CN210489603U

CN210489603U - Power electronic module and power electronic component packaging substrate

Info

Publication number: CN210489603U
Application number: CN201921967446.6U
Authority: CN
Inventors: 董晓鹏
Original assignee: Suzhou Shenglan Precision Machinery Co Ltd
Current assignee: Suzhou Shenglan Precision Machinery Co Ltd
Priority date: 2019-11-14
Filing date: 2019-11-14
Publication date: 2020-05-08
Anticipated expiration: 2029-11-14

Abstract

The utility model discloses a power electronic module and power electronic components packaging substrate relates to power electronic components technical field, for solving the current not good problem of packaging substrate radiating effect. The packaging substrate is characterized in that a heat transfer substrate is mounted outside the packaging substrate, a heat-conducting adhesive layer is arranged between the heat transfer substrate and the packaging substrate, the packaging substrate is connected with the heat transfer substrate in a splicing mode, first radiating fins are mounted at the lower end of the heat transfer substrate, second radiating fins are mounted on two sides of the heat transfer substrate, the upper end face and the lower end face of the heat transfer substrate are both wave-shaped end faces, a power electronic component is mounted at the upper end of the packaging substrate, a ceramic base material is mounted outside the power electronic component, a first heat-conducting block is mounted at the lower end of the power electronic component, and the first heat-conducting block is embedded inside.

Description

Power electronic module and power electronic component packaging substrate

Technical Field

The utility model relates to a power electronic components technical field specifically is a power electronic module and power electronic components packaging substrate.

Background

The power electronic device is also called a power semiconductor device, and is mainly used for high-power electronic devices (usually, the current is tens to thousands of amperes, and the voltage is more than hundreds of volts) in the aspects of electric energy conversion and control circuits of power equipment. The module packaging technology is an important component of power electronic system integration, directly affects the electrical performance, EMI characteristics, thermal performance and the like of the module, and is well known as a core driving force for the development of the future power electronic technology. In a power electronic integrated system, each discrete component is replaced by an integrated power electronic module, and the research on the packaging technology of the IPEM has important significance and practical value.

However, the conventional package substrate has poor heat dissipation effect; therefore, the existing requirements are not met, and a power electronic module and a power electronic component packaging substrate are provided for the requirement.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power electronic module and power electronic components packaging substrate to solve the current not good problem of packaging substrate radiating effect who proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a power electronic module and power electronic components packaging substrate, includes packaging substrate, packaging substrate's externally mounted has heat transfer substrate, be provided with the heat-conducting glue layer between heat transfer substrate and the packaging substrate, packaging substrate splices with heat transfer substrate and is connected, first fin is installed to heat transfer substrate's lower extreme, the second fin is all installed to heat transfer substrate's both sides, heat transfer substrate's upper and lower terminal surface all sets up to wave type terminal surface.

Preferably, the upper end of the package substrate is provided with a power electronic component, the outer portion of the power electronic component is provided with a ceramic substrate, the lower end of the power electronic component is provided with a first heat conduction block, and the first heat conduction block is embedded in the package substrate.

Preferably, a plurality of radiating fin slots are formed in the heat transfer substrate, and one ends of the first radiating fin and the second radiating fin are embedded into the radiating fin slots.

Preferably, the lower end of the first radiating fin is provided with a second heat conducting block, the lower end of the second heat conducting block is provided with a heat radiation fan, and the heat radiation fan is connected with the second heat conducting block through a fixing bolt.

Preferably, a protective net is arranged at the lower end of the heat radiation fan.

Preferably, the first heat sink is connected with the second heat conducting block by gluing.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a install first fin and second fin respectively at heat transfer substrate's lower extreme and both sides, increase heat radiating area, improve the radiating effect to the packaging substrate, be wave installation with first fin and second fin through wave type terminal surface, further increased heat radiating area, further improved the radiating effect to the packaging substrate;

2. the utility model accelerates the heat dissipation efficiency of the first heat dissipation fin through the heat dissipation fan, so that the heat generated by the power electronic components can be dissipated quickly, and the installation quantity of the heat dissipation fan can be adjusted by a user according to the size of the power electronic components;

3. the utility model discloses an insert the inside of fin slot with the one end of first fin and second fin, realize the installation to the fin, the installation is simple, can be according to the length of power electronic components's size adjustment fin.

Drawings

Fig. 1 is an overall front view of a power electronic module and a power electronic component package substrate according to the present invention;

fig. 2 is a connection relationship diagram of the first heat-conducting block and the package substrate of the present invention;

FIG. 3 is a connection diagram of the heat transfer substrate and the first heat sink according to the present invention;

fig. 4 is a schematic structural view of the heat dissipation fan of the present invention.

