CN220044049U - Full brick power module structure - Google Patents
Full brick power module structure Download PDFInfo
- Publication number
- CN220044049U CN220044049U CN202321525257.XU CN202321525257U CN220044049U CN 220044049 U CN220044049 U CN 220044049U CN 202321525257 U CN202321525257 U CN 202321525257U CN 220044049 U CN220044049 U CN 220044049U
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- plate
- metal heat
- heat conduction
- heat
- heat dissipation
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- 239000011449 brick Substances 0.000 title claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims description 77
- 229910052751 metal Inorganic materials 0.000 claims description 77
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- 239000004519 grease Substances 0.000 claims description 14
- 241000463219 Epitheca Species 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 12
- 239000011810 insulating material Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Abstract
The utility model relates to the field of power modules, in particular to a full brick power module structure, which comprises a bottom plate, wherein an upper shell is arranged at the top of the bottom plate, mounting seats are arranged at four corners of the top of the bottom plate, PCBA circuit boards are fixedly arranged at the tops of the four mounting seats through bolts, a lower shell is arranged at the bottom of the bottom plate, a heat conduction component is arranged at the bottom of the PCBA circuit board, a heat dissipation component is arranged at the bottom of the heat conduction component, the heat dissipation component is arranged in the lower shell, and an air cooling component is arranged in the lower shell, so that the full brick power module structure has the advantages that: the heat generated by the PCBA circuit board during operation can be timely led out and subjected to heat dissipation operation, and the heat dissipation assembly is actively dissipated through an air cooling mode, so that the heat exchange efficiency of the heat dissipation assembly and the outside is effectively improved, namely the heat dissipation effect is effectively improved, the heat accumulation in the whole brick power supply module is effectively reduced, and the service life of the whole brick power supply module is prolonged.
Description
Technical Field
The utility model relates to the field of power modules, in particular to a full brick power module structure.
Background
The power module has the outstanding advantages of small size, high power and the like, and the size of the power module is like a brick, so the power module is called a brick power supply. The full brick power supply is one of power supply modules with high power and wide application, and as the power design requirement of the product of the full brick power supply is larger and larger, the density of components is higher and higher, the volume miniaturization requirement is increasingly tended, and the heat generated during corresponding working is also increased.
Through retrieving, the bulletin number is a full brick power module structure of CN217182260U, the power distribution box comprises a box body, the inside fixedly provided with module mainboard of box body, module mainboard's lateral wall fixedly connected with heat conduction ring, the one end lateral wall fixedly connected with a plurality of radiating bars that the heat conduction ring is close to the box body, the junction fixedly connected with connecting block of radiating bar and box body, the opening has been seted up to the lateral wall of box body, open-ended inner wall fixedly connected with filter screen, the box body is located open-ended inner wall and is provided with opening and shutting mechanism.
Said utility model can timely discharge the heat produced by power supply module when it is used, and can reduce heat accumulation in the interior of power supply module so as to raise service life of power supply module, but when the heat produced by its internal main board is transferred onto the heat-radiating rod by means of metal heat-conducting rod and heat-conducting ring, the heat-radiating rod can only be used for passive heat exchange with external environment, so that its heat-exchanging efficiency is low, i.e. its heat-radiating effect is poor, and still further improvement is required.
Therefore, it is necessary to invent a full brick power module structure.
Disclosure of Invention
Therefore, the present utility model provides a full brick power module structure to solve the above-mentioned problems in the prior art.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a full brick power module structure, includes the bottom plate, and the bottom plate top is provided with the epitheca, and four corners in bottom plate top are provided with the mount pad, and four mount pad tops have PCBA circuit board through bolt fixed mounting, the bottom plate bottom is provided with the inferior valve, PCBA circuit board bottom is provided with heat conduction subassembly, heat conduction subassembly bottom is provided with heat dissipation subassembly, heat dissipation subassembly sets up in the bottom plate bottom, just heat dissipation subassembly is located the inferior valve, be provided with air cooling subassembly in the inferior valve.
Preferably, the heat conduction assembly comprises a heat conduction silicone grease layer and a metal heat conduction plate, wherein the heat conduction silicone grease layer is coated at the bottom of the PCBA circuit board, the bottom of the heat conduction silicone grease layer is coated at the top of the metal heat conduction plate, a plurality of metal heat conduction rods are vertically and fixedly arranged at the bottom of the metal heat conduction plate, and a plurality of metal heat conduction rods are arranged from left to right at equal intervals.
