CN113840516B - Liquid cooling cold plate and plate-level liquid cooling system - Google Patents
Liquid cooling cold plate and plate-level liquid cooling system Download PDFInfo
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- CN113840516B CN113840516B CN202111030385.2A CN202111030385A CN113840516B CN 113840516 B CN113840516 B CN 113840516B CN 202111030385 A CN202111030385 A CN 202111030385A CN 113840516 B CN113840516 B CN 113840516B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention relates to the technical field of cooling, and discloses a liquid cooling plate and a plate-level liquid cooling system, wherein the liquid cooling plate comprises: the shell is provided with a liquid inlet and a liquid outlet; the bottom of the accommodating cavity is provided with a first fin group and a second fin group, and a space is reserved between the first fin group and the second fin group along the first direction; forming first flow channels between adjacent first fins in the first fin group; forming a second flow channel between adjacent second fins in the second fin group; the first partition plate is arranged in the accommodating cavity and is positioned between the first fin group and the top of the accommodating cavity; a first guide channel and a second guide channel are arranged on one side of the first partition plate, which faces the top of the accommodating cavity, the first guide channel is respectively connected with the liquid inlet and the first flow channel, and the second guide channel is respectively connected with the liquid inlet and the second flow channel; the accommodating space is also provided with a guide-out channel. The liquid cooling cold plate can improve the cooling capacity of the cold plate and is suitable for special chips.
Description
Technical Field
The invention relates to the technical field of cooling, in particular to a liquid cooling plate and a plate-level liquid cooling system.
Background
With the development of 5G communication technology and the continuous evolution of IT/switch equipment performance and business capability, the single-chip power consumption (such as CPU and switch chip) is continuously increased, the current power consumption of the switch chip is 500W+, and the power consumption of the CPU is 300W+, which basically reaches the limit of the common air cooling heat dissipation technology; the power consumption of the next-generation switch chip is estimated to be 700W+, and the CPU 400W+, so that a stronger liquid cooling heat dissipation technology is needed to replace an air cooling technology to solve the heat dissipation of the large-power consumption chip.
In the current liquid cooling scheme of IT/communication equipment and data centers, cold plate type liquid cooling is the main development direction of liquid cooling technology. The heat of the chip is transferred to the cold plate through the heat-conducting interface material, and the liquid entering the cold plate from the liquid inlet absorbs the heat of the cold plate and flows out from the liquid outlet.
Because the middle of the chip is a high-power-consumption area, the two sides of the chip are low-power-consumption areas, and the temperature specification defined by the low-power-consumption areas is lower than that of the high-power-consumption areas. The application of conventional cold plate flow channel designs can lead to uneven heat dissipation in different areas of the chip, and even to overtemperature conditions.
Therefore, how to provide a liquid cooling plate suitable for a special chip is a problem to be solved.
Disclosure of Invention
The invention provides a liquid cooling plate and a plate-level liquid cooling system, which are used for improving the cooling capacity of the cold plate and are suitable for special chips.
In order to achieve the above purpose, the present invention provides the following technical solutions:
in a first aspect, the present application provides a liquid-cooled cold plate comprising:
the shell is provided with a containing cavity, and the containing cavity is provided with a liquid inlet and a liquid outlet; the bottom of the accommodating cavity is provided with a first fin group and a second fin group, the first fin group and the second fin group are oppositely arranged along a first direction, and a space is reserved between the first fin group and the second fin group; the first fin group comprises a plurality of first fins which are arranged at intervals along the second direction, and a first flow channel is formed between every two adjacent first fins; the second fin group comprises a plurality of second fins which are arranged at intervals along a second direction, and second flow channels are formed between adjacent second fins; the second direction is perpendicular to the first direction, and the second direction is perpendicular to the bottom of the accommodating cavity;
the first partition plate is arranged in the accommodating cavity and is positioned between the first fin group and the top of the accommodating cavity; a first guide channel and a second guide channel are arranged on one side of the first partition plate, which faces the top of the accommodating cavity, the first guide channel is respectively connected with the liquid inlet and one end of the first flow channel, which is away from the second flow channel, and the second guide channel is respectively connected with the liquid inlet and one end of the second flow channel, which is away from the first flow channel;
the accommodating space is internally provided with a guide-out channel, the guide-out channel is respectively connected with the outlet end of the first flow channel and the liquid outlet, and the guide-out channel is respectively connected with the outlet end of the second flow channel and the liquid outlet.
