CN213149701U - Combined heat dissipation structure for CPU and server - Google Patents
Combined heat dissipation structure for CPU and server Download PDFInfo
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- CN213149701U CN213149701U CN202022464257.6U CN202022464257U CN213149701U CN 213149701 U CN213149701 U CN 213149701U CN 202022464257 U CN202022464257 U CN 202022464257U CN 213149701 U CN213149701 U CN 213149701U
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Abstract
The utility model relates to a combination formula heat radiation structure and server for CPU belongs to electronic component heat dissipation technical field. This a combination formula heat radiation structure for CPU includes: a plurality of heat dissipation fans; the first radiators are close to the radiating fans, and a plurality of first radiating fins are arranged on each first radiator; the second radiators are arranged in parallel with the first radiators in a one-to-one correspondence mode, the second radiators are far away from the radiating fans, the second radiators are provided with second radiating fins, and the distance between every two adjacent first radiating fins is larger than the distance between every two adjacent second radiating fins. The server comprises a combined heat dissipation structure for the CPU. The combined heat dissipation structure for the CPU has a good heat dissipation effect, reduces the temperature difference between the front row CPU and the rear row CPU, and improves the overall performance of the server.
Description
Technical Field
The utility model belongs to the technical field of the electronic component heat dissipation, concretely relates to combination formula heat radiation structure and server for CPU.
Background
In the continuous deepening of cloud computing and artificial intelligence application, a large number of high-end four-way eight-way servers are increased, the more CPUs and memories, the stronger the performance of the whole machine, and the linear arrangement of the front and back rows of CPUs can effectively increase the number of the memories and other components and parts, thereby improving the performance of the servers.
However, the arrangement mode can cause the problems of large temperature difference between the front CPU and the rear CPU and the defects of overhigh temperature of the rear CPU and even exceeding the specification requirement, so that a server designer rarely adopts the scheme, and the performance of the server cannot be better improved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve above-mentioned technical problem and provide a combination formula heat radiation structure and server for CPU, the radiating effect is good, has reduced front-seat and back row CPU's the difference in temperature, improves the wholeness ability of server.
The utility model provides an above-mentioned technical problem's technical scheme as follows: a modular heat dissipation structure for a CPU, comprising:
a plurality of heat dissipation fans;
the first radiators are close to the radiating fans, and a plurality of first radiating fins are arranged on each first radiator;
the second radiators are arranged in parallel with the first radiators in a one-to-one correspondence mode, the second radiators are far away from the radiating fans, the second radiators are provided with second radiating fins, and the distance between every two adjacent first radiating fins is larger than the distance between every two adjacent second radiating fins.
The utility model has the advantages that: (1) the distance between two adjacent first radiating fins in the first radiator is larger than the distance between two adjacent second radiating fins in the second radiator, so that air blown by the radiating fan only absorbs part of heat when passing through the first radiating fins and does not reach a saturated state, and the air can also carry out heat exchange and radiation after contacting with the second radiating fins;
(2) because the distance between two adjacent second radiating fins is small, the contact area with air is large, the pressure during contact is large, and the heat is easy to radiate, thereby realizing the uniform radiation of the first radiator and the second radiator without the temperature difference;
(3) the first radiator and the second radiator can be arranged in parallel, the number of CPUs arranged in the same space is large, and the overall performance is improved.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Furthermore, the distance between two adjacent first radiating fins is 2.5-3.5 mm; the distance between every two adjacent second radiating fins is 1-2 mm.
The beneficial effect of adopting the further scheme is that: the radiating effect is better, and the heat dissipation is more even, can not produce the difference in temperature.
Further, the distance between two adjacent first radiating fins is 2.5 mm; the distance between two adjacent second radiating fins is 1.5 mm.
The beneficial effect of adopting the further scheme is that: the radiating effect is better, and the heat dissipation is more even, can not produce the difference in temperature.
Further, the first radiator comprises a first mounting seat and a first mounting column, the first mounting column is vertically arranged, the lower end of the first mounting column is fixedly connected with the first mounting seat, the first radiating fins are stacked and fixed on the first mounting column, and the first radiating fins are horizontally arranged.
