CN211630683U - Heat abstractor and electric automobile controller - Google Patents
Heat abstractor and electric automobile controller Download PDFInfo
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- CN211630683U CN211630683U CN202020069168.9U CN202020069168U CN211630683U CN 211630683 U CN211630683 U CN 211630683U CN 202020069168 U CN202020069168 U CN 202020069168U CN 211630683 U CN211630683 U CN 211630683U
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Abstract
The utility model provides a heat dissipation device and an electric automobile controller, wherein the heat dissipation device comprises a substrate, a first surface of the substrate is used for being connected with a heating element and transferring heat, and a second surface of the substrate is provided with a plurality of heat dissipation fins; the substrate is internally provided with a first cooling liquid channel, the plurality of radiating fins form a second cooling liquid channel, the first cooling liquid channel is communicated with the second cooling liquid channel, and the flow direction of cooling liquid in the first cooling liquid channel is opposite to that of cooling liquid in the second cooling liquid channel. The embodiment of the utility model provides a set up through making first coolant liquid passageway and second coolant liquid passageway fold mutually, can carry out the heat transfer cooling to the coolant liquid in the first coolant liquid passageway with the help of the coolant liquid in the second coolant liquid passageway for the head end that is in first coolant liquid passageway is unanimous with the heat transfer ability of terminal coolant liquid, and then solves the problem of the temperature uniformity after the heat dissipation, guarantees the radiating efficiency, improves the radiating effect.
Description
Technical Field
The utility model relates to a heat dissipation field, more specifically say, relate to a heat abstractor and electric automobile controller.
Background
The electric automobile controller is a core control device used for controlling starting, running, advancing and retreating, speed and stopping of a motor of the electric automobile and other electronic devices of the electric automobile, the general protection requirement grade of the electric automobile controller needs to reach IP67 grade, and the electric automobile controller is usually designed in a structural mode with high integration and high power density, so that the heat dissipation condition inside the electric automobile controller is poor, and the heat dissipation difficulty of a power module inside the electric automobile controller is higher and higher.
As shown in fig. 1, a schematic diagram of a heat dissipation structure of a conventional heat dissipation device at present, the heat dissipation device includes a substrate 11 and a cooling liquid channel disposed in the substrate 11, the cooling liquid channel penetrates through a length direction of the substrate 11, and a heat dissipation mounting position is formed in a region of an outer surface of the substrate 11 corresponding to the cooling liquid channel, a power module 12 is mounted on the heat dissipation mounting position along the length direction of the substrate 11, and a heat dissipation form of the power module 12 transfers heat of the power module 12 mounted on the heat dissipation mounting position by flowing a cooling liquid from one end to the other end of the substrate 11 in the length direction of the cooling liquid channel, thereby achieving heat dissipation and temperature reduction of the power module 12.
However, because the existing coolant channels are series-connected water channels in the same direction, there is a problem of coolant temperature accumulation (especially serious in the case of small flow of coolant and large heat generation of a heat generating device), that is, when the coolant flows to the end of the coolant channel, the heat exchange capability of the coolant is reduced because the coolant has transferred large heat at the head end, and the power module 12 assembled at the end cannot be cooled down (the heat exchange capability is reduced) by efficient heat dissipation, so that the local heat dissipation (the end of the coolant channel) is poor, and the power module 12 has a large temperature difference. Therefore, the existing heat dissipation device has obvious heat dissipation defects, and the cooling liquid in the cooling liquid channel has larger temperature difference, so that the heat exchange capacities of the cooling liquid at different positions are inconsistent, the heat dissipation temperature uniformity is poorer, and the heat dissipation effect is influenced.
