CN210804276U

CN210804276U - Novel blowing plate type heat dissipation module for server

Info

Publication number: CN210804276U
Application number: CN201921396544.9U
Authority: CN
Inventors: 汪林; 龚振兴; 黄明彬; 唐川
Original assignee: Kunshan Ping Tai Electronic Co ltd
Current assignee: Kunshan Ping Tai Electronic Co ltd
Priority date: 2019-08-27
Filing date: 2019-08-27
Publication date: 2020-06-19
Anticipated expiration: 2029-08-27

Abstract

The utility model relates to a novel inflation plate type heat dissipation module for server, which comprises a base plate and a fin group arranged on the base plate, wherein one side surface of the base plate is provided with a mounting groove, the fin group is connected in the mounting groove, one side of the base plate opposite to the fin group is connected with a middle part which is provided with a groove, the groove is of a hollow structure, a copper block is connected in the groove, the copper block is contacted with a heat source body, and one side of the base plate, the fin group and the heat source body is provided with a fan; the fin group comprises a plurality of fins, gaps are arranged between every two adjacent fins, the fins are L-shaped, bent portions of the fins are connected into the mounting grooves, flow channel cavities are formed in the middle of the fins, and refrigerants are filled in the cavities. The utility model discloses a board-like heat dissipation module of inflation has reduced manufacturing cost when guaranteeing the radiating efficiency, promotes radiator fin surface temperature's homogeneity simultaneously, has also promoted the radiator radiating efficiency.

Description

Novel blowing plate type heat dissipation module for server

Technical Field

The utility model relates to a novel board-like heat dissipation module of inflation for server belongs to the heat dissipation part field.

Background

With the rapid development of electronic technology, the demand for higher performance, higher density and higher intelligence of chips, the integration level, packaging density and operating frequency of chips are continuously improved, the required power consumption of a single chip is increased, high heat flux density thermal control or cooling processing mode of a large server has been widely concerned, and the design requirement of a compact structure of equipment makes heat dissipation more difficult, so that in order to enable the chips to operate normally more efficiently and more stably, the size and weight of the heat sink are larger and heavier in order to maintain the efficient heat dissipation function of the heat sink, however, various electronic components, structural members, chips and the like in a server system occupy a certain space, the space provided for the heat sink is very limited, and the stamped fin heat sink for the server in the prior art utilizes a fan to drive air to flow so as to exchange heat with heat collecting fins, so as to take away the heat of the fins to achieve the purpose of cooling. However, the thickness of the fins is small, so that the temperature difference between the low end with high temperature and the top end with low temperature of the fins is large, and the efficiency of the radiator is low. Therefore, how to effectively improve the efficiency of the heat sink on the premise of not increasing the volume of the heat sink as much as possible becomes the direction of efforts of numerous engineers.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a novel board-like thermal module that bloies for server, this board-like thermal module that bloies have reduced manufacturing cost when guaranteeing the radiating efficiency, promote radiator fin surface temperature's homogeneity simultaneously, have also promoted radiator radiating efficiency.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a novel blowing plate type heat dissipation module for a server comprises a base plate and a fin group arranged on the base plate, wherein a mounting groove is formed in the surface of one side of the base plate, the fin group is connected in the mounting groove, a groove is formed in the middle of one side, opposite to the fin group, of the base plate, the groove is of a hollow structure, a copper block is connected in the groove and is in contact with a heat source body, and a fan is arranged on one side of the base plate, the fin group and the heat source body;

the fin group comprises a plurality of fins, gaps are arranged between every two adjacent fins, the fins are L-shaped, bent portions of the fins are connected into the mounting grooves, flow channel cavities are formed in the middle of the fins, and refrigerants are filled in the cavities.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, fin groups are arranged on two sides of the fin group, and the fin groups are connected to the substrate.

2. In the above scheme, the fin group and the fin group are connected to the substrate through the heat conducting glue.

3. In the above scheme, the vertex of the substrate is provided with a through hole.

4. In the above scheme, base plate edge is equipped with a plurality of screws, the screw outside is equipped with heavy platform hole, heavy platform hole sets up on the base plate and carries on the back of the body one side with the mounting groove, be equipped with the swivel nut in the screw.

5. In the above scheme, the heat source body is connected to the copper block through the heat conducting glue.

6. In the above scheme, the wind direction of the fan is over against the gaps of the fins.

Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:

1. the utility model discloses a novel inflation plate formula heat dissipation module for server, including the base plate and install the fin group on the base plate, the fin on the fin group is the L type, inserts the portion of bending of L type fin in the mounting groove, can increase the area of contact with the heat source, improves heat transfer rate, reduces the radiating time, realizes the fin from the bottom to the evenly distributed of top temperature, and the base plate is hollow out construction, sets up the heat-conducting plate at hollow out construction part, has reduced the manufacturing cost of whole radiator when guaranteeing the radiating effect; because the gaps are arranged among the fins, an air channel can be formed, when the fan blows air towards the air channel, the heat dissipation rate can be further increased, and the structure is simple in process, wide in application range and applicable to servers with different sizes.

2. The utility model discloses a novel inflation plate formula heat dissipation module for server is equipped with fin group on the base plate, and fin group sets up in fin group both sides, but the area of make full use of base plate increases space utilization, can prevent the change of fan wind direction simultaneously, is favorable to concentrating of wind, further plays the radiating action.

