CN211149387U - Vacuum cavity soaking type heat conduction device for ruggedized computer - Google Patents
Vacuum cavity soaking type heat conduction device for ruggedized computer Download PDFInfo
- Publication number
- CN211149387U CN211149387U CN201922380641.5U CN201922380641U CN211149387U CN 211149387 U CN211149387 U CN 211149387U CN 201922380641 U CN201922380641 U CN 201922380641U CN 211149387 U CN211149387 U CN 211149387U
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- Prior art keywords
- heat conduction
- heat
- plate
- computer
- vacuum cavity
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- 238000002791 soaking Methods 0.000 title claims description 19
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000005219 brazing Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 8
- 230000003014 reinforcing effect Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 6
- 238000009833 condensation Methods 0.000 abstract description 4
- 230000005494 condensation Effects 0.000 abstract description 4
- 238000001704 evaporation Methods 0.000 abstract description 4
- 230000008020 evaporation Effects 0.000 abstract description 4
- 230000002787 reinforcement Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of heat conduction of a heat conduction reinforcement computer with a heat equalizing type in a computer vacuum cavity, and discloses a heat conduction device with a heat equalizing type in a computer vacuum cavity, which comprises a heat conduction plate substrate, wherein a circuit board is arranged at the bottom of the heat conduction plate substrate through a fastener, and the heat conduction plate substrate further comprises a sealing cover plate, a containing cavity is arranged in the heat conduction plate substrate, the sealing cover plate is used for sealing the containing cavity, and the sealing cover plate and the heat conduction plate substrate are fixed through vacuum brazing; this heat-transfer device is used for conducting the produced heat of the inside electron original paper of ruggedized computer to the ruggedized computer outside, and evaporation and condensation process hold the intracavity circulation to high efficiency heat dissipation has been realized.
Description
Technical Field
The utility model relates to a computer heat transfer device technical field, concretely relates to consolidate computer vacuum cavity soaking formula heat transfer device.
Background
The reinforced computer is a computer which takes corresponding guarantee measures for various factors influencing the performance of the computer, such as system structure, electrical characteristics, mechanical and physical structures and the like, in order to adapt to various severe environments when the computer is designed, and is also called as a computer resisting the severe environments. The method has strong environmental adaptability, high reliability and high maintainability.
The existing reinforced computer heat conduction plate adopts a heat conduction mode to cool an electronic element, is made of technical materials such as copper and aluminum, has the defects of low heat efficiency, uneven heat conduction and large equipment weight caused by large density of metal materials and is inconvenient to carry.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a consolidate computer vacuum cavity soaking formula heat abstractor, this heat abstractor are used for conducting the produced heat of the inside electron original paper of reinforcement computer to the reinforcement computer outside, and evaporation and condensation process are holding the intracavity circulation to high efficiency heat dissipation has been realized.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a consolidate computer vacuum cavity soaking formula heat-transfer device, includes the heat conduction board base plate, the circuit board is installed through the fastener to heat conduction board base plate bottom, still includes a sealed apron, be equipped with one in the heat conduction board base plate and hold the chamber, sealed apron is used for sealing hold the chamber, just sealed apron with heat conduction board base plate vacuum brazing is fixed.
The utility model discloses in, preferred, it is the vacuum cavity to hold the chamber, and the injection has heat conduction liquid in it.
The utility model discloses in, it is preferred, it still is equipped with a capillary board to hold the intracavity, be equipped with a plurality of capillary through-holes on the capillary board.
The utility model discloses in, it is preferred, heat-transfer device installs in quick-witted incasement, quick-witted case is fixed in the ruggedized computer.
The utility model discloses in, it is preferred, the machine case include chassis base and install in chassis base is last heating panel, be equipped with a plurality of heat radiation fins on the heating panel.
In the present invention, preferably, the sealing cover plate is closely attached to the heat dissipation plate through a locking device.
The utility model discloses in, preferred, locking device is including locating fixing base on the heat-conducting plate base plate, be fixed in fixed knot and fixing bolt on the heating panel, fixing bolt runs through the fixing base reaches fixed knot.
The utility model discloses in, preferred, the fixing base is isosceles trapezoid, the fixing base both sides all be equipped with one with the fixed knot that the fixing base shape matches, fixing bolt with fixed knot threaded connection.
In the present invention, preferably, the heat conducting plate substrate is further provided with a pulling aid.
The utility model discloses in, preferably, be equipped with a recess on the heat-conducting plate base plate, help and pull out the ware and rotate through the round pin axle and be fixed in on the heat-conducting plate base plate, and can locate in the recess.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a consolidate computer vacuum cavity soaking formula heat conduction device is used for conducting the produced heat of the inside electron original paper of ruggedized computer to the ruggedized computer outside, and evaporation and condensation process are holding the intracavity circulation to high efficiency heat dissipation has been realized.