Among the above-mentioned liquid cooling cold plate, the liquid cooling cold plate includes the casing, and the casing has the chamber of holding, holds the bottom in chamber and is equipped with first fin group and second fin group. Specifically, the first fin group and the second fin group are oppositely arranged along the first direction at the bottom of the accommodating cavity, and a space is arranged between the first fin group and the second fin group. Meanwhile, a first partition plate is arranged in the accommodating cavity and is positioned between the first fin group, the second fin group and the top of the accommodating cavity. First flow channels are formed among a plurality of first fins which are arranged at intervals along the second direction in the first fin group, and second flow channels are formed among a plurality of second fins which are arranged at intervals along the second direction in the second fin group. When the liquid cooling plate provided by the application is applied, cold fluid enters the accommodating cavity of the shell from the liquid inlet; then, part of cold fluid enters a first guide-in channel between the first partition plate and the top of the containing cavity, and part of cold fluid enters a second guide-in channel between the first partition plate and the top of the containing cavity; then, the cold fluid enters the first flow passage connected with the first introduction passage through the first introduction passage, and simultaneously, the cold fluid enters the second flow passage connected with the second introduction passage through the second introduction passage. Because the first leading-in channel is connected with one side of the first flow channel, which is far away from the second flow channel, and the second leading-in channel is connected with one end of the second flow channel, which is far away from the first flow channel, the cold fluid in the first flow channel and the cold fluid in the second flow channel are converged at a position close to the middle interval between the first fin group and the second fin group. Since the guiding-out channel in the accommodating cavity is connected with the outlet end of the first flow channel and the liquid outlet, and meanwhile, the guiding-out channel is connected with the outlet end of the second flow channel and the liquid outlet, cold fluid is finally guided out of the inside of the shell.
In the liquid cooling cold plate provided by the application, the first guide-in channel and the first flow channel form a U-shaped flow channel, and meanwhile, the second guide-in channel and the first flow channel form another U-shaped flow channel. When cold fluid enters the shell from the liquid inlet, the cold fluid enters the first fin group and the second fin group from two sides along the first partition plate, and then flows out from the liquid outlet after meeting gaps between the first fin group and the second fin group. Notably, the cold fluid in the liquid cooling cold plate provided by the application firstly cools the low-power consumption areas on the left side and the right side of the chip, and then cools the middle high-power consumption area. Therefore, the low-power consumption area of the chip is not affected by the thermal cascade of the high-power consumption area, and the liquid cooling cold plate provided by the application can realize good heat dissipation of the chip.
Therefore, the application can provide a liquid cooling cold plate to promote the cooling capacity of cold plate, adapt to special chip.
Preferably, the liquid outlet is positioned at one side of the second fin group, which is away from the first fin group;
the liquid cooling plate further comprises a second baffle plate, wherein the second baffle plate is positioned on one side of the second fin group, which is away from the first fin group, and is abutted with the top of the accommodating cavity and the bottom of the accommodating cavity; the second partition plate is provided with a main body part and two folded edges positioned at two sides of the main body part; a gap is formed between the main body part and the second fin group along the first direction, each of the two folded edges is connected with the main body part and one fin of the second fin group which is positioned at the outermost side in the second direction, so that a flow guide section is formed between the second partition plate and the second fin group; the diversion section is respectively connected with the second guide-in channel and one end of the second flow channel, which is away from the first flow channel.
Preferably, the first separator is abutted to the end face of the first fin group towards the top side of the accommodating cavity, and the first separator is abutted to the end face of the second fin group towards the top side of the accommodating cavity.
Preferably, the first introducing channel comprises a first main body section and a first flaring section, the first main body section is communicated with the liquid inlet, and the flow guiding area of the first flaring section is gradually increased along the direction deviating from the first main body section; and/or the number of the groups of groups,
the second guide-in channel comprises a second main body section and a second flaring section, the second main body section is communicated with the liquid inlet, and the flow guide area of the second flaring section is gradually increased along the direction deviating from the second main body section.
