CN104329851A - Semiconductor refrigeration refrigerator and manufacturing method thereof - Google Patents
Semiconductor refrigeration refrigerator and manufacturing method thereof Download PDFInfo
- Publication number
- CN104329851A CN104329851A CN201410437143.9A CN201410437143A CN104329851A CN 104329851 A CN104329851 A CN 104329851A CN 201410437143 A CN201410437143 A CN 201410437143A CN 104329851 A CN104329851 A CN 104329851A
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- side heat
- hot
- shell
- condensation segment
- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 161
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000005057 refrigeration Methods 0.000 title abstract description 15
- 238000009833 condensation Methods 0.000 claims description 101
- 230000005494 condensation Effects 0.000 claims description 101
- 239000000758 substrate Substances 0.000 claims description 82
- 238000012546 transfer Methods 0.000 claims description 61
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 51
- 229910002804 graphite Inorganic materials 0.000 claims description 51
- 239000010439 graphite Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 27
- 238000009413 insulation Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 13
- 238000005507 spraying Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
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- 238000007789 sealing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2201/00—Insulation
- F25D2201/10—Insulation with respect to heat
Abstract
The invention relates to a semiconductor refrigeration refrigerator and a manufacturing method of the semiconductor refrigeration refrigerator. The semiconductor refrigeration refrigerator comprises an outer shell, a semiconductor module and at least one heat end heat pipe which transmits the heat of the semiconductor to the outer shell, the semiconductor refrigeration refrigerator particularly comprises at least one heat end fixed pressing board, each heat end fixed pressing board fixes at least one part of a condensing segment of each heat end heat pipe on the inner surface of the outer shell, so that the at least one part of the condensing segment of each heat end heat pipe is attached to the inner surface of the outer shell. The invention further provides the manufacturing method of the semiconductor refrigeration refrigerator. According to the semiconductor refrigeration refrigerator and the manufacturing method thereof, the heat end fixed pressing board attaches to the at least one part of the condensing segment of the corresponding heat end heat pipe on the inner surface of the outer shell, the surface of the outer shell can be fully used as a heat dissipating surface, a heat dissipating fan is not needed, and the semiconductor refrigeration refrigerator is energy-saving, environment-friendly, high in reliability, simple in structure, convenient to install and high in practicality.
Description
Technical field
The present invention relates to refrigerator, particularly relate to a kind of semiconductor freezer and manufacture method thereof.
Background technology
Conventional refrigerator uses freon as cold-producing medium, and the power using compressor as refrigerator inside working medium circulation, also exist pollution problems such as depletions of the ozone layer, do not meet the environmental requirement of country.Semiconductor refrigerating, is also called thermoelectric cooling, thermoelectric cooling.Compared with traditional steam compression type refrigeration mode, semiconductor refrigerating is without the need to compressor, cold-producing medium, and cooling activation is rapid, and structure is simple, the advantages such as noiselessness, is therefore considered to a kind of environmental-protection refrigeration mode contributing to solving ozone layer destroying problem.Simultaneously, it is little that semiconductor refrigerating also has refrigerator volume, the advantage such as mobile, easy for installation, its refrigerating capacity can change between milliwatt level to multikilowatt, and the refrigeration temperature difference can adjust within the scope of 20 ~ 150 DEG C, therefore cool at electronic devices and components, small-type refrigeration appliance, military, Medical Devices, there is a lot of application in the fields such as scientific research, what is more important semiconductor refrigerating opens a Ge Xin branch of Refrigeration Technique, solves a refrigeration difficult problem for many occasions.Particularly in recent years along with our people's growth in the living standard, semiconductor refrigerating is promoted rapidly in the application of the domestic environments such as small refrigerator, water dispenser, dehumidifier.
At present, on market, most of semiconductor freezer adopts radiation aluminium groove or heat pipe cover fin as radiating module, this radiating mode, although the temperature in semiconductor cooling hot junction and the requirement of refrigeration indoor air temperature can be ensured, but also there are some problems, the aerofoil fan as realized forced convertion needs to consume extra electric energy, and the time run along with aerofoil fan increases simultaneously, noise and the fault rate of its generation are also increasing, affect the comfortableness of user.
Summary of the invention
An object of first aspect present invention is intended at least one defect overcoming refrigerator of the prior art, a kind of semiconductor freezer is provided, hot side heat can be fixed on shell and dispel the heat to make full use of shell by effectively, and without the need to consuming the low and failure rate is low of extra electric energy, noise.
A further object of first aspect present invention to make the homogeneous temperature of case surface distribute.
As far as possible another further object of first aspect present invention to improve the efficiency of semiconductor freezer.
An object of second aspect present invention to provide a kind of manufacture method for any one semiconductor freezer above-mentioned.
According to a first aspect of the invention, the invention provides a kind of semiconductor freezer, comprise shell and semiconductor module and the heat of described semiconductor module is reached at least one hot side heat of described shell, wherein, also comprise: at least one hot junction fixation clip, at least part of condensation segment of hot side heat described in every root is fixed on the inner surface of described shell by each described hot junction fixation clip, is posted by the inner surface of described shell to make at least part of condensation segment of hot side heat described in every root.
Alternatively, each described hot junction fixation clip has: protrusion, is formed with the holddown groove extended along its length, to hold at least part of condensation segment of corresponding described hot side heat; Extend laterally from two length edges of described protrusion respectively, to be fixedly connected with described shell and to abut in two fixing flanks the inner surface of described shell.
