration fin and the tendencies fan connecting successively; One side of described support heat-conducting substrate and described chip cold end touch, and the opposite side of described support heat-conducting substrate is connected with described the second near-end refrigeration fin.
Described support heat-conducting substrate and described the second near-end refrigeration fin are set to one-body molded.
One side of described heat conduction fixing base is provided with groove, and the hot junction of described heat pipe is embedded in described groove.
One side of described support heat conduction matrix is provided with cell body, and the cold junction of described the second heat pipe is embedded in the cell body of described support heat conduction matrix.
Described fan, described the second fan, described three fan, described the 4th fan, described tendencies fan, described heat conduction fixing base, described heat preservation member, described support heat conduction matrix, described soaking plate, described support heat-conducting substrate, described radiating fin, described near-end refrigeration fin, described refrigeration fin, described far-end refrigeration fin, described the second near-end refrigeration fin, described mounting plate all offer installation fixing hole.
The beneficial effects of the utility model: the hot junction of a kind of TEC chip of the present utility model and cold junction integrated heat dissipation structure, comprise TEC chip, hot-side heat dissipation assembly and cold junction cooling assembly; The two ends of TEC chip are respectively chip hot junction portion and chip cold end, and hot-side heat dissipation assembly is connected with chip hot junction portion, and cold junction cooling assembly is connected with chip cold end; Hot-side heat dissipation assembly comprises heat pipe, heat conduction fixing base, radiating fin and the fan setting gradually; The hot junction of heat pipe is embedded in heat conduction fixing base, and the cold junction of heat pipe is nested in radiating fin, and fan is connected with radiating fin; Cold junction cooling assembly comprises heat preservation member and the heat diffusion member setting gradually; TEC chip is embedded in heat preservation member, and chip hot junction portion is arranged at a side of heat preservation member and touches with the hot junction of heat pipe, and chip cold end is arranged at the opposite side of heat preservation member and touches with heat diffusion member.The hot junction of this TEC chip and cold junction integrated heat dissipation structure have advantages of that heat radiation refrigerating efficiency is high, and therefore, the hot junction of this TEC chip and cold junction integrated heat dissipation structure can be applied to large-size air conditioning or large-scale refrigerator, applied range.
Accompanying drawing explanation
Fig. 1 is the blast structural representation of the hot junction of a kind of TEC chip of the present utility model and the embodiment 1 of cold junction integrated heat dissipation structure.
Fig. 2 is the structural representation of the hot junction of a kind of TEC chip of the present utility model and the embodiment 1 of cold junction integrated heat dissipation structure.
Fig. 3 is the blast structural representation of the hot junction of a kind of TEC chip of the present utility model and the embodiment 2 of cold junction integrated heat dissipation structure.
Fig. 4 is the structural representation of the hot junction of a kind of TEC chip of the present utility model and the embodiment 2 of cold junction integrated heat dissipation structure.
Fig. 5 is the blast structural representation of the hot junction of a kind of TEC chip of the present utility model and the embodiment 3 of cold junction integrated heat dissipation structure.
Fig. 6 is the structural representation of the hot junction of a kind of TEC chip of the present utility model and the embodiment 3 of cold junction integrated heat dissipation structure.
In Fig. 1 to Fig. 6, include:
1---TEC chip, 101---chip hot junction portion, 102---chip cold end,
2---heat pipe,
3---heat conduction fixing base, 301---groove,
4---radiating fin,
5---fan,
6---heat preservation member,
7---the second heat pipe,
8---supporting heat conduction matrix, 801---cell body,
9---near-end refrigeration fin,
10---the second fan,
11---far-end refrigeration fin,
12---three fan,
13---mounting plate,
14---soaking plate,
15---support heat-conducting substrate,
16---refrigeration fin,
17---the 4th fan,
18---support heat-conducting substrate,
19---the second near-end refrigeration fin,
20---tendencies fan,
21---fixing hole is installed.
Embodiment
The utility model is described in further detail with the following Examples.