As shown in fig. 2, it is known that the temperature of the power module 12 at the right end of the substrate 11 is greatly different from the temperature at the left end of the substrate 11 (the left-right direction of the substrate 11 is the longitudinal direction thereof, and the coolant flows from the left end to the right end of the substrate 11). Specifically, the temperature of the power device 121 mounted on the left end of the substrate 11 (i.e., mounted at a position corresponding to the head end of the coolant channel) is 140.8 ℃, which is the lowest temperature; the temperature of the power device 122 mounted on the right end near the substrate 11 (i.e., mounted at a position corresponding to the end of the coolant passage) is 150.2 ℃, which is the maximum temperature, i.e., the maximum temperature difference of the power module 12 is 9.4 ℃ under the heat dissipation effect of the conventional heat dissipation apparatus.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a to above-mentioned current heat abstractor's coolant liquid passageway adopt syntropy the series connection water route and make the coolant liquid in the coolant liquid passageway have great difference in temperature, cause the heat transfer ability inconsistent, make radiating temperature uniformity relatively poor and influence the problem of radiating effect, provide a heat abstractor and electric automobile controller.
The embodiment of the present invention provides a heat dissipation device, including a substrate, a first surface of the substrate is used for connecting with a heating element and transferring heat, and a second surface of the substrate is provided with a plurality of heat dissipation fins;
the substrate is internally provided with a first cooling liquid channel, the plurality of radiating fins form a second cooling liquid channel, the first cooling liquid channel is communicated with the second cooling liquid channel, and the flow direction of cooling liquid in the first cooling liquid channel is opposite to that of cooling liquid in the second cooling liquid channel.
Preferably, the first surface and the second surface have a height difference, the first coolant passage is located between the first surface and the second surface, and the first coolant passage includes a plurality of through holes.
Preferably, the first coolant passage is formed by a plurality of parallel through holes provided in a longitudinal direction of the base plate, and the second coolant passage is formed by a gap between the heat radiating fins, which are parallel to the through holes.
Preferably, the liquid inlet and the liquid outlet of the heat dissipation device are located on the same side of the substrate.
Preferably, the base plate near the two ends of the radiating fin is communicated with the first cooling liquid channel from the second surface opening hole to form an inlet and an outlet of the first cooling liquid channel;
the outlet of the first cooling liquid channel is communicated with the inlet of the second cooling liquid channel.
Preferably, the liquid inlet of the heat sink is the inlet of the first cooling liquid channel, and the liquid outlet of the heat sink is the outlet of the second cooling liquid channel;
the liquid inlet and the liquid outlet of the heat dissipation device are isolated by a blocking piece.
Preferably, two ends of each through hole are respectively provided with a sealing element.
The embodiment of the utility model also provides an electric automobile controller, including casing, heat-generating body and the heat abstractor of any one above; the heating body is fixed on the first surface of the heat dissipation device, the casing comprises a lower casing, the heat dissipation device is fixed in the casing in a mode that the second surface faces the lower casing, and a closed cavity is formed between the heat dissipation device and the lower casing.
Preferably, the second surface of the substrate has two strip-shaped supports arranged in parallel, and the second cooling liquid channel is located between the two strip-shaped supports; the base plate is connected with the lower shell in a sealing mode through the two strip-shaped supporting pieces.
Preferably, an elastic sealing ring is arranged between the base plate and the lower shell;
or, the substrate is connected with the lower housing by friction welding.
The utility model discloses heat abstractor and electric automobile controller have following beneficial effect: through making first coolant liquid passageway and second coolant liquid passageway fold the setting mutually, realize double-deck heat dissipation, and make the coolant liquid in the first coolant liquid passageway and the coolant liquid flow direction in the second coolant liquid passageway opposite, can carry out the heat transfer with the help of the coolant liquid in the second coolant liquid passageway and cool down to the coolant liquid in the first coolant liquid passageway from this, thereby the difference in temperature of the coolant liquid in balanced first coolant liquid passageway, make the heat transfer ability that is in the head end of first coolant liquid passageway and terminal coolant liquid unanimous, and then make heat abstractor's whole heat transfer more even, the problem of homogeneous temperature nature after the solution dispels the heat, guarantee the radiating efficiency, and the heat radiating effect is improved.
