CN216120285U

CN216120285U - Transistor packaging frame applied to direct current motor controller

Info

Publication number: CN216120285U
Application number: CN202122684042.XU
Authority: CN
Inventors: 李富超; 钱晓途
Original assignee: Wuxi Xintu Semiconductor Co ltd
Current assignee: Wuxi Xintu Semiconductor Co ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2022-03-22
Anticipated expiration: 2031-11-04

Abstract

The utility model discloses a transistor packaging frame applied to a direct current motor controller, relates to the technical field of transistors, and aims to solve the problems that a main body of a transistor adopts a plate type structure, the structure is high in rigidity, mechanical stress generated during installation of the transistor is difficult to release, the transistor is deformed due to the mechanical stress, an inner wafer is damaged when the deformation is too large, and the use effect of the transistor is difficult to ensure. The transistor comprises a transistor body and is characterized in that a frame substrate is arranged inside the transistor body, the frame substrate and the transistor body are connected into a whole, flat bar-shaped pins are arranged below the transistor body and are three, the flat bar-shaped pins are electrically connected with the frame substrate, mounting holes are formed in the transistor body, through holes are formed in the lower portions of the mounting holes, the through holes are two, the mounting holes and the through holes are both punched with the transistor body into a whole, and a heat dissipation bottom plate is arranged on one side of the transistor body.

Description

Transistor packaging frame applied to direct current motor controller

Technical Field

The utility model relates to the technical field of transistors, in particular to a transistor packaging frame applied to a direct current motor controller.

Background

The direct current motor is a rotating motor which can convert direct current electric energy into mechanical energy or convert mechanical energy into direct current electric energy, and can realize mutual conversion of the direct current electric energy and the mechanical energy, a motor controller is an integrated circuit which controls the motor to work according to set direction, speed, angle and response time through active work, a plurality of transistors are installed on the direct current motor controller, and the transistors are solid semiconductor devices and have multiple functions of detection, rectification, amplification, switching, voltage stabilization, signal modulation and the like. The transistor, which is a type of variable current switch, is capable of controlling an output current based on an input voltage.

At present, the main part of transistor adopts plate-type structure, and this structural rigidity is higher, and the mechanical stress that produces when the installation transistor is difficult to release, and mechanical stress can make the transistor take place deformation, will lead to inside wafer to damage when the deformation volume is too big, and the result of use is difficult to ensure to the transistor, can not satisfy the user demand, therefore urgently needs a transistor packaging frame who is applied to dc motor controller in the market to solve these problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a transistor packaging frame applied to a direct current motor controller, and aims to solve the problems that a main body of a transistor in the background art is of a plate type structure, the structure is high in rigidity, mechanical stress generated during transistor installation is difficult to release, the transistor is deformed due to the mechanical stress, an internal wafer is damaged when the deformation is too large, and the use effect of the transistor is difficult to ensure.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a be applied to transistor packaging frame of DC motor controller, includes the transistor main part, the inside of transistor main part is provided with the frame base plate, and the frame base plate is connected structure as an organic whole with the transistor main part, the below of transistor main part is provided with flat bar pin, and flat bar pin is provided with threely, and three flat bar pin equidistance sets up in the below of transistor main part, flat bar pin and frame base plate electric connection, be provided with the mounting hole in the transistor main part, the below of mounting hole is provided with the through-hole, and the through-hole is provided with two, and mounting hole and through-hole all with transistor main part punching press structure as an organic whole, one side of transistor main part is provided with radiating bottom plate.

Preferably, the two through holes are arranged in an oval shape, and the two through holes are symmetrically arranged relative to the mounting hole.

Preferably, one side of mounting hole is provided with the erection bolt, and the one end of erection bolt runs through the mounting hole and extends to one side of heat dissipation bottom plate, be provided with the gasket between erection bolt and the transistor main part, and gasket and erection bolt sliding connection, the gasket is laminated with the transistor main part mutually, the outside of erection bolt is provided with the spring, and spring and erection bolt sliding connection, the both ends of spring laminate mutually with gasket and erection bolt respectively.

