CN112235998B - Fin radiator and electric screen cabinet with same - Google Patents
Fin radiator and electric screen cabinet with same Download PDFInfo
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- CN112235998B CN112235998B CN202010920998.2A CN202010920998A CN112235998B CN 112235998 B CN112235998 B CN 112235998B CN 202010920998 A CN202010920998 A CN 202010920998A CN 112235998 B CN112235998 B CN 112235998B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a fin radiator and an electric screen cabinet with the same, wherein the fin radiator comprises a radiating frame and three groups of radiating fins which are connected into a whole; the radiating frame comprises a radiating base plate, three groups of radiating fins are arranged on the same side of the radiating base plate, and each group of radiating fins comprises a plurality of radiating fins which are parallel to each other; each radiating fin in the first group of radiating fins is perpendicular to the radiating base plate, the second group of radiating fins and the third group of radiating fins are respectively arranged on two sides of the first group of radiating fins, and the second group of radiating fins and the third group of radiating fins are parallel to the radiating base plate. Compared with the prior art, the fin radiator provided by the invention has the advantages that the air flow is fully utilized by arranging the plurality of groups of radiating fins in different directions, and an ideal radiating effect is achieved. According to different regional heat size differences, the fin length and the thickness of design also are different to effectively improve the radiating efficiency. The radiator is integrally formed by hot die pressing of aluminum alloy, and has the advantages of simple structure, easy processing, light weight, small size and the like.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic devices, in particular to a fin radiator and an electric screen cabinet with the fin radiator.
Background
With the rapid development of semiconductor power devices, the power of a single device is higher and higher, for example, the heating power of the current rectifier diode can reach more than 200W, because these high-power devices have high rated voltage, large rated current, large total heating amount and high heating density, the requirement on the heat dissipation efficiency of a heat sink is very high, and the cooling and heat dissipation of the high-power devices are also the core that restricts the volume, weight and reliability of high-power electronic equipment. The traditional radiator is composed of a base plate and a group of radiating fins which are the same in length and perpendicular to the base plate, and is poor in radiating effect and large in size.
Disclosure of Invention
Aiming at the defect of poor heat dissipation effect of the heat sink in the prior art, the invention aims to provide the fin heat sink, wherein a traditional fin structure is changed, and a plurality of groups of heat dissipation fins in different directions are arranged, so that air flow is fully utilized, and an ideal heat dissipation effect is achieved.
The invention provides a fin radiator, which comprises a radiating frame and three groups of radiating fins, wherein the radiating frame and the three groups of radiating fins are connected into a whole; the radiating frame comprises a radiating base plate, three groups of radiating fins are arranged on the same side of the radiating base plate, and each group of radiating fins comprises a plurality of radiating fins which are parallel to each other; each radiating fin in the first group of radiating fins is perpendicular to the radiating base plate, the second group of radiating fins and the third group of radiating fins are respectively arranged on two sides of the first group of radiating fins, and each radiating fin in the second group of radiating fins and each radiating fin in the third group of radiating fins is parallel to the radiating base plate.
Preferably, two mounting plates are arranged on one side of the heat dissipation substrate at intervals, and the first group of heat dissipation fins are arranged between the two mounting plates; the second group of radiating fins are arranged on one of the mounting plates and are positioned on one side of the mounting plate, which faces away from the first group of radiating fins, and the third group of radiating fins are arranged on the other mounting plate and are positioned on one side of the mounting plate, which faces away from the first group of radiating fins.
Preferably, the two mounting plates are obliquely arranged on the heat dissipation substrate, a V-shaped groove is formed between the two mounting plates, and the first group of heat dissipation fins are arranged in the V-shaped groove.
Preferably, the length of each radiating fin in the first group of radiating fins is reduced from the middle of the V-shaped groove to two sides in sequence.
Preferably, the two mounting plates are perpendicular to the heat dissipation substrate, and the first group of heat dissipation fins are arranged on the heat dissipation substrate between the two mounting plates.
Preferably, in the second group of heat dissipation fins and/or the third group of heat dissipation fins, the heat dissipation area of each heat dissipation fin decreases sequentially as the distance between the heat dissipation fin and the heat dissipation substrate increases.
Preferably, in the second group of heat dissipation fins and/or the third group of heat dissipation fins, the length of each heat dissipation fin decreases in sequence as the distance between the heat dissipation fin and the heat dissipation substrate increases.
