CN109413956A - Electronic load radiator - Google Patents
Electronic load radiator Download PDFInfo
- Publication number
- CN109413956A CN109413956A CN201811442679.4A CN201811442679A CN109413956A CN 109413956 A CN109413956 A CN 109413956A CN 201811442679 A CN201811442679 A CN 201811442679A CN 109413956 A CN109413956 A CN 109413956A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- radiating substrate
- gear piece
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000005494 condensation Effects 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
Electronic load radiator designed by the present invention, it includes fastening gear piece block, it is mounted on the first heat-radiating substrate and the second heat-radiating substrate for fastening gear piece block upper and lower ends, metal-oxide-semiconductor installation position is equipped on first heat-radiating substrate and the second heat-radiating substrate, it further includes that upper end strip flattens heat pipe and lower end strip flattening heat pipe, first heat-radiating substrate bottom surface opens up upper end heat pipe fitting groove along its length, second heat-radiating substrate top surface opens up lower end heat pipe fitting groove along its length, upper end strip flattens heat pipe and is located in the heat pipe fitting groove of upper end, lower end strip flattens heat pipe and is located in the heat pipe fitting groove of lower end, the top and bottom that upper end strip flattens heat pipe are bonded the first heat-radiating substrate respectively and fasten gear piece block, the top and bottom that lower end strip flattens heat pipe are bonded respectively fastens gear piece block and the second heat-radiating substrate.Good heat dissipation effect of the present invention, heat dissipating mass is small, heatsink mass is light, radiator is at low cost, and metal-oxide-semiconductor reliable long-term working is high, and power power density is high.
Description
Technical field
The present invention relates to electronic circuit technology fields, in particular to a kind of electronic load radiator.
Technical background
High-power electronic load main power consumption device is MOS (Metal Oxide Semiconductor, metal oxide
Semiconductor) pipe and its is large number of, calorific value is huge when work, if heat cannot be distributed in time, metal-oxide-semiconductor
Temperature can gradually rise, once temperature is more than the junction temperature of metal-oxide-semiconductor, metal-oxide-semiconductor will be burnt, so as to cause entire electronic load
It can not work normally.
The Chinese patent of Publication No. CN106558562A discloses a kind of high-power electronic load metal-oxide-semiconductor radiator,
High-power MOS tube is set on circuit board by the device, and circuit board is placed on radiator, and metal-oxide-semiconductor is contacted with heat-radiating substrate surface,
When the circuit is operating, the heat that metal-oxide-semiconductor distributes is distributed rapidly by radiator by fan, if biggish in circuit power
When, the quantity of metal-oxide-semiconductor can be more, and the power loss of single metal-oxide-semiconductor can be bigger, according to this metal-oxide-semiconductor radiator structure, only
The length that can increase radiator and circuit board to radiate to metal-oxide-semiconductor, does so the weight of the depth and radiator that will increase cabinet,
The effective rate of utilization of this radiator structure radiator is low simultaneously, and heat dissipation effect is bad, and power power density is lower.
Summary of the invention
Present invention aim to provide a kind of good heat dissipation effect, heat dissipating mass is small, heatsink mass is light, radiator at
This is low, and metal-oxide-semiconductor reliable long-term working is high, the high electronic load radiator of power power density.
In order to achieve this, electronic load radiator designed by the present invention, it includes fastening gear piece block, is mounted on fastening
The first heat-radiating substrate and the second heat-radiating substrate of gear piece block upper and lower ends are equipped on the first heat-radiating substrate and the second heat-radiating substrate
Metal-oxide-semiconductor installation position, it is characterised in that: it further includes that upper end strip flattens heat pipe and lower end strip flattening heat pipe, the first heat dissipation base
Board bottom face opens up upper end heat pipe fitting groove along its length, and the second heat-radiating substrate top surface opens up the assembly of lower end heat pipe along its length
Slot, upper end strip flatten heat pipe and are located in the heat pipe fitting groove of upper end, and lower end strip flattens heat pipe and is located in the heat pipe fitting groove of lower end,
The top and bottom that upper end strip flattens heat pipe are bonded the first heat-radiating substrate respectively and fasten gear piece block, and lower end strip flattens heat pipe
Top and bottom be bonded fasten gear piece block and the second heat-radiating substrate respectively.
Described to fasten the multi-disc fastening gear piece that gear piece block includes superposition, each thickness for fastening gear piece is equal, and adjacent two
The spacing that piece fastens gear piece is equal.
