CN113207264A - Power supply heat dissipation device and power supply - Google Patents
Power supply heat dissipation device and power supply Download PDFInfo
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- CN113207264A CN113207264A CN202110465022.5A CN202110465022A CN113207264A CN 113207264 A CN113207264 A CN 113207264A CN 202110465022 A CN202110465022 A CN 202110465022A CN 113207264 A CN113207264 A CN 113207264A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 101
- 238000001816 cooling Methods 0.000 claims abstract description 80
- 238000002791 soaking Methods 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 45
- 238000009833 condensation Methods 0.000 claims description 19
- 230000005494 condensation Effects 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 16
- 230000008020 evaporation Effects 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 8
- 238000012544 monitoring process Methods 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000004512 die casting Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a power supply heat dissipation device and a power supply, wherein the power supply heat dissipation device comprises a shell, a power supply board, a controller, a cooling structure and a heat dissipation structure, wherein the power supply board is arranged in the shell, and a temperature acquisition probe is arranged on the power supply board; the controller is integrally arranged on the power panel and is electrically connected with the temperature acquisition probe; the heat dissipation structure is arranged at one end of the shell close to the power panel; the cooling structure comprises a soaking plate for heat dissipation, a cooling pipeline and a cooling working medium, wherein the soaking plate and the cooling pipeline are both arranged on the heat dissipation structure, and the soaking plate is abutted against the power panel; the cooling working medium is filled in the soaking plate and the cooling pipeline; and the controller controls the working states of the soaking plate and the cooling pipeline by changing the flow rate of the cooling working medium. The power supply heat dissipation device solves the problem that the existing power supply heat dissipation device is low in heat dissipation efficiency.
Description
Technical Field
The invention relates to the technical field of communication power supplies, in particular to a power supply heat dissipation device and a power supply.
Background
In the current communication basic station, integration communication power supply adopts natural radiating mode usually, power shell is panel beating or aluminum hull, power shell and radiator are installed together, install power PCB board in the casing, the bottom at the casing is installed to the radiator, the heat dissipation tooth is stretched out at casing bottom back, heat-generating bodies such as chip on the power PCB board and each device pass through the heat conduction pad, heat conduction materials such as heat conduction glue link to each other with radiator bottom base plate, the heat that heat-generating bodies such as chip on the power PCB board and each device produced is dispelled away through the heat dissipation tooth. And the requirements of reliability or economy and the like of the power supply are difficult to meet by adopting a natural heat dissipation mode and other heat dissipation means such as forced air volume or liquid cooling and the like.
The current common power supply has the following problems: (1) because the shell of the power supply is usually formed by die casting, the die-cast material has low heat conductivity, and the heat dissipation capacity of the whole aluminum die-cast shell of the power supply is limited, the power density of the power supply is difficult to further improve; (2) the chip on the power supply PCB board and the heating elements such as each device have high local power density, the local area heats intensively, the heat dissipation is difficult, and the temperature is raised; (3) the heat dissipation teeth have a certain height, the farther the base plate of the tooth piece heat dissipation device is, the lower the temperature is, and the area of the tail part of the heat dissipation tooth piece cannot be effectively utilized due to the height difference of the tooth piece.
Disclosure of Invention
The technical problems to be solved by the invention are as follows: aiming at the problem of low heat dissipation efficiency of the existing power supply heat dissipation device, the power supply heat dissipation device is provided.
The invention provides a power supply heat dissipation device which comprises a shell, a power supply board, a controller, a cooling structure and a heat dissipation structure, wherein the power supply board is arranged in the shell, and a temperature acquisition probe is arranged on the power supply board; the controller is integrally arranged on the power panel and is electrically connected with the temperature acquisition probe; the heat dissipation structure is arranged at one end of the shell close to the power panel; the cooling structure comprises a soaking plate for heat dissipation, a cooling pipeline and a cooling working medium, wherein the soaking plate and the cooling pipeline are both arranged on the heat dissipation structure, and the soaking plate is abutted against the power panel; the cooling working medium is filled in the soaking plate and the cooling pipeline; and the controller controls the working states of the soaking plate and the cooling pipeline by changing the flow rate of the cooling working medium.
Optionally, the heat dissipation structure includes a heat dissipation plate and heat dissipation teeth mounted on the heat dissipation plate, the heat dissipation plate is mounted on the housing, and the soaking plate is disposed on one side of the heat dissipation plate close to the power board; the heat dissipation teeth are arranged on one surface of the heat dissipation plate, which is far away from the soaking plate; the cooling pipeline is embedded into the heat dissipation teeth and arranged at one end, far away from the heat dissipation plate, of the heat dissipation teeth.
