CN219019386U

CN219019386U - Mixed heat radiator

Info

Publication number: CN219019386U
Application number: CN202223150490.2U
Authority: CN
Inventors: 李翔; 张超; 王兆盛
Original assignee: Sunlune Technology Beijing Co Ltd
Current assignee: Shenglong Singapore Pte Ltd
Priority date: 2022-11-23
Filing date: 2022-11-23
Publication date: 2023-05-12
Anticipated expiration: 2032-11-23

Abstract

The application provides a hybrid heat sink, the device includes: the cabinet body, N air-cooled heat dissipation modules and M liquid-cooled heat dissipation modules, wherein N is a positive integer multiple of 3; the N air-cooled heat dissipation modules are arranged in the cabinet body according to a delta shape and are used for dissipating heat of the N heating elements; the M liquid cooling heat dissipation modules are arranged in the residual space except N air cooling heat dissipation modules which are arranged in a delta shape in the cabinet body and used for dissipating heat of the M heating elements. In the radiating process, the air-cooled radiating modules distributed in the delta shape reduce the width space of the cabinet body occupied by the air-cooled radiating modules, so that more air-cooled radiating modules can be arranged in the cabinet body with the same size, the higher radiating requirement is met, the influence of heat cascade can be reduced by the delta-shaped distribution, and the radiating effect of the rear-row radiating modules is improved. In addition, the application also combines air cooling heat dissipation and liquid cooling heat dissipation technology to improve heat dissipation performance.

Description

Mixed heat radiator

Technical Field

The embodiment of the application relates to the field of heat dissipation equipment, in particular to a hybrid heat dissipation device.

Background

Along with the development of networking, the application of the data center in enterprises is more and more widespread, the installation density of a server cabinet serving as a constituent unit of the data center is continuously increased, and meanwhile, the number of elements and the power consumption are rapidly increased due to the improvement of the performance of the server, so that the heat dissipation resistance of the server is high, the heat flow density is high, the heat dissipation performance is poor, and the performance of the server cabinet is seriously affected.

The existing server heat dissipation method mainly comprises the steps that a plurality of heat dissipation modules are arranged in a server cabinet body in a serial mode, namely cooling air sequentially passes through all servers arranged in the serial mode, so that the heat dissipation modules transfer heat of heat sources in the servers, and the purpose of dissipating heat of the servers is achieved; or, a plurality of heat dissipation modules are arranged in the server cabinet side by side, so that the heat dissipation modules transfer heat of a heat source in the server, and the purpose of dissipating heat of the server is achieved.

However, in the existing heat dissipation method, on one hand, the heat dissipation effect of the back row heat dissipation modules on the heat source in the serial arrangement scheme is not good, on the other hand, the heat dissipation scheme of arranging the heat dissipation modules side by side is limited by the size of the server cabinet body, more heat dissipation modules cannot be arranged side by side, the heat dissipation effect is not good, the number of chips which can be arranged on the server is limited, and therefore the calculation power of the server is small.

Disclosure of Invention

The embodiment of the application provides a hybrid heat dissipating device, which can improve the heat dissipating performance of the heat dissipating device.

The device comprises: the cabinet body, N air-cooled heat dissipation modules and M liquid-cooled heat dissipation modules, wherein N is a positive integer multiple of 3, and M is a positive integer;

the N air-cooling heat dissipation modules are arranged in the cabinet body according to a delta shape and are used for dissipating heat of the N heating elements;

the M liquid cooling heat dissipation modules are arranged in the residual space except N air cooling heat dissipation modules which are arranged in a delta shape in the cabinet body and used for dissipating heat of the M heating elements.

In summary, according to the technical solution of the present application, when heat dissipation is performed, a hybrid heat dissipation device is provided, which includes: the cabinet body, N air-cooled heat dissipation modules and M liquid-cooled heat dissipation modules, wherein N is a positive integer multiple of 3, and M is a positive integer; the N air-cooling heat dissipation modules are arranged in the cabinet body according to a delta shape and are used for dissipating heat of the N heating elements; the M liquid cooling heat dissipation modules are arranged in the residual space except the N air cooling heat dissipation modules which are arranged in a delta shape in the cabinet body and are used for dissipating heat of the M heating elements; the heat exchanger is connected with the M liquid cooling heat dissipation modules and is used for providing cold sources for the M liquid cooling heat dissipation modules. In the radiating process, the air-cooled radiating modules which are arranged in the delta shape fully utilize the length space of the cabinet body, and the width space of the cabinet body occupied by the air-cooled radiating modules is reduced, so that more air-cooled radiating modules can be arranged in the cabinet body with the same size, the radiating requirements of more heating elements are met, and meanwhile, the air-cooled radiating modules which are arranged in the delta shape reduce the influence of heat cascade, so that the rear-row air-cooled radiating modules can still meet the radiating requirements of the heating elements. In addition, the air cooling heat dissipation technology and the liquid cooling heat dissipation technology are combined, and the heat dissipation performance of the heat dissipation device is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an existing heat dissipating device according to an embodiment of the present application;

FIG. 2 is a schematic structural diagram of another conventional heat dissipating device according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of another conventional heat dissipating device according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a hybrid heat dissipating device according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of an air-cooled heat dissipation module according to an embodiment of the present application;

fig. 6 is a schematic diagram of an air-cooled heat dissipation module according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of another air-cooled heat dissipation module according to an embodiment of the present disclosure;

fig. 8 is a schematic layout diagram of an air-cooled heat dissipation module according to an embodiment of the present application;

fig. 9 is a schematic diagram of a parallel manner of a back-exhaust cooling module according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a delta-shaped arrangement according to an embodiment of the present application;

fig. 11 is a schematic layout diagram of a front-back exhaust cooling module according to an embodiment of the present application;

fig. 12 is a schematic layout diagram of a liquid cooling heat dissipation module according to an embodiment of the present application;

FIG. 13 is a schematic view of a fan mounting location provided in an embodiment of the present application;

fig. 14 is a schematic diagram of a relative position of a fan and a heat exchanger according to an embodiment of the present disclosure.