The beneficial effect of adopting the further scheme is that: the first radiating fins are convenient to install.
Furthermore, a plurality of first mounting screws are arranged on the first mounting base.
The beneficial effect of adopting the further scheme is that: conveniently fix first mount pad on the mainboard through first mounting screw.
Further, a first fixing nut for fixing the plurality of first heat dissipation fins is arranged at the upper end of the first mounting column.
The beneficial effect of adopting the further scheme is that: the first radiating fins are fixed effectively and cannot fall off randomly.
Further, the second radiator comprises a second mounting seat and a second mounting column, the second mounting column is vertically arranged, the lower end of the second mounting column is fixedly connected with the second mounting seat, a plurality of second radiating fins are stacked and fixed on the second mounting column, and the plurality of second radiating fins are horizontally arranged.
The beneficial effect of adopting the further scheme is that: the second radiating fins are convenient to install.
Furthermore, a plurality of second mounting screws are arranged on the second mounting base, and second fixing nuts used for fixing a plurality of second radiating fins are arranged at the upper ends of the second mounting columns.
The beneficial effect of adopting the further scheme is that: the second mounting seat is convenient to mount, the fixing effect on the second radiating fins is good, and the second radiating fins cannot fall off randomly.
The utility model also provides a server, include the combination formula heat radiation structure who is used for CPU as above-mentioned.
Further, the server comprises a machine shell, a main board, electronic elements and a CPU, wherein the main board is installed in the machine shell, a plurality of installing ports used for installing the cooling fans are formed in the machine shell, the cooling fans are installed in the installing ports, additional air is blown into the machine shell through the cooling fans, the electronic elements and the CPU are installed on the main board and are arranged in an array mode, the first radiator is installed above the CPU close to the cooling fans, the second radiator is installed above the CPU far away from the cooling fans, and a plurality of radiating holes used for discharging hot air are formed in the side wall, opposite to the cooling fans, of the machine shell.
The server has the beneficial effects that: through the heat dissipation mode of the combined design, the CPU can be linearly arranged front and back, more memories and other components can be arranged under the condition that the area of the main board of the whole machine is not changed, so that the operational performance of the whole machine is improved, meanwhile, the air generated by the heat radiation fan can quickly pass through the first radiator and keep relatively small pressure drop, and simultaneously a small amount of heat is exchanged to form relatively low-temperature air to be blown to the second radiator, the second heat dissipation fins on the second heat dissipater are denser to form high wind pressure, more heat of the CPU in the rear row can be taken away quickly than wind energy at lower temperature, thereby ensuring that the temperature of the front and back rows of CPUs can meet the design requirement and avoiding the conventional staggered arrangement mode of the front and back rows of CPUs of the four-way server in the industry, the staggered placement of the front and back rows of the CPU increases the wiring area of the CPU, thereby reducing the placement positions of the memory and other components and parts and reducing the performance of the server.
Drawings
Fig. 1 is a schematic diagram of the internal structure of the server of the present invention;
fig. 2 is a schematic structural view of a first heat sink according to the present invention;
fig. 3 is a schematic structural diagram of a second heat sink according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a first heat sink; 2. a second heat sink; 3. a heat radiation fan; 4. a housing; 5. a main board; 6. an electronic component; 7. heat dissipation holes; 8. a first mounting seat; 9. a first mounting screw; 10. a first mounting post; 11. a first heat radiation fin; 12. a first fixing nut; 13. a second heat radiation fin; 14. a second mounting seat; 15. a second mounting screw; 16. a second mounting post; 17. a second retaining nut.
Detailed Description
The principles and features of the present invention are described below in conjunction with the following drawings, the examples given are only intended to illustrate the present invention and are not intended to limit the scope of the present invention.
Examples
As shown in fig. 1 to 3, the present embodiment provides a combined heat dissipation structure for a CPU, including: a plurality of heat radiation fans 3, a plurality of first heat sinks 1, and a plurality of second heat sinks 2.