Alternatively, each fixing flank of each described hot junction fixation clip is fixed on described shell by screw.
Alternatively, the innermost layer of shell wall of at least part of condensation segment of described hot side heat of described shell reclining is graphite rete.
Alternatively, the condensation segment of hot side heat described in every root comprises the first condensation segment and second condensation segment of the evaporator section both sides being positioned at this hot side heat; The quantity of at least one hot junction fixation clip described is at least two, utilizes the inner surface of a corresponding hot junction fixation clip and described shell thermally coupled respectively with at least part of pipeline section of the first condensation segment and the second condensation segment that make hot side heat described in every root.
Alternatively, the first condensation segment of hot side heat described in every root and at least part of pipeline section of the second condensation segment utilize corresponding described hot junction fixation clip to be fixed on the inner surface of two opposing sidewalls of described shell along horizontal longitudinal direction respectively.
Alternatively, the quantity of described at least one hot side heat is at least two, the first condensation segment of every root hot side heat in the described hot side heat of a part and at least part of pipeline section of the second condensation segment utilize corresponding described hot junction fixation clip to be fixed on the inner surface of two opposing sidewalls of described shell along horizontal longitudinal direction respectively, and the first condensation segment of the every root hot side heat in hot side heat described in remainder and at least part of pipeline section of the second condensation segment all utilize corresponding described hot junction fixation clip to be fixed on the inner surface of the roof of described shell along horizontal longitudinal direction, or, the quantity of described at least one hot side heat is at least three, the first condensation segment of every root hot side heat in the described hot side heat of a part and at least part of pipeline section of the second condensation segment utilize corresponding described hot junction fixation clip to be fixed on the inner surface of two opposing sidewalls of described shell along horizontal longitudinal direction respectively, first condensation segment of the every root hot side heat in hot side heat described in another part and at least part of pipeline section of the second condensation segment all utilize corresponding described hot junction fixation clip to be fixed on the inner surface of the roof of described shell along horizontal longitudinal direction, first condensation segment of the every root hot side heat in hot side heat described in remainder and at least part of pipeline section of the second condensation segment all utilize corresponding described hot junction fixation clip to be fixed on the inner surface of the diapire of described shell along horizontal longitudinal direction.
Alternatively, described semiconductor module comprises: semiconductor chilling plate; With hot junction heat transfer substrate, it is installed into makes the hot junction of its front surface and described semiconductor chilling plate contact against, described hot junction heat transfer substrate is formed with at least one holding tank, and each described holding tank is configured at least part of evaporator section of the corresponding described hot side heat of accommodation one.
Alternatively, the inner surface of the rear surface of described hot junction heat transfer substrate and the rear wall of described shell contacts against, and the innermost layer of the rear wall of described shell is graphite rete.
Alternatively, described semiconductor module comprises further: cool guiding block, and the cold junction of its rear surface and described semiconductor chilling plate contacts against; With the cold and hot end thermal insulation layer with central opening, described semiconductor chilling plate and described cool guiding block are arranged in described central opening, the hot junction of described semiconductor chilling plate protrudes from or flushes in the trailing flank of described cold and hot end thermal insulation layer, and the front surface of described cool guiding block protrudes from or flush in the leading flank of described cold and hot end thermal insulation layer; And cold junction heat transfer substrate, the front surface of its rear surface and described cool guiding block contacts against.
Alternatively, the opening of each described holding tank is in the front surface of described hot junction heat transfer substrate, contacts against with the hot junction of the outer wall and described semiconductor chilling plate that make at least part of evaporator section of hot side heat described in every root.
Alternatively, described in every root, at least part of condensation segment of hot side heat is flat tube.
Alternatively, described shell comprises separate Part I and rear wall, described Part I comprises the roof of described shell, diapire and two opposite side walls, at least part of condensation segment of hot side heat described in every root is fixed on the inner surface of described Part I by each described hot junction fixation clip, to be convenient to the installation of described semiconductor module when manufacturing described semiconductor freezer.
According to a second aspect of the invention, the invention provides a kind of manufacture method manufacturing any one semiconductor freezer above-mentioned, it is characterized in that, comprising:
Steps A: the pre-position at least part of condensation segment of every root hot side heat of described semiconductor freezer being positioned over the inner surface of the shell of described semiconductor freezer;
Step B: each described hot junction fixation clip cover is buckled at least part of condensation segment of corresponding described hot side heat;
Step C: each described hot junction fixation clip is fixed on described shell.
Alternatively, by multiple screw, each fixing flank of each described hot junction fixation clip is fixed on described shell, so that each described hot junction fixation clip is fixed on described shell.
Alternatively, before described steps A, also comprise steps A 1: graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the shell wall of at least part of condensation segment of the described hot side heat that reclines on the housing, to form graphite rete; And/or, graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the rear wall of described shell.
Alternatively, before described steps A, steps A 2 is also comprised: embedded in the corresponding holding tank of the hot junction heat transfer substrate of the semiconductor module of described semiconductor freezer by least part of evaporator section of hot side heat described in every root by pressure-riveting process.