Preferably, in the second group of heat dissipation fins and/or the third group of heat dissipation fins, the thickness of each heat dissipation fin decreases in sequence as the distance between the heat dissipation fin and the heat dissipation substrate increases.
Preferably, the heat dissipation fins are flat plate fins.
Preferably, the heat sink is molded from an aluminum alloy.
Compared with the prior art, the fin radiator provided by the invention has the advantages that the traditional fin structure is changed, and the plurality of groups of radiating fins in different directions are arranged, so that the air flow is fully utilized, and an ideal radiating effect is achieved. According to different regional heat size differences, the fin length and the thickness of design also are different to effectively improve the radiating efficiency. The radiator is integrally formed by hot die pressing of aluminum alloy, and has the advantages of simple structure, easy processing, light weight, small size and the like.
The invention also provides an electric screen cabinet, which comprises the finned radiator.
The features mentioned above can be combined in various suitable ways or replaced by equivalent features as long as the object of the invention is achieved.
Drawings
The invention will be described in more detail hereinafter on the basis of non-limiting examples only and with reference to the accompanying drawings. Wherein:
fig. 1 is a schematic structural diagram of a finned heat sink according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a finned heat sink according to another embodiment of the present invention.
Description of reference numerals:
1. a heat-dissipating substrate; 2. mounting a plate; 3. a first set of fins; 4. a second set of fins; 5. and a third group of radiating fins.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and more complete, the following technical solutions of the present invention will be described in detail, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the specific embodiments of the present invention belong to the protection scope of the present invention.
The first embodiment is as follows:
as shown in fig. 1, the fin heat sink (hereinafter referred to as heat sink) provided in the present invention includes a heat dissipation frame and three sets of heat dissipation fins, and the heat dissipation frame and the three sets of heat dissipation fins are connected as a whole. The heat sink occupies a given space having six faces including a top face, a bottom face, a front side face, a rear side face, a left side face and a right side face.
The heat dissipation frame comprises a heat dissipation substrate 1 and two mounting plates 2, wherein the heat dissipation substrate 1 is located on the top surface of a given space, the heat dissipation substrate 1 is used for mounting a power device (such as a rectifier diode), the top surface of the heat dissipation substrate 1 is a binding surface, and heat conduction resin is coated on the top surface of the heat dissipation substrate, so that the uniform heat dissipation of the device is ensured. The two mounting plates 2 are obliquely arranged on the heat dissipation substrate 1 and below the heat dissipation substrate 1, a V-shaped groove is formed between the two mounting plates 2, and in the aspect of the orientation in fig. 1, the opening of the V-shaped groove is downward, and the V-shaped groove is used for mounting the first group of heat dissipation fins 3. Three sets of radiating fins are arranged on the same side of the radiating base plate 1, each set of radiating fin comprises a plurality of radiating fins which are parallel to each other, a flow channel is formed between every two adjacent radiating fins, and air can flow along the flow channel.
The first group of radiating fins 3 are arranged in the V-shaped groove, each radiating fin in the first group of radiating fins 3 is perpendicular to the radiating base plate 1, each radiating fin of the first group of radiating fins 3 takes the joint of the radiating fin and the inner wall of the V-shaped groove as a starting point and extends towards the lower part of the radiating base plate 1 to form a group of flow channels penetrating through the front side surface and the rear side surface of the given space, and one side of the group of flow channels facing the bottom surface of the given space is open. The second group of radiating fins 4 and the third group of radiating fins 5 are respectively arranged on two sides of the first group of radiating fins 3, and each radiating fin in the second group of radiating fins 4 and the third group of radiating fins 5 is parallel to the radiating base plate 1. Specifically, the second group of heat dissipating fins 4 is provided on the left mounting plate 2 and is located on the side of the mounting plate 2 facing away from the first group of heat dissipating fins 3, and each of the heat dissipating fins of the second group of heat dissipating fins 4 extends to the left side of the heat dissipating base plate 1 with its junction with the left mounting plate 2 as a starting point, forming a group of flow channels that penetrate the front side and the rear side of the given space, and the group of flow channels is open to the side of the left side of the given space. The third group of radiating fins 5 is arranged on the right mounting plate 2 and is positioned on one side of the mounting plate 2, which is opposite to the first group of radiating fins 3, each radiating fin of the second group of radiating fins 4 extends towards the left side of the radiating base plate 1 by taking the joint of the radiating fin and the right mounting plate 2 as a starting point, a group of flow channels penetrating through the front side surface and the rear side surface of the given space are formed, and the group of flow channels is opened towards one side of the right side surface of the given space.
