CN201111626Y - Hot pipe heat conduction heat radiator - Google Patents
Hot pipe heat conduction heat radiator Download PDFInfo
- Publication number
- CN201111626Y CN201111626Y CNU2007201200918U CN200720120091U CN201111626Y CN 201111626 Y CN201111626 Y CN 201111626Y CN U2007201200918 U CNU2007201200918 U CN U2007201200918U CN 200720120091 U CN200720120091 U CN 200720120091U CN 201111626 Y CN201111626 Y CN 201111626Y
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- heat
- thermal conductivity
- radiator according
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat conducting and radiating device of a heat pipe that is used for barrel-shaped electronic equipments with metallic shells, in particular to a device that consists of a thermal source radiating block, a fixing block of a heat conducting tube, a screw, the heat conducting tube, an arc clamping plate and a heat conducting silicone grease and transmits heat to the metallic shells. The fixing block of the heat conducting tube and the arc clamping plate are contacted with an evaporation section and a condensing section of the heat conducting tube, the heat conducting silicone grease is coated inside a U-shaped slot, thus enlarging the contact surface with a thermal source and a radiating part, and achieving good and even radiating effect; furthermore, the heat conducting and radiating device of the heat pipe is suitable for the barrel-shaped metallic shells with different shapes and sizes in a certain range, and has the advantages of simple structure, low cost and convenient and stable use.
Description
Technical field
The utility model relates to a kind of heat pipe for thermal conductivity radiator, the electronic equipment that is used for the tubular metal shell, particularly the device by thermal source radiating block, heat pipe fixed block, screw, heat pipe, arc clip, heat-conducting silicone grease conducts heat on the metal shell of difformity and size, reaches good balanced radiating effect.
Technical background
Because integrated tubular metal shell structure and mould are simple, the intensity height, airtight performance is good, and cost is low, and the electronic equipment that uses adopts the type shell more and more out of doors, especially large-scale application on infrared one video camera and infrared shot-light.But owing to be the arc space of a tubular, if can't being transmitted to thermal source on the shell, the high power electronic assembly can form high temperature in inside, influence electronic device works stability, existing employing tubular metal shell electronic equipment generally adopts radiating mode:
1, stick the fin heat radiation on pyrotoxin, if fin can't large tracts of land be close to metal shell, heat can only utilize air transmitted to arrive shell, and radiating efficiency is poor; In addition because the tubular metal shell is an arc, if make arc separately or other specification fin can only adapt to a kind of shell, shell sizes changes slightly and promptly can't well use, and cost height and timeliness are low.
2, radiator fan is installed in inside, utilize the acceleration circulation of air to dispel the heat, but may there be inefficacy in fan itself, but also brings the problem of installation and cost.
3, the semiconductor refrigerating module is installed, if the semiconductor refrigerating module is installed at the thermal source place, though can reduce thermal source place temperature, but the principle of semiconductor refrigerating module is a Peltier effect, reach refrigeration and just mean that the other end must heat, and also there is the operating efficiency problem in the semiconductor refrigerating module, produced more heat again at the another side of semiconductor refrigerating module like this and formed new thermal source; And the same with fan, also there is the problem of cost and inefficacy in the semiconductor refrigerating module.
Summary of the invention
The purpose of this utility model is the heat pipe for thermal conductivity radiator that addresses the aforementioned drawbacks in the electronic equipment that provide a kind of be used in the tubular metal shell, and certain limit endoadaptation difformity and big or small tubular metal shell.
The utility model realizes that the above-mentioned purpose technical scheme is such, utilizes thermal source radiating block and heat pipe fixed block to fix the heat pipe evaporator section, and coats the contact area that heat-conducting silicone grease strengthens heat pipe and thermal source radiating block; Utilize socket or be welded on arc clip on the heat pipe condensation segment and coat the contact area that strengthens heat pipe and tubular metal shell inwall behind the heat-conducting silicone grease, final realization utilizes the high speed conduction effect of heat pipe that the heat at thermal source place is dispersed on the tubular metal shell fast.
The purpose of this utility model can be able to further realization by following technology solution:
Arc clip described in the utility model is made for possessing flexible metal material, becomes U-shaped, arc or semicircle, and punching press has fin in the bottom, is used for socket or is welded on the heat pipe condensation segment.
Heat pipe fixed block described in the utility model is that copper series or aluminium series metal material are made, and U-shaped or arc groove are arranged at the bottom, and screw hole is arranged, and the heat pipe evaporator section can be fixed on the thermal source radiating block.
The utility model uses screw by the heat pipe fixed block heat pipe evaporator section to be fixed on the thermal source radiating block, can adjust the parallel inwall of being close to the tubular metal shell of condensation segment that the heat pipe integral position makes heat pipe.