The marks in the drawings and the corresponding part names:

101-cabinet body, 102-air cooling heat dissipation module, 103-liquid cooling heat dissipation module, 104-fan, 105-heat exchanger, 201-radiating fin, 202-radiating bottom plate, 203-chip, 204-PCB board.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or server that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The heat dissipation device provided by the embodiment of the application can be applied to the field of any heat dissipation of a server.

With the rapid progress of technology, the performance of electronic devices is continuously improved, and the electronic devices are being developed towards energy conservation, modularization, high efficiency and the like, meanwhile, the application function requirements of servers are higher and higher, and the functions of server products are diversified. Therefore, in a limited space, more electronic components with high power consumption are usually required to be placed, so that the power consumption density in the limited space is increased, the heat flow density in the product is rapidly increased, and the temperature is rapidly increased, so that the thermal reliability of the product is greatly reduced, and even the normal operation of the product is greatly influenced, therefore, the thermal reliability of the whole cabinet server and the thermal design of the component level are very important, otherwise, the temperature of the electronic device is too high, and the phenomena of insulating property degradation, low-melting-point welding seam cracking, welding spot falling, thermal ageing of materials, service life reduction of the electronic device, even element damage and abnormal operation of the machine can occur. It has been shown by related studies that electronic device functional failure is primarily due to excessive temperature of the electronic device, i.e., thermal failure has been the primary failure mode of the electronic device. Aiming at server products, the phenomenon of slow reaction speed, shutdown restarting, blue screen, machine blocking and the like in the working process can be caused by the excessive temperature of the components, and the working process is seriously influenced. Therefore, heat dissipation research for servers is one of the important problems in the field of computer technology.

The conventional heat sink of the server will be described below.

Fig. 1 is a schematic structural diagram of a conventional heat dissipating device according to an embodiment of the present application.

As shown in fig. 1, the heat dissipation device includes four air-cooled heat dissipation modules, and two of the four air-cooled heat dissipation modules are arranged in parallel in a front row, and the other two air-cooled heat dissipation modules are arranged in parallel in a rear row, so as to form a 'field' -shaped structure. All cooling air passes through the front exhaust air cooling and radiating module and then passes through the rear exhaust air cooling and radiating module. In the heat dissipation process, as the front and rear air cooling heat dissipation modules are arranged in the server cabinet in series, the cooling air blown into the rear air exhaust cold heat dissipation module is the cooling air absorbing the heat of the front air exhaust cold heat dissipation module, the air temperature is higher, and the heat of the rear air exhaust cold heat dissipation module cannot be effectively taken away, so that the air cooling heat dissipation modules are arranged in the server cabinet in series, the heat cascade is serious, the heat dissipation effect of the rear air exhaust cold heat dissipation module is poor, and the heat dissipation requirement of a heating element cannot be met.

Fig. 2 is a schematic structural diagram of another conventional heat dissipating device according to an embodiment of the present application.

As shown in fig. 2, the heat dissipating device includes three air-cooled heat dissipating modules arranged side by side. Under the premise that the sizes of the air-cooled heat dissipation modules are the same, the parallel arrangement scheme needs a larger size of the server, as shown in fig. 2, and the width of the server is larger than that of the scheme shown in fig. 1, so that under the condition that the size of the server is limited, the parallel arrangement scheme of the air-cooled heat dissipation modules is poor in heat dissipation effect because more air-cooled heat dissipation modules cannot be placed.

Fig. 3 is a schematic structural diagram of another conventional heat dissipating device according to an embodiment of the present application.

As shown in fig. 3, the heat dissipating device includes two air-cooled heat dissipating modules arranged side by side. On the premise that the sizes of the air-cooled heat dissipation modules are the same, compared with the scheme shown in fig. 1, in the server cabinet body with the same size, the parallel arrangement scheme can only accommodate two air-cooled heat dissipation modules, so that the heat dissipation effect of the parallel arrangement scheme is poor due to the number of the air-cooled heat dissipation modules.

As described above, in the existing heat dissipation method, on one hand, due to the influence of thermal cascade, the heat dissipation effect of the rear-row heat dissipation module is poor, and the heat dissipation requirement of the heat source cannot be met; on the other hand, the heat dissipation scheme of heat dissipation module side by side arrangement is limited by the size of the server cabinet body, more heat dissipation modules cannot be placed side by side, the heat dissipation effect is poor, and the running speed of a network can be influenced due to the poor heat dissipation effect of the server. For example, when the heat source is a chip, because the heat dissipation effect of the server is poor, more chips cannot be arranged in the server, resulting in less computation power of the server and further affecting the running speed of the network.