The plurality of first heat sinks 1 are close to the plurality of heat dissipation fans 3, and a plurality of first heat dissipation fins 11 are disposed on each of the plurality of first heat sinks 1. The plurality of second radiators 2 and the plurality of first radiators 1 are arranged in parallel in a one-to-one correspondence manner, the plurality of second radiators 2 are arranged far away from the plurality of radiating fans 3, the plurality of second radiators 2 are respectively provided with a plurality of second radiating fins 13, and the distance between every two adjacent first radiating fins 11 is larger than the distance between every two adjacent second radiating fins 13.
The plurality of heat dissipation fans 3 are arranged in parallel, and air is blown to the first heat sink 1 by the heat dissipation fans 3. The heat dissipation is realized by heat exchange between the heat dissipation fins on the first heat sink 1 and the flowing air, and then the air continuously flows to the second heat sink 2, and heat exchange is performed through the second heat dissipation fins 13 to dissipate heat. Because the interval between two adjacent first heat radiation fins 11 is greater than the interval between two adjacent second heat radiation fins 13, when making the air flow between first heat radiation fins 11, atmospheric pressure is little, it is fast, the heat of taking away is few, and when getting into second heat radiation fins 13, make second heat radiation fins 13 fully contact with the air, can dispel the heat, thereby first radiator 1 and second radiator 2 can become a set up, still keep the radiating effect simultaneously, the degree of consistency of dispelling the heat simultaneously is high, the performance that the high influence CPU of difference in temperature or local temperature can not appear.
The prior art can set up first radiator 1 and second radiator 2 crisscross in order to guarantee the heat dissipation for radiator fan 3 blows the air respectively and arrives first radiator 1 and second radiator 2, but because second radiator 2 discrete hot-blast fan 3 is far away, the condition of the difference in temperature still can appear, simultaneously because crisscross distribution back, be unfavorable for carrying out reasonable layout to CPU, make the CPU quantity that sets up in the same space size reduce, reduced holistic performance.
According to the technical scheme of the embodiment, the distance between two adjacent first radiating fins 11 in the first radiator 1 is larger than the distance between two adjacent second radiating fins 13 in the second radiator 2, so that air blown by the radiating fan 3 only absorbs part of heat when passing through the first radiating fins 11, does not reach a saturated state, and can also perform heat exchange and heat dissipation after contacting with the second radiating fins 13. And because the distance between two adjacent second heat radiation fins 13 is small, the contact area with air is large, the pressure during contact is large, and heat radiation is easier, thereby realizing uniform heat radiation of the first heat radiator 1 and the second heat radiator 2 without temperature difference. In addition, the first radiator 1 and the second radiator 2 can be arranged in parallel, the number of CPUs arranged in the same space is large, and the overall performance is improved.
Preferably, in this embodiment, the distance between two adjacent first heat dissipation fins 11 is 2.5-3.5 mm; the distance between two adjacent second heat dissipation fins 13 is 1-2 mm. Preferably, the distance between two adjacent first radiator fins 11 is 2.5 mm; the distance between two adjacent second radiator fins 13 is 1.5 mm. The heat dissipation effect is better, and the number of the first heat dissipation fins 11 and the second heat dissipation fins 13 is more suitable.
Preferably, in this embodiment, the first heat sink 1 includes a first mounting seat 8 and a first mounting column 10, the first mounting column 10 is vertically disposed, a lower end of the first mounting column 10 is fixedly connected to the first mounting seat 8, the plurality of first heat dissipation fins 11 are stacked and fixed on the first mounting column 10, and the plurality of first heat dissipation fins 11 are horizontally disposed. The first mounting seat 8 is used for being mounted on the main board 5, and the first mounting column 10 is used for fixing the first heat dissipation fin 11. The number of the first mounting posts 10 is 4, and the upper ends of the first mounting posts 10 penetrate through the plurality of first heat dissipation fins 11.
Preferably, in this embodiment, the first mounting seat 8 is provided with a plurality of first mounting screws 9. Preferably, the number of the first mounting screws 9 is 4, and the first mounting screws are respectively positioned on four sides of the first mounting seat 8. The first mounting base 8 is conveniently fixed on the main board 5 through a first mounting screw 9.