Each thickness for fastening gear piece is equal and thickness range is 0.3~0.6mm.
The spacing of adjacent two panels fastening gear piece is equal and spacing range is 2~4mm.
The quantity for fastening the fastening gear piece for including in gear piece block is 14~22.
A kind of high-power electronic load radiator structure based on above-mentioned radiator, four electronic load radiators are side by side
It is fixed between the first fan fixed plate and the second fan fixed plate and forms load heat dissipation group, pacify side by side in the first fan fixed plate
Equipped with the first fan corresponding with four electronic load radiators, the second fan fixed plate has been mounted side by side and four electronic loads
Radiator corresponds to the second fan, which is set to the cabinet that volume is 2U (unit indicates server external dimensions)
It is interior.
The advantages of present invention by above-mentioned design, has radiator small in size, good heat dissipation effect, in same 4U volume machine
More heat spreader modules and metal-oxide-semiconductor can be placed using the present invention in case, can be dissipated more under same volume using the present invention
More heat, so that the long-term functional reliability of metal-oxide-semiconductor in cabinet is significantly improved, in addition, comparing the side of background technique
The case present invention can install more heat spreader modules and metal-oxide-semiconductor in same 4U volume cabinet, and can dissipate more heat
Measurer has higher power density.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is configuration schematic diagram of the invention；
Fig. 3 is the mounting structure schematic diagram that strip flattens heat pipe in the present invention；
Fig. 4 is that the structural schematic diagram in 2U cabinet is arranged in load heat dissipation group in the present invention；
Fig. 5 is that the structural schematic diagram in 4U cabinet is arranged in load heat dissipation group in the present invention；
Wherein, the 1-the first heat-radiating substrate, the 1.1-the second heat-radiating substrate, 2-upper end strips flatten heat pipe, 2.1-lower ends
Strip flattens heat pipe, 2.2-condensation ends, 2.3-evaporation ends, 3-fastening gear piece blocks, 3.1-fastening gear pieces, 4-load heat dissipations
Group, 5-metal-oxide-semiconductors, 6-metal-oxide-semiconductor press strips, 7-circuit boards, the 8-the first fan, the 8.1-the second fan, 9-insulating heat-conductive pads,
10-the first fan fixed plate, the 11-the second fan fixed plate, 12-metal-oxide-semiconductor installation positions, 13-metal-oxide-semiconductor pin welding holes,
14-upper end heat pipe fitting grooves, 15-lower end heat pipe fitting grooves.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
A kind of electronic load radiator of the present invention, as shown in Figures 1 to 3, it includes fastening gear piece block 3, is mounted on
Fasten the first heat-radiating substrate 1 and the second heat-radiating substrate 1.1 of 3 upper and lower ends of gear piece block, the first heat-radiating substrate 1 and the second heat dissipation base
Metal-oxide-semiconductor installation position 12 (for installing the tube body of metal-oxide-semiconductor 5) is equipped on plate 1.1, it further includes that upper end strip flattens 2 He of heat pipe
Lower end strip flattens heat pipe 2.1, and 1 bottom surface of the first heat-radiating substrate opens up upper end heat pipe fitting groove along 3 length direction of gear piece block is fastened
14 (welding grooves), 1.1 top surface of the second heat-radiating substrate open up lower end heat pipe fitting groove 15, upper end along 3 length direction of gear piece block is fastened
Strip flattens heat pipe 2 and is located in upper end heat pipe fitting groove 14, and lower end strip flattens heat pipe 2.1 and is located at lower end heat pipe fitting groove 15
In, the top and bottom that upper end strip flattens heat pipe 2 are bonded the first heat-radiating substrate 1 respectively and fasten gear piece block 3, lower end strip pressure
The top and bottom of flat heat pipe 2.1 are bonded respectively fastens gear piece block 3 and the second heat-radiating substrate 1.1.Above-mentioned upper end strip flattens heat
The design that pipe 2 and lower end strip flatten heat pipe 2.1 advantageously reduces the volume of electronic load radiator.Heat transfer is utilized in heat pipe
The heat of thermal objects can be transmitted to outside heat source rapidly by the quick thermal transport property of principle and refrigeration filling.