In order to solve the technical problem, the embodiment of the application provides a hybrid heat dissipating device, when heat dissipation is performed, N air-cooled heat dissipating modules are arranged in a delta shape through being arranged in a cabinet body, so that the N air-cooled heat dissipating modules dissipate heat of N heating elements, and M liquid-cooled heat dissipating modules are arranged in the residual space outside the N air-cooled heat dissipating modules arranged in a delta shape in the cabinet body and used for dissipating heat of M heating elements. In the heat dissipation process, on one hand, N air-cooled heat dissipation modules are distributed in the cabinet body according to the delta shape, and compared with the existing parallel distribution scheme, more air-cooled heat dissipation modules can be arranged in the cabinet body with the same size, so that the heat dissipation performance is better, and the heat dissipation requirement of more heat-generating elements is met; compared with the existing serial arrangement scheme, the heat-cascade heat-dissipation system reduces the influence of heat cascade and improves the heat dissipation performance of the rear exhaust air cooling heat dissipation module; on the other hand, the air cooling heat dissipation technology and the liquid cooling heat dissipation technology are combined, and the heat dissipation performance of the heat dissipation device is improved.

The following describes the technical solutions of the embodiments of the present application in detail through some embodiments. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.

Fig. 4 is a schematic structural diagram of a hybrid heat dissipating device according to an embodiment of the present application.

As shown in fig. 4, the apparatus includes: the cabinet body 101, N air-cooled heat dissipation modules 102 and M liquid-cooled heat dissipation modules 103, wherein N is a positive integer multiple of 3, and M is a positive integer;

the N air-cooled heat dissipation modules 102 are arranged in the cabinet 101 according to a delta shape and are used for dissipating heat of the N heating elements;

the M liquid cooling heat dissipation modules 103 are disposed in the remaining space of the cabinet 101 except the N air cooling heat dissipation modules arranged in a delta shape, and are used for dissipating heat of the M heating elements.

As shown in fig. 4, during the heat dissipation process, a part of cooling air is directly blown to the second row of air-cooled heat dissipation modules from both sides of the first air-exhaust cold heat dissipation module in each of the air-cooled heat dissipation modules arranged in a delta shape without passing through the first row of air-cooled heat dissipation modules, and another part of cooling air is blown into the second row by the first row of air-cooled heat dissipation modules. In the heat dissipation process, the average air temperature of the second air exhaust cold heat dissipation module is reduced, the influence of heat cascade is further reduced, and the heat dissipation performance of the heat dissipation device is improved.

In some embodiments, the hybrid heat dissipating device further includes a plurality of air-cooled heat dissipating modules, where the plurality of air-cooled heat dissipating modules may be arranged in a parallel arrangement and/or a serial arrangement in a remaining space of the cabinet.

Fig. 5 is a schematic structural diagram of an air-cooled heat dissipation module according to an embodiment of the present application.

The air-cooled heat dissipation module is generally disposed on a heat generating element, for example, as shown in fig. 5, an air-cooled heat dissipation module is disposed on a chip 203 of a PCB (Printed Circuit Board ) 204, and the air-cooled heat dissipation module includes a heat dissipation base 202 and a heat dissipation fin 201 connected to the heat dissipation base, wherein heat of the heat generating element (chip 203) is transferred to the heat dissipation base 202, and then transferred to the heat dissipation fin 201 by the heat dissipation base 202, and cooling air passing through the heat dissipation fin 201 takes away the heat on the heat dissipation fin to realize heat dissipation of the heat generating element.

The air cooling heat dissipation technology generally has the problems of low heat dissipation capacity, low cooling efficiency and high energy consumption; the liquid cooling heat dissipation technology relies on the flow of liquid to transfer heat, and compared with an air cooling heat dissipation mode, the liquid cooling heat dissipation module has high heat exchange performance and relatively better liquid cooling heat dissipation effect, meanwhile, the liquid cooling heat dissipation module occupies a small space of the cabinet body compared with the air cooling heat dissipation module, and can meet the heat dissipation requirement of a heating element in a limited cabinet body space, but the liquid cooling heat dissipation technology also has the risks of liquid leakage and electric conduction, so that the heat dissipation device provided by the embodiment of the application combines two modes of air cooling heat dissipation and liquid cooling heat dissipation, and the liquid cooling heat dissipation and the air cooling heat dissipation can form complementation.

The heating element is not particularly limited in the embodiment of the present application. Many heat generating components in the server, such as CPU (central processing unit ), graphics card, motherboard chipset, hard disk, chassis, power supply and even optical drive and memory, all require a heat dissipation module to dissipate heat.

The main components of the general server which generate heat are chips, the service efficiency and the service life of the chips are mainly influenced by the heat dissipation treatment technology, and the heat dissipation device is added at the position of the main chips, so that the operation efficiency of devices in the server cabinet can be improved, the heat dissipation effect of the data server is enhanced, and important components are protected. According to the hybrid heat dissipation device provided by the embodiment of the application, the air cooling heat dissipation module and the liquid cooling heat dissipation module can be arranged on the chip so as to conduct efficient heat dissipation on the chip.

The number of the air-cooled heat dissipation modules arranged according to the delta shape is not particularly limited. An appropriate number of air-cooled heat dissipation modules can be selected according to heat dissipation requirements and cabinet size.

Fig. 6 is a schematic diagram of an air-cooled heat dissipation module according to an embodiment of the present application.

