CN218603841U - Water cooling plate for electronic component - Google Patents
Water cooling plate for electronic component Download PDFInfo
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- CN218603841U CN218603841U CN202222299499.3U CN202222299499U CN218603841U CN 218603841 U CN218603841 U CN 218603841U CN 202222299499 U CN202222299499 U CN 202222299499U CN 218603841 U CN218603841 U CN 218603841U
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- water
- cooling liquid
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- mounting groove
- cooling plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model belongs to electronic component heat dissipation equipment, in particular to a water cooling plate for electronic components, which comprises a water cooling plate, wherein the water cooling plate is integrally formed, the water cooling plate is provided with a water storage tank, a water outlet tank and a mounting groove, the water storage tank and the water outlet tank are respectively positioned at two sides of the mounting groove, and the bottoms of the water storage tank and the water outlet tank are provided with water cooling plate mounting holes; the utility model designs the integrated water cooling plate comprising the water storage tank, the water outlet tank and the mounting groove, and the whole hollow part of the bottom of the mounting groove forms a flow channel, so that the space for the circulation of the cooling liquid can be increased, the capacity of the cooling liquid is increased, the contact area of the cooling liquid and the bottom of the mounting groove is increased, and the heat conduction and heat dissipation effects are increased; meanwhile, the cooling liquid flows in from a cooling liquid inlet at a relatively high position, flows out from a cooling liquid outlet at a relatively low position through a flow channel at the middle part, so that the cooling liquid is utilized separately, the heat conduction and heat dissipation effects are better, and the use performance of the product is improved.
Description
Technical Field
The utility model belongs to electronic components heat-dissipating equipment, concretely relates to water-cooling plate for electronic components.
Background
Modern electronic equipment further improves the requirements on reliability, performance indexes, power density and the like, and the thermal design of the electronic equipment is more and more important. The power device is a key device in most electronic equipment, and the reliability, safety and service life of the whole machine are directly affected by the working state of the power device. During the operation of the power device, the power device generates heat, the heat can raise the temperature of the power device, and the long-time high-temperature working environment can cause the performance of the device to be reduced and the service life of the device to be reduced, so that the heat dissipation of the device is one of the essential procedures of modern electronic equipment. While electronic devices are becoming more compact, the requirements for heat dissipation designs are also increasing. The heat dissipation mode of the water cooling plate is one of the high-efficiency heat dissipation modes of the power device at the present stage.
For example, chinese patent with application number CN201921975699.8 discloses a two-sided microchannel water cooling plate, including base frame, microchannel fin and backup pad, the base frame is for having a frame structure that runs through the opening, one side of base frame is opened there is the medium entry, the other side is opened there is the medium export, two microchannel fins symmetry set up in the both sides of base frame, the microchannel fin includes heat absorption base plate and heat dissipation teeth, the edge sealing connection of heat absorption base plate is at the opening part of base frame, the heat dissipation teeth is located on the surface of one side of heat absorption base plate, the heat dissipation teeth stretches into the inboard of base frame, the heat dissipation teeth comprises the fin that the polylith is parallel to each other, the regional microchannel that forms between two adjacent fins, be equipped with power electronic components on the surface of the other side of heat absorption base plate. The utility model has the advantages that: the heat dissipation effect is good; the structure is compact, the structural space of the whole machine is saved, and the material cost is saved; the production cost is low, and the radiating fins can be manufactured according to the thermal design requirement conditions; the heat dissipation structure can be applied to heat dissipation structures with more power electronic components.
There are many electronic product water-cooling boards on the market at present, but these current water-cooling boards are usually adopted "M" structure water route in order to improve the water-cooling effect, as stated in above-mentioned patent application file. The existing M-shaped waterway has limited heat exchange surface area, cannot fully utilize the surface of the whole water cooling plate, and has poor heat dissipation effect, so that technical personnel in the field provide the water cooling plate for electronic components to solve the technical problems in the background technology.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned weak point that exists among the prior art, the utility model provides a water-cooling plate for electronic components for solve current problem.
In order to solve the technical problem, the utility model adopts the following technical scheme:
a water cooling plate for electronic components comprises a water cooling plate, wherein the water cooling plate is integrally formed and is provided with a water storage groove, a water outlet groove and a mounting groove, the water storage groove and the water outlet groove are respectively positioned on two sides of the mounting groove, the mounting groove is used for mounting and fixing the electronic components, and water cooling plate mounting holes are formed in the bottoms of the water storage groove and the water outlet groove;
the top of the water storage tank is provided with a cooling liquid inlet, the side face of the water outlet tank is provided with a cooling liquid outlet, and the cooling liquid inlet, the cooling liquid outlet and an external cooling liquid source are communicated to form a circulating loop.