In above-mentioned technical proposal, upper end strip flattens heat pipe 2 and lower end strip flattening heat pipe 2.1 can be cracking by metal-oxide-semiconductor 5
Heat carry out balanced, and cooperate and fasten gear piece block 3 quickly and reduce the bulk temperature of metal-oxide-semiconductor 5 on heat-radiating substrate.
It is described to fasten the multi-disc fastening gear piece 3.1 that gear piece block 3 includes superposition, each fastening gear piece in above-mentioned technical proposal
3.1 thickness is equal, and the spacing that adjacent two panels fastens gear piece 3.1 is equal.Above-mentioned fastening gear piece block 3 is to fasten gear piece by multi-disc
3.1 are fastened by respective button point or so superposition.
In above-mentioned technical proposal, each thickness for fastening gear piece 3.1 is equal and thickness range is 0.3~0.6mm.
The spacing of adjacent two panels fastening gear piece 3.1 is equal and spacing range is 2~4mm.It is described to fasten the fastening tooth for including in gear piece block 3
The quantity of piece 3.1 is 14~22.The design of above-mentioned parameter can reduction under the premise of guaranteeing heat dissipation effect as far as possible it is individually electric
The volume of son load radiator.
In above-mentioned technical proposal, the upper end strip flattens heat pipe 2 and lower end strip flattens the condensation end 2.2 of heat pipe 2.1
It is respectively positioned on the front end for fastening gear piece block 3, upper end strip flattens heat pipe 2 and lower end strip flattens the equal position of evaporation ends 2.3 of heat pipe 2.1
In the rear end for fastening gear piece block 3；The left and right sides of first heat-radiating substrate, 1 bottom surface opens up the assembly of upper end heat pipe along its length
Slot 14 is respectively provided with upper end strip in each upper end heat pipe fitting groove 14 and flattens heat pipe 2, the left and right of 1.1 top surface of the second heat-radiating substrate
Two sides open up lower end heat pipe fitting groove 15 along its length, and lower end strip is respectively provided in each lower end heat pipe fitting groove 15 and flattens heat
Pipe 2.1.
In above-mentioned technical proposal, it further includes circuit board 7 and insulating heat-conductive pad 9, fastens and is respectively mounted at left and right sides of gear piece block 3
Circuit board 7, circuit board 7 are equipped with metal-oxide-semiconductor pin welding hole 13 (for realizing respective devices in the pin and circuit board 7 of metal-oxide-semiconductor 5
Electrical connection), insulating heat-conductive is set between each metal-oxide-semiconductor installation position 12 and corresponding metal-oxide-semiconductor 5 of first heat-radiating substrate 1
Insulating heat-conductive pad 9 is arranged in pad 9 between each metal-oxide-semiconductor installation position 12 and corresponding metal-oxide-semiconductor 5 of second heat-radiating substrate 1.1, adjacent
Two metal-oxide-semiconductors 5 the correspondence metal-oxide-semiconductor installation of the first heat-radiating substrate 1 or the second heat-radiating substrate 1.1 is fixed on by metal-oxide-semiconductor press strip 6
On position 12, in the pin access corresponding metal-oxide-semiconductor pin welding hole 13 of circuit board 7 of each metal-oxide-semiconductor 5.Insulating heat-conductive pad 9 can be into one
Step accelerates the radiating rate of metal-oxide-semiconductor 5, improves radiating efficiency of the invention.Metal-oxide-semiconductor 5 is adjacent two-by-two, solid by metal-oxide-semiconductor press strip 6
Fixed, there is no need to open up via hole, to install metal-oxide-semiconductor 5, (5 bottom of Mos pipe is charged metal to such insulating heat-conductive pad 9, if insulation
Installation via hole is opened up on heat conductive pad 9, then the distance of Mos pipe 5 charges metal to radiator is nearest, and the operating voltage of metal-oxide-semiconductor 5 is very
It is easy to pass on radiator by via hole) so that the present invention adapts to higher 5 operating voltage of Mos pipe, and improve safety
Property.
A kind of high-power electronic load radiator structure based on above-mentioned radiator, four electronic load radiators are side by side
It is fixed between the first fan fixed plate 10 and the second fan fixed plate 11 and forms load heat dissipation group 4, the first fan fixed plate 10
On the first fan 8 corresponding with four electronic load radiator rear ends has been mounted side by side, the second fan fixed plate 11 is mounted side by side
There is the second fan 8.1 corresponding with four electronic load radiator front ends, which is set to the cabinet that volume is 2U
It is interior, as shown in Figure 4.The heat dissipation wind channel that first fan 8, the second fan 8.1 are formed around load heat dissipation group 4 is more conducive to
5 heat of metal-oxide-semiconductor sheds.