In one implementation manner, the above n=6, the hybrid heat dissipating device includes 6 air-cooled heat dissipating modules arranged in a delta shape, and the 6 air-cooled heat dissipating modules arranged in a delta shape include two air-cooled heat dissipating modules arranged in a first row and four air-cooled heat dissipating modules arranged in a second row, as shown in fig. 6.

Fig. 7 is a schematic diagram of another air-cooled heat dissipation module according to an embodiment of the present application.

In another implementation manner, the above n=3, the hybrid heat dissipating device includes 3 air-cooled heat dissipating modules, and the 3 air-cooled heat dissipating modules arranged in a delta shape include a first air-cooled heat dissipating module arranged in a first row, and a second air-cooled heat dissipating module and a third air-cooled heat dissipating module arranged in a second row.

When 2 or more air-cooled heat dissipation modules which are arranged in a delta shape are arranged in the cabinet body, the arrangement mode of the 2 or more air-cooled heat dissipation modules which are arranged in a delta shape is not particularly limited in the embodiment of the application.

Fig. 8 is a schematic layout diagram of an air-cooled heat dissipation module according to an embodiment of the present application.

In the mode 1, each air-cooled heat dissipation module in a delta-shaped arrangement is connected in parallel with other air-cooled heat dissipation modules in a delta-shaped arrangement, as shown in fig. 4. The three air-cooled heat dissipation modules which are arranged in a delta shape are connected in parallel.

Compared with the existing parallel arrangement scheme, the embodiment of the application arranges the air-cooled heat dissipation modules in the cabinet body according to the delta shape, fully utilizes the length space of the cabinet body, reduces the width space occupied by the air-cooled heat dissipation modules in the cabinet body in the hybrid heat dissipation device, can set more air-cooled heat dissipation modules in the cabinet body with the same size, and meets the heat dissipation requirements of more heat generation elements.

Compared with the existing serial arrangement scheme, if 9 air-cooled heat dissipation modules are arranged in series, the heat dissipation effect of the second air-exhausted cold heat dissipation module is affected by heat cascading, and the heat dissipation requirement of the heat dissipation element cannot be met.

According to the embodiment of the application, three air-cooled radiating modules which are arranged in a delta shape are arranged in the cabinet body in parallel to form two rows, one part of cooling air is directly blown to the rear second air-exhausted cold radiating module from the two sides of the first air-exhausted cold radiating module without passing through the first air-cooled radiating module, the part of cooling air does not absorb the heat of the first air-exhausted cold radiating module, the air temperature is lower, and the other part of cooling air is blown to the second air-cooled radiating module only through one air-cooled radiating module, so that the absorbed heat is less, the average air temperature of cooling air received by the second air-cooled radiating module is lower, the heat of the second air-exhausted cold radiating module can be effectively taken away, and therefore the influence of heat cascading is reduced to the greatest extent, the heat radiating performance of the second air-exhausted cold radiating module is guaranteed, and the heat radiating requirement of a heating element is met.

Mode 2, each air-cooled heat dissipation module arranged in a delta shape is connected in series with other air-cooled heat dissipation modules arranged in a delta shape, as shown in fig. 8A. Three air-cooled heat dissipation modules which are arranged in a delta shape are connected in series.

When three air-cooled heat dissipation modules which are arranged in a delta shape are connected in series, the influence of heat cascade can be reduced to a certain extent.

Compared with the existing serial arrangement scheme, in the cabinet body with the same size, if the same number of air-cooled heat dissipation modules are arranged in series, the heat dissipation effect of the rear exhaust air-cooled heat dissipation modules is affected by heat cascading, and the heat dissipation requirement of the heat dissipation elements cannot be met. According to the embodiment of the application, the air-cooled heat dissipation modules are distributed in the cabinet body according to the delta shape, so that the quantity of the air-cooled heat dissipation modules penetrated by the cooling air at the left end and the right end is reduced, the absorbed heat is reduced, the air temperature is lower, and further, when the part of cooling air is blown to the rear exhaust air-cooled heat dissipation module, the average air temperature of the cooling air received by the rear exhaust heat dissipation module is reduced, the influence of heat cascade is reduced, the heat dissipation performance of the rear exhaust air-cooled heat dissipation module is ensured, and the heat dissipation requirement of a heating element is met.

Compared with the existing parallel arrangement scheme, the same number of air-cooled heat dissipation modules cannot be arranged in the cabinet body with the same size, and the heat dissipation requirements of more heat generation elements cannot be met.

In the mode 3, as shown in fig. 8B, among the 3 air-cooled heat dissipation modules arranged in a delta shape, one air-cooled heat dissipation module arranged in a delta shape is arranged in a first row, and the other two air-cooled heat dissipation modules arranged in a delta shape are arranged in a second row. The air-cooled heat dissipation modules of the second row are connected in parallel, and the air-cooled heat dissipation modules of the first row are connected in series with the air-cooled heat dissipation modules of the second row.

Compared with the existing serial arrangement scheme, in the cabinet body with the same size, if the same number of air-cooled heat dissipation modules are arranged in series, the heat dissipation effect of the rear exhaust air-cooled heat dissipation modules is affected by heat cascading, and the heat dissipation requirement of the heat dissipation elements cannot be met. According to the embodiment of the application, the air-cooled radiating modules are arranged in the cabinet body according to the delta shape, and part of the received cooling air is the cooling air which does not absorb the heat of the front exhaust air-cooled radiating module, and is directly blown to the rear exhaust air-cooled radiating module, so that the average air temperature of the rear exhaust air-cooled radiating module can be reduced, the influence of heat cascade is reduced, and the rear exhaust air-cooled radiating module meets the radiating requirement of a heating element.

