CN207780708U - A kind of server liquid-cooling heat radiator - Google Patents
A kind of server liquid-cooling heat radiator Download PDFInfo
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- CN207780708U CN207780708U CN201820153203.8U CN201820153203U CN207780708U CN 207780708 U CN207780708 U CN 207780708U CN 201820153203 U CN201820153203 U CN 201820153203U CN 207780708 U CN207780708 U CN 207780708U
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- liquid
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- cooling plate
- liquid cooling
- heat exchanger
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Abstract
The utility model is related to a kind of server liquid-cooling heat radiators, host including detachable connection and liquid-cooling heat radiator, power supply unit, multiple heat sources and the multiple memory bars that host includes motherboard, is fixed on motherboard, liquid-cooling heat radiator includes heat exchanger, multiple liquid cooling plates, multiple circulation lines and the water pump being fixed on heat exchanger and multiple fans；Liquid cooling plate is fixed as one by screw and heat source, and heat exchanger is set to the rear side of motherboard, and heat exchanger, water pump and multiple liquid cooling plates series winding are integrated by circulation line, form closed circulating water loop.The server liquid-cooling heat radiator of the utility model, heat exchanger, water pump and multiple liquid cooling plates are chained together by circulation line, to form closed circulating water loop, fan spins up the heat exchange efficiency of heat exchanger and ambient atmos, therefore the heat of heat source is pulled away rapidly and temperature is made to be greatly reduced, and the radiating efficiency of server is substantially improved.
Description
Technical field
The utility model is related to heat sink technology fields, more particularly to suitable for the electronics member in server, data center
The heat dissipation of device.
Background technology
With the development of information technology, the integrated level of electronic equipment is higher and higher, and the performance of computer and traffic device is more next
Stronger, the power of corresponding electronic component is also increasing, and current data center and high performance computing service device are also in court
More high density, the direction of higher computing capability is developed.However, when the arithmetic speed raising of electronic component or its quantity increase
When, heat caused by electronic component is consequently increased, and the temperature of electronic component is made to increase, and it is whole to directly affect server
Body works normally, it is therefore desirable to install heat dissipation equipment and radiate, to reduce the junction temperature of component, it is ensured that component is allowing temperature
The lower normal, reliability service of degree.
Traditional server, which is often arranged, has multigroup blower module, is carried out to electronic component in a manner of accelerating thermal convection current
Heat exchange reduces the temperature of server.Due in the prior art, larger volume can be used and the higher fan of power or increase wind
Quantity is fanned to improve radiating efficiency, still, service internal electronic component can be occupied when number of fans increases or increases in power
Installation space, even generate more noises, it is therefore desirable to strengthen heat dissipation technology to meet the radiating requirements of server.
Utility model content
The technical problems to be solved in the utility model is：A kind of server liquid-cooling heat radiator is provided, server is improved and dissipates
The thermal efficiency reduces energy consumption, promotes its inner space, and convenient for installation and maintenance, solves air-cooled in existing server radiating method
The problem that radiating efficiency is low, high energy consumption, high noise, occupied space are big.
The technical solution of the utility model is：The utility model provides a kind of server liquid-cooling heat radiator, including
The host and liquid-cooling heat radiator of detachable connection, the host includes motherboard, the power supply that is fixed on the motherboard
Power supply unit, multiple heat sources and multiple memory bars, the liquid-cooling heat radiator include heat exchanger, multiple liquid cooling plates, multiple circulation pipes
Road and the water pump being fixed on the heat exchanger and multiple fans；The liquid cooling plate is fixed as one by screw and the heat source
Body, the heat exchanger are set to the rear side of the motherboard, and the circulation line is by the heat exchanger, water pump and multiple liquid
Cold plate series winding is integrated, and forms closed circulating water loop.
Further, the water pump lower end is equipped with liquid injection port.
Further, the liquid cooling plate includes the first liquid cooling plate, the second liquid cooling plate, third liquid cooling plate and the 4th liquid cooling plate,
The circulation line includes first circulation pipeline, second circulation pipeline, third circulation line, the 4th circulation line and the 5th cycle
Pipeline；One end of the first circulation pipeline is water outlet, is connected with the water pump, and the other end connects with first liquid cooling plate
It is logical；The second circulation piping connection is between first liquid cooling plate and the second liquid cooling plate, the third circulation line connection
Between second liquid cooling plate and third liquid cooling plate, the 4th circulation line is connected to the third liquid cooling plate and the 4th liquid
Between cold plate；One end of 5th circulation line is connected to the 4th liquid cooling plate, and the other end is water inlet, is connected to described
The side of heat exchanger.