In above-mentioned technical proposal, the front end of each circuit board 7 is fixedly connected with first in four electronic load radiators
Fan fixed plate 10, the rear end of each circuit board 7 are fixedly connected with the second fan fixed plate 11.
In above-mentioned technical proposal, described in two groups load heat dissipation group 4 be superposed in volume be 4U cabinet in, such as Fig. 5 institute
Show.Same 4U volume lower case placed more heat spreader modules, and same 4U volume lower case placed more MOS
Pipe 5, can dissipate more heats, and under same power condition, the heat on single metal-oxide-semiconductor 5 is smaller, and temperature is lower, causes
The long-term functional reliability of metal-oxide-semiconductor 5 is higher.
The scheme introduced in background technique be that 3 big heat spreader modules, Mei Ge great can be set in a 4U cabinet
Heat spreader module on 40 metal-oxide-semiconductors are installed, 120 metal-oxide-semiconductors, each big heat spreader module can dissipate 2KW's altogether
Heat can dissipate altogether the heat of 6kw.It, can under same size inside a 4U cabinet after the solution of the present invention
To place 8 above-mentioned electronic load radiators, 24 metal-oxide-semiconductors are can be set in each electronic load radiator, altogether 192 MOS
Pipe, each electronic load radiator can dissipate the heat of 1KW, can dissipate the heat of 8KW in total, therefore the present invention has more
High power density.
The content that this specification is not described in detail belongs to the prior art well known to professional and technical personnel in the field.
Claims (10)
1. a kind of electronic load radiator, it includes fastening gear piece block (3), is mounted on and fastens the of gear piece block (3) upper and lower ends
It is equipped on one heat-radiating substrate (1) and the second heat-radiating substrate (1.1), the first heat-radiating substrate (1) and the second heat-radiating substrate (1.1)
Metal-oxide-semiconductor installation position (12), it is characterised in that: it further includes that upper end strip flattens heat pipe (2) and lower end strip flattening heat pipe
(2.1), the first heat-radiating substrate (1) bottom surface opens up upper end heat pipe fitting groove (14), the second heat-radiating substrate (1.1) top along its length
Face opens up lower end heat pipe fitting groove (15) along its length, and upper end strip flattens heat pipe (2) and is located at upper end heat pipe fitting groove (14)
In, lower end strip flatten heat pipe (2.1) be located in lower end heat pipe fitting groove (15), upper end strip flatten heat pipe (2) top surface with
Bottom surface is bonded the first heat-radiating substrate (1) respectively and fastens gear piece block (3), and lower end strip flattens the top and bottom of heat pipe (2.1)
Fitting fastens gear piece block (3) and the second heat-radiating substrate (1.1) respectively.
2. electronic load radiator according to claim 1, it is characterised in that: the fastening gear piece block (3) includes superposition
Multi-disc fasten gear piece (3.1), each thickness for fastening gear piece (3.1) is equal, and adjacent two panels fastens the spacing of gear piece (3.1)
It is equal.
3. electronic load radiator according to claim 2, it is characterised in that: each thickness for fastening gear piece (3.1)
Degree is equal and thickness range is 0.3~0.6mm.
4. electronic load radiator according to claim 2, it is characterised in that: adjacent two panels fastens between gear piece (3.1)
It is 2~4mm away from equal and spacing range.
5. electronic load radiator according to claim 2, it is characterised in that: include in the fastening gear piece block (3)
The quantity for fastening gear piece (3.1) is 14~22.
6. electronic load radiator according to claim 1, it is characterised in that: the upper end strip flatten heat pipe (2) and
The condensation end (2.2) that lower end strip flattens heat pipe (2.1) is respectively positioned on the front end for fastening gear piece block (3), and upper end strip flattens heat pipe
(2) and the evaporation ends (2.3) of lower end strip flattening heat pipe (2.1) are respectively positioned on the rear end for fastening gear piece block (3)；First heat dissipation
The left and right sides of substrate (1) bottom surface opens up upper end heat pipe fitting groove (14), each upper end heat pipe fitting groove (14) along its length
It is inside respectively provided with upper end strip and flattens heat pipe (2), the left and right sides of the second heat-radiating substrate (1.1) top surface opens up lower end along its length
Heat pipe fitting groove (15), the interior lower end strip that is respectively provided with of each lower end heat pipe fitting groove (15) flatten heat pipe (2.1).