In summary, the heat dissipation effect of embodiment 1 is larger than that of embodiment 3, and the heat dissipation effect of embodiment 3 is larger than that of embodiment 2. Compared with the existing serial arrangement mode, when the air-cooled heat dissipation modules with the same number are arranged and the cabinet body is the same in size, the heat cascade effect is reduced in mode 1, mode 2 and mode 3, and the heat dissipation performance is improved; compared with the existing parallel arrangement mode, in the cabinet body with the same size, more air-cooling heat dissipation modules can be placed in the mode 1, the mode 2 and the mode 3 so as to dissipate heat of more heating elements, and the arrangement mode of the delta shape ensures the heat dissipation performance of the rear exhaust air cooling heat dissipation module, so that the rear exhaust air cooling heat dissipation module can still meet the heat dissipation requirements of the heating elements.

The following embodiments are described by taking a heat dissipating device including 3 air-cooled heat dissipating modules as an example.

The embodiment of the application does not specifically limit the parallel mode of the two rear exhaust air cooling and radiating modules.

Fig. 9 is a schematic diagram of a parallel manner of a back-exhaust cooling module according to an embodiment of the present application.

In mode 1, two back-exhaust cooling modules are juxtaposed, but a gap exists between the two back-exhaust cooling modules, as shown in fig. 9.

In mode 2, the two back-exhaust cooling modules are arranged in parallel, and the two back-exhaust cooling modules are adjacent to each other without a gap therebetween, as shown in fig. 7.

In mode 1, because there is a gap between the two rear-row second air-cooled heat dissipation modules, the overall size of each air-cooled heat dissipation module is increased, so that the number of air-cooled heat dissipation modules which can be placed in a server cabinet is possibly smaller, but on the premise that the area swept by cooling air is large enough, the cross area between the two rear-row air-cooled heat dissipation modules and the front-row air-cooled heat dissipation module is reduced, so that more part of cooling air passing through the rear-row air-cooled heat dissipation modules is directly blown to the rear-row air-cooled heat dissipation modules, and does not pass through the front-row air-cooled heat dissipation modules, so that the air temperature is lower, and a better heat dissipation effect can be achieved. In the mode 2, since the two rear exhaust air cooling and heat dissipating modules are immediately adjacent, no gap exists between the two rear exhaust air cooling and heat dissipating modules, compared with the mode 1, the space occupied by the air cooling and heat dissipating modules with the delta-shaped structure is smaller, and in the servers with the same size, the number of the air cooling and heat dissipating modules which can be placed is possibly larger, so that the heat dissipating effect is better. However, in either mode 1 or mode 2, compared with the existing parallel technical scheme, the size of the heat dissipation module is reduced, more air-cooled heat dissipation modules can be placed in servers with the same size, and a better heat dissipation effect can be achieved.

The relative positions of the front air exhaust cold heat dissipation module and the rear air exhaust cold heat dissipation module are not particularly limited.

Fig. 10 is a schematic structural diagram of a delta-shaped arrangement according to an embodiment of the present application.

In one example, the front exhaust air cold heat sink module is at a position where the two air cold heat sink modules are relatively left, as shown in fig. 10A.

In another example, the front exhaust cold heat sink module is at a position where the two rear exhaust cold heat sink modules are relatively right-hand, as shown in fig. 10B.

In another example, the front exhaust cold heat sink module is at the center of the two rear exhaust cold heat sink modules, as shown in fig. 7.

The arrangement modes of the front air exhaust cold heat dissipation module and the rear air exhaust cold heat dissipation module are not particularly limited.

Fig. 11 is a schematic layout diagram of a front-back exhaust cooling module according to an embodiment of the present application.

Mode 1, the front exhaust cool heat dissipation module is immediately adjacent to the rear exhaust cool heat dissipation module, as shown in fig. 7.

Mode 2, a gap exists between the front air-exhaust cold heat dissipation module and the rear air-exhaust cold heat dissipation module, as shown in fig. 11.

The position and the number of the liquid cooling heat dissipation modules included in the hybrid heat dissipation device are not particularly limited.

Fig. 12 is a schematic diagram of an arrangement structure of a liquid cooling heat dissipation module according to an embodiment of the present application.

In one example, m=1, the heat dissipating device includes a liquid cooling heat dissipating module, and the liquid cooling heat dissipating module is disposed on the left side of the first air cooling heat dissipating module in the first row, as shown in fig. 12A.

In another example, the heat dissipating device includes a liquid cooling heat dissipating module disposed on the right side of the first air cooling heat dissipating module, as shown in fig. 12B.

In another example, the M liquid-cooled heat dissipation modules include a first liquid-cooled heat dissipation module and a second liquid-cooled heat dissipation module, where the first liquid-cooled heat dissipation module and the second liquid-cooled heat dissipation module are arranged in a first row and located on two sides of the first air-cooled heat dissipation module, as shown in fig. 12C.

