CN202974004U - Loop thermosyphon heat abstractor - Google Patents
Loop thermosyphon heat abstractor Download PDFInfo
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- CN202974004U CN202974004U CN2012206889294U CN201220688929U CN202974004U CN 202974004 U CN202974004 U CN 202974004U CN 2012206889294 U CN2012206889294 U CN 2012206889294U CN 201220688929 U CN201220688929 U CN 201220688929U CN 202974004 U CN202974004 U CN 202974004U
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- evaporation cavity
- capillary structure
- heat abstractor
- pipeline
- thermal siphon
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Abstract
The utility model discloses a loop thermosyphon heat abstractor which comprises an evaporation cavity, pipelines, a condenser, a capillary structure and working media, wherein at least one side of the evaporation cavity is of a plane structure, the capillary structure is arranged in the evaporation cavity and is tightly connected with the inner wall of a plane side of the evaporation cavity, the evaporation cavity is communicated with two ends of each pipeline, the condenser is installed on the outer lateral side of the middle section of the pipeline, and the working media are filled in the evaporation cavity and the pipelines. According to the loop thermosyphon heat abstractor, the interior pipelines form a loop, the working media move towards the same direction during operation, mutual promotion is achieved, and heat-transfer capability is strong and ultimate heat-transfer power is high; due to the fact that the capillary structure is arranged inside the evaporation cavity, evaporation of the working media can be achieved easily, the evaporation area is increased at the same time, film boiling does not occur easily, and the heat abstractor is enabled to bear large heat flux density; and due to the fact that the exterior of the evaporation cavity is plate-shaped, contact between the evaporation cavity and an electron device is easy, a connection piece used on a traditional thermosiphon is eliminated, and thermal-conduction resistance and thermal contact resistance are reduced.
Description
Technical field
The utility model relates to industrial electronic heat radiation product technical field, particularly relates to a kind of loop thermal siphon heat abstractor.
Background technology
The thermal siphon heat transfer technology has the not available superior function of common heat transfer technology, the advantage such as can regulate such as good heat-conductive characteristic, the heat exchange of secondary partition, heat flow density.Thereby in industrial heat exchange with reclaim the aspect such as energy-conservation and be widely used, and in industries such as electronics, metallurgy, chemical industry, building materials, power, a lot of successful examples are arranged.
The tradition thermal siphon designs for straight pipe type, in the thermal siphon bottom, thermal source heats internal working medium by shell, in operating temperature range, working medium explosive evaporation, working substance steam rise to the top of thermal siphon and meet the heat release of condensation knot, and condensation water is back to bringing-up section along inside pipe wall and again is heated evaporation, the continuous circulating phase-change of heat by working medium is passed to heat sink by thermal source, thereby reaches the purpose of efficient heat transfer.
Due to the restriction of traditional thermal siphon structure, there is following defective in it:
1, heat flow density aspect: because traditional thermal siphon inside is straight pipe wall, on less disengagement area, the phase transformation of working medium is easy to be transitioned into film boiling by bubble boiling, and heat of transformation current density is easy to reach the evaporation limit, makes the heat transfer property of thermal siphon sharply reduce;
2, limit heat transfer power aspect: in the straight tube-like thermal siphon course of work, the direction of motion of gaseous working medium and liquid refrigerant is opposite, the speed of service of the larger two states working medium of heat transfer power is faster, and mutual drag effects is larger, has finally limited the power limit of conducting heat;
3, tube-shaped structure aspect: the outer wall of tube-shaped structure has limited effective applying of thermal siphon and thermal source.When especially the applying electronic product dispelled the heat, the contact-making surface of electronic device mostly was greatly tabular, so thermal siphon in use must increase saddle connector, inevitable like this thermal conduction resistance and the thermal contact resistance of having increased.
This shows, thermal siphon of the prior art exists obvious deficiency and defective in structure, use, demand further improvement urgently, therefore how to found a kind of limit heat transfer power high, can bear larger heat flow density, reduce the loop thermal siphon heat abstractor of thermal conduction resistance and thermal contact resistance, real one of the current important field of research that belongs to.
The utility model content
The purpose of this utility model is to provide a kind of loop thermal siphon heat abstractor, can bear larger heat flow density, has limit heat transfer power high, the advantage that thermal conduction resistance and thermal contact resistance are low, thus overcome the deficiencies in the prior art.
For solving the problems of the technologies described above, a kind of loop thermal siphon of the utility model heat abstractor comprises evaporation cavity, pipeline, condenser, capillary structure and working medium, and wherein: at least one side of described evaporation cavity is planar structure; Described capillary structure is arranged in evaporation cavity, and capillary structure closely is connected with the plane one side inwall of evaporation cavity; Evaporation cavity is communicated with pipe ends, and condenser is arranged on the lateral surface of pipeline stage casing, and the working medium can is in evaporation cavity and pipeline.
As further improvement of the utility model, described capillary structure bottom is for the plane and closely be connected with evaporation cavity, and the top is slightly narrow, and inside is capillary structure.