Thermal source radiating block described in the utility model is that copper series or aluminium series metal material are made, and screw hole is arranged, and is respectively applied for fixedly thermal source and heat pipe fixed block; The side that contacts with heat pipe has U-shaped or arc groove (also can not slotting), is used for better contacting with heat pipe.
The condensation segment of the heat pipe in the utility model is in the parallel duty of being close to tubular metal shell inwall, the evaporator section of heat pipe is in the parallel duty of being close to thermal source radiating block plane, and the condensation segment of heat pipe and the angle of bend of evaporator section are by the angle decision of thermal source heat dissipation block surface and tubular metal shell inwall.
Capillary wick is posted in heat pipe inwall and bottom described in the utility model, and capillary wick is a kind of or several combination in groove, fine copper silk screen, fine copper cellulose and the spring of inside pipe wall or the metal powder sintered four kinds of structures.
The liquid of the heat pipe internal work described in the utility model generally is water, also can be alcohol, methyl alcohol, acetone.
The form of the heat pipe described in the utility model is circular, and is oval or pancake.
Effect of the present utility model is to give full play to the quick conductive effect of the heat dispersion and the heat pipe of metal shell itself, utilize heat pipe to transmit heat, heat-conducting silicone grease strengthens contact area, and the tubular metal shell of certain limit endoadaptation difformity and size, and volume is small and exquisite, processing procedure is simple, and cost is lower, working stability.
Description of drawings
Fig. 1, structural representation of the present utility model
The specific embodiment
As shown in Figure 1, the utility model comprises thermal source radiating block (1), heat pipe fixed block (2), and screw (3), heat pipe (4), arc clip (5), heat-conducting silicone grease (6) is formed.Thermal source radiating block (1) and heat pipe fixed block (2) adopt copper series or aluminium series metal material to make, and have screw hole and U-lag to be used for fixing heat pipe (4) evaporator section; Capillary wick is posted in heat pipe (4) inwall and bottom, capillary wick is a kind of or several combination in groove, fine copper silk screen, fine copper cellulose and the spring of inside pipe wall or the metal powder sintered four kinds of structures, inner hydraulic fluid is a water, also can be alcohol, methyl alcohol, acetone, and be shaped as circle, oval or pancake; Arc clip (5) use possesses flexible metal material makes, and the curved bottom punching press has fin, is used for socket or is welded on heat pipe (4) condensation segment; Screw (3) is fixed on heat pipe (4) evaporator section on the thermal source radiating block (1) by heat pipe fixed block (2), can adjust the parallel inwall of being close to the tubular metal shell of condensation segment that heat pipe (4) integral position makes heat pipe (4).In thermal source radiating block (1), coating evaporator section that heat-conducting silicone grease (6) makes heat pipe (4) in the U-shaped of heat pipe fixed block (2) and arc clip (5) or the deep-slotted chip breaker has than large tracts of land with condensation segment and contacts thermal source radiating block (1) and metal shell, form good heat conduction and heat radiation effect, and in the tubular metal shell, do not take too many space.
Claims (9)
1. heat pipe for thermal conductivity radiator, it comprises the thermal source radiating block, the heat pipe fixed block, screw, heat pipe, arc clip, heat-conducting silicone grease is formed, it is characterized in that: the heat pipe evaporator section is fixed on the thermal source radiating block by the heat pipe fixed block with screw, heat pipe condensation segment socket or be welded on the curved bottom of arc clip.
2. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: arc clip is made for possessing flexible metal material, becomes U-shaped, arc or semicircle.
3. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: U-shaped or arc groove are arranged at the heat pipe fixed block bottom of copper series or aluminium series metal material, and screw hole is arranged.
4. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: the thermal source radiating block of copper series or aluminium series metal material has screw hole.
5. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: scribble heat-conducting silicone grease in the heat pipe fixed block U-lag and in the arc clip U-lag.
6. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: the condensation segment of heat pipe is in the parallel duty of being close to tubular metal shell inwall, and the evaporator section of heat pipe is in the parallel duty of being close to thermal source radiating block plane.
7. heat pipe for thermal conductivity radiator according to claim 1, it is characterized in that: capillary wick is posted in heat pipe inwall and bottom, and capillary wick is a kind of or several combination in groove, fine copper silk screen, fine copper cellulose and the spring of inside pipe wall or the metal powder sintered four kinds of structures.
8. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: the liquid of heat pipe internal work generally is water, also can be alcohol, methyl alcohol, acetone.