The radiator in the above scheme has the advantages that the three groups of radiating fins in different directions are arranged, so that the flowing air from the front part, the rear part, the left part, the right part and the lower part of the radiator can enter the corresponding flowing channels to circulate, the heat radiation is carried out, the air flowing in different directions is fully utilized, and the ideal radiating effect is achieved.
Since the power device is mounted on the heat dissipation substrate 1 on the top of the heat sink, the amount of heat in the heat sink is gradually reduced from the top to the bottom, and in order to improve the heat dissipation efficiency, the following improvements may be made:
1. the length of each radiating fin in the first group of radiating fins 3 is sequentially reduced from the middle part of the V-shaped groove to two sides, namely the radiating fin positioned in the middle is the longest and the radiating fins positioned at two ends are the shortest;
2. in the second group of radiating fins 4 and/or the third group of radiating fins 5, the length of each radiating fin is sequentially reduced along with the increase of the distance between the radiating fin and the radiating substrate 1, namely the length of the radiating fins in the same group is sequentially reduced from top to bottom;
3. in the second group of heat dissipation fins 4 and/or the third group of heat dissipation fins 5, the thickness of each heat dissipation fin is sequentially reduced along with the increase of the distance between the heat dissipation fin and the heat dissipation substrate 1, that is, the thickness of the heat dissipation fins in the same group is sequentially reduced from top to bottom, and the air circulation area is increased when the thickness of the heat dissipation fins is reduced.
The scheme shown in fig. 1 comprehensively adopts the optimization methods, the radiating fin positioned in the middle of the first group of radiating fins 3 is the longest, the radiating fins positioned at two ends of the first group of radiating fins are the shortest, and the thicknesses of the radiating fins in the second group of radiating fins 4 and the third group of radiating fins 5 and the lengths of the radiating fins are correspondingly reduced from top to bottom in sequence.
Example two:
as shown in fig. 2, on the basis of the fin heat sink provided in the first embodiment, the two mounting plates 2 are arranged obliquely on the heat dissipation substrate 1 instead of being arranged vertically, the heat dissipation fins of the first group of heat dissipation fins 3 are all fixed on the heat dissipation substrate 1, and the lengths of the heat dissipation fins in the same group of heat dissipation fins are equal.
In order to improve the heat dissipation efficiency, the thickness of each of the second group of heat dissipation fins 4 and the third group of heat dissipation fins 5 may be sequentially reduced along with the increase of the distance between the heat dissipation fins and the heat dissipation substrate 1, that is, the thickness of the heat dissipation fins in the same group is sequentially reduced from top to bottom, and the air circulation area is increased when the thickness of the heat dissipation fins is reduced.
In the present invention, the length of the heat radiating fin refers to the distance from the root to the tip of the heat radiating fin. The specific number of the radiating fins can be adjusted according to the size of the radiator; the radiating fins are preferably flat plate fins; the radiator is preferably formed by compression molding of aluminum alloy, and has the advantages of simple structure, easy processing, light weight, small volume and the like.
It will be appreciated by those skilled in the art that the finned heat sink of the present invention may be applied to an electrical cabinet. When the finned radiator is applied to an electrical screen cabinet, the finned radiator is preferably fixedly installed in a cabinet body of the electrical screen cabinet, and a rectifier diode in the electrical screen cabinet is installed on a radiating substrate of the finned radiator.
Finally, it should be noted that: the above embodiments and examples are only used to illustrate the technical solution of the present invention, but not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments and examples, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments or examples may still be modified, or some of the technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments or examples of the present invention.
Claims (10)
1. A fin radiator is characterized by comprising a radiating frame and three groups of radiating fins, wherein the radiating frame and the three groups of radiating fins are connected into a whole; the radiating frame comprises a radiating base plate, three groups of radiating fins are arranged on the same side of the radiating base plate, and each group of radiating fins comprises a plurality of radiating fins which are parallel to each other; each radiating fin in the first group of radiating fins is perpendicular to the radiating base plate, the second group of radiating fins and the third group of radiating fins are respectively arranged on two sides of the first group of radiating fins, and each radiating fin in the second group of radiating fins and each radiating fin in the third group of radiating fins is parallel to the radiating base plate; in the second group of heat dissipation fins and/or the third group of heat dissipation fins, the thickness of each heat dissipation fin is sequentially reduced as the distance between the heat dissipation fin and the heat dissipation substrate increases.