Alternatively, after described step C, also step D is comprised:
The front surface of the cold junction heat transfer substrate of described semiconductor module is resisted against the rear surface of the inner bag of described semiconductor freezer;
The front surface of the first pre-arrangement semiconductor chilling plate of described semiconductor module, cool guiding block formed after being installed on cold and hot section of thermal insulation layer is resisted against the rear surface of described cold junction heat transfer substrate;
The front surface of the hot junction heat transfer substrate of described semiconductor module is resisted against the hot junction of described semiconductor chilling plate, and the Part I of described shell is fixedly connected with described inner bag;
By multiple screw respectively successively through in the screw hole screwed in after respective through hole, the respective through hole on described cold and hot end thermal insulation layer and the respective through hole on described cold junction heat transfer substrate on the heat transfer substrate of described hot junction on described inner bag rear wall;
The rear wall of described shell is installed, and the rear surface of the inner surface of the rear wall of described shell and described hot junction heat transfer substrate is contacted against.
Because utilize hot junction fixation clip that at least part of condensation segment of corresponding hot side heat is posted by the inner surface of shell in semiconductor freezer of the present invention and manufacture method thereof, therefore, it is possible to securely hot side heat is fixed on shell, to make full use of case surface as radiating surface, then do not need radiator fan, thus make that this semiconductor freezer noise is low, energy-conserving and environment-protective, reliability be high, and structure is simple, easy for installation, strong adaptability.
Further, due to the special structure of each hot junction fixation clip in semiconductor freezer of the present invention and manufacture method thereof, the transmission efficiency of the heat in hot side heat condensation segment is significantly improved.
Further, because the innermost layer of the part shell wall of semiconductor freezer of the present invention and manufacture method housing thereof is graphite rete, to utilize the horizontal high thermal conductivity of graphite film, be dissipated into case surface even heat hot side heat spread out of.
Further, due to the special structure of hot side heat in semiconductor freezer of the present invention and manufacture method thereof, substantially increase the efficiency passing cold efficiency and refrigerator.
Further, due to hot junction heat transfer substrate in semiconductor freezer of the present invention and manufacture method thereof and housing contacts against, significantly increase area of dissipation.
Further, owing to there is no radiator fan in semiconductor freezer of the present invention and preparation method thereof housing, the probability that moving component breaks down because of situations such as wearing and tearing, collisions can be avoided, improve semiconductor freezer reliability of operation and life-span.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention;
Fig. 2 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention;
Fig. 3 is the schematic diagram of hot junction fixation clip in semiconductor freezer according to an embodiment of the invention;
Fig. 4 is the schematic cross sectional views of semiconductor freezer according to an embodiment of the invention;
Fig. 5 is the schematic partial enlarged view at A place in Fig. 4;
Fig. 6 is the schematic local structural graph of semiconductor freezer according to an embodiment of the invention;
Fig. 7 is the schematic local structural graph of the inner bag of the semiconductor freezer with one embodiment of the invention;
Fig. 8 is the indicative flowchart of the manufacture method of semiconductor freezer according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 is the schematic explosive view of semiconductor freezer according to an embodiment of the invention.As shown in Figure 1, and with reference to figure 2, a kind of semiconductor freezer is embodiments provided, it at least one hot side heat 60 comprising shell 50 and semiconductor module 20 and the heat of semiconductor module 20 is reached shell 50.Especially, the semiconductor freezer in the embodiment of the present invention also comprises at least one hot junction fixation clip 70.At least part of condensation segment of every root hot side heat 60 is fixed on the inner surface of shell 50 by each hot junction fixation clip 70, with the inner surface making at least part of condensation segment of every root hot side heat 60 be posted by shell 50.Corresponding hot side heat 60 can be fixed on shell 50 by each hot junction fixation clip 70 securely, at least part of condensation segment and the shell 50 of every root hot side heat 60 directly recline, thermal contact resistance is little, to make full use of case surface as radiating surface, and do not need radiator fan, thus make these semiconductor freezer energy-conserving and environment-protective, reliability high, and structure is simple, easy for installation, strong adaptability, also can realize " zero noise " of semiconductor freezer heat radiation.
In order to improve heat exchange efficiency further, at least part of condensation segment of every root hot side heat 60 is flat tube, and the cross section namely abutting in the part hot side heat pipeline section on shell 50 is that squarish or square are circular.The inner surface of at least part of condensation segment directly reclined with shell 50 of every root hot side heat 60 also can smear heat conductive silica gel, to improve heat transfer efficiency.For the ease of the installation of semiconductor freezer, shell 50 can comprise separate Part I and rear wall.The Part I of shell 50 comprises the roof of shell 50, diapire and two opposite side walls, at least part of condensation segment of every root hot side heat 60 is fixed on the inner surface of Part I by each hot junction fixation clip 70, to be convenient to the installation of semiconductor module 20 when manufacturing semiconductor freezer.
Fig. 3 is the schematic diagram of hot junction fixation clip in semiconductor freezer according to an embodiment of the invention.Each hot junction fixation clip 70 has protrusion 71 and two fixing flanks 72.Protrusion 71 is formed with the holddown groove extended along its length, to hold at least part of condensation segment of corresponding hot side heat 60.Two fixing flanks 72 extend laterally from two of protrusion 71 length edges respectively, for being fixedly connected with shell 50 and abutting in the inner surface of shell 50, reach the inner surface of shell 50 with the heat at least part of condensation segment of corresponding hot side heat 60 being passed to hot junction fixation clip 70.Each fixing flank 72 has spaced multiple screw hole along its length, be fixed on shell 50 to make each fixing flank 72 of each hot junction fixation clip 70 by screw.
Fig. 4 is the schematic cross sectional views of semiconductor freezer according to an embodiment of the invention.As shown in Figure 4, and with reference to figure 5, the innermost layer of the shell wall of at least part of condensation segment of hot side heat that shell 50 reclines 60 is graphite rete, the innermost layer of the shell shell wall of at least part of condensation segment of one or more hot side heat 60 that is it reclines is graphite rete, is dissipated into the substrate layer surface of the shell wall with graphite rete with even heat hot side heat 60 spread out of.In the present invention's specific embodiment, the inner surface of two opposing sidewalls of shell 60 reclines hot side heat 60, then the innermost layer of two of shell 50 relative shell walls is graphite rete.The semiconductor freezer of the embodiment of the present invention makes full use of the horizontal high thermal conductivity (also can be described as uniform temperature) of graphite rete 51, the even heat that hot side heat 60 spreads out of is dissipated into the substrate layer surface of the shell wall with graphite rete, with the substrate layer making the shell wall with graphite rete equably distribute heat in the air outside shell 50.In other embodiment of the present invention, the outermost layer of the substrate layer of all shell walls of shell 50 all can be graphite rete 51.
Those skilled in the art it has been generally acknowledged that, metal substrate layer just has thermal conduction characteristic, heat can be passed in the air outside shell, and do not need samming, but the present inventor finds, when directly the heat of the condensation segment of every root hot side heat being reached inner surface of outer cover, the temperature in the region of the condensation segment of the close hot side heat on shell will far away higher than the region of the condensation segment away from hot side heat, make the heat that on the surface of shell, various piece is distributed inconsistent, reduce the heat radiation of semiconductor freezer.The graphite rete that graphite spraying coating or stickup graphite film are formed at least part of inner surface of substrate layer can make each local heat radiation of shell more even.
Consider the particularity of the structure of outcase of refrigerator, in the embodiment of the present invention, every root hot side heat is designed to the structure of " similar U-shaped ".Particularly, the condensation segment of every root hot side heat 60 comprises the first condensation segment and second condensation segment of the evaporator section both sides being positioned at this hot side heat, and the first condensation segment of every root hot side heat 60 and at least part of pipeline section of the second condensation segment are respectively perpendicular at least part of evaporator section of corresponding hot side heat 60.In embodiments of the present invention, the evaporator section of every root hot side heat 60 is the middle pipeline section part of corresponding hot side heat, be mainly used in the heat absorbing semiconductor module 20 generation, such as, the evaporator section of every root hot side heat 60 at least can comprise the portions in the hot junction heat transfer substrate 25 being embedded in semiconductor module 20 of corresponding hot side heat.The quantity of at least one hot junction fixation clip 70 is at least two, utilizes a corresponding hot junction fixation clip 70 thermally coupled with the inner surface of shell 50 respectively with at least part of pipeline section of the first condensation segment and the second condensation segment that make every root hot side heat 60.As shown in Figure 6, the quantity of at least one hot side heat 60 can be at least three, the first condensation segment of every root hot side heat 60 in part hot side heat and at least part of pipeline section of the second condensation segment utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of two opposing sidewalls of shell along horizontal longitudinal direction respectively, first condensation segment of the every root hot side heat 60 in another part hot side heat and at least part of pipeline section of the second condensation segment all utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of the roof of shell 50 along horizontal longitudinal direction, first condensation segment of the every root hot side heat 60 in remainder hot side heat and at least part of pipeline section of the second condensation segment all utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of the diapire of shell 50 along horizontal longitudinal direction.
The quantity of at least one hot side heat 60 of the present invention can (refrigerating capacity etc.) appropriate design according to the actual needs, and the first condensation segment of every root hot side heat 60 and the position of the second condensation segment also can reset according to actual needs.Such as when heat dissipation capacity is within 100W, by 4 " U-shaped like " heat pipes of arranging by the heat conduction of semiconductor module to the two sides of shell 50, roof and diapire.When heat dissipation capacity is 100 ~ 125W, by 5 " U-shaped like " heat pipes of arranging by the heat conduction of semiconductor module to the two sides of shell 50, roof and diapire.When heat dissipation capacity is 125 ~ 150W, by 6 " U-shaped like " heat pipes of arranging by the heat conduction of semiconductor module to the two sides of shell 50, roof and diapire.In general, hot junction heat often increases 25W, then need increase hot side heat 60.
In alternate embodiment more of the present invention, the first condensation segment of every root hot side heat 60 and at least part of pipeline section of the second condensation segment utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of a respective side walls and the inner surface of roof of shell along horizontal longitudinal direction respectively.Such as, the quantity of at least one hot side heat 60 can be 2, at least part of pipeline section of the first condensation segment of a hot side heat 60 utilizes corresponding hot junction fixation clip 70 to be fixed on the inner surface of a respective side walls of shell 50 along horizontal longitudinal direction, and at least part of pipeline section of the second condensation segment utilizes corresponding hot junction fixation clip 70 to be fixed on the inner surface of the roof of shell 50 along horizontal longitudinal direction; At least part of pipeline section of the first condensation segment of an other hot side heat 60 utilizes corresponding hot junction fixation clip 70 to be fixed on the inner surface of a respective side walls of shell 50 along horizontal longitudinal direction, and at least part of pipeline section of the second condensation segment utilizes corresponding hot junction fixation clip 70 to be fixed on the inner surface of the roof of shell 50 along horizontal longitudinal direction.