According to the size of the residual space of the cabinet body and the size of the liquid cooling heat dissipation module, the liquid cooling heat dissipation module can be arranged at other positions in the residual space of the cabinet body, for example, when the residual space on one side of the first air cooling heat dissipation module of the first row is enough to be provided with two liquid cooling heat dissipation modules, the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module can be arranged in the first row and are positioned on the same side of the first air cooling heat dissipation module.

The first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module may be arranged at any position on two sides of the first air cooling heat dissipation module, for example, the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module may be arranged on two sides close to the first air cooling heat dissipation module; the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module can be arranged on two sides of the first air cooling heat dissipation module, and a gap is reserved between the first liquid cooling heat dissipation module and the first air cooling heat dissipation module.

In some embodiments, the first liquid cooling heat dissipation module is located in front of the second air cooling heat dissipation module, and the height of the first liquid cooling heat dissipation module is lower than that of the second air cooling heat dissipation module, so that cooling air passes through the upper side of the first liquid cooling heat dissipation module to be blown to the second air cooling heat dissipation module;

the second liquid cooling heat dissipation module is positioned in front of the third air cooling heat dissipation module, and the height of the second liquid cooling heat dissipation module is lower than that of the third air cooling heat dissipation module, so that cooling air passes through the upper side of the second liquid cooling heat dissipation module and is blown to the third air cooling heat dissipation module.

In this embodiment, the cabinet bodies with the same size can only be provided with two air-cooled heat dissipation modules in the cabinet body in the traditional parallel arrangement scheme, so as to dissipate heat of the two heating elements; under the premise of occupying the same space of the cabinet body, the traditional serial arrangement scheme can only be used for arranging four air-cooling heat dissipation modules, and the heat dissipation effect of the rear exhaust air-cooling heat dissipation modules is poor due to the influence of thermal cascading, so that the heat dissipation requirement of the heating element cannot be met. According to the hybrid heat dissipation device, three air-cooled heat dissipation modules can be arranged in the cabinet body, and the three air-cooled heat dissipation modules are distributed according to the delta shape, so that the influence of heat cascading is reduced, and the second air-cooled heat dissipation module and the third air-cooled heat dissipation module can also meet the heat dissipation requirement of the heating element; in addition, set up first liquid cooling heat dissipation module in the place ahead of second forced air cooling heat dissipation module, set up second liquid cooling heat dissipation module in the place ahead of third forced air cooling heat dissipation module, and the high being less than second forced air cooling heat dissipation module of first liquid cooling heat dissipation module, the high being less than of second liquid cooling heat dissipation module third forced air cooling heat dissipation module, such arrangement structure can not influence the wind channel of the font forced air cooling heat dissipation module, make a portion cooling wind can directly blow to second forced air cooling heat dissipation module and third forced air cooling heat dissipation module by the top of liquid cooling heat dissipation module, the influence of heat cascade has been reduced, the heat dispersion of back exhaust forced air cooling heat dissipation module has been guaranteed, simultaneously, first liquid cooling heat dissipation module and second liquid cooling heat dissipation module are also used for radiating heating element, therefore, in the cabinet body of same size, under the prerequisite that occupies the cabinet body same space, the demand of 5 heating element can be satisfied in this application embodiment.

The hybrid heat dissipating device further comprises a fan, wherein the fan is used for providing cooling air for the N air-cooled heat dissipating modules.

The type of the fan is not particularly limited in the embodiments of the present application, and the fan may be a fan, a blower or other devices that may generate cooling air.

The arrangement mode of the fans is not particularly limited. The fans may be arranged in parallel or in series.

When the fan is a fan, the type of the fan is not particularly limited, and the heat dissipation fan may be an axial fan, a centrifugal fan or other types.

The position of the fan is not particularly limited in the embodiment of the application.

For example, when the fan is a fan. In one example, the heat dissipation fans are disposed inside the cabinet, and each server has its own heat dissipation fan, and combines the heat conduction cover and the air cooling heat dissipation module to dissipate heat of the main heating element.

In another example, a server cabinet employs a centralized air supply scheme, where fans are no longer installed in a single server. In the concentrated air supply scheme, the power of a single fan is higher, and the number of fans is reduced, so that the system construction and operation cost is reduced.

The relative positions of the fan and the air-cooled heat dissipation module are not particularly limited.

Fig. 13 is a schematic view of a fan installation position according to an embodiment of the present application.

In one implementation, the fan is located in front of the first exhaust cooling module, with the windward direction as the forward direction, as shown in fig. 13A.

In another implementation, the fan is located behind the second air-exhaust cold-heat-dissipation module, and forms a wind direction blown by the first air-exhaust cold-heat-dissipation module to the second air-exhaust cold-heat-dissipation module through the air-exhaust mode, as shown in fig. 13B.

In another implementation, fans are provided in front of the first exhaust cool heat dissipation module and behind the second exhaust cool heat dissipation module, as shown in fig. 13C.

The mixed heat dissipation device further comprises a cold source supply module, wherein the cold source supply module is connected with the M liquid cooling heat dissipation modules and used for providing cold sources for the M liquid cooling heat dissipation modules.

The embodiment of the application does not limit the specific type of the cold source supply module.

In one implementation, the cold source supply module includes a cooling tower that provides a cooling liquid to the liquid cooling module.

In another implementation, the cold source supply module includes a heat exchanger.