Drawings
Fig. 1 is a schematic structural diagram of a conventional heat dissipation device;
FIG. 2 is a temperature cloud of a power module of a conventional electric vehicle controller under the heat dissipation effect of a heat dissipation device;
fig. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a side projection of a heat dissipation device according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a partial section of an electric vehicle controller according to an embodiment of the present invention;
fig. 6 is a temperature cloud diagram of a power module of an electric vehicle controller provided by an embodiment of the present invention under the heat dissipation effect of a heat dissipation device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 3, which is a schematic structural diagram of a heat dissipation device provided in an embodiment of the present invention, the heat dissipation device may be installed in a driving motor controller of an electric vehicle or other driving motor controllers. As shown in fig. 4, the heat dissipation device in this embodiment includes a substrate 2, where the substrate 2 includes a first surface 201 and a second surface 202 (for example, when the first surface 201 is an upper surface of the substrate 2, the second surface 202 is a lower surface of the substrate 2), and the first surface 201 is mainly used for connecting with a heating element (for example, a power module) and transferring heat, that is, the first surface 201 of the substrate 2 forms a heat dissipation surface for dissipating heat from the heating element (for example, the power module), that is, the heating element mounted on the substrate 2 can transfer heat through the first surface 201, so as to dissipate heat and cool the heating element mounted on the first surface 201 of the substrate 2. The substrate 2 may be integrally formed by an extrusion process using a heat conductive metal material (e.g., aluminum metal), so as to facilitate processing and effectively reduce manufacturing cost.
The heat sink includes a first cooling liquid channel 21 and a second cooling liquid channel 22 which are communicated with each other, and the second surface 202 of the substrate 2 is provided with a plurality of heat dissipation fins 23. Specifically, the first cooling liquid channel 21 is located inside the base plate 2, and the second cooling liquid channel 22 is formed by a plurality of heat radiating fins 23 located on the second surface 202 and located outside the base plate 2. Therefore, the second cooling liquid channel 22 and the first cooling liquid channel 21 can be arranged in an overlapping manner in a direction away from the first surface 201 of the substrate 2, that is, the second cooling liquid channel 22 is located on the side of the first cooling liquid channel 21 opposite to the heat dissipation surface (i.e., the first surface 202), so that a double-layer structure can be realized to achieve a double-layer heat dissipation effect.
In practical applications, the first cooling liquid channel 21 and the second cooling liquid channel 22 are preferably arranged below the first surface 201 of the substrate 2 in an overlapping manner in a direction perpendicular to the first surface 201, that is, the first cooling liquid channel 21 and the second cooling liquid channel 22 are arranged below the heat dissipation surface (i.e., the first surface 201) in a manner of being double-layered up and down with respect to the first surface 201, the first cooling liquid channel 21 is close to the heat dissipation surface, and the second cooling liquid channel 22 is arranged on the other side of the first cooling liquid channel 21 opposite to the heat dissipation surface.
Specifically, the first cooling liquid channel 21 is located between the first surface 201 and the second surface 22 (there is a height difference between the first surface 201 and the second surface 22 of the substrate 2), and the first cooling liquid channel 21 is located between the first surface 201 and the second surface 202. In this way, because the first cooling liquid channel 21 and the second cooling liquid channel 22 are communicated, the first cooling liquid channel 21 and the second cooling liquid channel 22 can form a U-shaped water-cooling heat dissipation channel, so that the first cooling liquid channel 21 can interact with the second cooling liquid channel 22, further the temperature accumulation of the cooling liquid in the first cooling liquid channel 21 is weakened, and the situation that the cooling liquid in the first cooling liquid channel 21 has large temperature difference at different positions during heat dissipation is avoided.
To improve the heat dissipation effect, the flow direction of the coolant in the first coolant channel 21 is opposite to the flow direction of the coolant in the second coolant channel 22, that is, the head end of the first coolant channel 21 corresponds to the tail end of the second coolant channel 22, and the tail end of the first coolant channel 21 corresponds to the head end of the second coolant channel 22. Because the coolant in the second coolant channel 22 comes from the end of the first coolant channel 21, and the second coolant channel 22 does not directly radiate heat to the radiating surface of the substrate 2, the temperature of the coolant of the second coolant channel 22 is reduced from the head end to the end (radiating in the flowing process, so the end temperature is low), so that the coolant at the end of the second coolant channel 22 can exchange heat and cool the coolant at the head end of the first coolant channel 21 in time and efficiently, the temperature difference of the coolant in the first coolant channel 21 is balanced, and the radiating effect is improved. In practical applications, it is preferable that the first cooling liquid channel 21 and the second cooling liquid channel 22 are disposed adjacently, so that the heat exchange efficiency between the first cooling liquid channel 21 and the second cooling liquid channel 22 can be improved.
