CN211745055U - High-efficiency radiator for electronic component - Google Patents
High-efficiency radiator for electronic component Download PDFInfo
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- CN211745055U CN211745055U CN201921396548.7U CN201921396548U CN211745055U CN 211745055 U CN211745055 U CN 211745055U CN 201921396548 U CN201921396548 U CN 201921396548U CN 211745055 U CN211745055 U CN 211745055U
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- electronic components
- fins
- base plate
- heat sink
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Abstract
The utility model discloses a high-efficiency radiator for electronic components, which comprises a base plate and a fin group arranged on the base plate, wherein a plurality of mounting grooves are arranged on the surface of one side of the base plate, and the fin group is inserted in the mounting grooves; the fin group comprises a plurality of fins, a gap is arranged between every two adjacent fins, the fins are L-shaped, and bent parts of the fins are connected in the mounting grooves; the fin comprises two metal plates, four sides of the metal plates are attached, a cavity is formed in the middle of the metal plates, a refrigerant is filled in the cavity, fin groups are arranged on two sides of each fin group, and the fin groups are connected to the substrate. The utility model discloses a high-efficient radiator for electronic components can realize that the fin is by bottom to the evenly distributed of top temperature, and heat radiating area is big, and the radiating efficiency is high.
Description
Technical Field
The utility model relates to a radiator belongs to the electrical product field.
Background
With the rapid development of electronic technology, the demand for higher performance, higher density and higher intelligence of chips, the integration level, packaging density and operating frequency of chips are continuously improved, the required power consumption of a single chip is increased, high heat flux density thermal control or cooling processing mode of a large server has attracted much attention, and the design requirement of a compact structure of equipment makes heat dissipation more difficult, so that in order to enable the chips to operate more efficiently and more stably, the size and weight of the heat sink are larger and heavier in order to maintain the efficient heat dissipation function of the heat sink, however, various electronic components, structural members, chips and the like in a server system occupy a certain space, and the space provided for the heat sink is very limited, while the existing stamped fin heat sink has smaller fin thickness (0.3 mm or 0.4 mm), larger fin height, and larger temperature difference between the low end of high temperature of the fins and the top end of low temperature, the efficiency of the heat sink is low. Therefore, how to effectively improve the efficiency of the heat sink on the premise of not increasing the volume of the heat sink as much as possible becomes the direction of efforts of numerous engineers.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electronic components uses high-efficient radiator, this high-efficient radiator have increased with the area of contact of heat source, have guaranteed radiator fin surface temperature's homogeneity to promote radiator radiating efficiency.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a high-efficiency radiator for electronic components comprises a base plate and a fin group arranged on the base plate, wherein a plurality of mounting grooves are formed in the surface of one side of the base plate, and the fin group is inserted into the mounting grooves;
the fin group comprises a plurality of fins, a gap is arranged between every two adjacent fins, the fins are L-shaped, and bent parts of the fins are connected in the mounting grooves; the fin comprises two metal plates, four edges of the metal plates are attached, a cavity is formed in the middle of the metal plates, and a refrigerant is filled in the cavity.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, fin groups are arranged on two sides of the fin group, and the fin groups are connected to the substrate.
2. In the above scheme, the fin group is connected to the substrate through the heat conducting glue.
3. In the above scheme, the vertex of the substrate is provided with a through hole.
4. In the scheme, the edge of the base plate is provided with a plurality of screw holes, and the screw sleeves are arranged in the screw holes.
5. In the above scheme, the fin group is connected to the base plate in an adhesive manner.
6. In the above scheme, the substrate is a copper plate.
7. In the above scheme, the metal plate of the fin is provided with a plurality of connecting points to divide the cavity into a plurality of flow channels.
Because of the application of the technical scheme, compared with the prior art, the utility model have following advantage and effect:
1. the utility model discloses a high-efficient radiator for electronic components, including base plate and the fin group of installing on the base plate, the fin on the fin group is the L type, insert the bending portion of L type fin in the mounting groove, can increase the area of contact with the heat source, improve heat transfer rate, reduce the radiating time, realize the fin from bottom to the evenly distributed of top temperature, under the same circumstances of base plate size, the minor face of fin can be buckled into less size, make the fin interval reduce, increase the number of pieces of fin, improve the radiating effect of radiator when having guaranteed with heat source area of contact, the structure is simple in process, the range of application is wide, applicable on the radiator of different sizes; meanwhile, gaps are formed among the fins, so that heat on the fins can be diffused to the environment in time, and the heat dissipation efficiency is further improved.
2. The utility model discloses a high-efficient radiator for electronic components is equipped with fin group on the base plate, and fin group sets up in fin group both sides, but make full use of the area of base plate increases space utilization, and fin group can further play the radiating action simultaneously.
Drawings
FIG. 1 is a schematic view of the structure of the high-efficiency heat sink for electronic components of the present invention;
FIG. 2 is a schematic view of a fin structure of the high-efficiency heat sink for electronic components of the present invention;
FIG. 3 is a schematic view of the structure of the substrate in the high-efficiency heat sink for electronic components of the present invention;
fig. 4 is a schematic structural diagram of an embodiment two of the high-efficiency heat sink for electronic components of the present invention.