See Fig. 1 and Fig. 2.The hot junction of a kind of TEC chip of the present embodiment and cold junction integrated heat dissipation structure, comprise TEC chip 1, hot-side heat dissipation assembly and cold junction cooling assembly; The two ends of TEC chip 1 are respectively chip hot junction portion 101 and chip cold end 102, and hot-side heat dissipation assembly is connected with chip hot junction portion 101, and cold junction cooling assembly is connected with chip cold end 102; Hot-side heat dissipation assembly comprises heat pipe 2, heat conduction fixing base 3, radiating fin 4 and the fan 5 setting gradually; The hot junction of heat pipe 2 is embedded in heat conduction fixing base 3, and the cold junction of heat pipe 2 is nested in radiating fin 4, and fan 5 is connected with radiating fin 4; Cold junction cooling assembly comprises heat preservation member 6 and the heat diffusion member setting gradually; TEC chip 1 is embedded in heat preservation member 6, and chip hot junction portion 101 is arranged at a side of heat preservation member 6 and touches with the hot junction of heat pipe 2, and chip cold end 102 is arranged at the opposite side of heat preservation member 6 and touches with heat diffusion member.Wherein, chip hot junction portion 101 scribbles heat-conducting layer with the place of touching, hot junction of heat pipe 2.The hot junction of this TEC chip and cold junction integrated heat dissipation structure have advantages of that heat radiation refrigerating efficiency is high, and therefore, the hot junction of this TEC chip and cold junction integrated heat dissipation structure can be applied to large-size air conditioning or large-scale refrigerator, applied range.
In the present embodiment, a side of heat conduction fixing base 3 is provided with groove 301, and the hot junction of heat pipe 2 is embedded in groove 301.In the present embodiment, groove 301 be shaped as half slot.
In the present embodiment, heat diffusion member comprises the second heat pipe 7, support heat conduction matrix 8, near-end refrigeration fin 9 and the second fan 10; The cold junction of the second heat pipe 7 is embedded in and supports heat conduction matrix 8 and touch with chip cold end 102, and near-end refrigeration fin 9 is connected with support heat conduction matrix 8 and is one-body molded; The second fan 10 is connected with near-end refrigeration fin 9.Wherein, the cold junction place of touching of chip cold end 102 and the second heat pipe 7 scribbles heat-conducting layer.
In the present embodiment, the cold junction that a side of support heat conduction matrix 8 is provided with cell body 801, the second heat pipes 7 is embedded in the cell body 801 that supports heat conduction matrix 8.In the present embodiment, cell body 801 be shaped as half slot.
In the present embodiment, being shaped as of the second heat pipe 7 is U-shaped, and the two ends of the second U-shaped heat pipe 7 are the hot junction of the second heat pipe 7; The hot junction of two the second heat pipes 7 is provided with far-end refrigeration fin 11, three fan 12 and mounting plate 13; Far-end refrigeration fin 11 is fixed on mounting plate 13, the three fans 12 and is connected with far-end refrigeration fin 11; The hot junction of the second heat pipe 7 is nested in far-end refrigeration fin 11.
Wherein, by near-end fin 9 and the far-end refrigeration fin 11 that freezes, dispel the heat, can form good circulating current, make good heat dissipation effect.
In the present embodiment, fan 5, the second fan 10, three fan 12, heat conduction fixing base 3, heat preservation member 6, support heat conduction matrix 8, radiating fin 4, near-end refrigeration fin 9, far-end refrigeration fin 11 and mounting plate 13 all offer installs fixing hole 21, by fixing hole 21 being installed and being utilized mechanically conventional connector that above-mentioned each assembly is carried out to correspondence, be fixedly connected with, thereby guarantee that overall structure is reliable, avoided complicated welding procedure simultaneously.Wherein, being arranged between heat conduction fixing base 3 and support heat conduction matrix 8 of heat preservation member 6, and the outside of heat preservation member 6 is compressed by fixing hole 21 and connector are installed by heat conduction fixing base 3 and support heat conduction matrix 8, meanwhile, TEC chip 1 is also fixed on heat preservation member 6 by the clamped interlocking of fixing hole 21 is installed.
In the present embodiment, heat pipe 2 and the second heat pipe 7 are set to normal temperature copper water heat pipe, and wherein normal temperature copper water heat pipe is sintered type normal temperature copper water heat pipe or is plough groove type normal temperature copper water heat pipe.In addition, according to needs of production, heat pipe 2 and the second heat pipe 7 also can be set to aluminium ammoniacal liquor Cryo Heat Tube.
Wherein, the metal material that heat conduction fixing base 3 and support heat conduction matrix 8 adopt aluminium or copper etc. to have good heat conductive performance is made.
See Fig. 3 and Fig. 4.The embodiment 2 of the hot junction of a kind of TEC chip of the present utility model and cold junction integrated heat dissipation structure, the difference of the present embodiment and embodiment 1 is, in the present embodiment, heat diffusion member comprises soaking plate 14, support heat-conducting substrate 15, refrigeration fin 16 and the 4th fan 17 connecting successively; One side and the chip cold end 102 of soaking plate 14 touch, and the opposite side of soaking plate 14 is connected with support heat-conducting substrate 15.In the present embodiment, support heat-conducting substrate 15 and be set to one-body molded with refrigeration fin 16.