Optionally, the vapor chamber comprises an upper shell plate, a lower shell plate, an evaporation end liquid absorption core, two liquid filling pipes and a condensation end liquid absorption core, the lower shell plate is abutted against the power panel, the upper shell plate is connected with the lower shell plate, a cooling cavity is formed between the upper shell plate and the lower shell plate, and the cooling cavity is respectively connected with two ends of the cooling pipeline through the two liquid filling pipes; the evaporation end wick and the condensation end wick are both arranged in the cooling cavity, the condensation end wick is arranged on the upper shell plate, and the evaporation end wick is arranged on the lower shell plate.
Optionally, the vapor chamber further comprises a support column and a liquid pump for adjusting the flow rate of the cooling working medium, wherein the support column is arranged between the upper shell plate and the lower shell plate; the liquid pump is mounted on one of the liquid charging pipes and is in communication connection with the controller.
Optionally, the condensation end wick is disposed in the cooling line.
Optionally, the power supply heat dissipation device further comprises a sun-shading structure, the sun-shading structure comprises an automatic roller shutter and a monitoring probe used for detecting solar radiation, the monitoring probe is mounted on the shell, and the automatic roller shutter is arranged on the outer side of the heat dissipation teeth.
Optionally, the sunshade structure further comprises a guide plate, the guide plate is mounted on both sides of the shell, and the automatic roller shutter is mounted on the guide plate; be provided with the guide way on the deflector, automatic roll up curtain one end and extend into the guide way just can follow the extending direction of guide way removes.
Optionally, an upper cover is arranged on the housing, and a sealing strip is arranged between the upper cover and the housing.
Optionally, the power panel includes a heating device, a heat conducting material is disposed on the heating device, and the heat conducting material is abutted against the vapor chamber.
In another aspect, the invention further provides a power supply, which comprises the power supply heat dissipation device.
In the invention, the soaking plate is abutted against the power supply plate, so that the soaking plate is quickly transferred and diffused to the heat dissipation structure and the cooling pipeline through heat flow gathered on the surface of the power supply plate, thereby promoting heat dissipation and reducing the heat flow density on the power supply plate. The temperature acquisition probe is arranged, so that the controller acquires temperature data on the power panel in real time, and if the temperature is not within a preset range in the controller, the controller adjusts the flow rate of the cooling working medium, changes the heat dissipation efficiency of the soaking plate and the cooling pipeline, and enables the temperature of the power panel to be within the preset range of the controller. The cooling structure has the characteristics of flexible working conditions and wide application range through the regulation and control of the controller.
Drawings
Fig. 1 is a schematic structural diagram of a power supply heat dissipation device according to an embodiment of the present invention;
fig. 2 is an exploded view of a power heat sink according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an internal structure of a power heat dissipation device according to an embodiment of the present invention;
fig. 4 is a rear view of a power supply heat sink according to an embodiment of the present invention;
fig. 5 is a schematic view of a cooling structure of a power heat sink according to an embodiment of the invention;
fig. 6 is an exploded view of a vapor chamber of a power supply heat sink according to an embodiment of the present invention;
fig. 7 is a schematic view of a sunshade structure of a power heat dissipation device according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a housing of a power heat dissipation device according to an embodiment of the present invention;
fig. 9 is a schematic diagram illustrating the operation of only the vapor chamber of the power heat sink according to an embodiment of the present invention;
fig. 10 is a schematic diagram illustrating the operation of the soaking plate and the cooling pipe of the power heat sink according to an embodiment of the present invention;
fig. 11 is a control logic diagram of a controller of a power heat dissipation device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to explain the technical means of the present invention, the following description will be given by way of specific examples.
As shown in fig. 1 and fig. 2, and referring to fig. 3 to fig. 10, a power supply heat dissipation device according to an embodiment of the present invention includes a housing 10, a power supply board 2, a controller, a cooling structure 30, and a heat dissipation structure 40, where the power supply board 2 is installed inside the housing 10, and a temperature collection probe is disposed on the power supply board 2. The controller is arranged on the power panel 2 in an integrated mode and is electrically connected with the temperature acquisition probe. The heat dissipation structure 40 is installed at one end of the housing 10 close to the power panel 2. The cooling structure 30 comprises a soaking plate 31 used for heat dissipation, a cooling pipeline 32 and a cooling working medium, the soaking plate 31 and the cooling pipeline 32 are both arranged on the heat dissipation structure 40, and the soaking plate 31 is abutted to the power panel 2. The cooling working medium is filled in the soaking plate 31 and the cooling pipeline 32. The controller controls the working states of the soaking plate 31 and the cooling pipeline 32 by changing the flow rate of the cooling working medium. Specifically, the housing 10 is made of aluminum die-casting material by die-casting, and the housing 10 and the heat dissipation structure 40 are an integral structure. The cooling working medium adopts deionized water.