In the above drawings: 1. a substrate; 11. mounting grooves; 12. a through hole; 13. a screw hole; 15. a threaded sleeve; 2. a fin set; 21. a metal plate; 22. a joining point; 4. a set of fins.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a high-efficiency radiator for electronic components comprises a base plate 1 and a fin group 2 arranged on the base plate 1, wherein a plurality of mounting grooves 11 are formed in the surface of one side of the base plate 1, and the fin group 2 is inserted into the mounting grooves 11;
the fin group 2 comprises a plurality of fins, a gap is arranged between every two adjacent fins, the fins are L-shaped, and bent parts of the fins are connected in the mounting grooves 11; the fin comprises two metal plates 21, four sides of the metal plates 21 are attached, a cavity is formed in the middle of the metal plates, and a refrigerant is filled in the cavity.
The top of the substrate 1 is provided with a through hole 12, and the through hole 12 is used for mounting and positioning the substrate 1.
The edge of the base plate 1 is provided with a plurality of screw holes 13, and screw sleeves 15 are arranged in the screw holes.
The fin group 2 is attached to the base plate 1 by gluing.
The substrate 1 is a copper plate.
The metal plate 21 of the fin is provided with a plurality of connecting points 22 to divide the cavity into a plurality of flow channels.
Example 2: a high-efficiency radiator for electronic components comprises a base plate 1 and a fin group 2 arranged on the base plate 1, wherein a plurality of mounting grooves 11 are formed in the surface of one side of the base plate 1, and the fin group 2 is inserted into the mounting grooves 11;
the fin group 2 comprises a plurality of fins, a gap is arranged between every two adjacent fins, the fins are L-shaped, and bent parts of the fins are connected in the mounting grooves 11; the fin comprises two metal plates 21, four sides of the metal plates 21 are attached, a cavity is formed in the middle of the metal plates, and a refrigerant is filled in the cavity.
The fin group 4 is connected to the substrate 1 through a heat conductive adhesive.
The fin group 2 is attached to the base plate 1 by gluing.
The substrate 1 is a copper plate.
The metal plate 21 of the fin is provided with a plurality of connecting points 22 to divide the cavity into a plurality of flow channels.
When the high-efficiency radiator for the electronic component is used, the contact area with a heat source can be increased, the heat transfer rate is improved, the heat dissipation time is shortened, the uniform distribution of the temperature of the fins from the bottom to the top is realized, the short edges of the fins can be bent into smaller sizes under the condition that the sizes of the substrates are the same, the space between the fins is reduced, the number of the fins is increased, the heat dissipation effect of the radiator is improved while the contact area with the heat source is ensured, the structure is simple in process, the application range is wide, and the high-efficiency radiator can be suitable for radiators with different sizes; meanwhile, gaps are formed among the fins, so that heat on the fins can be diffused to the environment in time, and the heat dissipation efficiency is further improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (8)
1. The utility model provides an electronic components uses high-efficient radiator which characterized in that: the fin assembly comprises a base plate (1) and fin groups (2) arranged on the base plate (1), wherein a plurality of mounting grooves (11) are formed in the surface of one side of the base plate (1), and the fin groups (2) are inserted into the mounting grooves (11);
the fin group (2) comprises a plurality of fins, a gap is formed between every two adjacent fins, the fins are L-shaped, and bent parts of the fins are connected in the mounting grooves (11); the fin comprises two metal plates (21), four sides of the metal plates (21) are attached, a cavity is formed in the middle of the metal plates, and a refrigerant is filled in the cavity.
2. A high-efficiency heat sink for electronic components as claimed in claim 1, wherein: fin groups (4) are arranged on two sides of the fin group (2), and the fin groups (4) are connected to the substrate (1).
3. A high-efficiency heat sink for electronic components as claimed in claim 2, wherein: the fin group (4) is connected to the substrate (1) through heat conducting glue.
4. A high-efficiency heat sink for electronic components as claimed in claim 1, wherein: the top of the substrate (1) is provided with a through hole (12).
5. A high-efficiency heat sink for electronic components as claimed in claim 1, wherein: the edge of the base plate (1) is provided with a plurality of screw holes (13), and screw sleeves (15) are arranged in the screw holes.
6. A high-efficiency heat sink for electronic components as claimed in claim 1, wherein: the fin group (2) is connected to the base plate (1) in an adhesive mode.
7. A high-efficiency heat sink for electronic components as claimed in claim 1, wherein: the substrate (1) is a copper plate.
8. A high-efficiency heat sink for electronic components as claimed in claim 1, wherein: a plurality of connecting points (22) are arranged on a metal plate (21) of the fin to divide the cavity into a plurality of flow channels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921396548.7U CN211745055U (en) | 2019-08-27 | 2019-08-27 | High-efficiency radiator for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921396548.7U CN211745055U (en) | 2019-08-27 | 2019-08-27 | High-efficiency radiator for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211745055U true CN211745055U (en) | 2020-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921396548.7U Active CN211745055U (en) | 2019-08-27 | 2019-08-27 | High-efficiency radiator for electronic component |
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| Country | Link |
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| CN (1) | CN211745055U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840516A (en) * | 2021-09-03 | 2021-12-24 | 南昌华勤电子科技有限公司 | Liquid cooling plate and plate-level liquid cooling system |
-
2019
- 2019-08-27 CN CN201921396548.7U patent/CN211745055U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113840516A (en) * | 2021-09-03 | 2021-12-24 | 南昌华勤电子科技有限公司 | Liquid cooling plate and plate-level liquid cooling system |
| CN113840516B (en) * | 2021-09-03 | 2023-07-14 | 南昌华勤电子科技有限公司 | Liquid cooling cold plate and plate-level liquid cooling system |
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