CN106990822A - A kind of server for being equipped with water-cooling heat radiating system - Google Patents
A kind of server for being equipped with water-cooling heat radiating system Download PDFInfo
- Publication number
- CN106990822A CN106990822A CN201710232677.1A CN201710232677A CN106990822A CN 106990822 A CN106990822 A CN 106990822A CN 201710232677 A CN201710232677 A CN 201710232677A CN 106990822 A CN106990822 A CN 106990822A
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- Prior art keywords
- water
- heat exchanger
- cooled heat
- fan
- coldplate
- Prior art date
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 26
- 230000015654 memory Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000012530 fluid Substances 0.000 description 10
- 238000009434 installation Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/32—Means for saving power
- G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/325—Power saving in peripheral device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of server for being equipped with water-cooling heat radiating system, is related to server radiating technology, and the present invention includes motherboard and radiating module.Motherboard includes thermal source.Radiating module includes coldplate, water-cooled heat exchanger, one group of circulation line and multiple fans.Coldplate is thermally contacted in thermal source.Water-cooled heat exchanger is arranged at the side of motherboard.Circulation line connects water-cooled heat exchanger and coldplate, to form circulation waterway.Fan is adjacent to water-cooled heat exchanger.Heat exchange is carried out to thermal source by coldplate, and transfers heat to water-cooled heat exchanger, fan further accelerates the exchange rate between water-cooled heat exchanger and ambient atmos.Therefore, the server that the present invention is provided can lift overall radiating efficiency.
Description
Technical field
The present invention relates to server radiating technology, more particularly to a kind of server for being equipped with water-cooling heat radiating system.
Background technology
With the development of Information technology, the use of electronic installation is also increasingly popularized.Meanwhile, in order to meet the various of people
Demand, the arithmetic speed of electronic installation is also increasingly faster, and function is also stronger and stronger.For server, it may include multiple
Electronic component, such as multiple central processing units, multiple storage devices, multiple internal memories, in this way, server can be by above-mentioned module
To improve arithmetic speed, expand storage volume and function.However, when the arithmetic speed of electronic component is improved or its quantity
During increase, the heat produced by electronic component is consequently increased, and raises the temperature of electronic component, and then influences server whole
The normal operation of body.Therefore, server is often set with multigroup blower module, to electronic component in the way of accelerating thermal convection current
Heat exchange is carried out, and then reduces the temperature of server.In in the prior art, can be used volume is larger and power is higher fan or
It is to increase the quantity of fan, to improve radiating efficiency, and then makes the temperature drop of electronic component.But, when the quantity of fan increases
Plus or using volume it is larger, power is higher when, the installation space of electronic component can be accounted for, more noises are even produced.Therefore,
A kind of server with radiating module is needed at present, in the case where not increasing setting radiating module space, remains to improve clothes
Business device radiating efficiency.
The content of the invention
In order to solve the above technical problems, the present invention proposes a kind of server for being equipped with water-cooling heat radiating system.
A kind of server for being equipped with water-cooling heat radiating system,
Including motherboard and radiating module；
Motherboard includes thermal source；
Radiating module includes coldplate, water-cooled heat exchanger, one group of circulation line and more than one fan；
Coldplate is thermally contacted in thermal source；Water-cooled heat exchanger is arranged at the side of motherboard；Circulation line connection water-cooled heat
Exchanger and coldplate, to form circulation waterway；Fan is adjacent to water-cooled heat exchanger；Thermal source is carried out by coldplate
Heat exchange, and water-cooled heat exchanger is transferred heat to, fan further accelerates the heat between water-cooled heat exchanger and ambient atmos
Exchange rate.
Further, the thermal source is the associated heating resources of central processing unit, memory board and memory bar composition, and the quantity of thermal source is
More than one and be separated by more than 1cm distance.
Further, the fan is arranged between water-cooled heat exchanger and coldplate.
Further, the fan is arranged side by side.