Preferably, an insulating heat-conducting glue is arranged between the transistor main body and the heat dissipation bottom plate, and the insulating heat-conducting glue, the transistor main body and the heat dissipation bottom plate are connected into an integral structure.

Preferably, the transistor body is provided with two positioning slots on the side wall, and the two positioning slots are symmetrically arranged relative to the mounting hole.

Preferably, ribs are arranged among the three flat bar-shaped pins, and the ribs and the flat bar-shaped pins are connected into an integral structure.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model discloses a device passes through the setting of through-hole, gasket and spring, and the through-hole is oval setting for the rigidity that the part is connected about the transistor main part descends, and the mechanical stress that produces when carrying out the transistor installation will be released partly when the through-hole, reduces the transistor deformation volume, plays the effect of protection to inside wafer, and gasket and spring make the fixed structure body of transistor installation possess the shock-absorbing capacity, have improved the stability of transistor installation. The problems that the transistor is high in rigidity and difficult to release mechanical stress, and the internal wafer cannot be protected are solved.

2. The utility model discloses a device can release away the heat on the transistor fast through the setting of heat dissipation bottom plate, insulating heat conducting glue and rib, and insulating heat conducting glue can also play the effect of insulating protection on can transferring the heat on the transistor to the heat dissipation bottom plate, can straighten the flat bar pin with the help of the rib, the connection of the flat bar pin of being convenient for. The problems that the transistor is high in integration level and poor in heat dissipation performance and is prone to high-temperature burning are solved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a diagram of the connection between the insulating sheath and the transistor body and the heat sink base plate according to the present invention;

FIG. 3 is a diagram of the connection between the mounting plug and the transistor body according to the present invention.

In the figure: 1. a transistor body; 2. mounting holes; 3. positioning the slot; 4. a heat dissipation base plate; 5. insulating heat-conducting glue; 6. a through hole; 7. installing a bolt; 8. flat bar-shaped pins; 9. ribs; 10. a spring; 11. a frame substrate; 12. and (7) a gasket.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-3, an embodiment of the present invention is shown: a transistor packaging frame applied to a direct current motor controller comprises a transistor body 1, a frame substrate 11 is arranged inside the transistor body 1, the frame substrate 11 and the transistor body 1 are connected into a whole, flat bar-shaped pins 8 are arranged below the transistor body 1, three flat bar-shaped pins 8 are arranged, the three flat bar-shaped pins 8 are arranged at equal intervals below the transistor body 1, the flat bar-shaped pins 8 are electrically connected with the frame substrate 11, a mounting hole 2 is arranged on the transistor body 1, a through hole 6 is arranged below the mounting hole 2, two through holes 6 are arranged, the mounting hole 2 and the through hole 6 are both punched with the transistor body 1 into a whole, the through hole 6 enables the connection rigidity between the upper part and the lower part to be reduced, mechanical stress generated when the transistor is mounted can release a part of the mechanical stress when the transistor passes through the through hole 6, and the deformation of the transistor can be reduced, the wafer inside is protected, and a heat dissipation bottom plate 4 is arranged on one side of the transistor main body 1.

Further, two through-holes 6 are oval-shaped, and two through-holes 6 are symmetrically arranged with respect to the mounting hole 2. The mechanical stress release can be uniformized through the through holes 6, so that the whole stress is uniform.

Further, one side of mounting hole 2 is provided with mounting bolt 7, and one end of mounting bolt 7 runs through mounting hole 2 and extends to one side of heat dissipation bottom plate 4, is provided with gasket 12 between mounting bolt 7 and the transistor main part 1, and gasket 12 and mounting bolt 7 sliding connection, and gasket 12 and transistor main part 1 are laminated mutually, and the outside of mounting bolt 7 is provided with spring 10, and spring 10 and mounting bolt 7 sliding connection, and the both ends of spring 10 are laminated mutually with gasket 12 and mounting bolt 7 respectively. The mounting structure composed of the spacer 12 and the spring 10 enables the mounted transistor to have certain buffering performance, and improves the stability of transistor mounting.