Preferably, the heat exchanger further comprises a third partition plate, wherein the third partition plate is located between the outermost fins of the first fin group and the side wall of the accommodating cavity along the second direction, and the third partition plate is abutted to the top of the accommodating cavity.
Preferably, the heat exchanger further comprises a third partition plate, wherein the third partition plate is located between the outermost fins of the first fin group and the side wall of the accommodating cavity along the second direction, and the third partition plate is abutted with the bottom of the first partition plate.
Preferably, the liquid outlet is arranged at the side part of the accommodating cavity corresponding to the interval.
Preferably, the liquid inlet is positioned at the top of the accommodating cavity.
Preferably, the liquid inlet is located at a side portion of the accommodating cavity.
In a second aspect, the present application provides a board-level liquid cooling system, including the circuit board, locate the chip of circuit board one side, locate the heat conduction material of chip departure circuit board one side and locate the heat conduction material departure circuit board one side the liquid cooling cold plate in the arbitrary technical scheme that the above-mentioned first aspect provided.
Drawings
Fig. 1 is a schematic structural diagram of a board-level liquid cooling system according to an embodiment of the present application;
FIG. 2 is a top view of the chip of FIG. 1;
fig. 3 is a schematic structural diagram of a liquid cooling plate according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view taken at E-E of FIG. 3;
FIG. 5 is a view showing a structure of the first separator shown in FIG. 3;
fig. 6 is a schematic perspective view of a liquid cooling plate according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to the structure shown in fig. 1, an embodiment of the present application provides a board-level liquid cooling system, in which a liquid cooling plate 1 is used for being located at one side of a chip 2 to dissipate heat of the chip 2. It should be noted that a heat-conducting interface material 3 as shown in fig. 1 may be further disposed between the chip 2 and the liquid cooling plate to enhance heat dissipation effect; while the side of the chip 2 facing away from the liquid-cooled cold plate 1 is connected to the circuit board 4 (printed circuit board, PCB) or the chip 2 is arranged on the circuit board 4.
The chip 2 has different functional areas. Fig. 2 is a top view of the chip 2 in fig. 1, and as shown in fig. 2, a high power consumption area H is located in the middle of the chip 2 along the first direction, two sides of the high power consumption area H are respectively located in a low power consumption area L, and a temperature specification defined by the low power consumption area L is lower than that of the high power consumption area H.
Fig. 3 is a schematic structural diagram of a liquid cooling plate 1 according to an embodiment of the present application, and fig. 4 is a sectional view at E-E in fig. 3. As shown in fig. 3 and 4, the embodiment of the present application provides a liquid cooling plate 1, including:
the shell 11 is provided with a containing cavity, and the containing cavity is provided with a liquid inlet A and a liquid outlet B; the bottom of the accommodating cavity is provided with a first fin group 12 and a second fin group 13, the first fin group 12 and the second fin group 13 are oppositely arranged along the first direction, and a space is reserved between the first fin group 12 and the second fin group 13; the first fin group 12 includes a plurality of first fins arranged at intervals in the second direction, and first flow passages C1 are formed between adjacent first fins; the second fin group 13 includes a plurality of second fins arranged at intervals in the second direction, and second flow passages C2 are formed between adjacent second fins; the second direction is perpendicular to the first direction, and the second direction is perpendicular to the bottom of the accommodating cavity;
a first partition 14, the first partition 14 being disposed in the accommodating chamber and between the first fin group 12 and the top of the accommodating chamber; the first partition 14 is provided with a first guide channel D1 and a second guide channel D2 on one side facing the top of the accommodating cavity, the first guide channel D1 is respectively connected with the liquid inlet A and one end of the first flow channel C1, which is far away from the second flow channel C2, and the second guide channel D2 is respectively connected with the liquid inlet A and one end of the second flow channel C2, which is far away from the first flow channel C1;
and a guide-out channel is further arranged in the accommodating space and is respectively connected with the outlet end of the first flow channel C1 and the liquid outlet B, and the guide-out channel is respectively connected with the outlet end of the second flow channel C2 and the liquid outlet B.
