CN112285847A

CN112285847A - Multipath parallel optical module heat radiation structure

Info

Publication number: CN112285847A
Application number: CN202011064141.1A
Authority: CN
Inventors: 王亚丽; 肖金勇; 金本平
Original assignee: Wuhan Hengtaitong Technology Co ltd
Current assignee: Wuhan Hengtaitong Technology Co ltd
Priority date: 2020-09-30
Filing date: 2020-09-30
Publication date: 2021-01-29

Abstract

The invention relates to a multipath parallel optical module heat dissipation structure which comprises a shell and an optical module, wherein the optical module is arranged in the shell, heat conduction plates are arranged at the top end and the bottom end of the optical module, one side of each heat conduction plate, which is far away from the optical module, is provided with a plurality of heat conduction columns extending to the outside of the shell, one ends, which are positioned outside the shell, of the heat conduction columns are provided with bimetallic strips, and when the bimetallic strips are heated, the bimetallic strips are in an arc shape with openings facing away from one side. The heat-conducting plates are arranged at the top and the bottom of the optical module, the heat-conducting columns extending to the outside of the shell are arranged on the heat-conducting plates, heat is transferred to the bimetallic strip through the heat-conducting columns, so that the heat on the heat-conducting plates is dissipated through the bimetallic strip, when the bimetallic strip is heated, the bimetallic strip is in an arc shape with an opening facing to one side far away from the shell, the bimetallic strip is in contact with air far away from the shell, the dissipation of the heat on the bimetallic strip is accelerated, and the efficiency of the bimetallic strip in dissipating the heat on the optical module is improved.

Description

Multipath parallel optical module heat radiation structure

Technical Field

The invention relates to an optical module, in particular to a heat dissipation structure of a multi-path parallel optical module.

Background

With the development of science and technology, optical modules are widely applied to network communication and used for converting electrical signals and optical signals back and forth, and the optical modules generate heat after long-time operation.

Disclosure of Invention

The technical problem to be solved by the present invention is to provide a heat dissipation structure for a multi-path parallel optical module, so as to overcome the above-mentioned deficiencies in the prior art.

The technical scheme for solving the technical problems is as follows: the utility model provides a parallel optical module heat radiation structure of multichannel, includes casing and optical module, the optical module sets up the inside of casing, the top and the bottom of optical module all are equipped with the heat-conducting plate, every the heat-conducting plate deviates from one side of optical module all is equipped with a plurality of extensions to the outside heat conduction post of casing, the heat conduction post is located the outside one end of casing is equipped with the bimetallic strip, when the bimetallic strip is not heated, the bimetallic strip does not take place to deform, when the bimetallic strip is heated, the bimetallic strip is the opening orientation and keeps away from the arc of casing one side.

The invention has the beneficial effects that: the top and the bottom of optical module are equipped with the heat-conducting plate, be equipped with the heat conduction post that extends to the casing outside on the heat-conducting plate, through heat conduction post with heat transfer to bimetallic strip, thereby give off through the heat of bimetallic strip on to the heat-conducting plate, when the bimetallic strip is heated, the bimetallic strip is the arc that the casing one side was kept away from to the opening orientation, make bimetallic strip and the air of keeping away from the casing contact, accelerate thermal giving off on the bimetallic strip, the efficiency that the bimetallic strip heat gave off on the optical module has been improved.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation structure of a multi-path parallel optical module in an embodiment of the present invention;

fig. 2 is a cross-sectional view of a heat dissipation structure of a multi-path parallel optical module in an embodiment of the present invention.

In the figure: the light module comprises a shell 1, an optical module 2, a heat conducting plate 3, a heat conducting column 4, a bimetallic strip 5, an active strip 51, a passive strip 52, a groove 6, heat conducting silica gel 7, a heat radiating plate 8 and a bolt 9.

Detailed Description

The principles and features of this invention are described below in conjunction with the following drawings, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.

As shown in fig. 1-2, embodiment 1 of the present invention provides a multi-path parallel optical module heat dissipation structure, including a housing 1 and an optical module 2, where the optical module 2 is disposed inside the housing 1, heat conduction plates 3 are disposed at both the top end and the bottom end of the optical module 2, a plurality of heat conduction columns 4 extending to the outside of the housing 1 are disposed on one side of each heat conduction plate 3 away from the optical module 2, a bimetal 5 is disposed at one end of each heat conduction column 4 located outside the housing 1, when the bimetal 5 is not heated, the bimetal 5 does not deform, and when the bimetal 5 is heated, the bimetal 5 is in an arc shape with an opening facing a side away from the housing 1.