Preferably, the bottom plate is provided with a plurality of through holes, the through holes and the metal heat conducting rods are respectively in one-to-one correspondence, the bottom ends of the metal heat conducting rods vertically penetrate through the corresponding through holes, and the surfaces of the metal heat conducting rods are attached to the walls of the corresponding through holes.
Preferably, the heat dissipation assembly comprises a metal heat dissipation plate, the top of the metal heat dissipation plate is fixedly arranged at the bottom of the bottom plate, the metal heat dissipation plate is positioned at the inner side of the lower shell, a plurality of heat conduction rods are fixedly connected to the top of the metal heat dissipation plate, and a plurality of heat dissipation holes are uniformly formed in the metal heat dissipation plate.
Preferably, the air cooling assembly comprises an air inlet hole, a plurality of air inlet holes are formed in the rear end of the lower shell, and a first dustproof filter screen is fixedly installed inside each air inlet hole.
Preferably, a plurality of cooling fans are fixedly arranged on the rear side of the inner wall of the lower shell, the cooling fans and the air inlet holes are respectively in one-to-one correspondence, the air inlet holes are positioned right behind the corresponding cooling fans, and the cooling fans are positioned right behind the metal cooling plate.
Preferably, an air outlet is formed in the front end of the lower shell, and a dust-proof filter screen II is fixedly arranged in the air outlet.
Preferably, a plurality of pins are symmetrically arranged at the left end and the right end of the PCBA circuit board, and the tops of the pins vertically penetrate through the top of the upper shell.
The beneficial effects of the utility model are as follows: through the cooperation of bottom plate, epitheca, mount pad, PCBA circuit board, inferior valve, heat conduction subassembly, radiator unit and the forced air cooling subassembly that set up and use, can in time derive the heat that PCBA circuit board produced when moving to the heat dissipation operation, and carry out initiative heat dissipation to radiator unit through the form of forced air cooling, thereby effectively accelerate radiator unit and external heat exchange efficiency, effectively improve the radiating effect promptly, effectively reduce the inside heat gathering of full brick power module, thereby improve full brick power module's life.
Drawings
FIG. 1 is a perspective view of a structure provided by the present utility model;
fig. 2 is a cross-sectional view of a structure in a front view direction provided by the present utility model;
FIG. 3 is a cross-sectional view of a structure in a side view provided by the present utility model;
FIG. 4 is a perspective view of a metal heat conducting plate, a metal heat conducting rod, a metal heat dissipating plate and heat dissipating holes according to the present utility model;
fig. 5 is a perspective view of a structure provided by the present utility model.
In the figure: 1. a bottom plate; 2. an upper case; 3. a mounting base; 4. PCBA circuit board; 5. pins; 6. a thermally conductive silicone grease layer; 7. a metal heat-conducting plate; 8. a metal heat conducting rod; 9. a through hole; 10. a metal heat dissipation plate; 11. a heat radiation hole; 12. a lower case; 13. an air inlet hole; 14. a dustproof filter screen I; 15. a heat radiation fan; 16. an air outlet hole; 17. and a dustproof filter screen II.
Detailed Description
The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.