In the above liquid-cooled cold plate 1, the liquid-cooled cold plate 1 includes a housing 11, the housing 11 has a housing cavity, and a first fin group 12 and a second fin group 13 are provided at the bottom of the housing cavity. Specifically, the first fin group 11 and the second fin group 12 are disposed opposite to each other in the first direction at the bottom of the accommodating chamber with a space therebetween. Meanwhile, a first partition 14 is arranged in the accommodating cavity, and the first partition 14 is positioned between the first fin group 12, the second fin group 13 and the top of the accommodating cavity. First flow channels C1 are formed between a plurality of first fins arranged at intervals in the second direction in the first fin group 12, and second flow channels C2 are formed between a plurality of second fins arranged at intervals in the second direction in the second fin group 14. When the liquid cooling plate 1 provided by the embodiment of the application is applied, cold fluid enters the accommodating cavity of the shell 11 from the liquid inlet A; thereafter, a part of the cold fluid enters the first introduction passage D1 between the first partition 14 and the top of the receiving chamber, and a part of the cold fluid enters the second introduction passage D2 between the first partition 14 and the top of the receiving chamber; then, the cold fluid enters the first flow channel C1 connected thereto through the first introduction channel D1, and at the same time, the cold fluid enters the second flow channel C2 connected to the second introduction channel D2 through the second introduction channel D2. Since the first introduction passage D1 is connected to the side of the first flow passage C1 facing away from the second flow passage C2, and the second introduction passage D2 is connected to the end of the second flow passage C2 facing away from the first flow passage C1, the cold fluid in the first flow passage C1 and the cold fluid in the second flow passage C2 converge toward a position near the intermediate space between the first fin group 12 and the second fin group 13. Since the outlet channel in the accommodating chamber is connected to the outlet end of the first flow channel C1 and the liquid outlet B, and at the same time, the outlet channel is connected to the outlet end of the second flow channel C2 and the liquid outlet, the cold fluid is finally led out of the interior of the housing 11.
As shown in fig. 4, in the liquid cooling plate 1 provided in this embodiment of the present application, a first guide channel D1 and a first flow channel C1 form a U-shaped flow channel, and at the same time, a second guide channel D2 and a first flow channel C2 form another U-shaped flow channel. Specifically, when the cold fluid enters the housing 11 from the liquid inlet a, the cold fluid enters the first fin group 12 and the second fin group 13 from both sides along the first partition 14, and then flows out from the liquid outlet B after meeting the gaps between the first fin group 12 and the second fin group 13. It should be noted that, in the liquid cooling cold plate 1 provided in the embodiment of the present application, the cold fluid cools the low-power consumption area L on the left and right sides of the chip 2, and then cools the middle high-power consumption area H. Therefore, the low-power consumption area L of the chip is not affected by the heat cascade of the high-power consumption area H, and the liquid cooling plate 1 provided by the embodiment of the application can realize good heat dissipation of the chip 2.
Therefore, the embodiment of the application can provide the liquid cooling cold plate 1 so as to improve the cooling capacity of the cold plate and adapt to the special chip 2.
It should be noted that there are various possibilities for setting the position of the liquid outlet B, and when the liquid outlet B is set at a different position, the setting form of the guiding-out channel is also different, at least one of the following setting forms:
in a possible embodiment, with continued reference to the structure shown in fig. 3 and 4, the liquid outlet B is located on a side of the second fin set 13 facing away from the first fin set 12, and illustratively, the liquid outlet B is located at the top of the housing 11.
Referring to the structure shown in fig. 3 and 4, the liquid cooling plate 1 further includes a second partition 15, where the second partition 15 is located on a side of the second fin set 13 away from the first fin set 11 and abuts against the top of the accommodating cavity and the bottom of the accommodating cavity, so as to avoid leakage of the cooling fluid from the second partition 15 and the top or bottom of the accommodating cavity. Specifically, the second separator 15 has a main body portion 151 and two folded edges 152 located on both sides of the main body portion 151; in the first direction, there is a gap between the main body 151 and the second fin group 13, and each of the two folded edges 152 connects the main body 151 and one of the fins of the second fin group 13 located at the outermost side in the second direction to form a flow guiding section between the second separator 15 and the second fin group 13. The diversion section is respectively connected with the second guide-in channel D2 and one end of the second flow channel C2, which is away from the first flow channel.