Above-mentioned heat abstractor is through making first coolant liquid passageway 21 and second coolant liquid passageway 22 set up mutually folding, make the coolant liquid flow in first coolant liquid passageway 21 and the second coolant liquid passageway 22 opposite simultaneously, from this, can make first coolant liquid passageway 21 and second coolant liquid passageway 22 interact, carry out the heat transfer cooling to the coolant liquid of first coolant liquid passageway 21 with the help of the coolant liquid in the second coolant liquid passageway 22, thereby the difference in temperature of the coolant liquid in the balanced first coolant liquid passageway 21, the heat transfer ability of the coolant liquid that makes different positions (head end and end) at first coolant liquid passageway 21 tends to unanimity, and then make heat abstractor's whole heat transfer more even, the problem of the homochromy after the solution dispels the heat, guarantee the radiating efficiency, the radiating effect is improved.
In one embodiment of the present invention, the second cooling liquid channel 22 is formed on the outer side of the substrate 2 and adjacent to the second surface 202. The entire structure can thereby be simplified, no additional structure or member is required to constitute the first coolant passage 21 and the second coolant passage 22, and the coolant in the first coolant passage 21 and the coolant in the second coolant passage 22 can be efficiently heat-exchanged via the second surface 202.
Specifically, the first coolant passage 21 may be constituted by a plurality of passages arranged in parallel arranged along the length direction of the substrate 2. For the convenience of processing, a plurality of through holes penetrating the length direction of the substrate 2 may be directly processed in the center in the thickness direction of the substrate 2 (for example, by extrusion processing), and then both end openings of each through hole may be sealed with a seal member (for example, by welding), and the passage constituting the first coolant passage 21 may be constituted by a portion between the seal members at both end portions of the through hole. Through the structure, the processing difficulty is favorably reduced, and the processing efficiency is improved.
Since the second surface 202 of the base plate 2 is formed with a plurality of heat dissipation fins 23, it is preferable to arrange each heat dissipation fin 23 in a perpendicular manner to the second surface 202 in order to secure structural stability. In addition, the second cooling liquid channel 22 is formed by the gap between two adjacent heat dissipation fins 23, the structure is simple, the second cooling liquid channel 22 can be formed, the effective heat dissipation area of the first cooling liquid channel 21 can be increased, and the heat dissipation effect on the first cooling liquid channel 21 can be effectively improved. The heat accessible second surface 202 of the coolant liquid in the first coolant liquid passageway 21 shifts to radiating fin 23, by the coolant liquid in the second coolant liquid passageway 22 directly shift the heat on radiating fin 23, realize high-efficient cooling, and, can also improve the heat exchange efficiency between the coolant liquid in the first coolant liquid passageway 21 and the coolant liquid in the second coolant liquid passageway 22, the difference in temperature of the coolant liquid in the first coolant liquid passageway 21 is balanced with higher speed, make above-mentioned heat abstractor's whole heat transfer more even.
Above-mentioned heat abstractor's inlet and liquid outlet lie in same one side of base plate 2, and specifically preferred sets up with adjacent mode, and existing double-deck circulation heat dissipation that is favorable to forming improves structural design's rationality, and the flow butt joint of the coolant liquid between heat abstractor and the outside coolant liquid supply device of still being convenient for or all the other heat abstractor.
As shown in fig. 5, the outlet 212 of the first cooling liquid channel 21 is located on the second surface 202, and the outlet 212 of the first cooling liquid channel 21 is located at the first end of the heat dissipation fin 23 and forms the inlet of the second cooling liquid channel 22, so that the first cooling liquid channel 21 and the second cooling liquid channel 22 are communicated.
The inlet 211 of the first coolant channel 21 is located on the second surface 202 of the substrate 2, and the inlet 211 of the first coolant channel 21 is located at the second end of the heat dissipation fin 23, so that the coolant flowing to the head end of the second coolant channel 22 can exchange heat and cool (cross-radiate) the coolant at the head end of the first coolant channel 21.