Wherein, soaking plate 14, support heat-conducting substrate 15, refrigeration fin 16 and the 4th fan 17 all offer installs fixing hole 21, by fixing hole 21 being installed and being utilized mechanically conventional connector that above-mentioned each assembly is carried out to correspondence, be fixedly connected with, thereby guarantee that overall structure is reliable, avoided complicated welding procedure simultaneously.In the present embodiment, soaking plate 14 be shaped as tabular, certainly, according to the heat radiation needs of actual production, soaking plate 14 can also be designed to other 3D shape.
Wherein, the metal material that support heat-conducting substrate 15 adopts aluminium or copper etc. to have good heat conductive performance is made.
Other structure and the operation principle of the present embodiment are identical with embodiment 1, do not repeat them here.
See Fig. 5 and Fig. 6.The embodiment 3 of the hot junction of a kind of TEC chip of the present utility model and cold junction integrated heat dissipation structure, the difference of the present embodiment and embodiment 1 is, heat diffusion member comprises support heat-conducting substrate 18, the second near-end refrigeration fin 19 and the tendencies fan 20 connecting successively; The side and the chip cold end 102 that support heat-conducting substrate 18 touch, and the opposite side that supports heat-conducting substrate 18 is connected with the second near-end refrigeration fin 19.In the present embodiment, support heat-conducting substrate 18 and the second near-end refrigeration fin 19 are set to one-body molded.The second near-end refrigeration fin 19 that the second near-end refrigeration fin 19 is aluminium section bar, this second near-end refrigeration fin 19 is set to straight rib shape, thereby improves the heat transfer efficiency of the second near-end refrigeration fin 19.Certainly, according to the needs of actual production, this second near-end refrigeration fin 19 also can be set to other shape.
Wherein, support heat-conducting substrate 18, the second near-end refrigeration fin 19 and tendencies fan 20 and all offer installation fixing hole 21, by fixing hole 21 being installed and being utilized mechanically conventional connector that above-mentioned each assembly is carried out to correspondence, be fixedly connected with, thereby guarantee that overall structure is reliable, avoided complicated welding procedure simultaneously.
The metal material that support heat-conducting substrate 18 adopts aluminium or copper etc. to have good heat conductive performance is made.
Other structure and the operation principle of the present embodiment are identical with embodiment 1, do not repeat them here.
Finally should be noted that; above embodiment is the restriction for the technical solution of the utility model is described but not to the utility model protection range only; although the utility model is explained in detail with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement the technical solution of the utility model, and not depart from essence and the scope of technical solutions of the utility model.
Claims (9)
1. the hot junction of TEC chip and a cold junction integrated heat dissipation structure, is characterized in that: comprise TEC chip, hot-side heat dissipation assembly and cold junction cooling assembly; The two ends of described TEC chip are respectively chip hot junction portion and chip cold end, and described hot-side heat dissipation assembly is connected with described chip hot junction portion, and described cold junction cooling assembly is connected with described chip cold end;
Described hot-side heat dissipation assembly comprises heat pipe, heat conduction fixing base, radiating fin and the fan setting gradually; The hot junction of described heat pipe is embedded in described heat conduction fixing base, and the cold junction of described heat pipe is nested in described radiating fin, and described fan is connected with described radiating fin;
Described cold junction cooling assembly comprises heat preservation member and the heat diffusion member setting gradually; Described TEC chip is embedded in described heat preservation member, and described chip hot junction portion is arranged at a side of described heat preservation member and touches with the hot junction of described heat pipe, and described chip cold end is arranged at the opposite side of described heat preservation member and touches with described heat diffusion member.
2. the hot junction of a kind of TEC chip according to claim 1 and cold junction integrated heat dissipation structure, is characterized in that: described heat diffusion member comprises the second heat pipe, support heat conduction matrix, near-end refrigeration fin and the second fan; The cold junction of described the second heat pipe is embedded in described support heat conduction matrix and touches with described chip cold end, and described near-end refrigeration fin is connected with described support heat conduction matrix and is one-body molded; Described the second fan is connected with described near-end refrigeration fin.