In the liquid cooling and heat dissipation, the liquid cooling and heat dissipation module is arranged in the cabinet body, the liquid cooling and heat dissipation module comprises a liquid cooling plate, and liquid in the liquid cooling plate generally has higher heat conduction performance by arranging the liquid cooling plate on a main heating element in the server, so that heat of a heat source can be quickly absorbed, and cooling liquid absorbing heat of the heat source flows in the whole pipeline under the operation action of a water pump; the heat exchanger is usually combined with the fan, the heat radiation capacity is improved by forced convection of air, the heat radiation fin with large surface area is generally used for improving the heat exchange capacity, when the cooling liquid absorbing the heat of the heat source flows to the heat exchanger connected with the liquid cooling plate, the heat is transferred to the heat exchanger, and then the cooling air generated by the fan drives the air to flow rapidly, so that the rapidly flowing air takes away the heat on the heat radiation fin rapidly, the purpose of reducing the temperature of the heat source is achieved, meanwhile, the temperature of the cooling liquid is reduced, the cooling liquid flows back to the liquid cooling plate through the heat exchanger, and the low-temperature cooling liquid continuously absorbs the heat of the heating element.

The heat exchanger can be arranged in the cabinet body and can also be arranged outside the cabinet body, and the application is not particularly limited.

When the heat exchanger is arranged in the cabinet body, the embodiment of the application does not limit the relative positions of the heat exchanger and the air cooling heat dissipation module.

In some embodiments, the heat exchanger is connected in series with N air-cooled heat rejection modules. The serial connection mode of the heat exchanger and the N air-cooled heat dissipation modules is not particularly limited, and the heat exchanger may be located in front of the N air-cooled heat dissipation modules and connected in series with the N air-cooled heat dissipation modules, so that cooling air passing through the heat exchanger blows to the N air-cooled heat dissipation modules, or the heat exchanger may be located behind the N air-cooled heat dissipation modules and connected in series with the N air-cooled heat dissipation modules, so that cooling air blowing through the N air-cooled heat dissipation modules blows to the heat exchanger.

In other embodiments, the heat exchanger is disposed above the air-cooled heat dissipation module, with a portion of the cooling air blowing toward the air-cooled heat dissipation module and another portion blowing toward the heat exchanger.

When the heat exchanger is disposed in the cabinet, the relative positions of the fan and the heat exchanger are not particularly limited in the embodiments of the present application.

As shown in fig. 14A, the fan 104 is disposed in front of the first air-exhausting and cooling module, the heat exchanger is disposed behind the second air-exhausting and cooling module, and the cooling air is blown to the second air-exhausting and cooling module and the heat exchanger sequentially from the first air-exhausting and cooling module.

As shown in fig. 14B, the heat exchanger is disposed behind the second air-exhaust cooling module, and the fan is disposed behind the heat exchanger, and the cooling air is blown from the first air-exhaust cooling module to the second air-exhaust cooling module and the heat exchanger in sequence.

As shown in fig. 14C, the fan is disposed in front of the first air-exhaust cold-heat-dissipation module, the heat exchanger is disposed between the fan and the first air-exhaust cold-heat-dissipation module, and the cooling air is blown to the first air-exhaust cold-heat-dissipation module and the second air-exhaust cold-heat-dissipation module sequentially by the heat exchanger.

As shown in fig. 14D, the heat exchanger is disposed at the rear of the second air-exhaust cooling module, and the fans are disposed at the front of the first air-exhaust cooling module and at the rear of the heat exchanger, respectively, so that the cooling air is blown to the second air-exhaust cooling module and the heat exchanger from the first air-exhaust cooling module.

As shown in fig. 14E, the fans are respectively disposed in front of the first air-exhaust cooling module and behind the second air-exhaust cooling module, the heat exchanger is disposed between the fans and the first air-exhaust cooling module, and the cooling air is blown to the first air-exhaust cooling module and the second air-exhaust cooling module in sequence by the heat exchanger.

As shown in fig. 14F, the fan is disposed outside the cabinet body, the heat exchanger is disposed in front of the first air-exhaust cold-heat-dissipation module, and the cooling air is blown to the first air-exhaust cold-heat-dissipation module and the second air-exhaust cold-heat-dissipation module sequentially by the heat exchanger.

The connection mode between the liquid cooling heat dissipation modules is not particularly limited.

In one implementation, the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module are connected in series, the cold source supply module comprises a heat exchanger, the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module are both connected with the heat exchanger, and the cooling liquid of the heat exchanger flows into the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module from the inlet of the first liquid cooling heat dissipation module and flows back to the heat exchanger through the outlet of the second liquid cooling heat dissipation module.

In another implementation manner, the first liquid cooling heat dissipation module and the second liquid cooling heat dissipation module are connected in parallel, the cold source supply module comprises a first heat exchanger and a second heat exchanger, the first liquid cooling heat dissipation module is connected with the first heat exchanger, the second liquid cooling heat dissipation module is connected with the second heat exchanger, and the cooling liquid of the first heat exchanger flows into the first liquid cooling heat dissipation module from the inlet of the first liquid cooling heat dissipation module and flows back to the first heat exchanger through the outlet of the first liquid cooling heat dissipation module; the cooling liquid of the second heat exchanger flows into the second liquid cooling heat radiating module from the inlet of the second liquid cooling heat radiating module and flows back to the second heat exchanger through the outlet of the second liquid cooling heat radiating module.