Further, the heat source is cpu central processing unit or electronic component.
Further, the liquid cooling plate is single side heat dissipation or two-side radiation.
Further, multiple fans are arranged side by side between the heat exchanger and liquid cooling plate.
Further, the air outlet of the fan is towards the heat exchanger, and air intake vent is towards the heat source.
The server liquid-cooling heat radiator for implementing the utility model, has the advantages that：The service of the utility model
Device liquid-cooling heat radiator, heat caused by heat source are transferred to heat exchanger by liquid cooling plate, fan spin up heat exchanger with it is outer
The heat exchange efficiency of boundary's gas, therefore the heat of heat source is pulled away rapidly and temperature is made to be greatly reduced, the radiating efficiency of server is big
Width is promoted, and is specifically had the beneficial effect that：
(1 is equipped with multiple liquid cooling plates, can solve the problems, such as multiple cooling heat sources；
(2) heat exchanger is set to the rear side of motherboard, and fan is arranged side by side between heat exchanger and liquid cooling plate, is substantially improved
Server internal space；
(3) fan outlet effectively reduces server internal temperature towards heat exchanger, fan air intake vent towards heat source；
(4) heat exchanger, water pump and multiple liquid cooling plates are chained together by circulation line, to form closed recirculated water
The heat in circuit, heat source is pulled away rapidly and its heat source (electronic component) temperature is made to be greatly reduced；
(5) for one water pump of setting in circulation line, high efficiency drive accelerates its liquid circulation, and heat transfer is substantially improved；
(6) motherboard and liquid-cooling heat radiator are separation design, and when use is connected by fastening screw, installation maintenance and
It is convenient.
Description of the drawings
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing：
Fig. 1 is that the motherboard of the utility model server liquid-cooling heat radiator and liquid-cooling heat radiator decomposition texture are illustrated
Figure；
Fig. 2 is the overall package schematic diagram of the utility model server liquid-cooling heat radiator.
Reference numeral：
001 liquid-cooling heat radiator, 002 water inlet
003 water outlet, 004 water pump
The 4th liquid cooling plate of 005 the 5th circulation line 006
007 the 4th circulation line, 008 third liquid cooling plate
009 heat exchanger, 010 air outlet
011 fan, 012 first circulation pipeline
013 first liquid cooling plate, 014 second circulation pipeline
015 second liquid cooling plate, 016 third circulation line
017 memory bar, 018 heat source
019 motherboard, 020 screw
021 power supply unit, 022 air intake vent
023 liquid injection port
Specific implementation mode
Fig. 1 is to Fig. 2 shows a preferred embodiments of the utility model server liquid-cooling heat radiator comprising detachable
The host and liquid-cooling heat radiator 001 of formula connection, host includes motherboard 019, the power supply unit that is fixed on motherboard 019
021, multiple heat sources 018 and multiple memory bars 017, liquid-cooling heat radiator 001 include heat exchanger 009, multiple liquid cooling plates, multiple follow
Endless tube road and the water pump 004 being fixed on heat exchanger 009 and multiple fans 011；Liquid cooling plate passes through screw 020 and heat source 018
It is fixed as one, heat exchanger 009 is set to the rear side of motherboard 019, and circulation line is by heat exchanger 009, water pump 004 and multiple liquid
Cold plate series winding is integrated, and forms closed circulating water loop.Liquid is injected in liquid-cooling heat radiator 001, it is driven by water pump 004
Internal liquid circulation, liquid flow through the liquid cooling plate of multiple circulation line connections, pair multiple heat sources being fixed as one with liquid cooling plate
018 carries out heat exchange, and transfers heat to heat exchanger 009, and fan 011 will be changed close to heat exchanger 009, then by fan 011
Hot device 009 forms forced convertion heat exchange with ambient atmos, and heat is discharged, and reduces server internal temperature, realizes and efficiently dissipates
Heat avoids server temperature excessively high.
004 lower end of water pump is equipped with liquid injection port 023 in the present embodiment, the liquid injection liquid-cooling heat radiation dress for that will flow heat dissipation
It is recycled in setting to 0 01.
Liquid cooling plate includes the first liquid cooling plate 013, the second liquid cooling plate 015, third liquid cooling plate 008 and the 4th liquid in the present embodiment
Cold plate 006, circulation line include first circulation pipeline 012, second circulation pipeline 014, the cycle of third circulation line the 016, the 4th
Pipeline 007 and the 5th circulation line 005；One end of first circulation pipeline 012 is water outlet 003, is connected with water pump 004, separately
One end is connected to the first liquid cooling plate 013；Second circulation pipeline 014 be connected to the first liquid cooling plate 013 and the second liquid cooling plate 015 it
Between, third circulation line 016 is connected between the second liquid cooling plate 015 and third liquid cooling plate 008, the connection of the 4th circulation line 007
Between third liquid cooling plate 008 and the 4th liquid cooling plate 006；One end of 5th circulation line 005 is connected to the 4th liquid cooling plate 006,
The other end is water inlet 002, is connected to the side of heat exchanger 009.
Heat source 018 is cpu central processing unit or electronic component in the present embodiment.
Liquid cooling plate is that single side radiates or two-side radiation, liquid cooling plate can be only the one of contact motherboard 019 in the present embodiment
Side is arranged liquid cooling pipe and radiates, and can also be also provided with liquid cooling pipe in the other side and realize two-side radiation, more efficient, heat dissipation effect is more
It is good.
Multiple fans 011 are arranged side by side between heat exchanger 009 and liquid cooling plate in the present embodiment, and 010 direction of air outlet
Heat exchanger 009, air intake vent 022 is towards heat source 018.Fan 011 accelerates heat exchanger 009 to form the friendship of forced convertion heat with ambient atmos
It changes, the quantity of fan 011 is more, and radiating efficiency is higher, and heat dissipation effect is better, and air intake vent 022 is towards heat source 018, by heat source 018
The heat of generation is taken away, and air outlet 010 makes the heat in wind be discharged towards heat exchanger 009, effectively reduces server internal temperature
Degree.
Using the server liquid-cooling heat radiator of the utility model, caused by heat source, heat is transferred to by liquid cooling plate changes
Hot device, fan spins up the heat exchange efficiency of heat exchanger and ambient atmos, therefore the heat of heat source is pulled away rapidly and makes temperature
It is greatly reduced, the radiating efficiency of server is substantially improved, and specifically has the beneficial effect that：
(1 is equipped with multiple liquid cooling plates, can solve the problems, such as multiple cooling heat sources；
(2) heat exchanger is set to the rear side of motherboard, and fan is arranged side by side between heat exchanger and liquid cooling plate, is substantially improved
Server internal space；
(3) fan outlet effectively reduces server internal temperature towards heat exchanger, fan air intake vent towards heat source；
(4) heat exchanger, water pump and multiple liquid cooling plates are chained together by circulation line, to form closed recirculated water
The heat in circuit, heat source is pulled away rapidly and its heat source (electronic component) temperature is made to be greatly reduced；
(5) for one water pump of setting in circulation line, high efficiency drive accelerates its liquid circulation, and heat transfer is substantially improved；
(6) motherboard and liquid-cooling heat radiator are separation design, and when use is connected by fastening screw, installation maintenance and
It is convenient.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
It, in specific embodiments and applications can be with many changes may be made, as long as these variations are without departing from this with novel thought
The design of utility model, belongs to the scope of protection of the utility model.
Claims (7)
1. a kind of server liquid-cooling heat radiator, which is characterized in that the host including detachable connection and liquid-cooling heat radiator
(001), the host include motherboard (019), the power supply unit (021), the Duo Gere that are fixed on the motherboard (019)
Source (018) and multiple memory bars (017), the liquid-cooling heat radiator (001) includes heat exchanger (009), multiple liquid cooling plates, multiple
Circulation line and the water pump (004) being fixed on the heat exchanger (009) and multiple fans (011)；The liquid cooling plate passes through
Screw (020) is fixed as one with the heat source (018), after the heat exchanger (009) is set to the motherboard (019)
The heat exchanger (009), water pump (004) and multiple liquid cooling plate series windings are integrated, are formed closed by side, the circulation line
Circulating water loop.
2. server liquid-cooling heat radiator according to claim 1, which is characterized in that water pump (004) lower end is equipped with
Liquid injection port (023).
3. server liquid-cooling heat radiator according to claim 1, which is characterized in that the liquid cooling plate includes the first liquid cooling
Plate (013), the second liquid cooling plate (015), third liquid cooling plate (008) and the 4th liquid cooling plate (006), the circulation line include first
Circulation line (012), second circulation pipeline (014), third circulation line (016), the 4th circulation line (007) and the 5th cycle
Pipeline (005)；One end of the first circulation pipeline (012) is water outlet (003), is connected with the water pump (004), another
End is connected to first liquid cooling plate (013)；The second circulation pipeline (014) be connected to first liquid cooling plate (013) and
Between second liquid cooling plate (015), the third circulation line (016) is connected to second liquid cooling plate (015) and third liquid cooling
Between plate (008), the 4th circulation line (007) be connected to the third liquid cooling plate (008) and the 4th liquid cooling plate (006) it
Between；One end of 5th circulation line (005) is connected to the 4th liquid cooling plate (006), and the other end is water inlet (002),
It is connected to the side of the heat exchanger (009).
4. server liquid-cooling heat radiator according to claim 1, which is characterized in that the heat source (018) is the centers CPU
Processor or electronic component.
5. server liquid-cooling heat radiator according to claim 1, which is characterized in that the liquid cooling plate be single side radiate or
Two-side radiation.
6. server liquid-cooling heat radiator according to claim 1, which is characterized in that multiple fans (011) are side by side
The heat exchanger (009) is set between liquid cooling plate.
7. server liquid-cooling heat radiator according to claim 1 or 6, which is characterized in that the outlet air of the fan (011)
Mouthful (010) towards the heat exchanger (009), air intake vent (022) is towards the heat source (018).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820153203.8U CN207780708U (en) | 2018-01-30 | 2018-01-30 | A kind of server liquid-cooling heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820153203.8U CN207780708U (en) | 2018-01-30 | 2018-01-30 | A kind of server liquid-cooling heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207780708U true CN207780708U (en) | 2018-08-28 |
Family
ID=63211977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820153203.8U Expired - Fee Related CN207780708U (en) | 2018-01-30 | 2018-01-30 | A kind of server liquid-cooling heat radiator |
Country Status (1)
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| CN (1) | CN207780708U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| CN109857227A (en) * | 2018-12-28 | 2019-06-07 | 曙光节能技术（北京）股份有限公司 | The liquid cooling system of server |
| CN109885148A (en) * | 2018-12-28 | 2019-06-14 | 曙光节能技术（北京）股份有限公司 | Alleviate the method for server liquid cooling system failure and the cooling system of server |
| CN111372426A (en) * | 2020-03-13 | 2020-07-03 | 肇庆学院 | Liquid cooling heat abstractor of electromechanical device |
| CN111488044A (en) * | 2020-04-10 | 2020-08-04 | 扬州万方电子技术有限责任公司 | Efficient heat dissipation server based on VPX framework |
| CN117651400A (en) * | 2023-12-04 | 2024-03-05 | 广东液冷时代科技有限公司 | Integrated absorption refrigeration system for server |
-
2018
- 2018-01-30 CN CN201820153203.8U patent/CN207780708U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108121423A (en) * | 2018-01-30 | 2018-06-05 | 深圳市智通电子有限公司 | A kind of server liquid-cooling heat radiator |
| CN109857227A (en) * | 2018-12-28 | 2019-06-07 | 曙光节能技术（北京）股份有限公司 | The liquid cooling system of server |
| CN109885148A (en) * | 2018-12-28 | 2019-06-14 | 曙光节能技术（北京）股份有限公司 | Alleviate the method for server liquid cooling system failure and the cooling system of server |
| CN111372426A (en) * | 2020-03-13 | 2020-07-03 | 肇庆学院 | Liquid cooling heat abstractor of electromechanical device |
| CN111488044A (en) * | 2020-04-10 | 2020-08-04 | 扬州万方电子技术有限责任公司 | Efficient heat dissipation server based on VPX framework |
| CN111488044B (en) * | 2020-04-10 | 2021-02-12 | 扬州万方电子技术有限责任公司 | Heat dissipation server based on VPX framework |
| CN117651400A (en) * | 2023-12-04 | 2024-03-05 | 广东液冷时代科技有限公司 | Integrated absorption refrigeration system for server |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20210130 |
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| CF01 | Termination of patent right due to non-payment of annual fee |