CN102980429A - Loop thermosyphon heat dissipation device - Google Patents
Loop thermosyphon heat dissipation device Download PDFInfo
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- CN102980429A CN102980429A CN2012105393667A CN201210539366A CN102980429A CN 102980429 A CN102980429 A CN 102980429A CN 2012105393667 A CN2012105393667 A CN 2012105393667A CN 201210539366 A CN201210539366 A CN 201210539366A CN 102980429 A CN102980429 A CN 102980429A
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- capillary structure
- evaporation cavity
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- pipeline
- thermal siphon
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Abstract
The invention relates to a loop thermosyphon heat dissipation device which comprises an evaporation chamber, a duct, a condenser, a wick structure and working media, wherein at least one side of the evaporation chamber is in a plane structure; the wick structure is arranged in the evaporation chamber and is tightly connected with the inner wall of the plane side of the evaporation chamber; the evaporation chamber is communicated with both ends of the duct; the condenser is arranged on the outer side of the middle section of the duct; and the working medium is filled in the evaporation chamber and the duct. The loop thermosyphon heat dissipation device disclosed by the invention has the advantages that the inner tube forms a loop, and the inner working media move in the same direction during operation and promote mutually, so that the heat-transfer capability is higher, and the extreme heat-transfer power is high; the wick structure arranged in the evaporation chamber is favorable for evaporation of the working media, meanwhile, the evaporation area is enlarged, and the film boiling is not easily formed, so that the heat dissipation device can bear larger heat-flow density; and the outer part of the evaporation chamber is in a flat plate shape which is favorable for contact with electronic devices, thereby omitting connection pieces of the traditional thermosyphon and reducing thermal-conduction resistance and thermal contact resistance.
Description
Technical field
The present invention relates to industrial electronic heat radiation product technical field, particularly relate to a kind of loop thermal siphon heat abstractor.
Background technology
The thermal siphon heat transfer technology has the not available superior function of common heat transfer technology, the advantage such as can regulate such as good heat-conductive characteristic, the heat exchange of secondary partition, heat flow density.Thereby in industrial heat exchange with reclaim the aspect such as energy-conservation and be widely used, and in industries such as electronics, metallurgy, chemical industry, building materials, power a lot of successful examples are arranged.
The traditional hot siphon pipe designs for straight pipe type, in the thermal siphon bottom, thermal source heats internal working medium by shell, in operating temperature range, working medium explosive evaporation, working substance steam rise to the top of thermal siphon and meet the heat release of condensation knot, and condensation water is back to bringing-up section along inside pipe wall and again is heated evaporation, the continuous circulating phase-change of heat by working medium is passed to heat sink by thermal source, thereby reaches the purpose of efficient heat transfer.
Because the restriction of traditional hot siphon arrangement, there is following defective in it:
1, heat flow density aspect: because traditional hot siphon pipe inside is straight pipe wall, on less disengagement area, the phase transformation of working medium is easy to be transitioned into film boiling by bubble boiling, and heat of transformation current density is easy to reach the evaporation limit, so that the heat transfer property of thermal siphon sharply reduces;
2, limit heat transfer power aspect: in the straight tube-like thermal siphon course of work, the direction of motion of gaseous working medium and liquid refrigerant is opposite, the speed of service of the larger two states working medium of heat transfer power is faster, and mutual drag effects is larger, has finally limited the power limit of conducting heat;
3, tube-shaped structure aspect: the outer wall of tube-shaped structure has limited effective applying of thermal siphon and thermal source.When especially the applying electronic product dispelled the heat, the contact-making surface of electronic device mostly was greatly tabular, so thermal siphon in use must increase saddle connector, inevitable like this thermal conduction resistance and the thermal contact resistance of having increased.
This shows, thermal siphon of the prior art exists obvious deficiency and defective in structure, use, demand further improvement urgently, therefore it is high how to found a kind of limit heat transfer power, can bear larger heat flow density, reduce the loop thermal siphon heat abstractor of thermal conduction resistance and thermal contact resistance, real one of the current important field of research that belongs to.
Summary of the invention
The purpose of this invention is to provide a kind of loop thermal siphon heat abstractor, can bear larger heat flow density, have limit heat transfer power height, the advantage that thermal conduction resistance and thermal contact resistance are low, thus overcome the deficiencies in the prior art.