9. heat pipe for thermal conductivity radiator according to claim 1 is characterized in that: the form of heat pipe is circular, and is oval or pancake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201200918U CN201111626Y (en) | 2007-05-17 | 2007-05-17 | Hot pipe heat conduction heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201200918U CN201111626Y (en) | 2007-05-17 | 2007-05-17 | Hot pipe heat conduction heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201111626Y true CN201111626Y (en) | 2008-09-10 |
Family
ID=39963368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201200918U Expired - Fee Related CN201111626Y (en) | 2007-05-17 | 2007-05-17 | Hot pipe heat conduction heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201111626Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169857A (en) * | 2010-02-26 | 2011-08-31 | 昆山巨仲电子有限公司 | Flexible heat pipe structure and manufacturing method thereof |
| CN104329890A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat conduction device and semiconductor refrigerator with heat conduction device |
| CN104329852A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329855A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329851A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN107401871A (en) * | 2017-07-28 | 2017-11-28 | 安徽康佳同创电器有限公司 | A kind of refrigerator for cosmetics |
| CN107613731A (en) * | 2017-09-22 | 2018-01-19 | 浙江大学 | Suitable for the on-plane surface flat hot pipe radiator structure of aero-space electronic equipment |
| CN109141370A (en) * | 2018-09-26 | 2019-01-04 | 中国科学院长春光学精密机械与物理研究所 | The big power consumption CCD device conductive structure of space optical remote sensor |
-
2007
- 2007-05-17 CN CNU2007201200918U patent/CN201111626Y/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169857A (en) * | 2010-02-26 | 2011-08-31 | 昆山巨仲电子有限公司 | Flexible heat pipe structure and manufacturing method thereof |
| CN104329890A (en) * | 2014-03-28 | 2015-02-04 | 海尔集团公司 | Heat conduction device and semiconductor refrigerator with heat conduction device |
| CN104329890B (en) * | 2014-03-28 | 2017-01-04 | 海尔集团公司 | Heat-transfer device and there is the semiconductor freezer of this heat-transfer device |
| CN104329852A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329855A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329851A (en) * | 2014-08-29 | 2015-02-04 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329852B (en) * | 2014-08-29 | 2017-02-15 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329851B (en) * | 2014-08-29 | 2017-02-15 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator and manufacturing method thereof |
| CN104329855B (en) * | 2014-08-29 | 2017-04-05 | 青岛海尔股份有限公司 | Semiconductor freezer and its manufacture method |
| CN107401871A (en) * | 2017-07-28 | 2017-11-28 | 安徽康佳同创电器有限公司 | A kind of refrigerator for cosmetics |
| CN107613731A (en) * | 2017-09-22 | 2018-01-19 | 浙江大学 | Suitable for the on-plane surface flat hot pipe radiator structure of aero-space electronic equipment |
| CN109141370A (en) * | 2018-09-26 | 2019-01-04 | 中国科学院长春光学精密机械与物理研究所 | The big power consumption CCD device conductive structure of space optical remote sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201111626Y (en) | Hot pipe heat conduction heat radiator | |
| CN100395684C (en) | Loop radiating module | |
| CN203588992U (en) | Hot end and cold end integrated heat dissipation structure for TEC chip | |
| CN102202488A (en) | Heat-pipe heat radiation apparatus | |
| US20100243207A1 (en) | Thermal module | |
| CN102536745A (en) | Heat radiating device for heat pipes | |
| CN102980429A (en) | Loop thermosyphon heat dissipation device | |
| CN204042816U (en) | A kind of LED radiator based on vapor chamber heat dissipation technology | |
| JP2002305272A (en) | Heat sink and heat dissipation method of electronic component | |
| CN209726886U (en) | A kind of temperature-uniforming plate | |
| CN104654127A (en) | Lighting device and manufacturing method of radiator for lighting device | |
| CN201571152U (en) | Radiating structure of liquid crystal display television | |
| CN104180316A (en) | High-power lamp | |
| CN103249276A (en) | Heat dissipation device, heat dissipation component and electronic equipment | |
| CN211177171U (en) | Radiator and air conditioner | |
| US20140352925A1 (en) | Heat pipe structure | |
| CN204498550U (en) | Radiating subassembly | |
| CN204153576U (en) | Led street lamp | |
| CN210470132U (en) | Direct-contact low-thermal-resistance heat pipe radiator for heating device | |
| CN208384511U (en) | A kind of CPU fin-super heat-conductive pipe integral heat dissipation device | |
| CN203811967U (en) | Light supplementary camera | |
| CN110848820A (en) | Radiator and air conditioner | |
| CN106051486A (en) | High-power LED lamp heat dissipation device based on graphene heat rectification material and lamp | |
| CN201654660U (en) | Radiator structure | |
| JP5624771B2 (en) | Heat pipe and heat sink with heat pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080910 |