CN219068777U

CN219068777U - Military portable 6U sealed heat dissipation case structure

Info

Publication number: CN219068777U
Application number: CN202223239728.9U
Authority: CN
Inventors: 余廷军; 陈航; 张恒强; 高祥
Original assignee: Chengdu Jiujin Technology Co ltd
Current assignee: Chengdu Jiujin Technology Co ltd
Priority date: 2022-12-05
Filing date: 2022-12-05
Publication date: 2023-05-23
Anticipated expiration: 2032-12-05

Abstract

The utility model belongs to the field of electronic equipment facilities, and particularly relates to a military portable 6U sealed radiating case structure. The specific technical scheme is as follows: the integrated circuit board comprises a case, wherein a plurality of board modules are arranged in the case, the plurality of board modules dissipate heat through a plurality of heat dissipation and ventilation devices, and the outer sides of the heat dissipation and ventilation devices are attached to the board modules. The radiating and ventilating device is detachably connected with the chassis, and the outer side of the radiating and ventilating device is attached to the front side of the board card module, so that the radiating device of the chassis can be flexibly adjusted, the radiating area of the module is increased, the radiating path is shortened, and the radiating capacity of the chassis is improved. The heat dissipation and ventilation device is of a hollow structure, the inside of the heat dissipation and ventilation device is provided with a sheet-shaped heat dissipation fin, two ends of the heat dissipation and ventilation device are communicated with a plurality of through holes on the side plate of the case, a plurality of airflow circulation channels are formed, and the heat dissipation capacity of the device is enhanced.

Description

Military portable 6U sealed heat dissipation case structure

Technical Field

The utility model belongs to the field of electronic equipment facilities, and particularly relates to a military portable 6U sealed radiating case structure.

Background

With the increasing application of electronic equipment, the electronic equipment with high heat flux density is required to be applied to outdoor, extremely cold and hot, high-humidity, high-salt fog and sand dust environments. The requirements for heat dissipation of equipment are higher and higher, and the equipment is often required to have excellent heat dissipation and high-grade protection requirements.

In a traditional 6U plugboard card sealed case, heat dissipation of a board card module is mainly achieved through locking strips at two ends of the board card module and the case, and module heat is conducted to the case through heat conduction of the locking strip faces to dissipate heat. The area of the locking strip is limited, so that the heat conduction area is small, the heat transfer path from the heating chip to the radiating surface of the chassis is long, the radiating efficiency is low, and only a module with dozens of watts of heat consumption can be used for radiating. When a plurality of high heat flux modules are arranged in the case, the heat dissipation capacity of the case is difficult to meet the requirement. The heat dissipation capability of the case is insufficient, the temperature of the module is increased, and the module is kept at a high temperature for a long time, so that the service life of electronic components is shortened and even damaged. Therefore, there is a need for a heat sink that can flexibly adjust the number of heat sinks, increase the heat dissipation area of the module, and have a strong heat dissipation capability.

Disclosure of Invention

Aiming at the defects of the device, the utility model provides a military portable 6U sealed radiating case structure which can enlarge the radiating area of a module, shorten the radiating path and has stronger radiating capability.

In order to achieve the aim of the utility model, the utility model adopts the following technical scheme: the integrated circuit board comprises a case, wherein a plurality of board modules are arranged in the case, the plurality of board modules dissipate heat through a plurality of heat dissipation and ventilation devices, and the outer sides of the heat dissipation and ventilation devices are attached to the board modules.

Preferably: the machine case is provided with the cavity, the machine case includes first curb plate to and the second curb plate that sets up relatively with first curb plate, all be provided with a plurality of through-hole on first, the second curb plate, a plurality of through-hole with the cavity intercommunication.

Preferably: the heat dissipation and ventilation device is of a hollow structure, one port of the heat dissipation and ventilation device is connected to the end face of the first side plate, the other port of the heat dissipation and ventilation device is connected with the end face of the second side plate, and the heat dissipation and ventilation device is communicated with the through hole.