When the water cooling plate is used specifically, the water cooling plate is used for cooling and radiating electronic components of electronic products so as to improve the use performance of the products, however, the design of the existing book cooling plate is also diversified, the heat radiating effect of the water cooling plate of part of the products is not ideal, and therefore, the water cooling plate for the electronic components is designed, the water cooling plate for the electronic components is manufactured in an integrated forming mode and consists of a water storage tank, a water outlet tank and an installation groove, the electronic components are installed in the installation groove and are in contact with the installation groove, and heat conduction and radiation are carried out on the electronic components by utilizing a heat radiating copper sheet in the installation groove and the contact surface of the installation groove and the electronic components; wherein the catch basin, the play basin passes through the coolant liquid entry, coolant liquid export and external cooling liquid intercommunication form a circulation return circuit, let the coolant liquid form the circulation in the runner that the coolant liquid circulates in the bottom of mounting groove, carry out heat conduction heat dissipation to the bottom surface of mounting groove, thereby carry out heat conduction heat dissipation to electronic components, because the whole cavity in bottom of mounting groove forms the runner, can increase the space that the coolant liquid circulates, increase the capacity of coolant liquid and the area of contact of the bottom of mounting groove, increase heat conduction radiating effect, in addition the coolant liquid passes through the coolant liquid entry at the top of catch basin and gets into the catch basin, then it begins to circulate along the runner circulation and carry out heat dissipation to the bottom surface of mounting groove to hold full catch basin, then flow into the play basin, and flow out through the coolant liquid export of the side of the play basin, accomplish circulation, because the coolant liquid flows in from the coolant liquid entry of relative altitude, flow in through the runner in the middle part, flow out from the coolant liquid export of coolant liquid of relative low department, make the coolant liquid that flows out from the coolant liquid outlet of coolant liquid is after the heat exchange, make the coolant liquid obtain from the utilization of branch, the radiating effect is better, thereby improve the performance of products.
Furthermore, catch basin, play basin and mounting groove communicate each other and each inside all is hollow, forms the runner that the coolant liquid circulates at the bottom of mounting groove.
Furthermore, a heat dissipation copper sheet is arranged in the mounting groove and is fully distributed on the bottom surface of the whole mounting groove.
Further, the coolant inlet is centrally located in the top of the reservoir.
Furthermore, the cooling liquid outlet is positioned in the middle of the side surface of the water outlet groove and is parallel to the flow channel.
Compared with the prior art, the utility model, following beneficial effect has: by designing the integrated water cooling plate comprising the water storage tank, the water outlet tank and the mounting groove, the whole bottom of the mounting groove is hollow to form a flow channel, so that the flowing space of cooling liquid can be increased, the capacity of the cooling liquid is increased, the contact area of the cooling liquid and the bottom of the mounting groove is increased, and the heat conduction and heat dissipation effects are improved; simultaneously because the coolant liquid flows in from the coolant liquid entry of relative eminence, through the runner at middle part, flows out from the coolant liquid export of relative low department for the coolant liquid that flows out from the coolant liquid export all is after heat exchange, makes the coolant liquid obtain from the utilization of dividing, and the heat conduction radiating effect is better, thereby improves the performance of product.
Drawings
Fig. 1 is a schematic perspective view (view angle one) of an embodiment of a water-cooling plate for electronic components according to the present invention;
fig. 2 is a schematic perspective view (view two) of an embodiment of a water-cooling plate for electronic components according to the present invention;
fig. 3 is a schematic perspective view (view three) of a cleaning table removed in an embodiment of a water-cooling plate for electronic components according to the present invention;
reference numerals in the drawings of the specification include:
the water cooling plate comprises a water cooling plate 1, a water storage tank 101, a water outlet tank 102, a mounting groove 103, a heat dissipation copper sheet 1031, a cooling liquid inlet 104, a cooling liquid outlet 105, a water cooling plate mounting hole 106 and a flow passage 107.
Detailed Description
In order to make the present invention better understood by those skilled in the art, the technical solutions of the present invention are further described below with reference to the accompanying drawings and examples.
Wherein the showings are for the purpose of illustration only and not for the purpose of limiting the same, the same is shown by way of illustration only and not in the form of limitation; for a better explanation of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The same or similar reference numbers in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.
In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between components, is to be understood broadly, for example, as being a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows:
as shown in fig. 1-3, the utility model discloses. Specifically, the water cooling plate for the electronic component comprises a water cooling plate 1, wherein the water cooling plate 1 is integrally formed, the water cooling plate 1 is provided with a water storage tank 101, a water outlet tank 102 and a mounting groove 103, the water storage tank 101 and the water outlet tank 102 are respectively positioned at two sides of the mounting groove 103, the mounting groove 103 is used for mounting and fixing the electronic component, and water cooling plate mounting holes 106 are formed in the bottoms of the water storage tank 101 and the water outlet tank 102; the top of the water storage tank 101 is provided with a cooling liquid inlet 104, the side surface of the water outlet tank 102 is provided with a cooling liquid outlet 105, and the cooling liquid inlet 104, the cooling liquid outlet 105 and an external cooling liquid source are communicated to form a circulating loop.