Specifically, the length of the first coolant passage 21 is greater than the length of the second coolant passage 22, and the inlet 211 of the first coolant passage 21 is located at a portion of the first coolant passage 21 beyond the second coolant passage 22. In addition, because the outlet 221 of the second cooling liquid channel 22 is located at the second end of the heat dissipation fin 23, that is, the outlet 221 of the second cooling liquid channel 22 is located between the inlet 211 of the first cooling liquid channel 21 and the heat dissipation fin 23, a stopper (a baffle structure may also be formed on the substrate 2 by integral machining) is provided between the inlet 211 of the first cooling channel 21 and the outlet 221 of the second cooling liquid channel 22 for isolation, so as to prevent the inlet 211 of the first cooling channel 21 and the outlet 221 of the second cooling liquid channel 22 from communicating with each other.
Preferably, the heat dissipation fins 23 are parallel to the channels forming the first cooling liquid channel 21, so that the effective heat dissipation area of the first cooling liquid channel 21 can be increased through the heat dissipation fins 23, the heat dissipation efficiency is improved, the temperature difference of the cooling liquid in the first cooling liquid channel 21 is further efficiently balanced, and the heat dissipation effect is improved. Furthermore, the embodiment of the utility model provides an still provide an electric automobile controller, this electric automobile controller includes casing and foretell heat abstractor. As shown in fig. five, the lower housing 3 is disposed in the housing of the electric vehicle controller, and the heat sink is fixed in the housing with the second surface 202 facing the lower housing 3. And when the heat sink is fitted into the housing, a closed cavity is formed between the second surface 202 of the heat sink and the lower housing 3, thereby forming the second coolant passage 22. Of course, the structural shape and size of the lower housing 3 can be designed according to actual requirements to form a closed cavity with the second surface 202 of the heat sink.
Specifically, the inlet 211 of the first cooling liquid channel 21 and the outlet 221 of the second cooling liquid channel 22 are respectively located on the side wall of the housing where the second surface 202 faces, and the inlet 211 of the first cooling liquid channel 21 and the outlet 221 of the second cooling liquid channel 22 are adjacently arranged, so that the integration level of the housing can be improved while the heat dissipation effect is improved, the docking with an external cooling liquid container is facilitated, and the assembling and maintenance operations are facilitated. Preferably, the liquid inlet of the heat sink is formed by the inlet 211 of the first cooling liquid channel 21, and the liquid outlet of the heat sink is formed by the outlet 221 of the second cooling liquid channel 22.
The second surface 202 of the substrate 2 has two strip-shaped supporting members 24 arranged in parallel, the second cooling liquid channel 22 is located between the two strip-shaped supporting members 24, and the substrate 2 of the heat dissipation device is hermetically connected with the lower housing 3 through the two strip-shaped supporting members 24 to form a relatively sealed channel cavity, so that the second cooling liquid channel 22 is disposed in the channel cavity.
In order to ensure the sealing performance of the first cooling liquid channel 21 and the second cooling liquid channel 22, an elastic sealing ring is arranged between the base plate 2 and the lower shell 3 to seal the gap between the base plate 2 and the lower shell 3. Of course, in practical applications, the substrate 2 may also be connected to the lower housing 3 by friction welding, which may be determined according to practical situations.
As shown in fig. 6, for the power module of the electric vehicle controller provided in the embodiment of the present invention is a temperature cloud chart under the heat dissipation effect of the heat dissipation device, it can be known from the chart that the difference between the temperature of the power module 4 located at the right end of the substrate 2 (i.e. the head end of the first cooling liquid channel 21) and the temperature located at the left end of the substrate 2 (i.e. the tail end of the first cooling liquid channel 22) is significantly reduced compared with the difference of the power module under the effect of the existing heat dissipation device. Specifically, the temperature of the power device 41 mounted on the left end of the substrate 2 (i.e., the head end of the first coolant channel 21) is 138.2 ℃, which is the lowest temperature; the temperature of the power device 42 installed at the right end of the substrate 2 (i.e., the end of the first cooling liquid channel 21) is not the maximum temperature, but the temperature of the power device 43 installed at the middle position is 143.1 ℃, which is the maximum temperature, i.e., the maximum temperature difference of the power module 4 is 4.9 ℃ for the heat dissipation of the heat dissipation device, the temperature difference of the power module 4 is greatly reduced, and the temperature of the power module 4 is generally reduced, so that the heat dissipation effect of the heat dissipation device is relatively high, and the problem of temperature uniformity after heat dissipation can be solved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A heat dissipation device is characterized by comprising a substrate, wherein a first surface of the substrate is used for being connected with a heating body and transferring heat, and a second surface of the substrate is provided with a plurality of heat dissipation fins;
the substrate is internally provided with a first cooling liquid channel, the plurality of radiating fins form a second cooling liquid channel, the first cooling liquid channel is communicated with the second cooling liquid channel, and the flow direction of cooling liquid in the first cooling liquid channel is opposite to that of cooling liquid in the second cooling liquid channel.