For solving the problems of the technologies described above, a kind of loop thermal siphon of the present invention heat abstractor comprises evaporation cavity, pipeline, condenser, capillary structure and working medium, and wherein: at least one side of described evaporation cavity is planar structure; Described capillary structure is arranged in the evaporation cavity, and capillary structure closely is connected with the plane one side inwall of evaporation cavity; Evaporation cavity is communicated with pipe ends, and condenser is installed on the lateral surface of pipeline stage casing, and the working medium can is in evaporation cavity and pipeline.
As a further improvement on the present invention, described capillary structure bottom closely is connected for the plane and with evaporation cavity, and the top is slightly narrow, and inside is capillary structure.
Described pipeline comprises jet chimney and fluid pipeline, and described jet chimney is connected in the sidewall that evaporation cavity does not contact with capillary structure; Described fluid pipeline is connected in evaporation cavity and the close-connected sidewall of capillary structure, and extends to capillary structure inside.
Described capillary structure is the poroid capillary structure of post or channel form capillary structure.
Described capillary structure is formed by thermal conductive metal particle or ceramic material particle sintering.
Described evaporation cavity comprises punching press housing and the cavity cover plate that is fixedly connected with it.
Described capillary structure is connected with the punching press housing sintering of evaporation cavity.
Described condenser adopts radiation fin structure.
Described evaporation cavity and pipeline all adopt metal material.
Described pipeline also is connected with the vacuum pumping loading pipe.
After adopting above design, the present invention has following beneficial effect compared with the prior art:
1, the internal pipeline of heat abstractor of the present invention forms loop, and during the internal working medium operation, the direction of motion is consistent, mutually promotes, like this so that this thermal siphon has larger heat-transfer capability and very high limit heat transfer power;
2, heat abstractor of the present invention is provided with evaporation cavity, and inside is provided with capillary structure, is conducive to the working medium evaporation, increases simultaneously disengagement area, is difficult for forming film boiling, so that device can bear larger heat flow density;
3, the evaporation cavity of heat abstractor of the present invention, the outside is tabular, is conducive to contact with electronic device, has saved the siphonal connector of traditional hot, has reduced thermal conduction resistance and thermal contact resistance;
4, heat abstractor machinery-free moving component of the present invention has that safe and reliable, heat output is large, the advantage of flexible arrangement.
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Description of drawings
Above-mentioned only is the general introduction of technical solution of the present invention, and for can clearer understanding the present invention, the present invention is described in further detail below in conjunction with accompanying drawing and the specific embodiment.
The overall structure schematic diagram of Fig. 1 loop thermal siphon of the present invention heat abstractor.
The decomposition texture schematic diagram of Fig. 2 loop thermal siphon of the present invention heat abstractor.
The poroid capillary structure schematic diagram of post of Fig. 3 loop thermal siphon of the present invention heat abstractor.
The channel form capillary structure schematic diagram of Fig. 4 loop thermal siphon of the present invention heat abstractor.
The pipeline of Fig. 5 loop thermal siphon of the present invention heat abstractor and evaporation cavity syndeton schematic diagram.
The radiating principle figure of Fig. 6 loop thermal siphon of the present invention heat abstractor.
The specific embodiment
See also Fig. 1, shown in Figure 2, a kind of loop thermal siphon of the present invention heat abstractor comprises evaporation cavity 2, pipeline, condenser 4 and capillary structure 1, also comprises working medium 6 and vacuum pumping loading pipe 7.
Wherein, capillary structure 1 is arranged in the evaporation cavity 2, and be sintered together with evaporation cavity 2 sidewalls, pipeline is fixedly connected to form the airtight loop body that is connected with evaporation cavity 2 sidewalls, and the lateral surface of pipeline and the condenser of fin structure 4 connect together with fixed form.
See also Fig. 2, shown in Figure 5, evaporation cavity 2 of the present invention comprises punching press housing 21 and cavity cover plate 22, at least one side of evaporation cavity is planar structure, punching press housing 21 and cavity cover plate 22 adopt the fine copper material, be provided with above the punching press housing 21 and be beneficial to the bulge-structure that fixed cavity cover plate 22 is fixed, capillary structure 1 is arranged on evaporation cavity 2 inside, is sintered to integrative-structure with punching press housing 21, and capillary structure 1 closely is fixedly connected with planar wall one side of evaporation cavity 2.