Described pipeline comprises jet chimney and fluid pipeline, and described jet chimney is connected in the sidewall that evaporation cavity does not contact with capillary structure; Described fluid pipeline is connected in evaporation cavity and the close-connected sidewall of capillary structure, and extends to capillary structure inside.
Described capillary structure is the poroid capillary structure of post or channel form capillary structure.
Described capillary structure is formed by thermal conductive metal particle or metallic fiber or ceramic material particle sintering.
Described evaporation cavity comprises punching press housing and the cavity cover plate that is fixedly connected with it.
Described capillary structure is connected with the punching press housing sintering of evaporation cavity.
Described condenser adopts radiation fin structure.
Described evaporation cavity and pipeline all adopt metal material.
Described pipeline also is connected with the vacuum pumping loading pipe.
After adopting above design, the utility model has following beneficial effect compared with the prior art:
1, the internal pipeline of the utility model heat abstractor forms loop, and during the internal working medium operation, the direction of motion is consistent, mutually promotes, and makes like this this thermal siphon have larger heat-transfer capability and very high limit heat transfer power;
2, the utility model heat abstractor is provided with evaporation cavity, and inside is provided with capillary structure, is conducive to the working medium evaporation, increases simultaneously disengagement area, is difficult for forming film boiling, makes device can bear larger heat flow density;
3, the evaporation cavity of the utility model heat abstractor, the outside is tabular, is conducive to contact with electronic device, has saved the connector of traditional thermal siphon, has reduced thermal conduction resistance and thermal contact resistance;
4, the utility model heat abstractor machinery-free moving component has advantages of that safe and reliable, heat output is large, flexible arrangement.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Above-mentioned is only the general introduction of technical solutions of the utility model, and for can clearer understanding the utility model, the utility model is described in further detail below in conjunction with accompanying drawing and the specific embodiment.
The overall structure schematic diagram of Fig. 1 the utility model loop thermal siphon heat abstractor.
The decomposition texture schematic diagram of Fig. 2 the utility model loop thermal siphon heat abstractor.
The poroid capillary structure schematic diagram of post of Fig. 3 the utility model loop thermal siphon heat abstractor.
The channel form capillary structure schematic diagram of Fig. 4 the utility model loop thermal siphon heat abstractor.
Pipeline and the evaporation cavity syndeton schematic diagram of Fig. 5 the utility model loop thermal siphon heat abstractor.
The radiating principle figure of Fig. 6 the utility model loop thermal siphon heat abstractor.
The specific embodiment
See also Fig. 1, shown in Figure 2, a kind of loop thermal siphon of the utility model heat abstractor comprises evaporation cavity 2, pipeline, condenser 4 and capillary structure 1, also comprises working medium 6 and vacuum pumping loading pipe 7.
Wherein, capillary structure 1 is arranged in evaporation cavity 2, and be sintered together with evaporation cavity 2 sidewalls, pipeline is fixedly connected to form the airtight loop body that is connected with evaporation cavity 2 sidewalls, and the lateral surface of pipeline and the condenser of fin structure 4 connect together with fixed form.
See also Fig. 2, shown in Figure 5, evaporation cavity 2 of the present utility model comprises punching press housing 21 and cavity cover plate 22, at least one side of evaporation cavity is planar structure, punching press housing 21 and cavity cover plate 22 adopt the fine copper material, be provided with above punching press housing 21 and be beneficial to the fixing bulge-structure of fixed cavity cover plate 22, capillary structure 1 is arranged on evaporation cavity 2 inside, is sintered to integrative-structure with punching press housing 21, and capillary structure 1 closely is fixedly connected with planar wall one side of evaporation cavity 2.
Further; see also Fig. 3, shown in Figure 4; capillary structure 1 is formed by thermal conductive metal particle or metallic fiber or ceramic material particle sintering; the bottom is the plane; the top is slightly narrow; inside is capillary structure, has the heat exchange structure of enhancing and arranges, includes but not limited to the poroid capillary structure 8 of post, channel form capillary structure 9.This capillary structure can increase disengagement area, is beneficial to working medium and becomes gaseous state and overflow from the inside of capillary structure 1.
See also Fig. 2, shown in Figure 5, pipeline comprises jet chimney 3 and fluid pipeline 5.Jet chimney 3 is arranged on the side that punching press housing 21 is not connected with capillary structure, and is connected with the clearance spaces of evaporation cavity 2.Fluid pipeline 5 is arranged on punching press housing 21 and the close-connected sidewall of capillary structure 1 or other sidewalls, and extend into the inside of capillary structure 1, thereby can prevent that gaseous working medium from entering fluid pipeline 5, guarantee the pressure differential of gaseous working medium and liquid refrigerant, guarantee working medium circular flow in pipeline.Jet chimney 3 and fluid pipeline 5 also can be arranged on cavity lid one side.Preferably, jet chimney 3 and fluid pipeline 5 are arranged on two relative sides of punching press housing 21.
In addition, can be provided with the vacuum pumping loading pipe 7 with pipeline communication in any position of pipeline, preferably, vacuum pumping loading pipe 7 is arranged on the knuckle place of fluid pipeline 5, the confined space inside that is used for evaporation cavity 2, jet chimney 3 and fluid pipeline 5 are formed vacuumizes, make its inner space be in negative pressure or vacuum state and by the vacuum pumping loading pipe, working medium be injected into closed system inside, completing vacuumizing and can working medium, at last vacuum-pumping tube being sealed.
