CN207780708U - A kind of server liquid-cooling heat radiator - Google Patents

A kind of server liquid-cooling heat radiator Download PDF

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Publication number
CN207780708U
CN207780708U CN201820153203.8U CN201820153203U CN207780708U CN 207780708 U CN207780708 U CN 207780708U CN 201820153203 U CN201820153203 U CN 201820153203U CN 207780708 U CN207780708 U CN 207780708U
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Prior art keywords
liquid
heat
cooling plate
liquid cooling
heat exchanger
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CN201820153203.8U
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Chinese (zh)
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刘信生
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Shenzhen Zhitong Electronics Co Ltd
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Shenzhen Zhitong Electronics Co Ltd
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Abstract

The utility model is related to a kind of server liquid-cooling heat radiators, host including detachable connection and liquid-cooling heat radiator, power supply unit, multiple heat sources and the multiple memory bars that host includes motherboard, is fixed on motherboard, liquid-cooling heat radiator includes heat exchanger, multiple liquid cooling plates, multiple circulation lines and the water pump being fixed on heat exchanger and multiple fans;Liquid cooling plate is fixed as one by screw and heat source, and heat exchanger is set to the rear side of motherboard, and heat exchanger, water pump and multiple liquid cooling plates series winding are integrated by circulation line, form closed circulating water loop.The server liquid-cooling heat radiator of the utility model, heat exchanger, water pump and multiple liquid cooling plates are chained together by circulation line, to form closed circulating water loop, fan spins up the heat exchange efficiency of heat exchanger and ambient atmos, therefore the heat of heat source is pulled away rapidly and temperature is made to be greatly reduced, and the radiating efficiency of server is substantially improved.