2. The finned heat sink as claimed in claim 1, wherein two mounting plates are spaced apart on one side of the heat-dissipating substrate, the first set of heat-dissipating fins being disposed between the two mounting plates; the second group of radiating fins are arranged on one of the mounting plates and are positioned on one side of the mounting plate, which faces away from the first group of radiating fins, and the third group of radiating fins are arranged on the other mounting plate and are positioned on one side of the mounting plate, which faces away from the first group of radiating fins.
3. The finned heat sink as claimed in claim 2, wherein two of said mounting plates are obliquely disposed on said heat dissipating base plate, a V-shaped groove is formed between said two mounting plates, and said first set of heat dissipating fins are disposed in said V-shaped groove.
4. The finned heat sink as claimed in claim 3, wherein the length of each fin in the first set of fins decreases from the middle of the V-shaped groove to both sides.
5. The finned heat sink of claim 2 wherein two of said mounting plates are perpendicular to said heat sink base plate, said first set of heat sink fins being disposed on said heat sink base plate between said two mounting plates.
6. The finned heat sink according to any one of claims 1 to 5, wherein in the second group of fins and/or the third group of fins, the heat dissipation area of each fin decreases in order as the distance between the fin and the heat dissipation base increases.
7. The finned heat sink as claimed in claim 6, wherein in the second and/or third sets of fins, the length of each fin decreases in order as the distance between the fin and the heat dissipating substrate increases.
8. The finned heat sink of any one of claims 1-5 wherein the heat dissipating fins are flat plate fins.
9. The finned heat sink of any one of claims 1-5 wherein the heat sink is stamped and formed from an aluminum alloy.
10. An electrical cabinet comprising a finned heat sink as claimed in any one of claims 1 to 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010920998.2A CN112235998B (en) | 2020-09-04 | 2020-09-04 | Fin radiator and electric screen cabinet with same |
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CN202010920998.2A CN112235998B (en) | 2020-09-04 | 2020-09-04 | Fin radiator and electric screen cabinet with same |
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CN112235998A CN112235998A (en) | 2021-01-15 |
CN112235998B true CN112235998B (en) | 2021-12-07 |
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CN202010920998.2A Active CN112235998B (en) | 2020-09-04 | 2020-09-04 | Fin radiator and electric screen cabinet with same |
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CN114123610B (en) | 2021-12-02 | 2022-08-09 | 南昌三瑞智能科技有限公司 | Improve iron core temperature distribution's forced air cooling fin in motor |
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CN202697120U (en) * | 2012-05-18 | 2013-01-23 | 深圳市正弦电气股份有限公司 | Radiator |
CN204168686U (en) * | 2014-09-01 | 2015-02-18 | 绵阳和利科技实业有限公司 | A kind of radiator being applicable to electronic devices and components in air-conditioning |
CN205305309U (en) * | 2015-10-12 | 2016-06-08 | 桂林电子科技大学 | Electronic heat sink subassembly in convex cross -section that vertical position used |
CN207338351U (en) * | 2017-07-10 | 2018-05-08 | 上海辛格林纳新时达电机有限公司 | Radiator and radiator structure |
CN209880587U (en) * | 2019-05-21 | 2019-12-31 | 苏州市同兴铝业有限公司 | Heat radiator |
CN211352916U (en) * | 2020-01-04 | 2020-08-25 | 安徽晶谷周界微电子股份有限公司 | Microelectronic device radiator structure |
-
2020
- 2020-09-04 CN CN202010920998.2A patent/CN112235998B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202697120U (en) * | 2012-05-18 | 2013-01-23 | 深圳市正弦电气股份有限公司 | Radiator |
CN204168686U (en) * | 2014-09-01 | 2015-02-18 | 绵阳和利科技实业有限公司 | A kind of radiator being applicable to electronic devices and components in air-conditioning |
CN205305309U (en) * | 2015-10-12 | 2016-06-08 | 桂林电子科技大学 | Electronic heat sink subassembly in convex cross -section that vertical position used |
CN207338351U (en) * | 2017-07-10 | 2018-05-08 | 上海辛格林纳新时达电机有限公司 | Radiator and radiator structure |
CN209880587U (en) * | 2019-05-21 | 2019-12-31 | 苏州市同兴铝业有限公司 | Heat radiator |
CN211352916U (en) * | 2020-01-04 | 2020-08-25 | 安徽晶谷周界微电子股份有限公司 | Microelectronic device radiator structure |
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