See also shown in Figure 6, the operation principle of the utility model loop thermal siphon heat abstractor is: the inner confined space that forms of this device, the inner space is under negative pressure or vacuum state, working medium 6 liquid phase heights are lower, become gaseous state after the interior heat that absorbs the evaporation cavity conduction of capillary structure 1, along with increasing of gaseous working medium pressure, promote working medium 6 and arrive condenser 4 by jet chimney 3, become liquid state after working medium 6 is cooling in condenser 4, heat is transmitted in environment through condenser 4.Liquid refrigerant 6 continues to reflux under gravity and steam pressure effect, and by being back to capillary structure 1 after liquid pipeline 5, the heat absorption evaporation forms circulation, reaches the purpose of the gas-liquid phase transition transferring heat that relies on working medium.
The above; it is only preferred embodiment of the present utility model; be not that the utility model is done any pro forma restriction, those skilled in the art utilize the technology contents of above-mentioned announcement to make a little simple modification, equivalent variations or modification, all drop in protection domain of the present utility model.
Claims (10)
1. a loop thermal siphon heat abstractor, is characterized in that comprising evaporation cavity, pipeline, condenser, capillary structure and working medium, wherein:
At least one side of described evaporation cavity is planar structure;
Described capillary structure is arranged in evaporation cavity, and capillary structure closely is connected with the plane one side inwall of evaporation cavity;
Evaporation cavity is communicated with pipe ends, and condenser is arranged on the lateral surface of pipeline stage casing, and the working medium can is in evaporation cavity and pipeline.
2. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described capillary structure bottom is for the plane and closely be connected with evaporation cavity, and inside is capillary structure.
3. loop thermal siphon heat abstractor according to claim 2 is characterized in that:
Described pipeline comprises jet chimney and fluid pipeline, and described jet chimney is connected in the sidewall that evaporation cavity does not contact with capillary structure;
Described fluid pipeline is connected in evaporation cavity and the close-connected sidewall of capillary structure, and extends to capillary structure inside.
4. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described capillary structure is the poroid capillary structure of post or channel form capillary structure.
5. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described capillary structure is formed by thermal conductive metal particle or metallic fiber or ceramic material particle sintering.
6. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described evaporation cavity comprises punching press housing and the cavity cover plate that is fixedly connected with it.
7. loop thermal siphon heat abstractor according to claim 6 is characterized in that:
Described capillary structure is connected with the punching press housing sintering of evaporation cavity.
8. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described condenser adopts radiation fin structure.
9. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described evaporation cavity and pipeline all adopt metal material.
10. loop thermal siphon heat abstractor according to claim 1 is characterized in that:
Described pipeline also is connected with the vacuum pumping loading pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206889294U CN202974004U (en) | 2012-12-13 | 2012-12-13 | Loop thermosyphon heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206889294U CN202974004U (en) | 2012-12-13 | 2012-12-13 | Loop thermosyphon heat abstractor |
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| Publication Number | Publication Date |
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| CN202974004U true CN202974004U (en) | 2013-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012206889294U Expired - Fee Related CN202974004U (en) | 2012-12-13 | 2012-12-13 | Loop thermosyphon heat abstractor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980429A (en) * | 2012-12-13 | 2013-03-20 | 中国科学院大学 | Loop thermosyphon heat dissipation device |
| CN103307917A (en) * | 2013-06-27 | 2013-09-18 | 高诗白 | Micro-channel radiator |
| CN103413794A (en) * | 2013-08-16 | 2013-11-27 | 中国科学院深圳先进技术研究院 | Radiating packaging structure of semiconductor power device |
| CN105066756A (en) * | 2015-08-13 | 2015-11-18 | 袁竹 | Device for changing energy by using loop heat pipe |
| CN113207264A (en) * | 2021-04-28 | 2021-08-03 | 深圳市科信通信技术股份有限公司 | Power supply heat dissipation device and power supply |
-
2012
- 2012-12-13 CN CN2012206889294U patent/CN202974004U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102980429A (en) * | 2012-12-13 | 2013-03-20 | 中国科学院大学 | Loop thermosyphon heat dissipation device |
| CN103307917A (en) * | 2013-06-27 | 2013-09-18 | 高诗白 | Micro-channel radiator |
| CN103307917B (en) * | 2013-06-27 | 2015-09-30 | 广州市日森机械股份有限公司 | A kind of microchannel heat sink |
| CN103413794A (en) * | 2013-08-16 | 2013-11-27 | 中国科学院深圳先进技术研究院 | Radiating packaging structure of semiconductor power device |
| CN105066756A (en) * | 2015-08-13 | 2015-11-18 | 袁竹 | Device for changing energy by using loop heat pipe |
| CN113207264A (en) * | 2021-04-28 | 2021-08-03 | 深圳市科信通信技术股份有限公司 | Power supply heat dissipation device and power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20141213 |
|
| EXPY | Termination of patent right or utility model |