The second partition 15 separates the liquid outlet B from the second flow channel C2 and the second introduction channel D2. Specifically, after the cold fluid flows out from the first introduction passage D1, the second separator 15 blocks the cold fluid so that the cold fluid is introduced into the second flow passage C2 along the guide section formed by the second separator 15.
It should be noted that, with continued reference to the structure shown in fig. 3, the guiding-out channel includes a first guiding-out section S1 between the first fin group 12 and the second fin group 13, a second guiding-out section S2 between the second fin located at the outermost side of the second fin group 13 along the second direction and the inner wall of the accommodating cavity, and a third guiding-out section S3 located at a side of the second partition 15 facing away from the second fin group 13.
Based on the above technical solution, please refer to the structure shown in fig. 4, which may set: the first separator 14 is abutted against the top side end face of the first fin group 12 facing the accommodating cavity, and the first separator 14 is abutted against the top side end face of the second fin group 13 facing the accommodating cavity.
It should be noted that, since the first separator 14 abuts against the top portions of the first fin group 12 and the second fin group 13, when the cold fluid enters the first flow channel C1 and the second flow channel C2, the cold fluid can flow only along the first flow channel C1 and the second flow channel C2, and the cold fluid can be prevented from diffusing without passing through the first flow channel C1 and the second flow channel C2, so that the cooling efficiency can be improved.
Of course, in order to enhance the cooling effect of the cooling fluid on the first fin group 12 and/or the second fin group 13, referring to the structure diagram of the first partition 14 shown in fig. 5, it is also possible to provide:
the first guide-in channel D1 comprises a first main body section D11 and a first flaring section D12, the first main body section D11 is communicated with the liquid inlet A, and the flow guiding area of the first flaring section D12 is gradually increased along the direction deviating from the first main body section D11 so as to increase the heat exchanging area with the low-power consumption area L, thereby improving the heat exchanging effect; and/or the number of the groups of groups,
the second leading-in channel D2 comprises a second main body section D21 and a second flaring section D22, the second main body section D21 is communicated with the liquid inlet A, and the flow guiding area of the second flaring section D22 is gradually increased along the direction deviating from the second main body section D21 so as to increase the heat exchanging area with the low power consumption area L and further improve the heat exchanging effect.
It should be understood that the separation is schematically shown in fig. 5 as a dashed line, but the separation is not limited thereto. Fig. 6 is a schematic perspective view of a liquid cooling plate 1 according to an embodiment of the present application. As shown in fig. 6, the first partition 14 is installed inside the housing 11.
Referring to fig. 6 and referring to the structure shown in fig. 4, in order to avoid that the cold fluid flows reversely from the gap between the outermost first fin and the side wall of the accommodating cavity when flowing from the first guiding-out section S1 to the second guiding-out section S2, the liquid cooling cold plate 1 provided in the embodiment of the present application may further include a third partition 16, along the second direction, located between the outermost fin of the first fin group and the side wall of the accommodating cavity, and the third partition 16 abuts against the top of the accommodating cavity. Of course, the third partition 16 may also be disposed to abut against the bottom of the first partition 14, which is not described herein.
In another possible embodiment, the liquid outlet B is provided at a side portion of the accommodating cavity corresponding to the interval.
In another possible embodiment, the liquid inlet a is located at the top of the receiving chamber.