Meanwhile, the sealing cover plate and the capillary plate with lower density are adopted, and compared with a heat conducting plate made of technical materials such as copper and aluminum, the weight of the device is favorably reduced.
Drawings
Fig. 1 is a schematic structural diagram of a soaking heat-conducting device in a vacuum chamber of a ruggedized computer in this embodiment.
Fig. 2 is a schematic structural diagram of a soaking heat-conducting device in a vacuum chamber of a ruggedized computer in this embodiment.
Fig. 3 is a schematic view of a disassembled structure of a soaking heat-conducting device in a vacuum chamber of a ruggedized computer with a chassis according to the embodiment.
Fig. 4 is a schematic structural diagram of a heat conduction plate substrate in a soaking heat conduction device in a vacuum chamber of a ruggedized computer in the embodiment.
Fig. 5 is a schematic structural diagram of a circuit board in a heat spreader in a vacuum chamber of a ruggedized computer in accordance with the present embodiment.
In the drawings: 10-a heat conducting plate substrate, 101-an accommodating cavity, 102-a groove, 20-a circuit board, 30-a sealing cover plate, 40-a capillary plate, 50-a case, 51-a case base, 52-a heat dissipation plate, 53-a heat dissipation fin, 60-a locking device, 61-a fixed seat, 62-a fixed buckle, 63-a fixed bolt and 70-a pulling aid.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 5, a preferred embodiment of the present invention provides a heat spreader for heat dissipation in a vacuum chamber of a ruggedized computer, which is used to transfer heat generated by an original inside the ruggedized computer to the outside of the ruggedized computer.
Specifically, heat-conducting device includes heat-conducting plate base plate 10, circuit board 20 is installed through the fastener in heat-conducting plate base plate 10 bottom, and in this embodiment, the fastener is screw and nut, and circuit board 20 is fixed on heat-conducting plate base plate 10 through the cooperation of screw and nut, and the fixed mode is simple and firm.
Still include a sealed apron 30, be equipped with one in the heat conduction plate base plate 10 and hold chamber 101, sealed apron 30 is used for sealing hold chamber 101, just sealed apron 30 with heat conduction plate base plate 10 vacuum brazing is fixed. Further, the accommodating cavity 101 is a vacuum cavity, and heat conducting liquid is injected into the accommodating cavity, the heat conducting liquid adopts heat conducting oil with good heat conductivity, and specifically which heat conducting liquid is selected according to the requirement of an actual heat conducting device.
In this embodiment, a capillary plate 40 is further disposed in the accommodating cavity 101, a plurality of capillary through holes are disposed on the capillary plate 40, and the capillary plate 40 is disposed to increase a contact area and a contact time between the heat conducting liquid and the capillary plate 40.
In the present embodiment, the heat conduction device is installed in the casing 50, and the casing 50 is fixed in the ruggedized computer. Further, the chassis 50 includes a chassis base 51 and a heat dissipation plate 52 installed on the chassis base 51, the heat dissipation plate 52 is provided with a plurality of heat dissipation fins 53, and the heat dissipation fins 53 are used for increasing a heat dissipation area and improving a heat dissipation efficiency.
In the present embodiment, the sealing cover 30 is closely attached to the heat dissipating plate 52 by a locking device 60.
In the present embodiment, the locking device 60 includes a fixing base 61 provided on the heat conduction plate substrate 10, a fixing buckle 62 fixed on the heat dissipation plate 52, and a fixing bolt 63, and the fixing bolt 63 penetrates through the fixing base 61 and the fixing buckle 62. Specifically, in this embodiment, the fixing base 61 is an isosceles trapezoid, two sides of the fixing base 61 are respectively provided with a fixing buckle 62 matched with the fixing base 61 in shape, and the fixing bolt 63 is in threaded connection with one of the fixing buckles 62, and penetrates through the fixing base 61 and then is in threaded connection with the other fixing buckle 62, so that the heat conduction plate substrate 10 and the heat dissipation plate 52 can be fixed, the sealing cover plate 3 is tightly attached to the heat dissipation plate 52, and heat transmission to the heat dissipation plate 52 is facilitated.
In the present embodiment, the heat-conducting plate substrate 10 is further provided with an extraction aid 70.
Specifically, a groove 102 is formed in the heat conducting plate substrate 10, and the pulling aid 70 is rotationally fixed on the heat conducting plate substrate 10 through a pin shaft and can be arranged in the groove 102; when the whole heat conducting device needs to be taken out of the chassis 50, the pulling aid 70 can be manually pulled and the heat conducting device can be taken out of the chassis 50 only by rotating the pulling aid 70 around the groove 102 to rotate out of the groove 102.