7. electronic load radiator according to claim 1, it is characterised in that: it further includes that circuit board (7) and insulation are led
Heat pad (9) is fastened and is respectively mounted circuit board (7) at left and right sides of gear piece block (3), and circuit board (7) is equipped with metal-oxide-semiconductor pin welding hole
(13), insulating heat-conductive is set between each metal-oxide-semiconductor installation position (12) and corresponding metal-oxide-semiconductor (5) of first heat-radiating substrate (1)
It pads (9), insulating heat-conductive is set between each metal-oxide-semiconductor installation position (12) and corresponding metal-oxide-semiconductor (5) of the second heat-radiating substrate (1.1)
It pads (9), two adjacent metal-oxide-semiconductors (5) are fixed on the first heat-radiating substrate (1) or the second heat-radiating substrate by metal-oxide-semiconductor press strip (6)
(1.1) on correspondence metal-oxide-semiconductor installation position (12), the corresponding metal-oxide-semiconductor pin weldering of pin access circuit board (7) of each metal-oxide-semiconductor (5)
It connects in hole (13).
8. a kind of high-power electronic load radiator structure based on radiator described in claim 7, it is characterised in that: described in four
Electronic load radiator is fixed between the first fan fixed plate (10) and the second fan fixed plate (11) to be formed to load side by side to be dissipated
Hot group (4), the first fan (8) corresponding with four electronic load radiators has been mounted side by side in the first fan fixed plate (10),
The second fan (8.1) corresponding with four electronic load radiators, load heat dissipation has been mounted side by side in second fan fixed plate (11)
Group (4) is set in the cabinet that volume is 2U.
9. high-power electronic load radiator structure according to claim 8, it is characterised in that: four electronic loads dissipate
The front end of each circuit board (7) is fixedly connected with the first fan fixed plate (10) in hot device, and the rear end of each circuit board (7) is fixed to be connected
Connect the second fan fixed plate (11).
10. high-power electronic load radiator structure according to claim 8, it is characterised in that: load heat dissipation described in two groups
Group (4) is superposed in the cabinet that volume is 4U.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811442679.4A CN109413956A (en) | 2018-11-29 | 2018-11-29 | Electronic load radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811442679.4A CN109413956A (en) | 2018-11-29 | 2018-11-29 | Electronic load radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109413956A true CN109413956A (en) | 2019-03-01 |
Family
ID=65456257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811442679.4A Pending CN109413956A (en) | 2018-11-29 | 2018-11-29 | Electronic load radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109413956A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074147A (en) * | 2020-08-06 | 2020-12-11 | 北京比特大陆科技有限公司 | Radiator assembly, power calculating assembly and server |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060059684A1 (en) * | 2004-09-21 | 2006-03-23 | Foxconn Technology Co., Ltd. | Method of manufacturing a heat dissipating device |
| US20070133174A1 (en) * | 2005-11-30 | 2007-06-14 | Kabushika Kaisha Toshiba | Information processor with a radiator that includes a heat pipe |
| WO2009038490A1 (en) * | 2007-09-17 | 2009-03-26 | Vadim Anatolievich Pomytkin | Thermal spreader for heat pipe coolers and water coolers |
| CN201349386Y (en) * | 2008-12-31 | 2009-11-18 | 中国电力科学研究院 | Self-cooled heat pipe radiator |
| EP2426575A2 (en) * | 2010-05-28 | 2012-03-07 | Giga-Byte Technology | Heat-dissipation device |
| CN102647880A (en) * | 2011-02-16 | 2012-08-22 | 技嘉科技股份有限公司 | Heat abstractor |
| US20130155616A1 (en) * | 2011-12-16 | 2013-06-20 | Delta Electronics (Shanghai) Co., Ltd. | Hybrid heat sink and hybrid heat sink assembly for power module |
| CN103732025A (en) * | 2013-12-17 | 2014-04-16 | 南京海勇电子科技有限公司 | Electric vehicle controller |