In other substituting embodiments of the present invention, the quantity of at least one hot side heat 60 also can be at least two, the first condensation segment of every root hot side heat 60 in part hot side heat and at least part of pipeline section of the second condensation segment utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of two opposing sidewalls of shell 50 along horizontal longitudinal direction respectively, first condensation segment of the every root hot side heat 60 in remainder hot side heat and at least part of pipeline section of the second condensation segment all utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of the roof of shell 50 along horizontal longitudinal direction.In other alternate embodiment of the present invention, the first condensation segment of every root hot side heat 60 and at least part of pipeline section of the second condensation segment utilize corresponding hot junction fixation clip 70 to be fixed on the inner surface of two opposing sidewalls of shell along horizontal longitudinal direction respectively.
In a preferred embodiment of the invention, semiconductor module 20 can comprise semiconductor chilling plate 21, cold junction heat transfer substrate 22, hot junction heat transfer substrate 25 and cool guiding block 23 and have the cold and hot end thermal insulation layer 24 of central opening.The quantity of semiconductor chilling plate 21 can be one or more.In embodiments of the present invention, the quantity of semiconductor chilling plate 21 is one piece.The rear surface of cool guiding block 23 and the cold junction of semiconductor chilling plate 21 contact against, and the front surface of cool guiding block 23 and the rear surface of cold junction heat transfer substrate 22 contact against, so that the cold of semiconductor chilling plate 21 is reached cold junction heat transfer substrate 22.Semiconductor chilling plate 21 and cool guiding block 23 are arranged in the central opening of cold and hot end thermal insulation layer 24, the hot junction of semiconductor chilling plate 21 protrudes from or flushes in the trailing flank of cold and hot end thermal insulation layer 24, the front surface of cool guiding block 23 protrudes from or flushes in the leading flank of cold and hot end thermal insulation layer 24, to prevent from carrying out cold and hot exchange between cold junction heat transfer substrate 22 and hot junction heat transfer substrate 25.Hot junction heat transfer substrate 25 is installed into makes the hot junction of its front surface and semiconductor chilling plate 21 contact against, and to be passed in shell 50 by the heat of semiconductor chilling plate 21, dispels the heat.Hot junction heat transfer substrate 25 is formed with at least one holding tank, each holding tank is configured at least part of evaporator section of the corresponding hot side heat 60 of accommodation one.Semiconductor chilling plate 21, cold junction heat transfer substrate 22, hot junction heat transfer substrate 25 and cool guiding block 23 contact surface each other all will smear heat-conducting silicone grease, to reduce contact surface thermal resistance.
In a preferred embodiment of the invention, the inner surface of the rear surface of hot junction heat transfer substrate 25 and the rear wall of shell 50 contacts against, and the innermost layer of the rear wall of shell 60 is graphite rete 51, to make hot junction heat transfer substrate 25 contact with graphite rete 51, significantly increase area of dissipation.In other embodiment more of the present invention, the opening of each holding tank of hot junction heat transfer substrate 25 is in the front surface of hot junction heat transfer substrate 25, contact against with the outer wall of at least part of evaporator section and the hot junction of semiconductor chilling plate that make every root hot side heat 60, to make, between the inner surface of the evaporator section of every root hot side heat 60 and shell 50 rear wall, there is certain spacing, the heat on evaporator section absorption shell 50 inner surface of every root hot side heat 60 can be prevented, reduce radiating effect.
Fig. 7 is the schematic local structural graph of the inner bag of the semiconductor freezer with one embodiment of the invention.The semiconductor freezer of the embodiment of the present invention also can comprise at least one cool side heat pipes 30 and at least one cold junction fixation clip 40 of the inner bag 10 cold of semiconductor module 20 being reached semiconductor freezer.At least part of evaporator section of every root cool side heat pipes 30 is fixed on the outer surface of inner bag 10 by each cold junction fixation clip 40, with the outer surface making at least part of evaporator section of every root cool side heat pipes 30 be posted by inner bag 10, thus make semiconductor freezer using outer surface of liner as cold scattering face, simplified processing process, cost-saving.Each cold junction fixation clip 40 is consistent with the structure of the hot junction fixation clip 70 for fixing hot side heat 60.In alternate embodiment more of the present invention, at least part of evaporator section of every root cool side heat pipes 30 is welded in the outer surface of inner bag 10, and what adopt is the welding manner of soldering, namely cool side heat pipes 30 can be carried out soldering with the inner bag 10 through plating nickel on surface process and is connected, to reduce thermal contact resistance.
