CN211578733U

CN211578733U - Radiator of electronic equipment

Info

Publication number: CN211578733U
Application number: CN201922307418.8U
Authority: CN
Inventors: 汪林; 龚振兴; 黄明彬; 唐川
Original assignee: Kunshan Ping Tai Electronic Co ltd
Current assignee: Sichuan Pindai Electronic Technology Co.,Ltd.
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-09-25
Anticipated expiration: 2029-12-20

Abstract

The utility model discloses an electronic equipment radiator, which comprises a base plate, a fan and a plurality of fins arranged on the base plate, wherein the fan is arranged on one side of the base plate and the plurality of fins; the surface of one side of the substrate is provided with a plurality of mounting grooves, and the plurality of connecting points divide the cavity between the first aluminum plate and the second aluminum plate into a plurality of flow channels; the fin further includes the fin body, is located the portion of bending and the portion of cutting straightly of the other end of fin body one end, and during the portion of cutting straightly of this fin imbeds the mounting groove, the base plate further includes the copper billet in the recess of aluminum plate body and embedding aluminum plate body. The utility model discloses the homogeneity that rises the radiator and promotes radiator fin surface temperature improves the holistic anti deformation intensity of a plurality of fin, has guaranteed radiator global design's stability, has reduced holistic weight of radiator and cost.

Description

Radiator of electronic equipment

Technical Field

The utility model relates to a radiator belongs to the electrical product field.

Background

With the rapid development of electronic technology, higher performance, higher density and higher intelligence are required for chips, the integration level, packaging density and operating frequency of the chips are continuously improved, the required power consumption of a single chip is increased, high heat flux density heat control or cooling processing mode of a large server is widely concerned, the design requirement of the compact structure of the device makes the heat dissipation more difficult, so in order to ensure that the chip can normally operate more efficiently and more stably, in order to maintain the efficient heat dissipation function of the heat sink, the size and weight of the heat sink are increased, and the heat sink is heavier, however, in the server system, various electronic components, structural members, chips and the like occupy a certain space, the space provided for the heat sink is very limited, how to design a radiator with higher efficiency in a limited space urgently needs to adopt a more efficient heat dissipation technology to solve the problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an electronic equipment radiator, this electronic equipment radiator rise the radiator and promoted radiator fin surface temperature's homogeneity, improve the holistic anti deformation intensity of a plurality of fin, have guaranteed radiator global design's stability, have reduced the holistic weight of radiator and cost.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a radiator of electronic equipment comprises a base plate, a fan and a plurality of fins arranged on the base plate, wherein the fan is arranged on one side of the base plate and one side of the plurality of fins; the fin comprises a first aluminum plate and a second aluminum plate which are arranged face to face, the edges of the first aluminum plate and the second aluminum plate are connected together, the first aluminum plate and the second aluminum plate are connected through a plurality of connecting points distributed in compartments, the first aluminum plate and the second aluminum plate protrude outwards relative to the connecting points, so that a cavity is formed, the cavity between the first aluminum plate and the second aluminum plate is divided into a plurality of flow channels through the plurality of connecting points, and condensing agents are filled in the flow channels;

the fin further comprises a fin body, a bending part positioned at one end of the fin body and a straight-inserting part positioned at the other end of the fin body, a gap is formed between the adjacent fin bodies of the fins, the straight-inserting part of the fin is embedded into the mounting groove, and the bending part of the fin is close to the fin body of the adjacent fin; the base plate further comprises an aluminum plate body and a copper block embedded in the groove of the aluminum plate body.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the mounting groove is opened on the aluminum plate body and is run through with the recess, the portion of inserting directly of fin imbeds the mounting groove that is located the aluminum plate body and contacts with the copper billet.

2. In the above scheme, the aluminum plate body is provided with a plurality of mounting grooves which are arranged in parallel.