The working principle is as follows:
in the working process of the reinforced computer, heat generated by the work of the circuit board 20 at the bottom of the heat conducting plate substrate 10 or a chip on the circuit board 20 is transmitted into the accommodating cavity 101 from the heat conducting plate substrate 10, heat conducting liquid in the accommodating cavity 101 is heated and evaporated, is diffused along the capillary plate 40, conducts the heat to the heat dissipation plate 52 and dissipates the heat from the heat dissipation fins 53; then the steam is condensed into liquid after heat dissipation, and returns to the bottom of the heat conducting plate substrate 10 through the capillary plate 40; the evaporation and condensation process circulates in the accommodating chamber 101, thereby achieving high efficiency heat dissipation.
Compared with a heat conducting plate made of technical materials such as copper and aluminum, the sealing cover plate 30 and the capillary plate 40 adopted by the heat conducting device are lower in density, and the weight of equipment is favorably reduced. Meanwhile, the radiating effect is good, and the radiating efficiency is improved.
The above description is for the detailed description of the preferred possible embodiments of the present invention, but the embodiments are not intended to limit the scope of the present invention, and all equivalent changes or modifications accomplished under the technical spirit suggested by the present invention should fall within the scope of the present invention.
Claims (10)
1. A soaking type heat conduction device for reinforcing a computer vacuum cavity comprises a heat conduction plate substrate (10), wherein a circuit board (20) is installed at the bottom of the heat conduction plate substrate (10) through a fastener, and is characterized in that,
still include one sealed apron (30), be equipped with one in heat conduction board base plate (10) and hold chamber (101), sealed apron (30) are used for sealing hold chamber (101), just sealed apron (30) with heat conduction board base plate (10) vacuum brazing is fixed.
2. The soaking heat conduction device in the vacuum cavity of the ruggedized computer of claim 1, wherein the receiving cavity (101) is a vacuum cavity and a heat conduction liquid is injected therein.
3. The soaking heat conducting device in the vacuum cavity for reinforcing the computer in claim 1, wherein a capillary plate (40) is further arranged in the accommodating cavity (101), and a plurality of capillary through holes are arranged on the capillary plate (40).
4. The soaking heat conducting device in the vacuum chamber of the ruggedized computer of any one of claims 1-3, wherein the heat conducting device is mounted in a chassis (50), and the chassis (50) is fixed in the ruggedized computer.
5. The soaking type heat conducting device in the vacuum cavity of the ruggedized computer of claim 4, wherein the chassis (50) comprises a chassis base (51) and a heat dissipating plate (52) mounted on the chassis base (51), and a plurality of heat dissipating fins (53) are arranged on the heat dissipating plate (52).
6. A heat spreader for heat spreader in vacuum chamber of ruggedized computer as claimed in claim 5, wherein said hermetic cover plate (30) is tightly attached to said heat spreader plate (52) by a locking means (60).
7. The soaking type heat conduction device in the vacuum chamber of the ruggedized computer of claim 6, wherein the locking device (60) comprises a fixing seat (61) arranged on the heat conduction plate substrate (10), a fixing buckle (62) fixed on the heat dissipation plate (52) and a fixing bolt (63), and the fixing bolt (63) penetrates through the fixing seat (61) and the fixing buckle (62).
8. The soaking type heat conducting device in the vacuum cavity of the ruggedized computer of claim 7, wherein the fixing seat (61) is in the shape of an isosceles trapezoid, a fixing buckle (62) matched with the fixing seat (61) in shape is arranged on each of two sides of the fixing seat (61), and the fixing bolt (63) is in threaded connection with the fixing buckle (62).
9. The soaking type heat conduction device in the vacuum cavity for reinforcing the computer in claim 1 is characterized in that the heat conduction plate substrate (10) is further provided with a pulling aid (70).
10. The soaking type heat conduction device in the vacuum cavity of the ruggedized computer of claim 9, wherein a groove (102) is formed in the heat conduction plate substrate (10), and the pulling aid (70) is rotatably fixed on the heat conduction plate substrate (10) through a pin shaft and can be arranged in the groove (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922380641.5U CN211149387U (en) | 2019-12-26 | 2019-12-26 | Vacuum cavity soaking type heat conduction device for ruggedized computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922380641.5U CN211149387U (en) | 2019-12-26 | 2019-12-26 | Vacuum cavity soaking type heat conduction device for ruggedized computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211149387U true CN211149387U (en) | 2020-07-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922380641.5U Expired - Fee Related CN211149387U (en) | 2019-12-26 | 2019-12-26 | Vacuum cavity soaking type heat conduction device for ruggedized computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211149387U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113207264A (en) * | 2021-04-28 | 2021-08-03 | 深圳市科信通信技术股份有限公司 | Power supply heat dissipation device and power supply |
-
2019
- 2019-12-26 CN CN201922380641.5U patent/CN211149387U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113207264A (en) * | 2021-04-28 | 2021-08-03 | 深圳市科信通信技术股份有限公司 | Power supply heat dissipation device and power supply |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200731 |
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| CF01 | Termination of patent right due to non-payment of annual fee |