Further, each fan has air outlet respectively, and at least one air outlet is towards thermal source.
Further, the radiating module also includes water pump, in circulation line.Further, water-cooled heat exchanger
With a delivery port, coldplate is provided with water intake end, water pump respectively with the delivery port of water-cooled heat exchanger and coldplate
Water intake end is connected.
The beneficial effects of the invention are as follows
According to a kind of outfit water-cooling heat radiating system server provided by the present invention, the heat produced by thermal source is passed by coldplate
Water-cooled heat exchanger is handed to, fan rotates to accelerate water-cooled heat exchanger and extraneous exchange rate.Therefore, compared to
Prior art, the heat of thermal source is pulled away rapidly and temperature is greatly reduced, and the radiating efficiency of server is substantially improved.Furthermore,
The server of the present invention reduces the setting quantity of fan, but improves the radiating efficiency of server, also reaches effect of power saving.
Brief description of the drawings
Fig. 1 is the schematic top plan view of the present invention.
Embodiment
More detailed illustrate is carried out to present disclosure below：
As shown in figure 1, book server 10 includes casing 100, motherboard 200, radiating module 300 and power supply unit 400.
Motherboard 200 is arranged in casing 100.Motherboard 200 includes thermal source 210, multiple slots 230, multiple internal memories
231.Thermal source 210 is central processing unit (Central ProcessingUnit).In addition, thermal source can also be chipset, storage
Device or power supply unit, and the quantity of thermal source can be multiple and separated by a distance.When server 10 is operated, thermal source
210 can produce heat energy.Slot 230 is located at the both sides of thermal source 210 respectively, and internal memory 231 is arranged on slot 230.Work as server
During 10 operating, internal memory 231 can also produce heat energy.
Radiating module 300 is arranged in casing 100.Radiating module 300 includes coldplate 380, water-cooled heat exchanger
310 (liquid-coolingheat exchanger or liquid-cooling radiator), one group of circulation line 360 with
And multiple fans 320,330,340,350.Coldplate 380 is thermally contacted in thermal source 210.In coldplate 380 there is chamber (not paint
Show) and fins group (not illustrating), fins group is in chamber.Water-cooled heat exchanger 310 is arranged at motherboard 200
Side.Fan 320,330,340,350 is adjacent to water-cooled heat exchanger 310.The connection water-cooled heat of circulation line 360
Exchanger 310 and coldplate 380.In this way, circulation line 360, water-cooled heat exchanger 310 and the common shape of coldplate 380
Into circulation waterway.Fluid is flowable in circulation waterway, so that the heat transfer of coldplate 380 is to water-cooled heat exchanger 310.
In addition, also can be as needed, water-cooled heat exchanger 310 and fan 320,330,340,350 may be disposed at outside casing 100,
The quantity of fan 320,330,340,350 may be greater than one positive integer.
The set location of fan described in detail below.Fan 320,330,340,350 is arranged at water-cooled heat exchanger 310
And between coldplate 380, and fan 320,330,340,350 is arranged side by side (side byside).With fan 320,330,
Exemplified by 340, fan 320,330,340 has air intake vent 322,332,342 and air outlet 324,334,344, air intake vent respectively
322nd, 332,342 towards water-cooled heat exchanger 310.Air outlet 334,344 is towards thermal source 210, and air outlet 324 is towards slot
230.In the present embodiment, overall width phase of the width of water-cooled heat exchanger 310 substantially with fan 320,330,340,350
Together, in this way, when server 10 is operated, the rotation of fan 320,330,340,350 can lift water-cooled heat exchanger 310 and outer
The heat exchange of boundary's air.
At least one wind scooper (not illustrating) also can be set in radiating module 300, respectively positioned at fan 320,330,340
Air intake vent 322,332,342 or air outlet 324,334,344.When wind scooper is located at the air intake vent of fan 320,330,340
322nd, 332,342 when, can effectively guide ambient atmos into fan 320,330,340.When wind scooper is located at the air outlet of fan
324th, 334,344 when, use the air-flow that guiding fan 320,330,340 is produced, improve wind-guiding rate, and then improving heat radiation efficiency.
In this example, radiating module 300 also includes water pump 370, in circulation line 360.Water-cooled heat exchanger
310 have water inlet 314 and delivery port 312.Coldplate 380 has a water intake end 382 and water side 384, water intake end 382
And water side 384 is respectively communicated with chamber.Circulation line 360 includes the first pipeline 362, the second pipeline 364 and the 3rd pipeline
365.The two ends of first pipeline 362 connect the delivery port 312 of water-cooled heat exchanger 310 and one end of water pump 370 respectively, the
The two ends of two pipelines 364 connect the other end of water pump 370 and the water intake end 382 of coldplate 380 respectively.3rd pipeline 365
Two ends connect the water side 384 of coldplate 380 and the water inlet 314 of water-cooled heat exchanger 310 respectively.In other words, exist
In the present embodiment, the delivery port 312 and the phase of water intake end 382 of coldplate 380 of water pump 370 respectively with water-cooled heat exchanger 31
Connection.
Power supply unit 400 is arranged at the opposite side of motherboard 200, but the quantity and set location of power supply unit 400
It is adjusted according to actual demand.
The flow that radiating module 300 introduced below is radiated.First, when server 10 is transported, thermal source 210, internal memory
231st, on power supply unit 400 and motherboard 200 electronic component running and produce heat.Operate and produce by water pump 370
Draft, the fluid of the low temperature in water-cooled heat exchanger 310 flow in water pump 370 from delivery port 312 through the first pipeline 362.
Then, fluids in series enters in coldplate 380 through the second pipeline 364 and water intake end 382.Because thermal source 210 is thermally contacted in cold
But plate 380, so the heat that thermal source 210 is produced can be transferred to coldplate 380, so that the heat of thermal source 210 enters with coldplate 380
Row heat exchange.In this way, heat transfer is to fluid, the temperature of fluid is raised because absorbing heat.Then, the fluid of high temperature is cooled down certainly
The water side 384 of plate 380 and the water inlet 314 that water-cooled heat exchanger 310 is flow to via the 3rd pipeline 365, high temperature fluid
Heat transfer to water-cooled heat exchanger 310, and water-cooled heat exchanger 31 can carry out heat exchange with ambient atmos, to take away
Heat.In this way, the temperature of fluid can decline rapidly.Because the operating of fan 320,330,340,350, can more accelerate ambient atmos
Thermal convection current.The ambient atmos of fan guiding simultaneously enter in server 10, gas and thermal source 210, internal memory 231, power supply unit
400 and motherboard 200 on electronic component carry out heat exchange, take away heat.In this way, the bulk temperature in server 10 can be fast
Speed declines, and then maintains the stable running of server 10.After the fluid temperature (F.T.) in water-cooled heat exchanger 310 declines, fluid
Water-cooled heat exchanger 310 can be flowed out again, to carry out heat exchange again with coldplate 380.
On the whole, because thermal source 210 is the maximum heat source of server 10, when the heat of thermal source 210 is dissipated rapidly
After thermal modules 300 are taken away, the temperature in server 10 is to decline to a great extent, and then maintains the stable running of server 10.Even if
The air-flow for guiding and entering in server 10 by fan 320,330,340,350 has absorbed water-cooled heat exchanger 310
Heat, do not interfere with heat exchange of the following air-flow with other electronic components in the server 10 yet.
In addition, or power higher fan more compared to usage quantity in the prior art, the service that the present invention is provided
Though the radiating module 300 of device 10 still can effectively lift integrity service device 10 using negligible amounts, volume and lower-powered fan
Radiating efficiency.In this way, server 10 can also install more electronic components or central processing unit, to lift the work(of server
Energy and computation rate.It is total described, it is equipped with according to one kind provided by the present invention produced by water-cooling heat radiating system server, thermal source
Heat be transferred to water-cooled heat exchanger by coldplate, fan rotates to accelerate water-cooled heat exchanger and ambient atmos
Exchange rate.Therefore, compared to prior art, the temperature of thermal source is greatly reduced, and the radiating efficiency of server is substantially improved.
Therefore the server that the present invention is provided solves the problem of prior art server radiating is not good.Furthermore, service of the invention
Device reduces the setting quantity of fan or reduces its volume, but improves the radiating efficiency of server, also reaches effect of power saving.
Claims (8)
1. a kind of server for being equipped with water-cooling heat radiating system, it is characterised in that
Including motherboard and radiating module；
Motherboard includes thermal source；
Radiating module includes coldplate, water-cooled heat exchanger, one group of circulation line and more than one fan；
Coldplate is thermally contacted in thermal source；Water-cooled heat exchanger is arranged at the side of motherboard；Circulation line connection water-cooled heat
Exchanger and coldplate, to form circulation waterway；Fan is adjacent to water-cooled heat exchanger；Thermal source is carried out by coldplate
Heat exchange, and water-cooled heat exchanger is transferred heat to, fan further accelerates the heat between water-cooled heat exchanger and ambient atmos
Exchange rate.
2. server according to claim 1, it is characterised in that the thermal source is central processing unit, memory board and memory bar
The associated heating resources of composition.
3. server according to claim 2, it is characterised in that the quantity of thermal source for more than one and be separated by 1cm with
On distance.
4. server according to claim 1, it is characterised in that the fan is arranged at water-cooled heat exchanger and cold
But between plate.
5. server according to claim 3, it is characterised in that the fan is arranged side by side.
6. server according to claim 1 or 5, it is characterised in that each fan has an air outlet respectively, extremely
A rare air outlet is towards thermal source.
7. server according to claim 1, it is characterised in that the radiating module also includes water pump, located at circulation pipe
Lu Zhong.
8. server according to claim 7, it is characterised in that water-cooled heat exchanger has a delivery port, cooling
Plate is provided with water intake end, and water pump is connected with the delivery port of water-cooled heat exchanger and the water intake end of coldplate respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710232677.1A CN106990822A (en) | 2017-04-11 | 2017-04-11 | A kind of server for being equipped with water-cooling heat radiating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710232677.1A CN106990822A (en) | 2017-04-11 | 2017-04-11 | A kind of server for being equipped with water-cooling heat radiating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106990822A true CN106990822A (en) | 2017-07-28 |
Family
ID=59415888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710232677.1A Pending CN106990822A (en) | 2017-04-11 | 2017-04-11 | A kind of server for being equipped with water-cooling heat radiating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106990822A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| CN111045502A (en) * | 2019-12-23 | 2020-04-21 | 联想(北京)有限公司 | Combined type cooling system and electronic device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104423504A (en) * | 2013-08-28 | 2015-03-18 | 英业达科技有限公司 | Server |
| CN104423503A (en) * | 2013-08-28 | 2015-03-18 | 英业达科技有限公司 | Server |
| CN106527603A (en) * | 2015-09-10 | 2017-03-22 | 天津神为科技有限公司 | Totally-sealed normal-temperature self-circulating energy-saving mute special server case |
-
2017
- 2017-04-11 CN CN201710232677.1A patent/CN106990822A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104423504A (en) * | 2013-08-28 | 2015-03-18 | 英业达科技有限公司 | Server |
| CN104423503A (en) * | 2013-08-28 | 2015-03-18 | 英业达科技有限公司 | Server |
| CN106527603A (en) * | 2015-09-10 | 2017-03-22 | 天津神为科技有限公司 | Totally-sealed normal-temperature self-circulating energy-saving mute special server case |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| CN111045502A (en) * | 2019-12-23 | 2020-04-21 | 联想(北京)有限公司 | Combined type cooling system and electronic device |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170728 |
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| RJ01 | Rejection of invention patent application after publication |