In another possible embodiment, the liquid inlet a is located at the side of the receiving chamber.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (7)
1. A liquid-cooled cold plate, comprising:
the shell is provided with a containing cavity, and the containing cavity is provided with a liquid inlet and a liquid outlet; the bottom of the accommodating cavity is provided with a first fin group and a second fin group, the first fin group and the second fin group are oppositely arranged along a first direction, and a space is reserved between the first fin group and the second fin group; the first fin group comprises a plurality of first fins which are arranged at intervals along the second direction, and a first flow channel is formed between every two adjacent first fins; the second fin group comprises a plurality of second fins which are arranged at intervals along a second direction, and second flow channels are formed between adjacent second fins; the second direction is perpendicular to the first direction, and the second direction is perpendicular to the bottom of the accommodating cavity;
the first partition plate is abutted to the end face of the first fin group, which faces the top of the accommodating cavity, and the first partition plate is abutted to the end face of the second fin group, which faces the top of the accommodating cavity; a first guide channel and a second guide channel are arranged on one side of the first partition plate, which faces the top of the accommodating cavity, the first guide channel is respectively connected with the liquid inlet and one end of the first flow channel, which is away from the second flow channel, and the second guide channel is respectively connected with the liquid inlet and one end of the second flow channel, which is away from the first flow channel;
the accommodating cavity is internally provided with a guide-out channel, the guide-out channel is respectively connected with the outlet end of the first flow channel and the liquid outlet, and the guide-out channel is respectively connected with the outlet end of the second flow channel and the liquid outlet;
the liquid outlet is positioned at one side of the second fin group, which is away from the first fin group;
the liquid cooling plate further comprises a second baffle plate, wherein the second baffle plate is positioned on one side of the second fin group, which is away from the first fin group, and is abutted with the top of the accommodating cavity and the bottom of the accommodating cavity; the second partition plate is provided with a main body part and two folded edges positioned at two sides of the main body part; a gap is formed between the main body part and the second fin group along the first direction, each of the two folded edges is connected with the main body part and one fin of the second fin group which is positioned at the outermost side in the second direction, so that a flow guide section is formed between the second partition plate and the second fin group; the flow guide section is respectively connected with one end of the second guide-in channel, which is away from the first flow channel, of the second flow channel;
the first guide-in channel comprises a first main body section and a first flaring section, the first main body section is communicated with the liquid inlet, and the flow guiding area of the first flaring section is gradually increased along the direction deviating from the first main body section; and/or the number of the groups of groups,
the second guide-in channel comprises a second main body section and a second flaring section, the second main body section is communicated with the liquid inlet, and the flow guide area of the second flaring section is gradually increased along the direction deviating from the second main body section.
2. The liquid cooled cold plate of claim 1, further comprising a third spacer plate positioned between the outermost fins of the first fin group and the containment cavity side wall in the second direction, and the third spacer plate is in abutment with the top of the containment cavity.
3. The liquid cooled cold plate of claim 1, further comprising a third spacer plate positioned between the outermost fins of the first fin group and the containment cavity side wall in the second direction, and the third spacer plate is in abutment with the bottom of the first spacer plate.
4. The liquid cooled cold plate of claim 1, wherein the liquid outlet is provided in a side portion of the receiving chamber corresponding to the space.
5. The liquid cooled cold plate of any one of claims 1-4 wherein the liquid inlet is located at the top of the receiving chamber.
6. The liquid cooled panel of any one of claims 1-4, wherein the liquid inlet is located on a side of the receiving cavity.
7. A board-level liquid cooling system, comprising a circuit board, a chip arranged on one side of the circuit board, a heat conducting material arranged on one side of the chip away from the circuit board, and a liquid cooling plate according to any one of claims 1-6 arranged on one side of the heat conducting material away from the circuit board.
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| CN202111030385.2A CN113840516B (en) | 2021-09-03 | 2021-09-03 | Liquid cooling cold plate and plate-level liquid cooling system |
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| CN202111030385.2A CN113840516B (en) | 2021-09-03 | 2021-09-03 | Liquid cooling cold plate and plate-level liquid cooling system |
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| CN113840516B true CN113840516B (en) | 2023-07-14 |
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| JP2016100456A (en) * | 2014-11-21 | 2016-05-30 | 日本軽金属株式会社 | Manufacturing method for liquid-cooled jacket and liquid-cooled jacket |
| CN109982544A (en) * | 2017-12-27 | 2019-07-05 | 长城汽车股份有限公司 | Liquid cooling heat radiator |
| CN110531571A (en) * | 2018-05-24 | 2019-12-03 | 中强光电股份有限公司 | Liquid cooling radiator |
| CN211745055U (en) * | 2019-08-27 | 2020-10-23 | 昆山品岱电子有限公司 | High-efficiency radiator for electronic component |
| CN112954949A (en) * | 2019-12-10 | 2021-06-11 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for same |
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