When the water cooling plate is used specifically, the water cooling plate is used for cooling and radiating electronic components of electronic products so as to improve the use performance of the products, however, the design of the existing book cooling plate is also diversified, the heat radiating effect of the water cooling plate of part of the products is not ideal, and therefore, the water cooling plate for the electronic components is designed, the water cooling plate for the electronic components is manufactured in an integrated forming mode and consists of a water storage tank 101, a water outlet tank 102 and a mounting groove 103, wherein the electronic components are mounted in the mounting groove 103 and are in contact with the mounting groove 103, and the heat conduction and the heat radiation are carried out on the electronic components by utilizing a heat radiation copper sheet 1031 in the mounting groove 103 and the contact surfaces of the mounting groove 103 and the electronic components; the water storage tank 101 and the water outlet tank 102 are communicated with an external cooling liquid through a cooling liquid inlet 104 and a cooling liquid outlet 105 to form a circulating loop, the cooling liquid flows through a flow channel 107 formed in the bottom of the mounting groove 103 and flows through the cooling liquid, heat conduction and heat dissipation are carried out on the bottom surface of the mounting groove 103, and therefore heat conduction and heat dissipation are carried out on the electronic component.
The reservoir tank 101, the outlet tank 102, and the mounting tank 103 are communicated with each other and each has a hollow interior, and a flow passage 107 through which a cooling liquid flows is formed at the bottom of the mounting tank 103. A heat dissipation copper sheet 1031 is arranged in the mounting groove 103, and the heat dissipation copper sheet 1031 is fully distributed on the bottom surface of the whole mounting groove 103. The coolant inlet 104 is located centrally at the top of the reservoir 101. The coolant outlet 105 is located in the middle of the side of the outlet channel 102 and is parallel to the flow channel 107.
The above are merely embodiments of the present invention, and the common general knowledge of the known specific structures and characteristics in the schemes is not described herein too much, so that those skilled in the art can know all the common technical knowledge in the technical field of the present invention before the application date or the priority date, can know all the prior art in the field, and have the capability of applying the conventional experimental means before the date. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (5)
1. The utility model provides a water-cooling board for electronic components, includes water-cooling board (1), water-cooling board (1) is integrated into one piece, its characterized in that: the water cooling plate (1) is provided with a water storage tank (101), a water outlet tank (102) and a mounting groove (103), the water storage tank (101) and the water outlet tank (102) are respectively positioned on two sides of the mounting groove (103), the mounting groove (103) is used for mounting and fixing electronic components, and water cooling plate mounting holes (106) are formed in the bottoms of the water storage tank (101) and the water outlet tank (102);
the top of the water storage tank (101) is provided with a cooling liquid inlet (104), the side surface of the water outlet tank (102) is provided with a cooling liquid outlet (105), and the cooling liquid inlet (104), the cooling liquid outlet (105) and an external cooling liquid source are communicated to form a circulating loop.
2. A water-cooled plate for electronic components as claimed in claim 1, wherein: the water storage tank (101), the water outlet tank (102) and the mounting tank (103) are communicated with each other, the interiors of the water storage tank, the water outlet tank and the mounting tank are hollow, and a flow channel (107) through which cooling liquid flows is formed at the bottom of the mounting tank (103).
3. A water-cooled plate for electronic components as claimed in claim 2, wherein: and a heat dissipation copper sheet (1031) is arranged in the mounting groove (103), and the heat dissipation copper sheet (1031) is fully distributed on the bottom surface of the whole mounting groove (103).
4. A water-cooled plate for an electronic component as recited in claim 3, wherein: the coolant inlet (104) is located centrally at the top of the reservoir (101).
5. A water-cooled plate for an electronic component as recited in claim 4, wherein: the cooling liquid outlet (105) is positioned in the middle of the side surface of the water outlet groove (102) and is parallel to the flow channel (107).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222299499.3U CN218603841U (en) | 2022-08-31 | 2022-08-31 | Water cooling plate for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222299499.3U CN218603841U (en) | 2022-08-31 | 2022-08-31 | Water cooling plate for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218603841U true CN218603841U (en) | 2023-03-10 |
Family
ID=85399273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222299499.3U Active CN218603841U (en) | 2022-08-31 | 2022-08-31 | Water cooling plate for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218603841U (en) |
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2022
- 2022-08-31 CN CN202222299499.3U patent/CN218603841U/en active Active
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