Referring to fig. 1-5, the utility model provides a full brick power module structure, which comprises a bottom plate 1, wherein an upper shell 2 is arranged at the top of the bottom plate 1, mounting seats 3 are arranged at four corners of the top of the bottom plate 1, PCBA circuit boards 4 are fixedly arranged at the tops of the four mounting seats 3 through bolts, a plurality of pins 5 are symmetrically arranged at the left end and the right end of each PCBA circuit board 4, the top ends of the pins 5 vertically penetrate through the top of the upper shell 2 and can be used for connecting a wire harness, a lower shell 12 is arranged at the bottom of the bottom plate 1, a heat conducting component is arranged at the bottom of each PCBA circuit board 4, a heat radiating component is arranged at the bottom of the bottom plate 1, the heat radiating component is positioned in the lower shell 12, and an air cooling component is arranged in the lower shell 12;
the heat conduction assembly comprises a heat conduction silicone grease layer 6 and a metal heat conduction plate 7, wherein the heat conduction silicone grease takes organic silicone as a main raw material, a material with excellent heat resistance and heat conduction performance is added, the manufactured heat conduction type organic silicone grease compound is used for heat conduction and heat dissipation of electronic components such as a power amplifier, a transistor, an electronic tube, a CPU and the like, the heat conduction silicone grease layer 6 is coated at the bottom of the PCBA circuit board 4, the bottom of the heat conduction silicone grease layer 6 is coated at the top of the metal heat conduction plate 7, namely, when the PCBA circuit board 4 operates, generated heat energy can be conducted onto the metal heat conduction plate 7 through the heat conduction silicone grease layer 6, a plurality of metal heat conduction rods 8 are vertically and fixedly arranged at the bottom of the metal heat conduction plate 7 from left to right, namely, the heat energy conducted onto the metal heat conduction plate 7 can be continuously conducted through the metal heat conduction rods 8, a plurality of through holes 9 are formed in the base plate 1, the through holes 9 are respectively corresponding to the metal heat conduction rods 8 one by one, the bottom ends of the metal heat conduction rods 8 vertically penetrate through the corresponding through holes 9, the surfaces of the metal heat conduction rods 8 are attached to the walls of the corresponding through holes 9, namely, when the base plate 1 penetrates through the metal heat conduction rods 8 and the metal heat conduction plate 1, and the potting adhesive has good performance, and the following design is reasonable, and leakage is prevented;
the heat radiation component comprises a metal heat radiation plate 10, the top of the metal heat radiation plate 10 is fixedly arranged at the bottom of the bottom plate 1, the metal heat radiation plate 10 is positioned at the inner side of the lower shell 12, the bottom ends of a plurality of metal heat conduction rods 8 are fixedly connected to the top of the metal heat radiation plate 10, namely heat can be conducted to the metal heat radiation plate 10 positioned at the outer side of the bottom plate 1 through the plurality of metal heat conduction rods 8, and a plurality of heat radiation holes 11 are uniformly formed in the metal heat radiation plate 10, so that the heat radiation area can be effectively increased, and the heat radiation effect can be improved;
the air cooling assembly comprises an air inlet hole 13, a plurality of air inlet holes 13 are formed in the rear end of a lower shell 12, a first dustproof filter screen 14 is fixedly installed in each of the plurality of air inlet holes 13 and can be used for filtering dust and other impurities, dust and other impurities are prevented from adhering to the surfaces of a metal radiating plate 10 and the radiating holes 11, continuous radiating performance of the metal radiating plate 10 and the radiating holes 11 is guaranteed, a plurality of radiating fans 15 are fixedly installed on the rear side of the inner wall of the lower shell 12, the plurality of radiating fans 15 and the plurality of air inlet holes 13 are respectively in one-to-one correspondence, the air inlet holes 13 are located right behind the corresponding radiating fans 15, the plurality of radiating fans 15 are located right behind the metal radiating plate 10, so that when the plurality of radiating fans 15 do work, external air can be sucked in by the air inlet holes 13 and accelerated to form cold air, and then is blown to the metal radiating plate 10, under the action of the plurality of radiating holes 11, namely, the contact surface of the metal radiating plate 10 and the cold air can be effectively increased, so that heat on the metal radiating plate 10 and the cold air can be quickly cooled, and heat on the metal radiating plate 10 can be effectively increased, and the heat conducting to the corresponding radiating plate 10 can be quickly cooled, and the heat in the front of the metal radiating plate 10 can be effectively, therefore, the heat exchange efficiency is effectively improved, and the heat efficiency is effectively and the heat-conducting efficiency is effectively improved, and the heat energy can be effectively and the heat-insulating material, and heat-insulating material heat insulating material.
In the utility model, the metal heat conducting plate 7, the metal heat conducting rod 8 and the metal heat radiating plate 10 are all preferably made of metal copper, so that the metal heat conducting plate has better heat conducting performance, the materials are easy to obtain, and the cost is controllable.
The working principle of the utility model is as follows: when the PCBA circuit board 4 operates, the generated heat energy can be conducted onto the metal heat conducting plate 7 through the heat conducting silicone grease layer 6 and then is transferred onto the metal heat radiating plate 10 through the metal heat conducting rod 8, when a plurality of heat radiating fans 15 do work, external air can be sucked in through the air inlet holes 13 and accelerated to form cold air and then is blown to the metal heat radiating plate 10, under the action of the plurality of heat radiating holes 11, the cold air can flow through the plurality of heat radiating holes 11, namely the contact surface between the metal heat radiating plate 10 and the cold air is effectively increased, so that the heat conducted onto the metal heat radiating plate 10 is rapidly cooled, active heat radiation can be carried out on the metal heat radiating plate 10, the heat exchange efficiency between the metal heat radiating plate 10 and the outside is effectively improved, namely the heat radiating effect is effectively improved, the heat accumulation inside the whole brick power module is effectively reduced, and the service life of the whole brick power module is prolonged.