2. The heat dissipating device of claim 1, wherein the first surface and the second surface have a height difference, the first coolant channel is located between the first surface and the second surface, and the first coolant channel comprises a plurality of through holes.
3. The heat dissipating device of claim 2, wherein the first coolant passage is constituted by a plurality of parallel through holes provided along a length direction of the base plate, and the second coolant passage is constituted by gaps between the heat dissipating fins which are parallel to the through holes.
4. The heat dissipating device of claim 3, wherein the liquid inlet and the liquid outlet of the heat dissipating device are located on the same side of the substrate.
5. The heat dissipating device of claim 4, wherein an inlet and an outlet of the first cooling fluid channel are formed on the base plate near both ends of the heat dissipating fin and communicated from the second surface opening to the first cooling fluid channel;
the outlet of the first cooling liquid channel is communicated with the inlet of the second cooling liquid channel.
6. The heat dissipating device of claim 5, wherein the liquid inlet of the heat dissipating device is an inlet of the first cooling liquid channel, and the liquid outlet of the heat dissipating device is an outlet of the second cooling liquid channel;
the liquid inlet and the liquid outlet of the heat dissipation device are isolated by a blocking piece.
7. The heat dissipating device of claim 2, wherein a sealing member is disposed at each of both ends of each of the through holes.
8. An electric vehicle controller, characterized by comprising a case, a heat generating body, and the heat dissipating device according to any one of claims 1 to 7; the heating body is fixed on the first surface of the heat dissipation device, the casing comprises a lower casing, the heat dissipation device is fixed in the casing in a mode that the second surface faces the lower casing, and a closed cavity is formed between the heat dissipation device and the lower casing.
9. The electric automobile controller according to claim 8, wherein the second surface of the base plate has two strip-shaped supports arranged in parallel, and the second cooling liquid channel is located between the two strip-shaped supports; the base plate is connected with the lower shell in a sealing mode through the two strip-shaped supporting pieces.
10. The electric automobile controller according to claim 9, characterized in that an elastic sealing ring is arranged between the base plate and the lower housing;
or, the substrate is connected with the lower housing by friction welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020069168.9U CN211630683U (en) | 2020-01-15 | 2020-01-15 | Heat abstractor and electric automobile controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020069168.9U CN211630683U (en) | 2020-01-15 | 2020-01-15 | Heat abstractor and electric automobile controller |
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| CN211630683U true CN211630683U (en) | 2020-10-02 |
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| CN202020069168.9U Active CN211630683U (en) | 2020-01-15 | 2020-01-15 | Heat abstractor and electric automobile controller |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597202A (en) * | 2021-06-30 | 2021-11-02 | 联想(北京)有限公司 | Cold drawing and electronic equipment |
| CN116075106A (en) * | 2021-11-01 | 2023-05-05 | 华为技术有限公司 | Radiating assembly, vehicle module and vehicle |
-
2020
- 2020-01-15 CN CN202020069168.9U patent/CN211630683U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597202A (en) * | 2021-06-30 | 2021-11-02 | 联想(北京)有限公司 | Cold drawing and electronic equipment |
| CN116075106A (en) * | 2021-11-01 | 2023-05-05 | 华为技术有限公司 | Radiating assembly, vehicle module and vehicle |
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Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215000 52 tianedang Road, Yuexi Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |
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| CP03 | Change of name, title or address |