Preferably, in this embodiment, the upper end of the first mounting post 10 is provided with a first fixing nut 12 for fixing the plurality of first radiator fins 11. The upper end of each first mounting column 10 is connected with a first fixing nut 12 through threads, and the first fixing nut 12 abuts against the topmost first heat dissipation fin 11. Thereby, the first heat dissipation fins 11 are fixed effectively and will not fall off at will.
Preferably, in the present embodiment, the second heat sink 2 includes a second mounting seat 14 and a second mounting column 16, the second mounting column 16 is vertically disposed, a lower end of the second mounting column 16 is fixedly connected to the second mounting seat 14, the plurality of second heat dissipation fins 13 are stacked and fixed on the second mounting column 16, and the plurality of second heat dissipation fins 13 are horizontally disposed. Wherein the second mounting seat 14 is used for mounting on the main board 5, and the second mounting post 16 is used for fixing the second heat dissipating fin 13. The number of the second mounting posts 16 is 4, and the upper ends of the second mounting posts 16 penetrate through the plurality of second heat dissipation fins 13.
Preferably, in this embodiment, a plurality of second mounting screws 15 are disposed on the second mounting base 14, and a second fixing nut 17 for fixing a plurality of second heat dissipating fins 13 is disposed at an upper end of the second mounting column 16. The number of the second mounting screws 15 is 4, and the second mounting screws are respectively positioned on four sides of the second mounting seat 14. The second mounting seat 14 is conveniently fixed on the main board 5 by a second mounting screw 15. The upper end of each second mounting column 16 is connected with a second fixing nut 17 through threads, and the second fixing nut 17 abuts against the topmost second heat dissipation fin 13. Thereby, the second heat radiation fins 13 are fixed effectively and will not fall off at will.
The embodiment also provides a server, which comprises the combined heat dissipation structure for the CPU.
Wherein, the server includes casing 4, mainboard 5, electronic component 6 and CPU, mainboard 5 is installed in casing 4, be equipped with a plurality of installing ports that are used for installing radiator fan 3 on casing 4, a plurality of radiator fan 3 are installed in corresponding the installing port, blow in casing 4 in with the additional air through radiator fan 3, electronic component 6 and CPU are installed on mainboard 5, and array arrangement, first radiator 1 is installed in the CPU top that is close to radiator fan 3, second radiator 2 is installed in the CPU top of keeping away from radiator fan 3, be equipped with a plurality of louvres 7 that are used for the discharge steam on the casing 4 with the relative lateral wall of radiator fan 3.
Through the heat dissipation mode of the combined design, the CPU can be linearly arranged front and back, more memories and other components can be arranged under the condition that the area of the whole machine mainboard 5 is not changed, thereby improving the operational performance of the whole machine, meanwhile, the air generated by the heat radiation fan 3 can quickly pass through the first radiator 1 and keep relatively small pressure drop, and simultaneously exchange a small amount of heat to form relatively low-temperature air to be blown to the second radiator 2, the second heat dissipation fins 13 on the second heat sink 2 are denser to form high wind pressure, more heat of the back row CPU is taken away quickly than wind energy with lower temperature, thereby ensuring that the temperature of the front and back rows of CPUs can meet the design requirement and avoiding the conventional staggered arrangement mode of the front and back rows of CPUs of the four-way server in the industry, the staggered placement of the front and back rows of the CPU increases the wiring area of the CPU, thereby reducing the placement positions of the memory and other components and parts and reducing the performance of the server.
In the description of the present invention, it is to be understood that the terms "center", "length", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "inner", "outer", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A combined heat dissipation structure for a CPU, comprising:
a plurality of heat radiation fans (3);
the heat radiator comprises a plurality of first radiators (1), wherein the plurality of first radiators (1) are close to a plurality of heat radiating fans (3), and a plurality of first heat radiating fins (11) are arranged on each of the plurality of first radiators (1);
the radiator comprises a plurality of second radiators (2), the second radiators (2) and the first radiators (1) are arranged in parallel in a one-to-one correspondence mode, the second radiators (2) are far away from the radiating fans (3), the second radiators (2) are provided with a plurality of second radiating fins (13), and the distance between every two adjacent first radiating fins (11) is larger than the distance between every two adjacent second radiating fins (13).