Description

A kind of server liquid-cooling heat radiator
Technical field
The utility model is related to heat sink technology fields, more particularly to suitable for the electronics member in server, data center The heat dissipation of device.
Background technology
With the development of information technology, the integrated level of electronic equipment is higher and higher, and the performance of computer and traffic device is more next Stronger, the power of corresponding electronic component is also increasing, and current data center and high performance computing service device are also in court More high density, the direction of higher computing capability is developed.However, when the arithmetic speed raising of electronic component or its quantity increase When, heat caused by electronic component is consequently increased, and the temperature of electronic component is made to increase, and it is whole to directly affect server Body works normally, it is therefore desirable to install heat dissipation equipment and radiate, to reduce the junction temperature of component, it is ensured that component is allowing temperature The lower normal, reliability service of degree.
Traditional server, which is often arranged, has multigroup blower module, is carried out to electronic component in a manner of accelerating thermal convection current Heat exchange reduces the temperature of server.Due in the prior art, larger volume can be used and the higher fan of power or increase wind Quantity is fanned to improve radiating efficiency, still, service internal electronic component can be occupied when number of fans increases or increases in power Installation space, even generate more noises, it is therefore desirable to strengthen heat dissipation technology to meet the radiating requirements of server.
Utility model content
The technical problems to be solved in the utility model is:A kind of server liquid-cooling heat radiator is provided, server is improved and dissipates The thermal efficiency reduces energy consumption, promotes its inner space, and convenient for installation and maintenance, solves air-cooled in existing server radiating method The problem that radiating efficiency is low, high energy consumption, high noise, occupied space are big.
The technical solution of the utility model is:The utility model provides a kind of server liquid-cooling heat radiator, including The host and liquid-cooling heat radiator of detachable connection, the host includes motherboard, the power supply that is fixed on the motherboard Power supply unit, multiple heat sources and multiple memory bars, the liquid-cooling heat radiator include heat exchanger, multiple liquid cooling plates, multiple circulation pipes Road and the water pump being fixed on the heat exchanger and multiple fans;The liquid cooling plate is fixed as one by screw and the heat source Body, the heat exchanger are set to the rear side of the motherboard, and the circulation line is by the heat exchanger, water pump and multiple liquid Cold plate series winding is integrated, and forms closed circulating water loop.
Further, the water pump lower end is equipped with liquid injection port.
Further, the liquid cooling plate includes the first liquid cooling plate, the second liquid cooling plate, third liquid cooling plate and the 4th liquid cooling plate, The circulation line includes first circulation pipeline, second circulation pipeline, third circulation line, the 4th circulation line and the 5th cycle Pipeline;One end of the first circulation pipeline is water outlet, is connected with the water pump, and the other end connects with first liquid cooling plate It is logical;The second circulation piping connection is between first liquid cooling plate and the second liquid cooling plate, the third circulation line connection Between second liquid cooling plate and third liquid cooling plate, the 4th circulation line is connected to the third liquid cooling plate and the 4th liquid Between cold plate;One end of 5th circulation line is connected to the 4th liquid cooling plate, and the other end is water inlet, is connected to described The side of heat exchanger.
Further, the heat source is cpu central processing unit or electronic component.
Further, the liquid cooling plate is single side heat dissipation or two-side radiation.
Further, multiple fans are arranged side by side between the heat exchanger and liquid cooling plate.
Further, the air outlet of the fan is towards the heat exchanger, and air intake vent is towards the heat source.
The server liquid-cooling heat radiator for implementing the utility model, has the advantages that:The service of the utility model Device liquid-cooling heat radiator, heat caused by heat source are transferred to heat exchanger by liquid cooling plate, fan spin up heat exchanger with it is outer The heat exchange efficiency of boundary's gas, therefore the heat of heat source is pulled away rapidly and temperature is made to be greatly reduced, the radiating efficiency of server is big Width is promoted, and is specifically had the beneficial effect that:
(1 is equipped with multiple liquid cooling plates, can solve the problems, such as multiple cooling heat sources;
(2) heat exchanger is set to the rear side of motherboard, and fan is arranged side by side between heat exchanger and liquid cooling plate, is substantially improved Server internal space;
(3) fan outlet effectively reduces server internal temperature towards heat exchanger, fan air intake vent towards heat source;
(4) heat exchanger, water pump and multiple liquid cooling plates are chained together by circulation line, to form closed recirculated water The heat in circuit, heat source is pulled away rapidly and its heat source (electronic component) temperature is made to be greatly reduced;
(5) for one water pump of setting in circulation line, high efficiency drive accelerates its liquid circulation, and heat transfer is substantially improved;
(6) motherboard and liquid-cooling heat radiator are separation design, and when use is connected by fastening screw, installation maintenance and It is convenient.
Description of the drawings
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing:
Fig. 1 is that the motherboard of the utility model server liquid-cooling heat radiator and liquid-cooling heat radiator decomposition texture are illustrated Figure;