The top and the bottom of optical module 2 are equipped with heat-conducting plate 3, be equipped with on the heat-conducting plate 3 and extend to 1 outside heat-conducting post 4 of casing, through heat-conducting post 4 with heat transfer to bimetallic strip 5 on, thereby give off through bimetallic strip 5 the heat on the heat-conducting plate 3, when bimetallic strip 5 is heated, the bimetallic strip is the arc that casing 1 one side was kept away from to the opening orientation, make bimetallic strip 5 and the air of keeping away from casing 1 contact, accelerate thermal giving off on bimetallic strip 5, the efficiency that bimetallic strip 5 heat gave off on focusing module 2 has been improved.

Embodiment 2 of the present invention provides a multi-path parallel optical module heat dissipation structure, in embodiment 1, a groove 6 is formed on one side of a heat conduction plate 3 close to an optical module 2, heat conduction silica gel 7 is filled in the groove 6, heat transfer from the optical module 2 to the heat conduction plate 3 is accelerated by virtue of good heat conduction performance of the heat conduction silica gel 7, and the heat conduction silica gel 7 is filled in the groove 6, so that a contact area with the heat conduction plate 3 is increased, and efficiency of heat transfer is further improved.

Embodiment 3 of the present invention provides a heat dissipation structure for a multi-path parallel optical module, in which based on embodiment 2, a bimetal 5 is in a shape of an arc with an opening facing a housing 1, and the bimetal 5 is in a shape of a deviation toward the housing 1, so that corners of the bimetal 5 are prevented from being hooked, and occupation of the bimetal 5 on the volume of the housing 1 is saved.

Embodiment 4 of the present invention provides a heat dissipation structure for a multi-path parallel optical module, in which based on embodiment 3, a bimetal 5 includes an active strip 51 and a passive strip 52, the active strip 51 is disposed on a heat conducting column 4, the passive strip 52 is disposed on a side of the active strip 51 away from the heat conducting column 4, a thermal expansion coefficient of the active strip 51 is greater than a thermal expansion coefficient of the passive strip 52, a grade of the bimetal 5 may be 5J82140, the active strip 51 may be Mn72Ni10Cu18, and the passive strip 52 may be Ni36, and may deform at a low temperature, so as to ensure that the active strip 51 can turn toward a side away from a housing 1.

Embodiment 5 of the present invention provides a multipath parallel optical module heat dissipation structure, in embodiment 4, front and rear sides of an optical module 2 are fixed inside a housing 1 through heat dissipation plates 8, the heat dissipation plates 8 clamp the optical module 2 through bolts 9, a heat conductive silica gel 7 is coated between the heat dissipation plates 8 and the housing 1, the heat dissipation plates 8 dissipate heat on the optical module 2 through the heat conductive silica gel 7, and a good working environment is further provided for the optical module 2.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a parallel optical module heat radiation structure of multichannel, its characterized in that, includes casing (1) and optical module (2), optical module (2) set up the inside of casing (1), the top and the bottom of optical module (2) all are equipped with heat-conducting plate (3), every heat-conducting plate (3) deviate from one side of optical module (2) all is equipped with a plurality of extensions to casing (1) outside heat conduction post (4), heat conduction post (4) are located the outside one end of casing (1) is equipped with bimetallic strip (5), when bimetallic strip (5) are not heated, bimetallic strip (5) do not take place deformation, when bimetallic strip (5) are heated, bimetallic strip (5) are the opening orientation and keep away from the arc of casing (1) one side.

2. The heat dissipation structure of the multi-path parallel optical module according to claim 1, wherein a groove (6) is formed on one side of the heat conductive plate (3) close to the optical module (2), and a heat conductive silica gel (7) is filled in the groove (6).

3. The multiple parallel optical module heat dissipation structure according to claim 1, wherein the bimetal (5) has an arc shape opening toward the housing (1).

4. The thermal dissipation structure of the multi-path parallel optical module of claim 1, wherein the bimetal (5) comprises an active plate (51) and a passive plate (52), the active plate (51) is disposed on the heat conducting pillar (4), the passive plate (52) is disposed on a side of the active plate (51) away from the heat conducting pillar (4), and a thermal expansion coefficient of the active plate (51) is greater than that of the passive plate (52).

5. The heat dissipation structure of the multi-path parallel optical module according to claim 1, wherein the front side and the rear side of the optical module (2) are fixed inside the housing (1) through heat dissipation plates (8), the heat dissipation plates (8) clamp the optical module (2) through bolts (9), and heat conductive silica gel (7) is coated between the heat dissipation plates (8) and the housing (1).