2. The combined heat dissipation structure for CPU of claim 1, wherein the distance between two adjacent first heat dissipation fins (11) is 2.5-3.5 mm; the distance between every two adjacent second radiating fins (13) is 1-2 mm.
3. The combined heat dissipation structure for CPU of claim 2, wherein the spacing between two adjacent first heat dissipation fins (11) is 2.5 mm; the distance between two adjacent second radiating fins (13) is 1.5 mm.
4. The combined heat dissipation structure for a CPU of claim 1, wherein the first heat sink (1) comprises a first mounting base (8) and a first mounting column (10), the first mounting column (10) is vertically disposed, a lower end of the first mounting column (10) is fixedly connected to the first mounting base (8), a plurality of first heat dissipation fins (11) are stacked and fixed on the first mounting column (10), and a plurality of first heat dissipation fins (11) are horizontally disposed.
5. The combined heat dissipation structure for CPU of claim 4, wherein the first mounting seat (8) is provided with a plurality of first mounting screws (9).
6. The combined heat dissipation structure for a CPU of claim 4, wherein the upper end of the first mounting post (10) is provided with a first fixing nut (12) for fixing the plurality of first heat dissipation fins (11).
7. The combined heat dissipation structure for a CPU of any one of claims 1-6, wherein the second heat sink (2) comprises a second mounting seat (14) and a second mounting column (16), the second mounting column (16) is vertically disposed, a lower end of the second mounting column (16) is fixedly connected to the second mounting seat (14), a plurality of second heat dissipation fins (13) are stacked and fixed on the second mounting column (16), and a plurality of second heat dissipation fins (13) are horizontally disposed.
8. The combined heat dissipation structure for a CPU of claim 7, wherein a plurality of second mounting screws (15) are provided on the second mounting seat (14), and a second fixing nut (17) for fixing a plurality of second heat dissipation fins (13) is provided at an upper end of the second mounting column (16).
9. A server comprising the combined heat dissipation structure for a CPU according to any one of claims 1 to 8.
10. The server according to claim 9, characterized in that the server comprises a chassis (4), a motherboard (5), electronic components (6) and a CPU, the main board (5) is arranged in the casing (4), a plurality of mounting openings for mounting the heat radiation fan (3) are arranged on the casing (4), the heat radiation fan (3) is arranged in the mounting openings, the external air is blown into the machine shell (4) through the heat radiation fan (3), the electronic component (6) and the CPU are mounted on the main board (5), and arranged in an array, the first radiator (1) is arranged above the CPU close to the radiating fan (3), the second radiator (2) is arranged above the CPU far away from the heat radiation fan (3), and a plurality of heat dissipation holes (7) for discharging hot air are formed in the side wall, opposite to the heat dissipation fan (3), of the machine shell (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022464257.6U CN213149701U (en) | 2020-10-30 | 2020-10-30 | Combined heat dissipation structure for CPU and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022464257.6U CN213149701U (en) | 2020-10-30 | 2020-10-30 | Combined heat dissipation structure for CPU and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213149701U true CN213149701U (en) | 2021-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022464257.6U Active CN213149701U (en) | 2020-10-30 | 2020-10-30 | Combined heat dissipation structure for CPU and server |
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| Country | Link |
|---|---|
| CN (1) | CN213149701U (en) |
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- 2020-10-30 CN CN202022464257.6U patent/CN213149701U/en active Active
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Address after: 518000 16th floor, block B, building 7, Baoju building, Baoneng Science Park, Longhua District, Shenzhen City, Guangdong Province Patentee after: Baode computer system Co.,Ltd. Address before: 518000 16th floor, block B, building 7, Baoju building, Baoneng Science Park, Longhua District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN POWER LEADER COMPUTER SYSTEM Co.,Ltd. |
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