Fig. 2 is the overall package schematic diagram of the utility model server liquid-cooling heat radiator.
Reference numeral:
001 liquid-cooling heat radiator, 002 water inlet
003 water outlet, 004 water pump
The 4th liquid cooling plate of 005 the 5th circulation line 006
007 the 4th circulation line, 008 third liquid cooling plate
009 heat exchanger, 010 air outlet
011 fan, 012 first circulation pipeline
013 first liquid cooling plate, 014 second circulation pipeline
015 second liquid cooling plate, 016 third circulation line
017 memory bar, 018 heat source
019 motherboard, 020 screw
021 power supply unit, 022 air intake vent
023 liquid injection port
Specific implementation mode
Fig. 1 is to Fig. 2 shows a preferred embodiments of the utility model server liquid-cooling heat radiator comprising detachable The host and liquid-cooling heat radiator 001 of formula connection, host includes motherboard 019, the power supply unit that is fixed on motherboard 019 021, multiple heat sources 018 and multiple memory bars 017, liquid-cooling heat radiator 001 include heat exchanger 009, multiple liquid cooling plates, multiple follow Endless tube road and the water pump 004 being fixed on heat exchanger 009 and multiple fans 011;Liquid cooling plate passes through screw 020 and heat source 018 It is fixed as one, heat exchanger 009 is set to the rear side of motherboard 019, and circulation line is by heat exchanger 009, water pump 004 and multiple liquid Cold plate series winding is integrated, and forms closed circulating water loop.Liquid is injected in liquid-cooling heat radiator 001, it is driven by water pump 004 Internal liquid circulation, liquid flow through the liquid cooling plate of multiple circulation line connections, pair multiple heat sources being fixed as one with liquid cooling plate 018 carries out heat exchange, and transfers heat to heat exchanger 009, and fan 011 will be changed close to heat exchanger 009, then by fan 011 Hot device 009 forms forced convertion heat exchange with ambient atmos, and heat is discharged, and reduces server internal temperature, realizes and efficiently dissipates Heat avoids server temperature excessively high.
004 lower end of water pump is equipped with liquid injection port 023 in the present embodiment, the liquid injection liquid-cooling heat radiation dress for that will flow heat dissipation It is recycled in setting to 0 01.
Liquid cooling plate includes the first liquid cooling plate 013, the second liquid cooling plate 015, third liquid cooling plate 008 and the 4th liquid in the present embodiment Cold plate 006, circulation line include first circulation pipeline 012, second circulation pipeline 014, the cycle of third circulation line the 016, the 4th Pipeline 007 and the 5th circulation line 005;One end of first circulation pipeline 012 is water outlet 003, is connected with water pump 004, separately One end is connected to the first liquid cooling plate 013;Second circulation pipeline 014 be connected to the first liquid cooling plate 013 and the second liquid cooling plate 015 it Between, third circulation line 016 is connected between the second liquid cooling plate 015 and third liquid cooling plate 008, the connection of the 4th circulation line 007 Between third liquid cooling plate 008 and the 4th liquid cooling plate 006;One end of 5th circulation line 005 is connected to the 4th liquid cooling plate 006, The other end is water inlet 002, is connected to the side of heat exchanger 009.
Heat source 018 is cpu central processing unit or electronic component in the present embodiment.
Liquid cooling plate is that single side radiates or two-side radiation, liquid cooling plate can be only the one of contact motherboard 019 in the present embodiment Side is arranged liquid cooling pipe and radiates, and can also be also provided with liquid cooling pipe in the other side and realize two-side radiation, more efficient, heat dissipation effect is more It is good.
Multiple fans 011 are arranged side by side between heat exchanger 009 and liquid cooling plate in the present embodiment, and 010 direction of air outlet Heat exchanger 009, air intake vent 022 is towards heat source 018.Fan 011 accelerates heat exchanger 009 to form the friendship of forced convertion heat with ambient atmos It changes, the quantity of fan 011 is more, and radiating efficiency is higher, and heat dissipation effect is better, and air intake vent 022 is towards heat source 018, by heat source 018 The heat of generation is taken away, and air outlet 010 makes the heat in wind be discharged towards heat exchanger 009, effectively reduces server internal temperature Degree.
Using the server liquid-cooling heat radiator of the utility model, caused by heat source, heat is transferred to by liquid cooling plate changes Hot device, fan spins up the heat exchange efficiency of heat exchanger and ambient atmos, therefore the heat of heat source is pulled away rapidly and makes temperature It is greatly reduced, the radiating efficiency of server is substantially improved, and specifically has the beneficial effect that:
(1 is equipped with multiple liquid cooling plates, can solve the problems, such as multiple cooling heat sources;
(2) heat exchanger is set to the rear side of motherboard, and fan is arranged side by side between heat exchanger and liquid cooling plate, is substantially improved Server internal space;
(3) fan outlet effectively reduces server internal temperature towards heat exchanger, fan air intake vent towards heat source;
(4) heat exchanger, water pump and multiple liquid cooling plates are chained together by circulation line, to form closed recirculated water The heat in circuit, heat source is pulled away rapidly and its heat source (electronic component) temperature is made to be greatly reduced;
(5) for one water pump of setting in circulation line, high efficiency drive accelerates its liquid circulation, and heat transfer is substantially improved;
(6) motherboard and liquid-cooling heat radiator are separation design, and when use is connected by fastening screw, installation maintenance and It is convenient.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality It, in specific embodiments and applications can be with many changes may be made, as long as these variations are without departing from this with novel thought The design of utility model, belongs to the scope of protection of the utility model.

Claims (7)

1. a kind of server liquid-cooling heat radiator, which is characterized in that the host including detachable connection and liquid-cooling heat radiator (001), the host include motherboard (019), the power supply unit (021), the Duo Gere that are fixed on the motherboard (019) Source (018) and multiple memory bars (017), the liquid-cooling heat radiator (001) includes heat exchanger (009), multiple liquid cooling plates, multiple Circulation line and the water pump (004) being fixed on the heat exchanger (009) and multiple fans (011);The liquid cooling plate passes through Screw (020) is fixed as one with the heat source (018), after the heat exchanger (009) is set to the motherboard (019) The heat exchanger (009), water pump (004) and multiple liquid cooling plate series windings are integrated, are formed closed by side, the circulation line Circulating water loop.
2. server liquid-cooling heat radiator according to claim 1, which is characterized in that water pump (004) lower end is equipped with Liquid injection port (023).
3. server liquid-cooling heat radiator according to claim 1, which is characterized in that the liquid cooling plate includes the first liquid cooling Plate (013), the second liquid cooling plate (015), third liquid cooling plate (008) and the 4th liquid cooling plate (006), the circulation line include first Circulation line (012), second circulation pipeline (014), third circulation line (016), the 4th circulation line (007) and the 5th cycle Pipeline (005);One end of the first circulation pipeline (012) is water outlet (003), is connected with the water pump (004), another End is connected to first liquid cooling plate (013);The second circulation pipeline (014) be connected to first liquid cooling plate (013) and Between second liquid cooling plate (015), the third circulation line (016) is connected to second liquid cooling plate (015) and third liquid cooling Between plate (008), the 4th circulation line (007) be connected to the third liquid cooling plate (008) and the 4th liquid cooling plate (006) it Between;One end of 5th circulation line (005) is connected to the 4th liquid cooling plate (006), and the other end is water inlet (002), It is connected to the side of the heat exchanger (009).
4. server liquid-cooling heat radiator according to claim 1, which is characterized in that the heat source (018) is the centers CPU Processor or electronic component.
5. server liquid-cooling heat radiator according to claim 1, which is characterized in that the liquid cooling plate be single side radiate or Two-side radiation.
6. server liquid-cooling heat radiator according to claim 1, which is characterized in that multiple fans (011) are side by side The heat exchanger (009) is set between liquid cooling plate.
7. server liquid-cooling heat radiator according to claim 1 or 6, which is characterized in that the outlet air of the fan (011) Mouthful (010) towards the heat exchanger (009), air intake vent (022) is towards the heat source (018).
CN201820153203.8U 2018-01-30 2018-01-30 A kind of server liquid-cooling heat radiator Active CN207780708U (en)

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Application Number Priority Date Filing Date Title
CN201820153203.8U CN207780708U (en) 2018-01-30 2018-01-30 A kind of server liquid-cooling heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820153203.8U CN207780708U (en) 2018-01-30 2018-01-30 A kind of server liquid-cooling heat radiator

Publications (1)

Publication Number Publication Date
CN207780708U true CN207780708U (en) 2018-08-28

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109857227A (en) * 2018-12-28 2019-06-07 曙光节能技术(北京)股份有限公司 The liquid cooling system of server
CN109885148A (en) * 2018-12-28 2019-06-14 曙光节能技术(北京)股份有限公司 Alleviate the method for server liquid cooling system failure and the cooling system of server
CN111372426A (en) * 2020-03-13 2020-07-03 肇庆学院 Liquid cooling heat abstractor of electromechanical device
CN111488044A (en) * 2020-04-10 2020-08-04 扬州万方电子技术有限责任公司 Efficient heat dissipation server based on VPX framework

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109857227A (en) * 2018-12-28 2019-06-07 曙光节能技术(北京)股份有限公司 The liquid cooling system of server
CN109885148A (en) * 2018-12-28 2019-06-14 曙光节能技术(北京)股份有限公司 Alleviate the method for server liquid cooling system failure and the cooling system of server
CN111372426A (en) * 2020-03-13 2020-07-03 肇庆学院 Liquid cooling heat abstractor of electromechanical device
CN111488044A (en) * 2020-04-10 2020-08-04 扬州万方电子技术有限责任公司 Efficient heat dissipation server based on VPX framework
CN111488044B (en) * 2020-04-10 2021-02-12 扬州万方电子技术有限责任公司 Heat dissipation server based on VPX framework

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