Preferably: and the heat dissipation and ventilation device is internally provided with a sheet-shaped heat dissipation fin.

Preferably: and the front surface of the board card module is attached to the outer side of the heat dissipation and ventilation device.

Preferably: and a fan is arranged on the outer side of the first side plate or the second side plate.

Preferably: the integrated circuit board comprises a first side plate and a second side plate, wherein the inner sides of the first side plate and the second side plate are symmetrically provided with guide grooves, locking bars are arranged in the guide grooves, and two ends of the integrated circuit board module are detachably connected with the guide grooves through the locking bars.

The utility model has the following beneficial effects:

(1) The radiating and ventilating device is detachably connected with the chassis, and the outer side of the radiating and ventilating device is attached to the front side of the board card module, so that the radiating device of the chassis can be flexibly adjusted, the radiating area of the module is increased, the radiating path is shortened, and the radiating capacity of the chassis is improved.

(2) The heat dissipation and ventilation device is of a hollow structure, the inside of the heat dissipation and ventilation device is provided with a sheet-shaped heat dissipation fin, two ends of the heat dissipation and ventilation device are communicated with a plurality of through holes on the side plate of the case, a plurality of airflow circulation channels are formed, and the heat dissipation capacity of the device is enhanced.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a heat dissipating and ventilating device;

reference numerals: the heat dissipation plate comprises a first side plate 1, a second side plate 2, a third side plate 3, a sheet-shaped heat dissipation fin 4, a cover plate 5, a bottom plate 6, a heat dissipation and ventilation device 7 and a fan 8.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The technical means used in the examples are conventional means well known to those skilled in the art unless otherwise indicated.

In the description of the present utility model, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

As shown in fig. 1-2, the utility model discloses a military portable 6U sealed heat dissipation case structure, which comprises a case, wherein a plurality of board card modules are arranged in the case, the plurality of board card modules dissipate heat through a plurality of heat dissipation and ventilation devices 7, and the outer sides of the heat dissipation and ventilation devices 7 are attached to the board card modules.

Specifically, a plurality of heat dissipation and ventilation devices 7 are uniformly distributed in the case, the heat dissipation and ventilation devices 7 are attached to the board card module, that is to say, the board card module is subjected to heat dissipation treatment through the heat dissipation and ventilation devices 7, and the heat dissipation and ventilation devices 7 are detachably connected with the case, so that the corresponding number of heat dissipation and ventilation devices 7 can be installed in the case according to the actual use number of the board card module, the heat dissipation and ventilation devices of the case can be flexibly adjusted, the heat dissipation area of the board card module is increased, and the heat dissipation capacity of the case is improved.

Further, the case is provided with a cavity, the case comprises a first side plate 1 and a second side plate 2 which is opposite to the first side plate 1, a plurality of through holes are formed in the first side plate and the second side plate, and the through holes are communicated with the cavity.

Specifically, the chassis includes first curb plate 1, second curb plate 2, two third curb plates 3, apron 5 and bottom plate 6, and wherein first curb plate 1 and second curb plate 2 set up relatively, and first curb plate 1 and second curb plate 2 are provided with a plurality of through-hole respectively, therefore the chassis is not airtight structure, is a structure that gas circulated.

Further, the heat dissipation and ventilation device 7 is of a hollow structure, one port of the heat dissipation and ventilation device is connected to the end face of the first side plate 1, the other port of the heat dissipation and ventilation device is connected to the end face of the second side plate 2, and the heat dissipation and ventilation device 7 is communicated with the through hole.