In the using process, as shown in fig. 11, when the power supply works, the controller collects the temperature on the power supply board 2 in real time, if the power supply is low or the environmental temperature is low, the temperature on the power supply board 2 does not exceed the temperature range preset by the controller, the controller does not need to change the flow rate of the cooling working medium, and only the soaking plate 31 is used for radiating the heat of the power supply board 2. If the temperature on the power panel 2 exceeds the preset temperature range of the controller, the controller calculates the flow rate requirement of the cooling working medium according to the temperature, changes the flow rate of the cooling working medium in the soaking plate 31 and the cooling structure 30 and cools the emitted heat until the temperature of the power panel 2 is within the preset temperature range.
In the embodiment, the soaking plate 31 is abutted against the power board 2, so that the soaking plate 31 is rapidly transferred and diffused to the heat dissipation structure 40 and the cooling pipeline 32 through the heat flow gathered on the surface of the power board 2, thereby promoting heat dissipation, reducing the heat flow density on the power board 2, and solving the problem of heat concentration in a local area. The temperature data on the power panel 2 can be acquired by the controller in real time by arranging the temperature acquisition probe, if the temperature is not within the preset range in the controller, the flow rate of the cooling working medium can be adjusted by the controller, the heat dissipation efficiency of the soaking plate 31 and the cooling pipeline 32 can be changed, and the temperature of the power panel 2 is within the preset range of the controller. The cooling structure 30 has the characteristics of flexible working conditions and wide application range through the regulation and control of the controller.
As shown in fig. 1 to 4, in some embodiments of the present invention, the heat dissipation structure 40 includes a heat dissipation plate 41 and heat dissipation teeth 42 mounted on the heat dissipation plate 41, the heat dissipation plate 41 is mounted on the housing 10, the soaking plate 31 is disposed on a side of the heat dissipation plate 41 close to the power board 2, and heat balance on the heat dissipation plate 41 is achieved by disposing the soaking plate 31. The heat dissipation teeth 42 are disposed on a surface of the heat dissipation plate 41 facing away from the soaking plate 31. The cooling pipeline 32 is embedded in the heat dissipation teeth 42 and is disposed at one end of the heat dissipation teeth 42 far away from the heat dissipation plate 41. Specifically, the cooling pipe 32 is embedded in the heat dissipation teeth 42 by brazing at the end away from the heat dissipation plate 41, effectively utilizing the heat dissipation area of the heat dissipation teeth 42.
As shown in fig. 5 and 6, in some embodiments of the present invention, the vapor chamber 31 includes an upper casing plate 311, a lower casing plate 312, an evaporation end liquid absorbing core 313, two liquid charging pipes 314, and a condensation end liquid absorbing core 315, the lower casing plate 312 abuts against the power supply board 2, the upper casing plate 311 is connected to the lower casing plate 312, specifically, edges of the upper casing plate 311 and the lower casing plate 312 are connected by diffusion welding, and a cooling cavity is formed between the upper casing plate 311 and the lower casing plate 312 to provide a flow channel for vapor and reduce saturated vapor pressure of a cooling medium, so that the cooling medium can boil at a temperature far lower than a boiling point under atmospheric pressure, thereby achieving an effect of enhancing heat transfer. The cooling cavity is connected to two ends of the cooling pipeline 32 through two liquid charging pipes 314. Specifically, the liquid charging pipe 314 is connected with the upper shell plate 311 and the lower shell plate 312 through gas flame brazing, the evaporation end liquid absorbing core 313 and the condensation end liquid absorbing core 315 are both arranged in the cooling cavity, the condensation end liquid absorbing core 315 is installed on the upper shell plate 311, and the evaporation end liquid absorbing core 313 is installed on the lower shell plate 312. Liquid working medium is arranged in the evaporation end liquid absorption core 313, and condensed working medium, a condensation end and an evaporation end are arranged in the condensation end liquid absorption core 315.