Further; see also Fig. 3, shown in Figure 4; capillary structure 1 is formed by thermal conductive metal particle or metallic fiber or ceramic material particle sintering; the bottom is the plane; the top is slightly narrow; inside is capillary structure, has the heat exchange structure of enhancing and arranges, includes but not limited to the poroid capillary structure 8 of post, channel form capillary structure 9.This capillary structure can increase disengagement area, is beneficial to working medium and becomes gaseous state and overflow from the inside of capillary structure 1.
See also Fig. 2, shown in Figure 5, pipeline comprises jet chimney 3 and fluid pipeline 5.Jet chimney 3 is arranged on the side that punching press housing 21 is not connected with capillary structure, and is connected with the clearance spaces of evaporation cavity 2.Fluid pipeline 5 is arranged on punching press housing 21 and capillary structure 1 close-connected sidewall or other sidewalls, and extend into the inside of capillary structure 1, thereby can prevent that gaseous working medium from entering fluid pipeline 5, guarantee the pressure differential of gaseous working medium and liquid refrigerant, guarantee working medium circular flow in pipeline.Jet chimney 3 and fluid pipeline 5 also can be arranged on cavity and cover a side.Preferably, jet chimney 3 and fluid pipeline 5 are arranged on two relative sides of punching press housing 21.
In addition, can be provided with the vacuum pumping loading pipe 7 with pipeline communication in any position of pipeline, preferably, vacuum pumping loading pipe 7 is installed in the knuckle place of fluid pipeline 5, be used for the confined space inside that evaporation cavity 2, jet chimney 3 and fluid pipeline 5 form is vacuumized, make its inner space be in negative pressure or vacuum state and by the vacuum pumping loading pipe working medium is injected into closed system inside, finish vacuumizing and can working medium, at last vacuum-pumping tube is sealed.
See also shown in Figure 6, the operation principle of loop thermal siphon heat abstractor of the present invention is: the inner confined space that forms of this device, the inner space is under negative pressure or the vacuum state, working medium 6 liquid phase heights are lower, behind the capillary structure 1 interior heat that absorbs the evaporation cavity conduction, become gaseous state, along with increasing of gaseous working medium pressure, promote working medium 6 and arrive condenser 4 by jet chimney 3, working medium 6 becomes liquid state after cooling off in condenser 4, heat is transmitted in the environment through condenser 4.Liquid refrigerant 6 continues to reflux under gravity and steam pressure effect, and by being back to capillary structure 1 behind the liquid pipeline 5, the heat absorption evaporation forms circulation, reaches the purpose of the gas-liquid phase transition transferring heat that relies on working medium.
The above; it only is preferred embodiment of the present invention; be not that the present invention is done any pro forma restriction, those skilled in the art utilize the technology contents of above-mentioned announcement to make a little simple modification, equivalent variations or modification, all drop in protection scope of the present invention.
Claims (10)
1. a loop thermal siphon heat abstractor is characterized in that comprising evaporation cavity, pipeline, condenser, capillary structure and working medium, wherein:
At least one side of described evaporation cavity is planar structure;
Described capillary structure is arranged in the evaporation cavity, and capillary structure closely is connected with the plane one side inwall of evaporation cavity;
Evaporation cavity is communicated with pipe ends, and condenser is installed on the lateral surface of pipeline stage casing, and the working medium can is in evaporation cavity and pipeline.
2. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described capillary structure bottom closely is connected for the plane and with evaporation cavity, and inside is capillary structure.
3. loop thermal siphon heat abstractor according to claim 2 is characterized in that:
Described pipeline comprises jet chimney and fluid pipeline, and described jet chimney is connected in the sidewall that evaporation cavity does not contact with capillary structure;
Described fluid pipeline is connected in evaporation cavity and the close-connected sidewall of capillary structure, and extends to capillary structure inside.
4. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described capillary structure is the poroid capillary structure of post or channel form capillary structure.
5. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described capillary structure is formed by thermal conductive metal particle or metallic fiber or ceramic material particle sintering.
6. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described evaporation cavity comprises punching press housing and the cavity cover plate that is fixedly connected with it.