3. the hot junction of a kind of TEC chip according to claim 2 and cold junction integrated heat dissipation structure, is characterized in that: being shaped as of described the second heat pipe is U-shaped, and the two ends of the second U-shaped heat pipe are the hot junction of the second heat pipe; The hot junction of two described the second heat pipes is provided with far-end refrigeration fin, three fan and mounting plate; Described far-end refrigeration fin is fixed on described mounting plate, and described three fan is connected with described far-end refrigeration fin; The hot junction of described the second heat pipe is nested in described far-end refrigeration fin.
4. the hot junction of a kind of TEC chip according to claim 1 and cold junction integrated heat dissipation structure, is characterized in that: described heat diffusion member comprises soaking plate, support heat-conducting substrate, refrigeration fin and the 4th fan connecting successively; One side of described soaking plate and described chip cold end touch, and the opposite side of described soaking plate is connected with described support heat-conducting substrate.
5. the hot junction of a kind of TEC chip according to claim 4 and cold junction integrated heat dissipation structure, is characterized in that: described support heat-conducting substrate and described refrigeration fin are set to one-body molded.
6. the hot junction of a kind of TEC chip according to claim 1 and cold junction integrated heat dissipation structure, is characterized in that: described heat diffusion member comprises support heat-conducting substrate, the second near-end refrigeration fin and the tendencies fan connecting successively; One side of described support heat-conducting substrate and described chip cold end touch, and the opposite side of described support heat-conducting substrate is connected with described the second near-end refrigeration fin.
7. the hot junction of a kind of TEC chip according to claim 6 and cold junction integrated heat dissipation structure, is characterized in that: described support heat-conducting substrate and described the second near-end refrigeration fin are set to one-body molded.
8. the hot junction of a kind of TEC chip according to claim 1 and cold junction integrated heat dissipation structure, is characterized in that: a side of described heat conduction fixing base is provided with groove, and the hot junction of described heat pipe is embedded in described groove.
9. the hot junction of a kind of TEC chip according to claim 2 and cold junction integrated heat dissipation structure, is characterized in that: a side of described support heat conduction matrix is provided with cell body, and the cold junction of described the second heat pipe is embedded in the cell body of described support heat conduction matrix.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320534859.1U CN203588992U (en) | 2013-08-30 | 2013-08-30 | Hot end and cold end integrated heat dissipation structure for TEC chip |
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|---|---|---|---|
| CN201320534859.1U CN203588992U (en) | 2013-08-30 | 2013-08-30 | Hot end and cold end integrated heat dissipation structure for TEC chip |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104219433A (en) * | 2014-09-17 | 2014-12-17 | 深圳英飞拓科技股份有限公司 | Monitoring pick-up device and cooling and dehumidifying method thereof |
| CN104882807A (en) * | 2015-05-19 | 2015-09-02 | 南京国电南自新能源科技有限公司 | Heat radiation type SVG equipment cabinet body |
| CN106288585A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | semiconductor refrigerating box |
| CN106288583A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
| CN106288500A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
| CN106288584A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Semiconductor refrigerating box |
| WO2017076329A1 (en) * | 2015-11-04 | 2017-05-11 | 深圳市光峰光电技术有限公司 | Tec heat dissipation assembly and projection device |
| CN108738281A (en) * | 2018-05-31 | 2018-11-02 | 四川斐讯信息技术有限公司 | A kind of enhancing radiator and control method |
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2013
- 2013-08-30 CN CN201320534859.1U patent/CN203588992U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104219433A (en) * | 2014-09-17 | 2014-12-17 | 深圳英飞拓科技股份有限公司 | Monitoring pick-up device and cooling and dehumidifying method thereof |
| CN104882807A (en) * | 2015-05-19 | 2015-09-02 | 南京国电南自新能源科技有限公司 | Heat radiation type SVG equipment cabinet body |
| CN104882807B (en) * | 2015-05-19 | 2017-05-17 | 南京国电南自新能源科技有限公司 | Heat radiation type SVG equipment cabinet body |
| CN106288585A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | semiconductor refrigerating box |
| CN106288583A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Pass device for cooling and there is the semiconductor refrigerating box of this biography device for cooling |
| CN106288500A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Heat abstractor and there is the semiconductor refrigerating box of this heat abstractor |
| CN106288584A (en) * | 2015-05-29 | 2017-01-04 | 青岛海尔智能技术研发有限公司 | Semiconductor refrigerating box |
| WO2017076329A1 (en) * | 2015-11-04 | 2017-05-11 | 深圳市光峰光电技术有限公司 | Tec heat dissipation assembly and projection device |
| CN108738281A (en) * | 2018-05-31 | 2018-11-02 | 四川斐讯信息技术有限公司 | A kind of enhancing radiator and control method |
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Granted publication date: 20140507 |