The cooling liquid in the liquid cooling heat radiation module can be pure water, distilled water, fluoridized liquid or other heat conducting liquid. The specific type of the liquid cooling heat dissipation module is not limited in the embodiment of the application.

In some embodiments, at least one wind blocking member is provided on both sides of the second air-cooled heat dissipating module and/or the third air-cooled heat dissipating module arranged in the second row.

In order to reduce the influence of thermal cascade, the heat dissipation performance of the second air-cooled heat dissipation module and the third air-cooled heat dissipation module which are arranged in the second row is guaranteed, and in the embodiment of the application, the wind shielding component is arranged on one side of the second air-cooled heat dissipation module, so that more cooling wind passes through the second air-cooled heat dissipation module, and more heat is taken away; and/or, a wind shielding component is arranged at one side of the third air-cooled heat dissipation module, so that more cooling air passes through the third air-cooled heat dissipation module, and more heat is taken away. In the heat dissipation process, the wind shielding component with smaller size is used for filling the air duct, and the effect of reducing the influence of heat cascade can be achieved without occupying larger space of the cabinet body.

The specific type of the wind shielding member is not limited in the embodiments of the present application.

In one example, the wind blocking member is a dummy fin having no heat conductive property;

in another example, the wind blocking member is a screen.

In another example, the wind blocking member is a porous medium.

In summary, according to the technical solution of the present application, when heat dissipation is performed, a hybrid heat dissipation device is provided, which includes: the cabinet body, N air-cooled heat dissipation modules and M liquid-cooled heat dissipation modules, wherein N is a positive integer multiple of 3, and M is a positive integer; the N air-cooling heat dissipation modules are arranged in the cabinet body according to a delta shape and are used for dissipating heat of the N heating elements; the M liquid cooling heat dissipation modules are arranged in the residual space except N air cooling heat dissipation modules which are arranged in a delta shape in the cabinet body and used for dissipating heat of the M heating elements. In the radiating process, the air-cooled radiating modules arranged in the delta shape reduce the space occupied by the air-cooled radiating modules in the cabinet body, so that more air-cooled radiating modules can be arranged in the cabinet body with the same size to meet the radiating requirements of more heating elements, and meanwhile, the air-cooled radiating modules arranged in the delta shape reduce the influence of heat cascade, so that the rear-row air-cooled radiating modules can still meet the radiating requirements of the heating elements.

The preferred embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solutions of the present application within the scope of the technical concept of the present application, and all the simple modifications belong to the protection scope of the present application. For example, the specific features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various possible combinations are not described in detail. As another example, any combination of the various embodiments of the present application may be made without departing from the spirit of the present application, which should also be considered as disclosed herein.

Claims

1. A hybrid heat sink, comprising: the cabinet body, N air-cooled heat dissipation modules and M liquid-cooled heat dissipation modules, wherein N is a positive integer multiple of 3, and M is a positive integer;

the M liquid cooling heat dissipation modules are arranged in the rest space except the N air cooling heat dissipation modules which are arranged in a delta shape in the cabinet body and used for dissipating heat of the M heating elements.

2. The apparatus of claim 1, wherein N is 3, and the 3 air-cooled heat dissipation modules arranged in a delta configuration comprise a first air-cooled heat dissipation module arranged in a first row and a second air-cooled heat dissipation module and a third air-cooled heat dissipation module arranged in a second row.

3. The apparatus of claim 2, wherein the M liquid-cooled heat dissipation modules comprise a first liquid-cooled heat dissipation module and a second liquid-cooled heat dissipation module, the first liquid-cooled heat dissipation module and the second liquid-cooled heat dissipation module being arranged in the first row and on both sides of the first air-cooled heat dissipation module.

4. The apparatus of claim 3, wherein the first liquid cooled heat sink module is positioned in front of the second air cooled heat sink module and the first liquid cooled heat sink module has a height that is lower than a height of the second air cooled heat sink module such that cooling air is blown to the second air cooled heat sink module through an upper side of the first liquid cooled heat sink module;

the second liquid cooling heat dissipation module is located in front of the third air cooling heat dissipation module, and the height of the second liquid cooling heat dissipation module is lower than that of the third air cooling heat dissipation module, so that cooling air passes through the upper portion of the second liquid cooling heat dissipation module and is blown to the third air cooling heat dissipation module.

5. The apparatus of claim 2, wherein the hybrid heat sink further comprises a fan for providing cooling air to the N air-cooled heat sink modules, the fan being located in front of the first air-exhausted cold heat sink module and/or behind the second air-exhausted cold heat sink module.

6. The apparatus of claim 5, wherein the hybrid heat sink further comprises a cold source supply module coupled to the M liquid-cooled heat sink modules for providing cold sources to the M liquid-cooled heat sink modules.

7. The apparatus of claim 6, wherein the cold source supply module comprises a heat exchanger.

8. The apparatus of claim 7, wherein the heat exchanger is disposed between the first air-cooled heat dissipation module and the fan, and wherein cooling air generated by the fan is blown by the heat exchanger toward the first air-cooled heat dissipation module.

9. The apparatus of claim 7, wherein the heat exchanger is disposed behind the second and third air-cooled heat dissipation modules, the cooling air being blown by the first air-cooled heat dissipation module toward the second, third, and heat exchangers.

10. The device according to claim 2, characterized in that at least one wind shielding member is provided on both sides of the second and/or third air-cooled heat dissipating modules arranged in the second row.