7. loop thermal siphon heat abstractor according to claim 6 is characterized in that:
Described capillary structure is connected with the punching press housing sintering of evaporation cavity.
8. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described condenser adopts radiation fin structure.
9. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described evaporation cavity and pipeline all adopt metal material.
10. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described pipeline also is connected with the vacuum pumping loading pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105393667A CN102980429A (en) | 2012-12-13 | 2012-12-13 | Loop thermosyphon heat dissipation device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105393667A CN102980429A (en) | 2012-12-13 | 2012-12-13 | Loop thermosyphon heat dissipation device |
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| CN102980429A true CN102980429A (en) | 2013-03-20 |
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| CN2012105393667A Pending CN102980429A (en) | 2012-12-13 | 2012-12-13 | Loop thermosyphon heat dissipation device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411256A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | In the loop heat pipe that condensation segment has part to fill up capillary material |
| CN110411252A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | Has the loop heat pipe of different tube diameters |
| CN110411255A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | It is divided into the loop heat pipe of steam flow channel and fluid course with pipe |
| CN111669944A (en) * | 2020-06-22 | 2020-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
| CN112867364A (en) * | 2021-02-08 | 2021-05-28 | 苏州汇川技术有限公司 | Split type thermosiphon phase change radiator and industrial control equipment |
| CN114485233A (en) * | 2022-02-28 | 2022-05-13 | 苏州浪潮智能科技有限公司 | Impact backflow type gravity thermosiphon radiator and electronic equipment |
| CN116399148B (en) * | 2023-03-31 | 2024-06-07 | 东莞智富五金制品有限公司 | Production method of high-power efficient heat exchange transpiration loop module |
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| US20060162903A1 (en) * | 2005-01-21 | 2006-07-27 | Bhatti Mohinder S | Liquid cooled thermosiphon with flexible partition |
| CN1967129A (en) * | 2005-11-17 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN101478868A (en) * | 2009-01-23 | 2009-07-08 | 北京奇宏科技研发中心有限公司 | Heat radiating device and manufacturing process thereof |
| CN101672592A (en) * | 2009-10-16 | 2010-03-17 | 中国科学院上海技术物理研究所 | Miniaturized loop heat pipe |
| CN202974004U (en) * | 2012-12-13 | 2013-06-05 | 中国科学院大学 | Loop thermosyphon heat abstractor |
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2012
- 2012-12-13 CN CN2012105393667A patent/CN102980429A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060162903A1 (en) * | 2005-01-21 | 2006-07-27 | Bhatti Mohinder S | Liquid cooled thermosiphon with flexible partition |
| CN1967129A (en) * | 2005-11-17 | 2007-05-23 | 富准精密工业(深圳)有限公司 | Heat pipe |
| CN101478868A (en) * | 2009-01-23 | 2009-07-08 | 北京奇宏科技研发中心有限公司 | Heat radiating device and manufacturing process thereof |
| CN101672592A (en) * | 2009-10-16 | 2010-03-17 | 中国科学院上海技术物理研究所 | Miniaturized loop heat pipe |
| CN202974004U (en) * | 2012-12-13 | 2013-06-05 | 中国科学院大学 | Loop thermosyphon heat abstractor |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411256A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | In the loop heat pipe that condensation segment has part to fill up capillary material |
| CN110411252A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | Has the loop heat pipe of different tube diameters |
| CN110411255A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | It is divided into the loop heat pipe of steam flow channel and fluid course with pipe |
| CN111669944A (en) * | 2020-06-22 | 2020-09-15 | 深圳市鸿富诚屏蔽材料有限公司 | 3D phase change superconducting radiator |
| CN112867364A (en) * | 2021-02-08 | 2021-05-28 | 苏州汇川技术有限公司 | Split type thermosiphon phase change radiator and industrial control equipment |
| CN114485233A (en) * | 2022-02-28 | 2022-05-13 | 苏州浪潮智能科技有限公司 | Impact backflow type gravity thermosiphon radiator and electronic equipment |
| CN116399148B (en) * | 2023-03-31 | 2024-06-07 | 东莞智富五金制品有限公司 | Production method of high-power efficient heat exchange transpiration loop module |
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Application publication date: 20130320 |