In the present embodiment, as shown in fig. 9 and 10, when the vapor chamber 31 is operated, the heat of the power supply board 2 is conducted to the inside of the vapor chamber 31 through the lower case plate 312 and the evaporation end liquid absorption core 313, so that the liquid working medium inside the evaporation end liquid absorption core 313 is evaporated or boiled. A portion of the vapor condenses on the condensation side of condensation-side wick 315 and another portion condenses in cooling circuit 32. Part of heat is conducted to the outer surface of the upper shell plate 311 through the condensation end liquid suction core 315 and the upper shell plate 311, and then is dissipated to a cooling working medium through convection heat transfer, and the condensation working medium in the condensation end liquid suction core 315 returns to the evaporation end through the combined action of gravity and capillary pressure in the condensation end liquid suction core 315 to participate in gas-liquid circulation again. The other part is condensed by the cooling pipeline 32 and then taken back to the evaporation end of the condensation end liquid suction core 315 as a cooling working medium to participate in the gas-liquid circulation again. The heat dissipation of the soaking plate 31 to the power panel 2 is realized through the evaporation and condensation of the liquid working medium, and the heat dissipation effect is good. Meanwhile, the cooling pipeline 32 condenses the evaporated liquid working medium to realize gas-liquid circulation of the liquid, so that uninterrupted cooling is facilitated, and the cooling effect is good.
As shown in fig. 5 and 6, in some embodiments of the present invention, the soaking plate 31 further includes a support column 316 and a liquid pump 317 for adjusting the flow rate of the cooling medium, and the support column 316 is disposed between the upper shell plate 311 and the lower shell plate 312. The liquid pump 317 is mounted to one of the fill tubes 314 and is in communication with the controller. By providing support posts 316. Tensile stress is provided during diffusion welding of the upper shell plate 311 and the lower shell plate 312 of the soaking plate 31, and the upper shell plate 311 and the lower shell plate 312 are prevented from being deformed by heat. The support posts 316 may also provide compressive stress during the evacuation process, preventing the upper shell plate 311 and lower shell plate 312 from collapsing. The support posts 316 also provide support during operation of the vapor chamber 31 to prevent thermal distortion due to excessive operating temperatures. By providing the liquid pump 317, when the controller detects a temperature exceeding a set range, the controller transmits a signal to the liquid pump 317 to adjust the rotational speed of the liquid pump 317 to control the flow rate of the cooling medium.
In some embodiments of the present invention, the cooling circuit 32 is provided with the condensation-side wick 315 to increase the cooling effect.
As shown in fig. 1 and 2, referring to fig. 7, in some embodiments of the present invention, the power supply heat sink further includes a sunshade structure, the sunshade structure includes an automatic roller shutter 51 and a monitoring probe 52 for detecting solar radiation, the monitoring probe 52 is mounted on the housing 10 and is in communication with the controller, and the automatic roller shutter 51 is disposed outside the heat sink 42. The monitoring probe 52 detects whether the solar radiation exceeds the preset value of 100w/m in real time2If the value exceeds the preset value, the monitoring probe 52 sends a signal to the controller, and the automatic roller shutter 51 is unfolded to prevent the direct solar radiation heat dissipation teeth 42 from isolating an external heat source. When the temperature is lower than the preset value, the coil stock is automatically retracted, so that the heat dissipation teeth 42 and air generate convection heat dissipation.
As shown in fig. 1 and 2, referring to fig. 7, in some embodiments of the present invention, the sunshade structure further includes a guide plate 53, the guide plate 53 is mounted on both sides of the housing 10, and the automatic roll screen 51 is mounted on the guide plate 53. The guide plate 53 is provided with a guide groove 531, and one end of the automatic rolling shutter 51 extends into the guide groove 531 and can move along the extending direction of the guide groove 531.
As shown in fig. 2 and 8, in some embodiments of the present invention, an upper cover 11 is disposed on the housing 10, and a sealing strip 12 is disposed between the upper cover 11 and the housing 10. After the upper cover 11 is installed in the housing 10, a closed structure is formed in the housing 10, and the sealing strip 12 plays a role in installation, protection and sealing. Specifically, the housing 10 is provided with a power inlet and outlet connector 13.
In some embodiments of the present invention, the power board 2 includes a heat generating device, and the heat generating device is provided with a heat conducting material, which is abutted against the soaking plate 31. Specifically, the heating device comprises a chip, a transformer and a MOS tube.