First evaporator section of every root cool side heat pipes 30 and at least part of pipeline section of the second evaporator section are fixed on the outer surface of two opposing sidewalls of inner bag 10 respectively along horizontal longitudinal direction.Or the quantity of at least one cool side heat pipes 30 is at least three, so that two parts or three parts can be divided into.When being separated into two parts, the first evaporator section of every root cool side heat pipes 30 in part cool side heat pipes and at least part of pipeline section of the second evaporator section are fixed on the outer surface of two opposing sidewalls of inner bag 10 respectively along horizontal longitudinal direction, the first evaporator section of the every root cool side heat pipes 30 in remainder cool side heat pipes and at least part of pipeline section of the second evaporator section are all fixed on the outer surface of the roof of inner bag 10 along horizontal longitudinal direction.When being separated into three parts, the first evaporator section of every root cool side heat pipes 30 in part cool side heat pipes and at least part of pipeline section of the second evaporator section are fixed on the outer surface of two opposing sidewalls of inner bag 10 respectively along horizontal longitudinal direction, first evaporator section of the every root cool side heat pipes 30 in another part cool side heat pipes and at least part of pipeline section of the second evaporator section are all fixed on the outer surface of the roof of inner bag 10 along horizontal longitudinal direction, first evaporator section of the every root cool side heat pipes 30 in remainder cool side heat pipes and at least part of pipeline section of the second evaporator section are all fixed on the outer surface of the diapire of inner bag 10 along horizontal longitudinal direction.
Cold junction heat transfer substrate 22 is also formed with at least one holding tank, and each holding tank is configured at least part of condensation segment of the corresponding cool side heat pipes 30 of accommodation one.The opening of each holding tank is in the rear surface of cold junction heat transfer substrate 22, contacts against with the front surface of the outer wall and cool guiding block 23 that make at least part of condensation segment of every root cool side heat pipes 30.The exterior surface of the front surface of cold junction heat transfer substrate 22 and the rear wall of inner bag 10 against.At least part of outermost layer of inner bag 10 also can be the graphite rete 12 of inner bag 10, to improve refrigerating efficiency.Particularly, the outermost layer of at least part of courage wall of inner bag 10 is graphite rete, and the outermost layer of the courage wall of at least part of evaporator section of one or more cool side heat pipes 30 that it reclines is necessary for graphite rete, be evenly dissipated into substrate layer 11 surface of the courage wall with graphite rete with cold cool side heat pipes 30 spread out of.At least part of evaporator section of every root cool side heat pipes 30 is flat tube.
In one embodiment of the invention, the substrate layer of the substrate layer of inner bag 10, cold junction heat transfer substrate 22 and hot junction heat transfer substrate 25 and shell 50 all adopts aluminium alloy 6061 and utilizes aluminium section bar cold extruding formation process one-body molded, and plating nickel on surface process is carried out to it, argon arc welding is carried out to its gap, utilizes drilling machine to hole in relevant position.In addition, shell 50 outer surface can cover ABS hard material.The material of cool guiding block 23 can adopt the copper product that heat transfer efficiency is higher.The substrate layer of the substrate layer of inner bag 10, cold junction heat transfer substrate 22, cool guiding block 23 and hot junction heat transfer substrate 25 and shell 50 also can adopt other metal material.
What cool side heat pipes 30 and hot side heat 60 mainly adopted is copper product, and the working medium in cool side heat pipes 30 can be ethanol or methyl alcohol, and the working medium in hot side heat 60 can be deionized water.In order to ensure temperature and the temperature difference of the cold and hot end of semiconductor chilling plate 21, single cool side heat pipes 30 and hot side heat 60 its temperature difference under the power test condition of 25W must be less than 5 DEG C.Cool side heat pipes 30 and hot side heat 60 through oversintering, fluid injection, vacuumize, first form circle directly-heated pipe after technique after degasification and sealing, then utilize punch press and pressing mold that circle directly-heated pipe is struck out required form, such as flat tube shape, also needs after flattening to carry out finish turning processing to its surface, to ensure flatness.Comparatively large in environment for use humidity, also need to carry out chemical nickel plating to cool side heat pipes 30 and hot side heat 60 surface, and carry out Salt frog test, be corroded to avoid cool side heat pipes.
The cold and hot end thermal insulation layer 24 of semiconductor module 20 adopts polyurethane foam material, foaming-formed by mould, then holes to its relevant position, and semiconductor chilling plate 21 and cool guiding block 23 interference fit is positioned in central opening.
Fig. 8 is the indicative flowchart of the manufacture method of semiconductor freezer according to an embodiment of the invention.The embodiment of the present invention additionally provides a kind of manufacture method manufacturing any one semiconductor freezer above-mentioned, and it comprises:
Steps A: the pre-position at least part of condensation segment of every root hot side heat of semiconductor freezer being positioned over the inner surface of the shell of semiconductor freezer.
Step B: each hot junction fixation clip cover is buckled at least part of condensation segment of corresponding hot side heat.
Step C: each hot junction fixation clip is fixed on shell.Particularly, by multiple screw, each fixing flank of each hot junction fixation clip is fixed on shell, so that each hot junction fixation clip is fixed on shell.
In one embodiment of the invention, before steps A, also comprise steps A 1: graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the shell wall of at least part of condensation segment of the hot side heat that reclines on shell, to form graphite rete; And/or on the inner surface of the substrate layer of the rear wall of shell graphite spraying coating or paste graphite film.In this, also can on the inner surface of the substrate layer of other shell wall of shell graphite spraying coating or paste graphite film, that is, steps A 1 also can be regarded as: graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the predetermined shell wall of shell, to form graphite rete, the predetermined shell wall of shell at least comprises shell wall and/or the rear wall of at least part of condensation segment of one or more hot side heat that it reclines.