Drawings

Fig. 1 is a schematic structural view of a novel inflation plate type heat dissipation module for a server according to the present invention;

FIG. 2 is a schematic diagram of a fin structure in the inflation plate type heat dissipation module of the present invention;

fig. 3 is a schematic diagram of a substrate structure in the inflation plate type heat dissipation module of the present invention;

fig. 4 is a schematic diagram of a structure of a sinking platform hole in the inflation plate type heat dissipation module of the present invention;

fig. 5 is a schematic view illustrating the decomposition of the supporting portion in the inflation plate type heat dissipation module of the present invention.

In the above drawings: 1. a substrate; 11. mounting grooves; 12. a through hole; 13. a screw hole; 15. a threaded sleeve; 2. a fin set; 21. a runner cavity; 3. a set of fins; 4. a fan; 5. a copper block; 6. heat conducting glue; 7. a heat source body.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a novel blowing plate type heat dissipation module for a server comprises a base plate 1 and a fin group 2 installed on the base plate 1, wherein a mounting groove 11 is formed in the surface of one side of the base plate 1, the fin group 2 is connected in the mounting groove 11, a groove is formed in the middle of the base plate 1, which is connected with the side opposite to the fin group 2, and is of a hollow structure, a copper block 5 is connected in the groove, the copper block 5 is in contact with a heat source body 7, and a fan 4 is arranged on one side of the base plate 1, the fin group 2 and the heat source body 7;

the fin group 2 comprises a plurality of fins, gaps are arranged between every two adjacent fins, the fins are L-shaped, bent portions of the fins are connected in the installation grooves 11, flow channel cavities 21 are arranged in the middle of the fins, and refrigerants are filled in the cavities.

Fin groups 3 are arranged on two sides of the fin group 2, and the fin groups 3 are connected to the substrate 1.

The fin group 3 and the fin group 2 are connected to the substrate 1 through heat conducting glue.

The heat source body 7 is connected to the copper block 5 through the heat conducting glue 6.

The wind direction of the fan 4 is opposite to the gaps of the fins.

Example 2: a novel blowing plate type heat dissipation module for a server comprises a base plate 1 and a fin group 2 installed on the base plate 1, wherein a mounting groove 11 is formed in the surface of one side of the base plate 1, the fin group 2 is connected in the mounting groove 11, a groove is formed in the middle of the base plate 1, which is connected with the side opposite to the fin group 2, and is of a hollow structure, a copper block 5 is connected in the groove, the copper block 5 is in contact with a heat source body 7, and a fan 4 is arranged on one side of the base plate 1, the fin group 2 and the heat source body 7;

The substrate 1 has a through hole 12 at its apex.

The edge of the base plate 1 is provided with a plurality of screw holes 13, the outer side of each screw hole 13 is provided with a counter sink hole, the counter sink holes are formed in the side, opposite to the mounting groove 11, of the base plate 1, and the screw sleeves 15 are arranged in the screw holes 13.

The wind direction of the fan 4 is opposite to the gaps of the fins.

The novel inflation plate type heat dissipation module for the server comprises a base plate and a fin group arranged on the base plate, wherein the fins on the fin group are L-shaped, the bent parts of the L-shaped fins are inserted into the mounting grooves, the contact area between the L-shaped fins and a heat source can be increased, the heat transfer rate is improved, the heat dissipation time is reduced, the uniform distribution of the temperature of the fins from the bottom to the top is realized, the base plate is of a hollow structure, and the heat conduction plate is arranged on the hollow structure part, so that the production cost of the whole radiator is reduced while the heat dissipation effect is ensured; because the gaps are arranged among the fins, an air channel can be formed, when the fan blows air towards the air channel, the heat dissipation rate can be further increased, and the structure is simple in process, wide in application range and applicable to servers with different sizes.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. The utility model provides a novel board-like heat dissipation module of inflation for server which characterized in that: the heat source structure comprises a substrate (1) and a fin group (2) arranged on the substrate (1), wherein a mounting groove (11) is formed in the surface of one side of the substrate (1), the fin group (2) is connected in the mounting groove (11), a groove is formed in the middle of one side, opposite to the fin group (2), of the substrate (1) and is connected with the heat source body (7), the groove is of a hollow structure, a copper block (5) is connected in the groove, the copper block (5) is in contact with the heat source body (7), and a fan (4) is arranged on one side of the substrate (1), the fin group (2) and the heat source body (7);

the fin group (2) comprises a plurality of fins, gaps are formed between every two adjacent fins, the fins are L-shaped, bent portions of the fins are connected into the mounting grooves (11), a flow channel cavity (21) is formed in the middle of each fin, and refrigerant is filled in the cavities.

2. The new blow-up plate heat sink module for a server of claim 1, wherein: fin groups (3) are arranged on two sides of the fin group (2), and the fin groups (3) are connected to the substrate (1).

3. The new blow-up plate heat sink module for a server of claim 2, wherein: the fin group (3) and the fin group (2) are connected to the substrate (1) through heat conducting glue.

4. The new blow-up plate heat sink module for a server of claim 1, wherein: the top of the substrate (1) is provided with a through hole (12).

5. The new blow-up plate heat sink module for a server of claim 1, wherein: base plate (1) edge is equipped with a plurality of screw (13), the screw (13) outside is equipped with heavy platform hole, heavy platform hole sets up one side back of the body with mounting groove (11) on base plate (1), be equipped with swivel nut (15) in screw (13).

6. The new blow-up plate heat sink module for a server of claim 1, wherein: the heat source body (7) is connected to the copper block (5) through heat conducting glue (6).

7. The new blow-up plate heat sink module for a server of claim 1, wherein: the wind direction of the fan (4) is opposite to the gaps of the fins.