The above description is only of the preferred embodiments of the present utility model, and any person skilled in the art may modify the present utility model or make modifications to the present utility model with the technical solutions described above. Therefore, any simple modification or equivalent made according to the technical solution of the present utility model falls within the scope of the protection claimed by the present utility model.
Claims (8)
1. The utility model provides a full brick power module structure, includes bottom plate (1), and bottom plate (1) top is provided with epitheca (2), and four corners in bottom plate (1) top are provided with mount pad (3), and four mount pad (3) tops have PCBA circuit board (4) through bolt fixed mounting, its characterized in that: the novel printed circuit board assembly is characterized in that a lower shell (12) is arranged at the bottom of the bottom plate (1), a heat conducting component is arranged at the bottom of the PCBA circuit board (4), a heat radiating component is arranged at the bottom of the heat conducting component, the heat radiating component is arranged at the bottom of the bottom plate (1), the heat radiating component is located in the lower shell (12), and an air cooling component is arranged in the lower shell (12).
2. The full brick power supply module structure of claim 1 wherein: the heat conduction assembly comprises a heat conduction silicone grease layer (6) and a metal heat conduction plate (7), wherein the heat conduction silicone grease layer (6) is coated at the bottom of the PCBA circuit board (4), the bottom of the heat conduction silicone grease layer (6) is coated at the top of the metal heat conduction plate (7), a plurality of metal heat conduction rods (8) are vertically and fixedly arranged at the bottom of the metal heat conduction plate (7), and a plurality of metal heat conduction rods (8) are arranged from left to right at equal intervals.
3. A full brick power supply module structure according to claim 2, wherein: a plurality of through holes (9) are formed in the bottom plate (1), the through holes (9) correspond to the metal heat conducting rods (8) one by one, the bottom ends of the metal heat conducting rods (8) vertically penetrate through the corresponding through holes (9), and the surfaces of the metal heat conducting rods (8) are attached to the walls of the corresponding through holes (9).
4. A full brick power supply module structure according to claim 3, wherein: the heat dissipation assembly comprises a metal heat dissipation plate (10), the top of the metal heat dissipation plate (10) is fixedly arranged at the bottom of the bottom plate (1), the metal heat dissipation plate (10) is located on the inner side of the lower shell (12), a plurality of metal heat conduction rods (8) are fixedly connected to the top of the metal heat dissipation plate (10), and a plurality of heat dissipation holes (11) are uniformly formed in the metal heat dissipation plate (10).
5. The full brick power supply module structure of claim 4 wherein: the air cooling assembly comprises an air inlet hole (13), a plurality of air inlet holes (13) are formed in the rear end of the lower shell (12), and a plurality of dustproof filter screens I (14) are fixedly installed inside the air inlet holes (13).
6. The full brick power supply module structure of claim 5 wherein: a plurality of cooling fans (15) are fixedly arranged on the rear side of the inner wall of the lower shell (12), the cooling fans (15) are respectively in one-to-one correspondence with the air inlet holes (13), the air inlet holes (13) are positioned right behind the corresponding cooling fans (15), and the cooling fans (15) are positioned right behind the metal cooling plate (10).
7. The full brick power supply module structure of claim 6 wherein: an air outlet hole (16) is formed in the front end of the lower shell (12), and a dustproof filter screen II (17) is fixedly arranged in the air outlet hole (16).
8. The full brick power supply module structure of claim 1 wherein: a plurality of pins (5) are symmetrically arranged at the left end and the right end of the PCBA circuit board (4), and the top ends of the pins (5) vertically penetrate through the top of the upper shell (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321525257.XU CN220044049U (en) | 2023-06-15 | 2023-06-15 | Full brick power module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321525257.XU CN220044049U (en) | 2023-06-15 | 2023-06-15 | Full brick power module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220044049U true CN220044049U (en) | 2023-11-17 |
Family
ID=88726203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321525257.XU Active CN220044049U (en) | 2023-06-15 | 2023-06-15 | Full brick power module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220044049U (en) |
-
2023
- 2023-06-15 CN CN202321525257.XU patent/CN220044049U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |