CN108121423A - A kind of server liquid-cooling heat radiator - Google Patents
A kind of server liquid-cooling heat radiator Download PDFInfo
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Abstract
本发明涉及一种服务器液冷散热装置，包括可拆卸式连接的主机和液冷散热装置，主机包括主机板、固定于主机板上的电源供应器、多个热源和多个内存条，液冷散热装置包括换热器、多个液冷板、多个循环管路以及固定于换热器上的水泵和多个风扇；液冷板通过螺丝与热源固定为一体，换热器设置于主机板的后侧，循环管路将换热器、水泵及多个液冷板串连为一体，形成密闭的循环水回路。本发明的服务器液冷散热装置，通过循环管路将换热器、水泵及多个液冷板串连在一起，以形成密闭的循环水回路，风扇旋转加速换热器与外界气体的换热效率，因此热源的热量迅速被带走而使温度大幅降低，服务器的散热效率大幅提升。
The invention relates to a server liquid cooling heat dissipation device, which includes a detachably connected host and a liquid cooling heat dissipation device. The host includes a main board, a power supply fixed on the main board, multiple heat sources and multiple memory sticks. The heat dissipation device includes a heat exchanger, multiple liquid cooling plates, multiple circulation lines, water pumps and multiple fans fixed on the heat exchanger; the liquid cooling plate is fixed with the heat source by screws, and the heat exchanger is set on the main board On the rear side, the circulation pipeline connects the heat exchanger, water pump and multiple liquid cooling plates in series to form a closed circulating water circuit. The server liquid cooling device of the present invention connects a heat exchanger, a water pump, and multiple liquid cooling plates in series through a circulation pipeline to form a closed circulating water circuit, and the rotation of the fan accelerates the heat exchange between the heat exchanger and the outside air Therefore, the heat from the heat source is quickly taken away to greatly reduce the temperature, and the heat dissipation efficiency of the server is greatly improved.
Description
技术领域technical field
本发明涉及散热器技术领域，尤其涉及适用于在服务器、数据中心的电子元器件的散热。The invention relates to the technical field of radiators, in particular to the heat dissipation of electronic components suitable for servers and data centers.
背景技术Background technique
随着信息技术的发展，电子设备的集成度越来越高，计算机和报务器的性能越来越强，其相应的电子元器件的功率也越来越大，当前数据中心和高性能计算服务器也在朝着更高密度、更高计算能力的方向发展。然而，当电子元器件的运算速度提高或其数量增加时，电子元器件所产生的热量也随之增加，而使电子元器件的温度升高，直接影响服务器整体正常工作，因此需要安装散热设备进行散热，以降低元器件的结温，确保元器件在允许温度下正常、可靠运行。With the development of information technology, the integration of electronic equipment is getting higher and higher, the performance of computers and servers is getting stronger and stronger, and the power of the corresponding electronic components is also increasing. The current data center and high-performance computing server It is also moving in the direction of higher density and higher computing power. However, when the computing speed of electronic components increases or their quantity increases, the heat generated by electronic components also increases, and the temperature of electronic components rises, which directly affects the normal operation of the server as a whole, so it is necessary to install heat dissipation equipment Carry out heat dissipation to reduce the junction temperature of the components and ensure the normal and reliable operation of the components at the allowable temperature.
传统服务器往往设置具有多组风扇模块，以加速热对流的方式对电子元器件进行热交换，降低服务器的温度。由于现有技术中，可使用体积较大且功率较高的风扇或增加风扇数量来提高散热效率，但是，当风扇数量增加或增在功率时会占用服务内部电子元器件的设置空间，甚而产生更多的噪音，因此需要强化散热技术来满足服务器的散热需求。Traditional servers are often equipped with multiple groups of fan modules to heat-exchange electronic components in a way that accelerates heat convection to reduce the temperature of the server. In the prior art, fans with larger volume and higher power can be used or the number of fans can be increased to improve heat dissipation efficiency. However, when the number of fans is increased or the power is increased, it will occupy the installation space of the internal electronic components of the service, and even generate More noise, so enhanced heat dissipation technology is required to meet the heat dissipation requirements of the server.
发明内容Contents of the invention
本发明要解决的技术问题是：提供一种服务器液冷散热装置，提高服务器散热效率、降低能耗、提升其内部空间，而且安装维护方便，解决现有服务器散热方法中风冷散热效率低、能耗高、噪音高、占用空间大的问题。The technical problem to be solved by the present invention is: to provide a server liquid-cooled heat dissipation device, which improves the heat dissipation efficiency of the server, reduces energy consumption, improves its internal space, and is easy to install and maintain, and solves the problem of low air-cooled heat dissipation efficiency in the existing server heat dissipation method. Problems of high energy consumption, high noise, and large space occupation.
本发明的技术解决方案是：本发明提供一种服务器液冷散热装置，包括可拆卸式连接的主机和液冷散热装置，所述主机包括主机板、固定于所述主机板上的电源供应器、多个热源和多个内存条，所述液冷散热装置包括换热器、多个液冷板、多个循环管路以及固定于所述换热器上的水泵和多个风扇；所述液冷板通过螺丝与所述热源固定为一体，所述换热器设置于所述主机板的后侧，所述循环管路将所述换热器、水泵及多个所述液冷板串连为一体，形成密闭的循环水回路。The technical solution of the present invention is: the present invention provides a server liquid cooling heat dissipation device, including a detachably connected host and a liquid cooling heat dissipation device, the host includes a main board, a power supply fixed on the main board , a plurality of heat sources and a plurality of memory bars, the liquid-cooled heat dissipation device includes a heat exchanger, a plurality of liquid cooling plates, a plurality of circulation pipelines, a water pump and a plurality of fans fixed on the heat exchanger; The liquid cooling plate is fixed together with the heat source by screws, the heat exchanger is arranged on the rear side of the main board, and the circulation pipeline connects the heat exchanger, the water pump and a plurality of the liquid cooling plates in series. Connected as a whole to form a closed circulating water circuit.
进一步的，所述水泵下端设有注液口。Further, a liquid injection port is provided at the lower end of the water pump.
进一步的，所述液冷板包括第一液冷板、第二液冷板、第三液冷板和第四液冷板，所述循环管路包括第一循环管路、第二循环管路、第三循环管路、第四循环管路和第五循环管路；所述第一循环管路的一端为出水口，与所述水泵相连接，另一端与所述第一液冷板连通；所述第二循环管路连接于所述第一液冷板和第二液冷板之间，所述第三循环管路连接于所述第二液冷板和第三液冷板之间，所述第四循环管路连接于所述第三液冷板和第四液冷板之间；所述第五循环管路的一端与所述第四液冷板连通，另一端为入水口，连接于所述换热器的一侧。Further, the liquid cold plate includes a first liquid cold plate, a second liquid cold plate, a third liquid cold plate and a fourth liquid cold plate, and the circulation pipeline includes a first circulation pipeline, a second circulation pipeline , the third circulation pipeline, the fourth circulation pipeline and the fifth circulation pipeline; one end of the first circulation pipeline is a water outlet, connected with the water pump, and the other end communicates with the first liquid cold plate ; The second circulation pipeline is connected between the first liquid cold plate and the second liquid cold plate, and the third circulation pipeline is connected between the second liquid cold plate and the third liquid cold plate , the fourth circulation pipeline is connected between the third liquid cold plate and the fourth liquid cold plate; one end of the fifth circulation pipeline communicates with the fourth liquid cold plate, and the other end is a water inlet , connected to one side of the heat exchanger.
进一步的，所述热源为CPU中央处理器或电子元器件。Further, the heat source is a CPU central processing unit or electronic components.
进一步的，所述液冷板为单面散热或双面散热。Further, the liquid cooling plate can dissipate heat on one side or on two sides.
进一步的，多个所述风扇并排设置于所述换热器与液冷板之间。Further, multiple fans are arranged side by side between the heat exchanger and the liquid cold plate.
进一步的，所述风扇的出风口朝向所述换热器，入风口朝向所述热源。Further, the air outlet of the fan faces the heat exchanger, and the air inlet faces the heat source.
实施本发明的服务器液冷散热装置，具有以下有益效果：本发明的服务器液冷散热装置，热源所产生的热量藉由液冷板传递至换热器，风扇旋转加速换热器与外界气体的换热效率，因此热源的热量迅速被带走而使温度大幅降低，服务器的散热效率大幅提升，具体有益效果如下：Implementing the server liquid cooling heat dissipation device of the present invention has the following beneficial effects: in the server liquid cooling heat dissipation device of the present invention, the heat generated by the heat source is transferred to the heat exchanger through the liquid cold plate, and the rotation of the fan accelerates the heat exchanger and the external air. Heat exchange efficiency, so the heat from the heat source is quickly taken away to greatly reduce the temperature, and the heat dissipation efficiency of the server is greatly improved. The specific beneficial effects are as follows:
(1设有多个液冷板，可解决多个热源散热问题；(1 There are multiple liquid cooling plates, which can solve the heat dissipation problem of multiple heat sources;
(2)换热器设置于主机板的后侧，风扇并排设置于换热器与液冷板之间，大幅提升服务器内部空间；(2) The heat exchanger is arranged on the rear side of the motherboard, and the fans are arranged side by side between the heat exchanger and the liquid cooling plate, which greatly improves the internal space of the server;
(3)风扇出风口朝向换热器，风扇入风口朝向热源，有效降低服务器内部温度；(3) The air outlet of the fan faces the heat exchanger, and the air inlet of the fan faces the heat source, effectively reducing the internal temperature of the server;
(4)通过循环管路将换热器、水泵及多个液冷板串连在一起，以形成密闭的循环水回路，热源的热量迅速被带走而使其热源(电子元器件)温度大幅降低；(4) The heat exchanger, water pump and multiple liquid cooling plates are connected in series through the circulating pipeline to form a closed circulating water circuit, and the heat of the heat source is quickly taken away so that the temperature of the heat source (electronic components) is greatly increased reduce;
(5)设置一水泵于循环管路中，高效驱动加速其液体循环，大幅提升热量传递；(5) Install a water pump in the circulation pipeline to efficiently drive and accelerate its liquid circulation, greatly improving heat transfer;
(6)主机板和液冷散热装置为分离式设计，使用时通过紧固螺丝连接，安装维护及其方便。(6) The main board and the liquid cooling device are designed separately, and are connected by fastening screws during use, which is extremely convenient for installation and maintenance.
附图说明Description of drawings
下面将结合附图及实施例对本发明作进一步说明，附图中：The present invention will be further described below in conjunction with accompanying drawing and embodiment, in the accompanying drawing:
图1为本发明服务器液冷散热装置的主机板与液冷散热装置分解结构示意图；FIG. 1 is a schematic diagram of an exploded structure of a motherboard and a liquid cooling device of a server liquid cooling device according to the present invention;
图2为本发明服务器液冷散热装置的整体组装示意图。FIG. 2 is a schematic diagram of the overall assembly of the server liquid cooling heat dissipation device of the present invention.
附图标记：Reference signs:
001 液冷散热装置 002 入水口001 Liquid cooling device 002 Water inlet
003 出水口 004 水泵003 Water outlet 004 Water pump
005 第五循环管路 006 第四液冷板005 Fifth circulation pipeline 006 Fourth liquid cold plate
007 第四循环管路 008 第三液冷板007 The fourth circulation pipeline 008 The third liquid cold plate
009 换热器 010 出风口009 Heat exchanger 010 Air outlet
011 风扇 012 第一循环管路011 Fan 012 First circulation line
013 第一液冷板 014 第二循环管路013 The first liquid cold plate 014 The second circulation line
015 第二液冷板 016 第三循环管路015 Second liquid cold plate 016 Third circulation pipeline
017 内存条 018 热源017 Memory module 018 Heat source
019 主机板 020 螺丝019 Motherboard 020 Screw
021 电源供应器 022 入风口021 Power supply unit 022 Air inlet
023 注液口023 Injection port
具体实施方式Detailed ways
图1至图2示出本发明服务器液冷散热装置的一个优选实施例，其包括可拆卸式连接的主机和液冷散热装置001，主机包括主机板019、固定于主机板019上的电源供应器021、多个热源018和多个内存条017，液冷散热装置001包括换热器009、多个液冷板、多个循环管路以及固定于换热器009上的水泵004和多个风扇011；液冷板通过螺丝020与热源018固定为一体，换热器009设置于主机板019的后侧，循环管路将换热器009、水泵004及多个液冷板串连为一体，形成密闭的循环水回路。液冷散热装置001内注入液体，由水泵004驱动其内部液体循环，液体流经多个循环管路连接的液冷板，对与液冷板固定为一体的多个热源018进行热交换，并将热量传递至换热器009，风扇011靠近换热器009，再通过风扇011将换热器009与外界气体形成强制对流热交换，将热量排出，降低服务器内部温度，实现高效散热，避免服务器温度过高。Fig. 1 to Fig. 2 show a preferred embodiment of the server liquid cooling heat dissipation device of the present invention, and it comprises the main frame of detachable connection and liquid cooling heat dissipation device 001, and main frame comprises main board 019, the power supply that is fixed on main board 019 021, a plurality of heat sources 018 and a plurality of memory sticks 017, the liquid cooling heat sink 001 includes a heat exchanger 009, a plurality of liquid cold plates, a plurality of circulation pipelines, and a water pump 004 fixed on the heat exchanger 009 and a plurality of The fan 011; the liquid cooling plate is fixed together with the heat source 018 through the screw 020, the heat exchanger 009 is set on the rear side of the main board 019, and the circulation pipeline connects the heat exchanger 009, the water pump 004 and multiple liquid cooling plates in series , forming a closed circulating water loop. The liquid cooling device 001 is injected with liquid, and the internal liquid circulation is driven by the water pump 004. The liquid flows through the liquid cooling plates connected by multiple circulation pipelines, and performs heat exchange on the multiple heat sources 018 fixed integrally with the liquid cooling plates, and The heat is transferred to the heat exchanger 009, the fan 011 is close to the heat exchanger 009, and then the heat exchanger 009 and the outside air are formed to form forced convection heat exchange through the fan 011, the heat is discharged, the internal temperature of the server is reduced, and efficient heat dissipation is realized to avoid server Temperature is too high.
本实施例中水泵004下端设有注液口023，用于将流动散热的液体注入液冷散热装置001中进行循环。In this embodiment, the lower end of the water pump 004 is provided with a liquid injection port 023, which is used to inject the flowing liquid for heat dissipation into the liquid cooling device 001 for circulation.
本实施例中液冷板包括第一液冷板013、第二液冷板015、第三液冷板008和第四液冷板006，循环管路包括第一循环管路012、第二循环管路014、第三循环管路016、第四循环管路007和第五循环管路005；第一循环管路012的一端为出水口003，与水泵004相连接，另一端与第一液冷板013连通；第二循环管路014连接于第一液冷板013和第二液冷板015之间，第三循环管路016连接于第二液冷板015和第三液冷板008之间，第四循环管路007连接于第三液冷板008和第四液冷板006之间；第五循环管路005的一端与第四液冷板006连通，另一端为入水口002，连接于换热器009的一侧。In this embodiment, the liquid cold plate includes the first liquid cold plate 013, the second liquid cold plate 015, the third liquid cold plate 008 and the fourth liquid cold plate 006, and the circulation pipeline includes the first circulation pipeline 012, the second circulation pipeline Pipeline 014, third circulation pipeline 016, fourth circulation pipeline 007 and fifth circulation pipeline 005; one end of the first circulation pipeline 012 is the water outlet 003, which is connected to the water pump 004, and the other end is connected to the first liquid The cold plate 013 is connected; the second circulation pipeline 014 is connected between the first liquid cold plate 013 and the second liquid cold plate 015, and the third circulation pipeline 016 is connected between the second liquid cold plate 015 and the third liquid cold plate 008 Between, the fourth circulation pipeline 007 is connected between the third liquid cold plate 008 and the fourth liquid cold plate 006; one end of the fifth circulation pipeline 005 communicates with the fourth liquid cold plate 006, and the other end is the water inlet 002 , connected to one side of the heat exchanger 009.
本实施例中热源018为CPU中央处理器或电子元器件。In this embodiment, the heat source 018 is a CPU central processing unit or an electronic component.
本实施例中液冷板为单面散热或双面散热，液冷板可以只在接触主机板019的一侧设置液冷管散热，也可以在另一侧也设置液冷管实现双面散热，效率更高，散热效果更佳。In this embodiment, the liquid cooling plate is single-sided or double-sided heat dissipation. The liquid cooling plate can only be provided with a liquid cooling tube on the side that contacts the main board 019 to dissipate heat, or a liquid cooling tube can also be installed on the other side to achieve double-sided heat dissipation. , higher efficiency and better heat dissipation.
本实施例中多个风扇011并排设置于换热器009与液冷板之间，且出风口010朝向换热器009，入风口022朝向热源018。风扇011加速换热器009与外界气体形成强制对流热交换，风扇011的数量越多，散热效率越高，散热效果越好，入风口022朝向热源018，将热源018产生的热量带走，出风口010朝向换热器009，使风中的热量排出，有效降低服务器内部温度。In this embodiment, a plurality of fans 011 are arranged side by side between the heat exchanger 009 and the liquid cooling plate, and the air outlet 010 faces the heat exchanger 009 , and the air inlet 022 faces the heat source 018 . The fan 011 accelerates the heat exchanger 009 to form forced convection heat exchange with the outside air. The more fans 011, the higher the heat dissipation efficiency and the better the heat dissipation effect. The air inlet 022 faces the heat source 018, taking away the heat generated by the heat source 018, The tuyere 010 is directed toward the heat exchanger 009, so that the heat in the wind is discharged, and the internal temperature of the server is effectively reduced.
使用本发明的服务器液冷散热装置，热源所产生的热量藉由液冷板传递至换热器，风扇旋转加速换热器与外界气体的换热效率，因此热源的热量迅速被带走而使温度大幅降低，服务器的散热效率大幅提升，具体有益效果如下：Using the server liquid cooling device of the present invention, the heat generated by the heat source is transferred to the heat exchanger through the liquid cold plate, and the fan rotates to accelerate the heat exchange efficiency between the heat exchanger and the outside air, so the heat from the heat source is quickly taken away and the The temperature is greatly reduced, and the heat dissipation efficiency of the server is greatly improved. The specific beneficial effects are as follows:
(1设有多个液冷板，可解决多个热源散热问题；(1 There are multiple liquid cooling plates, which can solve the heat dissipation problem of multiple heat sources;
(2)换热器设置于主机板的后侧，风扇并排设置于换热器与液冷板之间，大幅提升服务器内部空间；(2) The heat exchanger is arranged on the rear side of the motherboard, and the fans are arranged side by side between the heat exchanger and the liquid cooling plate, which greatly improves the internal space of the server;
(3)风扇出风口朝向换热器，风扇入风口朝向热源，有效降低服务器内部温度；(3) The air outlet of the fan faces the heat exchanger, and the air inlet of the fan faces the heat source, effectively reducing the internal temperature of the server;
(4)通过循环管路将换热器、水泵及多个液冷板串连在一起，以形成密闭的循环水回路，热源的热量迅速被带走而使其热源(电子元器件)温度大幅降低；(4) The heat exchanger, water pump and multiple liquid cooling plates are connected in series through the circulating pipeline to form a closed circulating water circuit, and the heat of the heat source is quickly taken away so that the temperature of the heat source (electronic components) is greatly increased reduce;
(5)设置一水泵于循环管路中，高效驱动加速其液体循环，大幅提升热量传递；(5) Install a water pump in the circulation pipeline to efficiently drive and accelerate its liquid circulation, greatly improving heat transfer;
(6)主机板和液冷散热装置为分离式设计，使用时通过紧固螺丝连接，安装维护及其方便。(6) The main board and the liquid cooling device are designed separately, and are connected by fastening screws during use, which is extremely convenient for installation and maintenance.
以上内容仅为本发明的较佳实施例，对于本领域的普通技术人员，依据本发明的思想，在具体实施方式及应用范围上可以作出许多变化，只要这些变化未脱离本发明的构思，均属于本发明的保护范围。The above content is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the idea of the present invention, many changes can be made in the specific implementation and application range, as long as these changes do not depart from the concept of the present invention, all Belong to the protection scope of the present invention.
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