On the other hand, an embodiment of the invention further provides a power supply, which comprises the power supply heat dissipation device.
The above examples are only for illustrating the technical solutions of the present invention, and are not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: modifications of the technical solutions described in the embodiments or equivalent replacements of some technical features may still be made. Such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A power supply heat dissipation device is characterized by comprising a shell, a power supply board, a controller, a cooling structure and a heat dissipation structure, wherein the power supply board is arranged in the shell, and a temperature acquisition probe is arranged on the power supply board; the controller is integrally arranged on the power panel and is electrically connected with the temperature acquisition probe; the heat dissipation structure is arranged at one end of the shell close to the power panel; the cooling structure comprises a soaking plate for heat dissipation, a cooling pipeline and a cooling working medium, wherein the soaking plate and the cooling pipeline are both arranged on the heat dissipation structure, and the soaking plate is abutted against the power panel; the cooling working medium is filled in the soaking plate and the cooling pipeline; and the controller controls the working states of the soaking plate and the cooling pipeline by changing the flow rate of the cooling working medium.
2. The power supply heat dissipation device according to claim 1, wherein the heat dissipation structure comprises a heat dissipation plate and heat dissipation teeth mounted on the heat dissipation plate, the heat dissipation plate is mounted on the housing, and the soaking plate is disposed on one side of the heat dissipation plate close to the power supply board; the heat dissipation teeth are arranged on one surface of the heat dissipation plate, which is far away from the soaking plate; the cooling pipeline is embedded into the heat dissipation teeth and arranged at one end, far away from the heat dissipation plate, of the heat dissipation teeth.
3. The power supply heat dissipation device according to claim 2, wherein the vapor chamber comprises an upper casing plate, a lower casing plate, an evaporation end liquid absorbing core, two liquid filling pipes and a condensation end liquid absorbing core, the lower casing plate abuts against the power supply plate, the upper casing plate is connected with the lower casing plate, a cooling cavity is formed between the upper casing plate and the lower casing plate, and the cooling cavity is respectively connected with two ends of the cooling pipeline through the two liquid filling pipes; the evaporation end wick and the condensation end wick are both arranged in the cooling cavity, the condensation end wick is arranged on the upper shell plate, and the evaporation end wick is arranged on the lower shell plate.
4. The power heat sink according to claim 3, wherein the soaking plate further comprises a support column and a liquid pump for adjusting the flow rate of the cooling medium, the support column being disposed between the upper shell plate and the lower shell plate; the liquid pump is mounted on one of the liquid charging pipes and is in communication connection with the controller.
5. The electrical heat sink of claim 3, wherein the cooling circuit has the condenser-side wick disposed therein.
6. The power supply heat sink device of claim 2, further comprising a sun shade structure, wherein the sun shade structure comprises an automatic roller shutter and a monitoring probe for detecting solar radiation, the monitoring probe is mounted on the housing and is in communication with the controller, and the automatic roller shutter is disposed outside the heat dissipation teeth.
7. The power supply heat sink according to claim 6, wherein the sunshade structure further comprises a guide plate, the guide plate is mounted on both sides of the housing, and the automatic roller shutter is mounted on the guide plate; be provided with the guide way on the deflector, automatic roll up curtain one end and extend into the guide way just can follow the extending direction of guide way removes.
8. The power supply heat sink device according to claim 1, wherein the housing is provided with an upper cover, and a sealing strip is provided between the upper cover and the housing.
9. The power supply heat sink according to claim 1, wherein the power supply board comprises a heat generating device, and a heat conductive material is disposed on the heat generating device and is abutted against the soaking plate.
10. A power supply comprising the power supply heat sink of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110465022.5A CN113207264A (en) | 2021-04-28 | 2021-04-28 | Power supply heat dissipation device and power supply |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110465022.5A CN113207264A (en) | 2021-04-28 | 2021-04-28 | Power supply heat dissipation device and power supply |
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| CN113207264A true CN113207264A (en) | 2021-08-03 |
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| CN202110465022.5A Pending CN113207264A (en) | 2021-04-28 | 2021-04-28 | Power supply heat dissipation device and power supply |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023279759A1 (en) * | 2021-07-09 | 2023-01-12 | 中兴通讯股份有限公司 | Heat dissipation device and communication device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023279759A1 (en) * | 2021-07-09 | 2023-01-12 | 中兴通讯股份有限公司 | Heat dissipation device and communication device |
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Application publication date: 20210803 |