Specifically, the heat dissipation and ventilation device 7 is internally provided with an air channel, two ends of the air channel are respectively connected with the inner sides of the first side plate 1 and the second side plate 2, wherein through holes on the first side plate and the second side plate are communicated with the heat dissipation and ventilation device 7, when air flows from the through hole on one side plate to flow through the air channel in the heat dissipation and ventilation device 7, and finally flows to the through hole on the side plate on the other side of the chassis, an air flow channel is formed, that is, heat of the board card module is directly conducted from the front of the module to the heat dissipation and ventilation device 7, and heat exchange is carried out between the board card module and the air flow through the heat dissipation and ventilation device 7, so that a heat dissipation path is shortened, and heat dissipation efficiency is improved.

In order to enhance the heat dissipation effect, the heat dissipation and ventilation device 7 is internally provided with a sheet-shaped heat dissipation fin 4.

Specifically, the fins can be arranged inside the heat dissipation and ventilation device 7 in a fastening mode, a needle mode, a section welding mode and the like, the air channel is divided into a plurality of small air channels, and the heat dissipation capacity of the device is enhanced.

Further, the front surface of the board card module is attached to the outer side of the heat dissipation and ventilation device 7.

Specifically, the part of the board card module needing heat dissipation is the front, and the front of the board card module is attached to the outer side of the heat dissipation and ventilation device 7, so that the heat dissipation efficiency of the device is greatly improved.

Further, a fan 8 is arranged on the outer side of the first side plate 1 or the second side plate 2.

Specifically, the fan 8 rotates to drive air to flow, so that air flows from one side of the chassis to the other side of the chassis through the heat dissipation and ventilation device 7, wherein the fan 8 can be mounted on any one side of the first side plate 1 and the second side plate 2 of the chassis, and the action mode of the fan can be an air draft mode or an air blowing mode.

In order to realize detachable connection of the board card module and the chassis, guide grooves are symmetrically formed in the inner sides of the first side plate 1 and the second side plate 2, locking bars are arranged in the guide grooves, and two ends of the board card module are detachably connected with the guide grooves through the locking bars.

The above embodiments are only illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications, variations, alterations, substitutions made by those skilled in the art to the technical solution of the present utility model should fall within the protection scope defined by the claims of the present utility model without departing from the spirit of the design of the present utility model.

Claims

1. The utility model provides a for military use portable 6U seals heat dissipation machine case structure which characterized in that: the integrated circuit board cooling and ventilating device comprises a case, wherein a plurality of board card modules are arranged in the case, the plurality of board card modules radiate heat through a plurality of cooling and ventilating devices (7), and the outer sides of the cooling and ventilating devices (7) are attached to the board card modules.

2. The military portable 6U sealed heat dissipating chassis structure of claim 1, wherein: the case is provided with a cavity, the case comprises a first side plate (1) and a second side plate (2) which is arranged opposite to the first side plate (1), a plurality of through holes are formed in the first side plate and the second side plate, and the through holes are communicated with the cavity.

3. The military portable 6U sealed heat dissipating chassis structure of claim 2, wherein: the heat dissipation and ventilation device (7) is of a hollow structure, one port of the heat dissipation and ventilation device is connected to the end face of the first side plate (1), the other port of the heat dissipation and ventilation device is connected with the end face of the second side plate (2), and the heat dissipation and ventilation device (7) is communicated with the through hole.

4. The military portable 6U sealed heat dissipating chassis structure of claim 1, wherein: a sheet-shaped radiating fin (4) is arranged in the radiating and ventilating device (7).

5. The military portable 6U sealed heat dissipating chassis structure of claim 1, wherein: the front surface of the board card module is attached to the outer side of the heat dissipation and ventilation device (7).

6. The military portable 6U sealed heat dissipating chassis structure of claim 2, wherein: the fan (8) is arranged on the outer side of the first side plate (1) or the second side plate (2).

7. The military portable 6U sealed heat dissipating chassis structure of claim 2, wherein: the integrated circuit board is characterized in that guide grooves are symmetrically formed in the inner sides of the first side plate (1) and the second side plate (2), locking bars are arranged in the guide grooves, and two ends of the integrated circuit board module are detachably connected with the guide grooves through the locking bars.