3. In the above scheme, the fins are connected with the mounting grooves through heat conducting glue or welding.

4. In the scheme, the filling amount of the condensing agent accounts for 20-30% of the volume of the flow channel.

5. In the above scheme, the included angle between the bending part and the fin body is 90 °.

Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:

1. the utility model discloses electronic equipment radiator, the height of the inner chamber of its fin has increased, and the resistance of condensing agent backward flow further reduces, further promotes the homogeneity of radiator fin surface temperature and radiator radiating efficiency; in addition, it is located the portion of bending of fin body one end and the portion of inserting directly of the other end, and is adjacent be equipped with the clearance between the fin body of fin, in the portion of inserting directly of this fin embedding mounting groove, the portion of bending of fin is close to with the fin body of adjacent fin, has both formed the air current wind channel that does not leak out, is favorable to the heat diffusion, also improves the holistic anti deformation intensity of a plurality of fin, has guaranteed radiator global design's stability.

2. The utility model discloses electronic equipment radiator, its base plate further include the copper billet in the recess of aluminum plate body and embedding aluminum plate body, under the unchangeable prerequisite of guaranteeing whole heat dispersion, reduced holistic weight of radiator and cost.

Drawings

FIG. 1 is a schematic view of the heat sink structure of the electronic device of the present invention;

FIG. 2 is a schematic view of a partial structure of the heat sink of the electronic device of the present invention;

FIG. 3 is a schematic view of a fin structure in the heat sink of the electronic device of the present invention;

FIG. 4 is a schematic cross-sectional view of FIG. 3;

fig. 5 is a schematic view of the structure of the electronic device radiator of the present invention.

In the above drawings: 1. a substrate; 2. a fin; 21. a first aluminum plate; 22. a second aluminum plate; 23. a fin body; 3. mounting grooves; 4. a cavity; 5. a joining point; 6. a flow channel; 7. a gap; 8. a bending part; 9. a straight insertion part; 10. an aluminum plate body; 101. a groove; 11. a fan; 12. and (4) a copper block.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a radiator of electronic equipment comprises a base plate 1, a fan 11 and a plurality of fins 2 arranged on the base plate 1, wherein the fan 11 is arranged on one side of the base plate 1 and one side of the plurality of fins 2; the fin comprises a base plate 1, a plurality of mounting grooves 3 are formed in one side surface of the base plate 1, fins 2 comprise a first aluminum plate 21 and a second aluminum plate 22 which are arranged face to face, the edges of the first aluminum plate 21 and the second aluminum plate 22 are connected together, the first aluminum plate 21 and the second aluminum plate 22 are connected through a plurality of connecting points 5 distributed in compartments, the first aluminum plate 21 and the second aluminum plate 22 are outwards protruded relative to the connecting points 5, a cavity 4 is formed, the cavity between the first aluminum plate 21 and the second aluminum plate 22 is divided into a plurality of flow channels 6 through the connecting points 5, and condensing agents are filled in the flow channels 6;

the fin 2 further comprises a fin body 23, a bending part 8 positioned at one end of the fin body 23 and a straight-inserting part 9 positioned at the other end of the fin body, a gap 7 is arranged between the adjacent fin bodies 23 of the fin 2, the straight-inserting part 9 of the fin 2 is embedded into the mounting groove 3, and the bending part 8 of the fin 2 is close to the fin body 23 of the adjacent fin 2; the base plate 1 further comprises an aluminum plate body 10 and a copper block 12 embedded in the groove 101 of the aluminum plate body 10.

The mounting groove 3 is formed in the aluminum plate body 10 and is communicated with the groove 101, and the straight insertion part 9 of the fin 2 is embedded in the mounting groove 3 of the aluminum plate body 10 and is in contact with the copper block 12;

the aluminum plate body 10 is provided with a plurality of parallel mounting grooves 3; the fins 2 are connected with the mounting grooves 3 through heat conducting glue.

The filling amount of the condensing agent accounts for 28 percent of the volume of the flow channel 6; the angle between the bending part 8 and the fin body 23 is 90 °.