In the figure: 1. a package substrate; 2. a heat transfer substrate; 3. a heat-conducting adhesive layer; 4. a power electronic component; 5. a ceramic substrate; 6. a first heat-conducting block; 7. a heat sink slot; 8. a first heat sink; 9. a second heat sink; 10. a wave-shaped end face; 11. a second heat-conducting block; 12. a heat radiation fan; 13. fixing the bolt; 14. and (4) a protective net.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a power electronic module and power electronic components packaging substrate, including packaging substrate 1, packaging substrate 1's externally mounted has heat transfer substrate 2, be provided with heat-conducting glue layer 3 between heat transfer substrate 2 and the packaging substrate 1, both can be as the adhesive and can be heat-conducting medium, packaging substrate 1 is connected with 2 cementing of heat transfer substrate, first fin 8 is installed to the lower extreme of heat transfer substrate 2, second fin 9 is all installed to the both sides of heat transfer substrate 2, the upper and lower terminal surface of heat transfer substrate 2 all sets up to wave type terminal surface 10, be the wave installation with first fin 8 and second fin 9 through wave type terminal surface 10, heat radiating area has further been increased, further improved the radiating effect to packaging substrate 1.

Further, power electronic components 4 are installed to packaging substrate 1's upper end, and power electronic components 4's externally mounted has ceramic substrate 5, and first heat conduction piece 6 is installed to power electronic components 4's lower extreme, and the inside of first heat conduction piece 6 embedding packaging substrate 1, heat conduction that can be better.

Further, a plurality of radiating fin slots 7 are formed in the heat transfer substrate 2, one ends of the first radiating fins 8 and the second radiating fins 9 are embedded into the radiating fin slots 7, and one ends of the first radiating fins 8 and the second radiating fins 9 are inserted into the radiating fin slots 7, so that the first radiating fins 8 and the second radiating fins 9 are installed, the installation is simple, and the lengths of the radiating fins can be adjusted according to the sizes of the power electronic components 4.

Further, a second heat conduction block 11 is installed at the lower end of the first heat dissipation fin 8, a heat dissipation fan 12 is installed at the lower end of the second heat conduction block 11, the heat dissipation fan 12 is connected with the second heat conduction block 11 through a fixing bolt 13, the heat dissipation efficiency of the first heat dissipation fin 8 is accelerated through the heat dissipation fan 12, and therefore heat generated by the power electronic component 4 can be dissipated quickly.

Further, a protective screen 14 is provided at the lower end of the heat dissipation fan 12, so that the overall safety during heat dissipation is improved.

Furthermore, the first heat sink 8 and the second heat conducting block 11 are connected by adhesive, which can be used as both adhesive and heat conducting medium.

The working principle is as follows: when the packaging substrate is used, the packaging substrate 1 is of a U-shaped structure, the first heat conduction block 6 at the lower end of the power electronic component 4 is embedded into the packaging substrate 1, heat can be better conducted, the heat is dissipated through a heat sink formed by the heat conduction substrate 2, the first heat dissipation fin 8 and the second heat dissipation fin 9 together, the heat dissipation area of the first heat dissipation fin 8 and the second heat dissipation fin 9 is increased, the heat dissipation effect on the packaging substrate 1 is improved, the heat dissipation efficiency of the first heat dissipation fin 8 is improved through the wave-shaped end face 10, the heat generated by the power electronic component 4 can be quickly dissipated, a user can adjust the installation number of the heat dissipation fans 12 according to the size of the power electronic component 4, and one end of the first heat dissipation fin 8 and one end of the second heat dissipation fin 9 are inserted into the heat dissipation slots 7, the first radiating fin 8 and the second radiating fin 9 are installed easily, and the lengths of the radiating fins can be adjusted according to the size of the power electronic component 4.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a power electronic module and power electronic components and parts packaging substrate, includes packaging substrate (1), its characterized in that: the externally mounted of packaging substrate (1) has heat transfer substrate (2), be provided with between heat transfer substrate (2) and packaging substrate (1) thermal conductive adhesive layer (3), packaging substrate (1) splices with heat transfer substrate (2) and is connected, first fin (8) are installed to the lower extreme of heat transfer substrate (2), second fin (9) are all installed to the both sides of heat transfer substrate (2), the upper and lower terminal surface of heat transfer substrate (2) all sets up to wave type terminal surface (10).

2. The power electronic module and power electronic component package substrate of claim 1, wherein: the packaging structure is characterized in that a power electronic component (4) is installed at the upper end of the packaging substrate (1), a ceramic substrate (5) is installed outside the power electronic component (4), a first heat conduction block (6) is installed at the lower end of the power electronic component (4), and the first heat conduction block (6) is embedded into the packaging substrate (1).

3. The power electronic module and power electronic component package substrate of claim 1, wherein: a plurality of radiating fin slots (7) are formed in the heat transfer base plate (2), and one ends of the first radiating fin (8) and the second radiating fin (9) are embedded into the radiating fin slots (7).

4. The power electronic module and power electronic component package substrate of claim 1, wherein: the lower end of the first radiating fin (8) is provided with a second heat conducting block (11), the lower end of the second heat conducting block (11) is provided with a heat radiating fan (12), and the heat radiating fan (12) is connected with the second heat conducting block (11) through a fixing bolt (13).

5. The power electronic module and power electronic component package substrate of claim 4, wherein: the lower end of the heat radiation fan (12) is provided with a protective net (14).

6. The power electronic module and power electronic component package substrate of claim 4, wherein: the first radiating fin (8) is connected with the second heat conducting block (11) in a gluing mode.