Such as, in the present invention's specific embodiment, the inner surface of two opposing sidewalls of shell reclines hot side heat.It will be understood by those skilled in the art that, can only graphite spraying coating or paste graphite film on the inner surface of the substrate layer of two opposing sidewalls of shell, be disseminated to two opposing sidewalls of shell with the even heat by semiconductor module, thus make enclosure catch a cold evenly; Also can only graphite spraying coating or paste graphite film, so that the heat on the hot junction heat transfer substrate of semiconductor module is directly passed to housing back wall on the inner surface of the substrate layer of the rear wall of shell; Also can on the inner surface of the substrate layer of two of a shell opposing sidewalls and rear wall graphite spraying coating or paste graphite film; Also can on the inner surface of whole substrate layers of shell graphite spraying coating or paste graphite film.Above-mentioned four kinds of situations, can select according to the work requirements of semiconductor freezer.
In another embodiment of the invention, before steps A, also steps A 2 can be comprised: embedded in the corresponding holding tank of the hot junction heat transfer substrate of the semiconductor module of semiconductor freezer by least part of evaporator section of pressure-riveting process by every root hot side heat.
Also comprise step D after step c: the rear surface front surface of the cold junction heat transfer substrate of semiconductor module being resisted against the inner bag of semiconductor freezer;
The front surface of the first pre-arrangement semiconductor chilling plate of semiconductor module, cool guiding block formed after being installed on cold and hot end thermal insulation layer is resisted against the rear surface of cold junction heat transfer substrate;
The front surface of the hot junction heat transfer substrate of semiconductor module is resisted against the hot junction of semiconductor chilling plate, and the Part I of shell is fixedly connected with inner bag;
By multiple screw respectively successively through in the screw hole screwed in after respective through hole, the respective through hole on cold and hot end thermal insulation layer and the respective through hole on cold junction heat transfer substrate on the heat transfer substrate of hot junction on inner bag rear wall;
The rear wall of mounting casing, and the rear surface of the inner surface of the rear wall of shell and hot junction heat transfer substrate is contacted against.
The rear surface front surface of the cold junction heat transfer substrate of semiconductor module being resisted against the inner bag of semiconductor freezer in step D comprises: embed in the corresponding holding tank of the cold junction heat transfer substrate of the semiconductor module of semiconductor freezer by pressure-riveting process by least part of condensation segment of every root cool side heat pipes; At least part of evaporator section of every root cool side heat pipes of semiconductor freezer is fixed on the outer surface of the inner bag of semiconductor freezer, to form the second pre-arrangement.
The front surface of the hot junction heat transfer substrate of semiconductor module is resisted against the hot junction of semiconductor chilling plate, namely the Part I of shell and hot junction heat transfer substrate is arranged on the second pre-arrangement.
After step D, also comprise step e: filled polyurethane foaming layer between inner bag and shell, reveal with cold indoor between isolated storing.
After step e, also comprise step F: in the contact position of the Qianmen of semiconductor freezer and shell, magnetic sealing strip is installed, by Qianmen by hinge together with housing hinge.
It should be noted that above-mentioned steps can make semiconductor freezer carry out work, but in order to attractive in appearance or other requirement, also need the parts etc. installing some ornamental member, protectiveness.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (18)
1. a semiconductor freezer, comprises shell and semiconductor module and the heat of described semiconductor module is reached at least one hot side heat of described shell, it is characterized in that, also comprise:
At least one hot junction fixation clip, at least part of condensation segment of hot side heat described in every root is fixed on the inner surface of described shell by each described hot junction fixation clip, is posted by the inner surface of described shell to make at least part of condensation segment of hot side heat described in every root.
2. semiconductor freezer according to claim 1, is characterized in that, each described hot junction fixation clip has:
Protrusion, is formed with the holddown groove extended along its length, to hold at least part of condensation segment of corresponding described hot side heat; With
Extend laterally from two length edges of described protrusion respectively, to be fixedly connected with described shell and to abut in two fixing flanks the inner surface of described shell.
3. semiconductor freezer according to claim 2, is characterized in that,
The each fixing flank of each described hot junction fixation clip is fixed on described shell by screw.
4. semiconductor freezer according to claim 1, is characterized in that,
The innermost layer of the shell wall of at least part of condensation segment of described hot side heat that described shell reclines is graphite rete.
5. semiconductor freezer according to claim 1, is characterized in that,
The condensation segment of hot side heat described in every root comprises the first condensation segment and second condensation segment of the evaporator section both sides being positioned at this hot side heat;
The quantity of at least one hot junction fixation clip described is at least two, utilizes the inner surface of a corresponding hot junction fixation clip and described shell thermally coupled respectively with at least part of pipeline section of the first condensation segment and the second condensation segment that make hot side heat described in every root.
6. semiconductor freezer according to claim 5, is characterized in that,
First condensation segment of hot side heat described in every root and at least part of pipeline section of the second condensation segment utilize corresponding described hot junction fixation clip to be fixed on the inner surface of two opposing sidewalls of described shell along horizontal longitudinal direction respectively.