Further, an insulating heat-conducting glue 5 is arranged between the transistor body 1 and the heat-radiating bottom plate 4, and the insulating heat-conducting glue 5 is connected with the transistor body 1 and the heat-radiating bottom plate 4 into an integral structure. The heat on the transistor body 1 can be transferred to the heat dissipation bottom plate 4 through the insulating heat conduction glue 5, and the heat dissipation performance is improved.

Further, the side wall of the transistor body 1 is provided with two positioning slots 3, and the two positioning slots 3 are symmetrically arranged relative to the mounting hole 2. The transistor body 1 is accurately mounted by the positioning slot 3.

Further, ribs 9 are arranged between the three flat bar-shaped pins 8, and the ribs 9 and the flat bar-shaped pins 8 are connected into an integral structure. The bent flat bar-shaped pins 8 can be straightened through the ribs 9, so that the flat bar-shaped pins 8 can be conveniently connected.

The working principle is as follows: when the transistor is installed and fixed by using the installation bolt 7, the through hole 6 enables the connection rigidity between the upper part and the lower part to be reduced, mechanical stress generated in the installation process can be released partially when passing through the through hole 6, the deformation quantity of the lower part is greatly reduced, and the effect of protecting an internal wafer is achieved; the insulating heat-conducting glue 5 can transfer heat on the transistor body 1 to the heat dissipation bottom plate 4, and the heat is rapidly released by means of the heat dissipation bottom plate 4, so that the heat dissipation performance of the transistor is improved, and the transistor is prevented from being burnt out at high temperature.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A transistor package frame for a dc motor controller, comprising a transistor body (1), characterized in that: the utility model discloses a transistor, including transistor main part (1), the inside of transistor main part (1) is provided with frame base plate (11), and frame base plate (11) and transistor main part (1) are connected structure as an organic whole, the below of transistor main part (1) is provided with flat bar pin (8), and flat bar pin (8) are provided with threely, and three flat bar pin (8) equidistance setting in the below of transistor main part (1), flat bar pin (8) and frame base plate (11) electric connection, be provided with mounting hole (2) on transistor main part (1), the below of mounting hole (2) is provided with through-hole (6), and through-hole (6) are provided with two, and mounting hole (2) and through-hole (6) all with transistor main part (1) punching press structure as an organic whole, one side of transistor main part (1) is provided with radiating bottom plate (4).

2. The transistor package frame of claim 1, wherein: two through-hole (6) are oval-shaped setting, and two through-holes (6) set up about mounting hole (2) symmetry.

3. The transistor package frame of claim 1, wherein: one side of mounting hole (2) is provided with erection bolt (7), and the one end of erection bolt (7) runs through mounting hole (2) and extends to one side of radiating bottom plate (4), be provided with gasket (12) between erection bolt (7) and transistor main part (1), and gasket (12) and erection bolt (7) sliding connection, gasket (12) laminate mutually with transistor main part (1), the outside of erection bolt (7) is provided with spring (10), and spring (10) and erection bolt (7) sliding connection, the both ends of spring (10) laminate mutually with gasket (12) and erection bolt (7) respectively.

4. The transistor package frame of claim 1, wherein: and an insulating heat-conducting glue (5) is arranged between the transistor main body (1) and the heat dissipation bottom plate (4), and the insulating heat-conducting glue (5) is connected with the transistor main body (1) and the heat dissipation bottom plate (4) into an integral structure.

5. The transistor package frame of claim 1, wherein: the transistor is characterized in that two positioning slots (3) are formed in the side wall of the transistor body (1), and the two positioning slots (3) are symmetrically arranged relative to the mounting hole (2).

6. The transistor package frame of claim 1, wherein: ribs (9) are arranged between the three flat bar-shaped pins (8), and the ribs (9) and the flat bar-shaped pins (8) are connected into an integral structure.