Example 2: a radiator of electronic equipment comprises a base plate 1, a fan 11 and a plurality of fins 2 arranged on the base plate 1, wherein the fan 11 is arranged on one side of the base plate 1 and one side of the plurality of fins 2; the fin comprises a base plate 1, a plurality of mounting grooves 3 are formed in one side surface of the base plate 1, fins 2 comprise a first aluminum plate 21 and a second aluminum plate 22 which are arranged face to face, the edges of the first aluminum plate 21 and the second aluminum plate 22 are connected together, the first aluminum plate 21 and the second aluminum plate 22 are connected through a plurality of connecting points 5 distributed in compartments, the first aluminum plate 21 and the second aluminum plate 22 are outwards protruded relative to the connecting points 5, a cavity 4 is formed, the cavity between the first aluminum plate 21 and the second aluminum plate 22 is divided into a plurality of flow channels 6 through the connecting points 5, and condensing agents are filled in the flow channels 6;

The mounting groove 3 is formed in the aluminum plate body 10 and communicated with the groove 101, and the straight insertion portion 9 of the fin 2 is embedded in the mounting groove 3 of the aluminum plate body 10 and contacts with the copper block 12.

The fins 2 are connected with the mounting grooves 3 through welding; the filling amount of the condensing agent accounts for 24 percent of the volume of the flow channel 6.

When the electronic equipment radiator is adopted, the height of the inner cavity of the fin is increased, the resistance of the reflux of the condensing agent is further reduced, and the uniformity of the surface temperature of the fin of the radiator and the radiating efficiency of the radiator are further improved; in addition, an air flow duct which does not leak air is formed, heat diffusion is facilitated, the integral deformation resistance strength of the plurality of fins is improved, and the stability of the integral design of the radiator is ensured; and moreover, the weight and the cost of the whole radiator are reduced on the premise of ensuring that the whole radiating performance is not changed.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. An electronic device heat sink, comprising: the fan comprises a base plate (1), a fan (11) and a plurality of fins (2) arranged on the base plate (1), wherein the fan (11) is arranged on one side of the base plate (1) and the plurality of fins (2); the fin comprises a base plate (1), wherein a plurality of mounting grooves (3) are formed in one side surface of the base plate (1), fins (2) comprise a first aluminum plate (21) and a second aluminum plate (22) which are arranged face to face, the edges of the first aluminum plate (21) and the second aluminum plate (22) are connected together, the first aluminum plate (21) and the second aluminum plate (22) are connected through connecting points (5) distributed in a plurality of compartments, the first aluminum plate (21) and the second aluminum plate (22) are outwards protruded relative to the connecting points (5) to form a cavity (4), the cavity between the first aluminum plate (21) and the second aluminum plate (22) is divided into a plurality of flow channels (6), and condensing agents are filled in the flow channels (6);

the fin (2) further comprises a fin body (23), a bending part (8) positioned at one end of the fin body (23) and a straight-inserting part (9) positioned at the other end of the fin body, a gap (7) is arranged between the fin bodies (23) of the adjacent fins (2), the straight-inserting part (9) of the fin (2) is embedded into the mounting groove (3), and the bending part (8) of the fin (2) is close to the fin body (23) of the adjacent fin (2); the base plate (1) further comprises an aluminum plate body (10) and a copper block (12) embedded in the groove (101) of the aluminum plate body (10).

2. The electronic device heat sink of claim 1, wherein: the mounting groove (3) is formed in the aluminum plate body (10) and communicated with the groove (101), and the straight insertion portion (9) of the fin (2) is embedded into the mounting groove (3) located in the aluminum plate body (10) and is in contact with the copper block (12).

3. The electronic device heat sink of claim 1, wherein: the aluminum plate body (10) is provided with a plurality of parallel mounting grooves (3).

4. The electronic device heat sink of claim 1, wherein: the fins (2) are connected with the mounting grooves (3) through heat conducting glue or welding.

5. The electronic device heat sink of claim 1, wherein: the filling amount of the condensing agent accounts for 20-30% of the volume of the flow channel (6).

6. The electronic device heat sink of claim 1, wherein: the included angle between the bending part (8) and the fin body (23) is 90 degrees.