7. semiconductor freezer according to claim 5, is characterized in that,
The quantity of described at least one hot side heat is at least two, the first condensation segment of every root hot side heat in the described hot side heat of a part and at least part of pipeline section of the second condensation segment utilize corresponding described hot junction fixation clip to be fixed on the inner surface of two opposing sidewalls of described shell along horizontal longitudinal direction respectively, and the first condensation segment of the every root hot side heat in hot side heat described in remainder and at least part of pipeline section of the second condensation segment all utilize corresponding described hot junction fixation clip to be fixed on the inner surface of the roof of described shell along horizontal longitudinal direction; Or
The quantity of described at least one hot side heat is at least three, the first condensation segment of every root hot side heat in the described hot side heat of a part and at least part of pipeline section of the second condensation segment utilize corresponding described hot junction fixation clip to be fixed on the inner surface of two opposing sidewalls of described shell along horizontal longitudinal direction respectively, first condensation segment of the every root hot side heat in hot side heat described in another part and at least part of pipeline section of the second condensation segment all utilize corresponding described hot junction fixation clip to be fixed on the inner surface of the roof of described shell along horizontal longitudinal direction, first condensation segment of the every root hot side heat in hot side heat described in remainder and at least part of pipeline section of the second condensation segment all utilize corresponding described hot junction fixation clip to be fixed on the inner surface of the diapire of described shell along horizontal longitudinal direction.
8. semiconductor freezer according to claim 1, is characterized in that, described semiconductor module comprises:
Semiconductor chilling plate; With
Hot junction heat transfer substrate, it is installed into makes the hot junction of its front surface and described semiconductor chilling plate contact against, described hot junction heat transfer substrate is formed with at least one holding tank, and each described holding tank is configured at least part of evaporator section of the corresponding described hot side heat of accommodation one.
9. semiconductor freezer according to claim 8, is characterized in that,
The inner surface of the rear surface of described hot junction heat transfer substrate and the rear wall of described shell contacts against, and the innermost layer of the rear wall of described shell is graphite rete.
10. semiconductor freezer according to claim 8, is characterized in that, described semiconductor module comprises further:
Cool guiding block, the cold junction of its rear surface and described semiconductor chilling plate contacts against; With
There is the cold and hot end thermal insulation layer of central opening, described semiconductor chilling plate and described cool guiding block are arranged in described central opening, the hot junction of described semiconductor chilling plate protrudes from or flushes in the trailing flank of described cold and hot end thermal insulation layer, and the front surface of described cool guiding block protrudes from or flush in the leading flank of described cold and hot end thermal insulation layer; And
Cold junction heat transfer substrate, the front surface of its rear surface and described cool guiding block contacts against.
11. semiconductor freezers according to claim 10, is characterized in that,
The opening of each described holding tank is in the front surface of described hot junction heat transfer substrate, contacts against with the hot junction of the outer wall and described semiconductor chilling plate that make at least part of evaporator section of hot side heat described in every root.
12. semiconductor freezers according to claim 1, is characterized in that,
Described in every root, at least part of condensation segment of hot side heat is flat tube.
13. semiconductor freezers according to claim 1, is characterized in that,
Described shell comprises separate Part I and rear wall, described Part I comprises the roof of described shell, diapire and two opposite side walls, at least part of condensation segment of hot side heat described in every root is fixed on the inner surface of described Part I by each described hot junction fixation clip, to be convenient to the installation of described semiconductor module when manufacturing described semiconductor freezer.
The manufacture method of semiconductor freezer according to any one of 14. 1 kinds of claims 1 to 13, is characterized in that, comprising:
Steps A: the pre-position at least part of condensation segment of every root hot side heat of described semiconductor freezer being positioned over the inner surface of the shell of described semiconductor freezer;
Step B: each described hot junction fixation clip cover is buckled at least part of condensation segment of corresponding described hot side heat;
Step C: each described hot junction fixation clip is fixed on described shell.
15. manufacture methods according to claim 14, is characterized in that,
By multiple screw, each fixing flank of each described hot junction fixation clip is fixed on described shell, so that each described hot junction fixation clip is fixed on described shell.
16. manufacture methods according to claim 14, is characterized in that, before described steps A, also comprise steps A 1:
Graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the shell wall of at least part of condensation segment of the described hot side heat that reclines on the housing, to form graphite rete; And/or
Graphite spraying coating or stickup graphite film on the inner surface of the substrate layer of the rear wall of described shell.
17. manufacture methods according to claim 14, is characterized in that, before described steps A, also comprise steps A 2:
By pressure-riveting process, at least part of evaporator section of hot side heat described in every root is embedded in the corresponding holding tank of the hot junction heat transfer substrate of the semiconductor module of described semiconductor freezer.
18. manufacture methods according to claim 17, is characterized in that, after described step C, also comprise step D:
The front surface of the cold junction heat transfer substrate of described semiconductor module is resisted against the rear surface of the inner bag of described semiconductor freezer;
The front surface of the first pre-arrangement semiconductor chilling plate of described semiconductor module, cool guiding block formed after being installed on cold and hot section of thermal insulation layer is resisted against the rear surface of described cold junction heat transfer substrate;
The front surface of the hot junction heat transfer substrate of described semiconductor module is resisted against the hot junction of described semiconductor chilling plate, and the Part I of described shell is fixedly connected with described inner bag;
By multiple screw respectively successively through in the screw hole screwed in after respective through hole, the respective through hole on described cold and hot end thermal insulation layer and the respective through hole on described cold junction heat transfer substrate on the heat transfer substrate of described hot junction on described inner bag rear wall;
The rear wall of described shell is installed, and the rear surface of the inner surface of the rear wall of described shell and described hot junction heat transfer substrate is contacted against.
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| CN105466153A (en) * | 2016-01-13 | 2016-04-06 | 广东机电职业技术学院 | Portable cold and hot insulation box and temperature regulation method thereof |
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