| CN103747650A (en) * | 2013-12-17 | 2014-04-23 | 南京海勇电子科技有限公司 | Controller for electric vehicles |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
| CN207282486U (en) * | 2017-09-26 | 2018-04-27 | 无锡赛盈动力科技有限公司 | A kind of fixed structure, controller and the electric car of controller metal-oxide-semiconductor |
| CN209472944U (en) * | 2018-11-29 | 2019-10-08 | 武汉精能电子技术有限公司 | Electronic load radiator |
-
2018
- 2018-11-29 CN CN201811442679.4A patent/CN109413956A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060059684A1 (en) * | 2004-09-21 | 2006-03-23 | Foxconn Technology Co., Ltd. | Method of manufacturing a heat dissipating device |
| US20070133174A1 (en) * | 2005-11-30 | 2007-06-14 | Kabushika Kaisha Toshiba | Information processor with a radiator that includes a heat pipe |
| WO2009038490A1 (en) * | 2007-09-17 | 2009-03-26 | Vadim Anatolievich Pomytkin | Thermal spreader for heat pipe coolers and water coolers |
| CN201349386Y (en) * | 2008-12-31 | 2009-11-18 | 中国电力科学研究院 | Self-cooled heat pipe radiator |
| EP2426575A2 (en) * | 2010-05-28 | 2012-03-07 | Giga-Byte Technology | Heat-dissipation device |
| CN102647880A (en) * | 2011-02-16 | 2012-08-22 | 技嘉科技股份有限公司 | Heat abstractor |
| US20130155616A1 (en) * | 2011-12-16 | 2013-06-20 | Delta Electronics (Shanghai) Co., Ltd. | Hybrid heat sink and hybrid heat sink assembly for power module |
| CN103732025A (en) * | 2013-12-17 | 2014-04-16 | 南京海勇电子科技有限公司 | Electric vehicle controller |
| CN103747650A (en) * | 2013-12-17 | 2014-04-23 | 南京海勇电子科技有限公司 | Controller for electric vehicles |
| CN106558562A (en) * | 2016-11-21 | 2017-04-05 | 武汉精立电子技术有限公司 | A kind of high power load metal-oxide-semiconductor heat abstractor |
| CN207282486U (en) * | 2017-09-26 | 2018-04-27 | 无锡赛盈动力科技有限公司 | A kind of fixed structure, controller and the electric car of controller metal-oxide-semiconductor |
| CN209472944U (en) * | 2018-11-29 | 2019-10-08 | 武汉精能电子技术有限公司 | Electronic load radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074147A (en) * | 2020-08-06 | 2020-12-11 | 北京比特大陆科技有限公司 | Radiator assembly, power calculating assembly and server |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201403273Y (en) | Radiating structure of electronic device | |
| CN104661487B (en) | Optical module radiator structure and electronic product | |
| CN2884809Y (en) | Radiator of power element | |
| CN110265367A (en) | A kind of middle power inverter single tube radiator structure | |
| CN208589226U (en) | A kind of heat dissipation type high LED number color screen | |
| CN209472944U (en) | Electronic load radiator | |
| CN208462136U (en) | A kind of pcb board convenient for heat dissipation | |
| CN101026132A (en) | Multi-mode radiator comprising cooling chip and its radiating method | |
| CN109413956A (en) | Electronic load radiator | |
| WO2021088654A1 (en) | Heat dissipation device and circuit board heat dissipation structure | |
| CN209402925U (en) | A kind of two-side radiation device of pcb board | |
| CN202918632U (en) | Double-sided cooling structure of multi-power components and electronic device thereof | |
| CN204836913U (en) | Compound radiator and heat dissipation module | |
| CN112235998B (en) | Fin radiator and electric screen cabinet with same | |
| CN202697145U (en) | Circuit board fastening heat dissipation component | |
| CN204929519U (en) | Integration heat radiation structure | |
| CN211792634U (en) | Air-cooled case using vapor chamber technology | |
| CN211959657U (en) | CEM-3 copper-clad plate easy to radiate heat | |
| CN211785712U (en) | Bottom shell structure of electric energy meter | |
| CN210183748U (en) | Solar photovoltaic inverter | |
| CN208874535U (en) | Thermal energy convection heat emission type photovoltaic module | |
| CN201788960U (en) | Heat radiation structure of semiconductor electronic component | |
| CN204857704U (en) | Heat dissipation connection structure of power module | |
| CN220326085U (en) | Heat radiation structure for photovoltaic optimizer | |
| CN216693939U (en) | Cooling device, electric control box and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |