TWI838973B - server - Google Patents

Abstract

A server includes an external mounting frame and a motherboard device. The external mounting frame has an air inlet and an air outlet. The motherboard device includes a motherboard frame, a second fan module, an electronic component module, and a heat dissipation module that seals the motherboard frame and covers the second fan module and the electronic component module. The heat dissipation module has a first heat dissipation substrate, a second heat dissipation substrate, a first heat dissipation unit, and a second heat dissipation unit. The second fan module drives the first airflow in a first space to flow through the electronic component module and then flows out from the second fan module to a second space, and then flows back to the first space through the second heat dissipation unit to achieve internal convection heat dissipation and actively increase the heat dissipation efficiency inside the motherboard device. The main air entering from the air inlet flows through the first heat dissipation unit to form heat exchange and flows out from the air outlet to effectively ensure the heat dissipation efficiency.

Description

server

The present invention relates to an outdoor electronic system, in particular to a server.

In recent years, with the vigorous development and rapid growth of servers, there is now a need to install servers outdoors. Generally speaking, outdoor servers are designed to be waterproof and dustproof to ensure internal protection, and can respond to rainy conditions or avoid dust from entering the interior and accumulating pollution and other external environmental factors. The heat dissipation mechanism of outdoor servers is usually to use the vents in the server case to allow external air to enter the vents to cool the server and then discharge the hot air through another vent. However, relying solely on external air for heat dissipation can only support the reduction of low-power electronic components inside the server. If the host device inside the server is equipped with high-capacity storage, memory, PCIe card or high-performance electronic chip components, the natural convection heat dissipation mechanism of external air cannot effectively dissipate heat, which may cause hazards such as server crashes or failures. Although fans are installed outside the server case to increase the airflow of external air into the vents, the host device inside the server will generate high temperatures and heat during the efficient processing operation. Simply increasing the airflow entering the vents to perform a natural convection heat dissipation mechanism still cannot quickly and effectively cool the host device inside the server. Server crashes or failures will still occur. Therefore, how to efficiently dissipate the heat inside the server requires further discussion and improvement by practitioners.

Therefore, the purpose of the present invention is to provide a server with good heat dissipation efficiency.

Therefore, the server of the present invention includes an external mounting frame, a first fan module disposed in the external mounting frame, a motherboard device disposed in the external mounting frame, and a heat dissipation module sealedly covered on the motherboard device. The heat dissipation module and the motherboard device together define a sealed chamber.

The external mounting frame includes a housing and a housing cover disposed on the housing. The housing has an air inlet, an air outlet, a fan area between the air inlet and the air outlet and close to the air outlet, and a motherboard area between the air inlet and the air outlet and close to the air inlet. The first fan module is disposed in the housing.

The motherboard device is disposed in the housing and located in the motherboard area of the housing, and includes a motherboard frame disposed in the housing and defining the sealed chamber together with the heat dissipation module, a motherboard disposed in the sealed chamber, a second fan module disposed in the sealed chamber, and an electronic component module disposed on the motherboard.

The mainboard frame has a first supporting plate close to the first fan module, and a second supporting plate parallel to and spaced from the first supporting plate and away from the first fan module. The second fan module is disposed in the mainboard frame and close to the first supporting plate.

The heat dissipation module is sealed and covered on the mainboard frame and covers the second fan module and the electronic component module. The first fan module allows the main airflow entering the air inlet to pass through the heat dissipation module and flow out to the air outlet.

The heat dissipation module includes a first heat dissipation substrate which is sealed and combined with the first supporting plate and the second supporting plate to seal the mainboard frame and define the sealed chamber with the mainboard frame, a second heat dissipation substrate which is parallel and spaced from the first heat dissipation substrate and located in the sealed chamber, a first heat dissipation unit which is located outside the sealed chamber and is arranged on the upper surface of the first heat dissipation substrate, and a second heat dissipation unit which is arranged on the lower surface of the first heat dissipation substrate and extends from the first heat dissipation substrate to the second heat dissipation substrate and is connected to the second heat dissipation substrate. The main airflow entering the air inlet passes through the first heat dissipation unit of the heat dissipation module and flows out from the air outlet. The electronic component module has a connecting plate connecting the mainboard and the second heat dissipation substrate of the heat dissipation module. The second heat dissipation substrate covers the second fan module and the electronic component module. The second heat dissipation substrate, the second fan module and the connecting plate jointly define a first space. The first heat dissipation substrate, the first support plate and the second support plate jointly define a second space. The second fan module causes the first airflow in the first space to flow from the connecting plate through the electronic component module and the second heat dissipation substrate and toward the first support plate, and causes the first airflow to flow out from the second fan module to the second space. The first airflow flowing out from the second fan module flows toward the first heat dissipation substrate and flows toward the second support plate through the second heat dissipation unit, and flows back to the first space from the connecting plate.

The effect of the present invention is that: the heat dissipation module is sealed and covered on the mainboard frame and covers the second fan module and the electronic component module, and the second fan module drives the first airflow in the first space to flow through the electronic component module and the second heat dissipation substrate and then flows out from the second fan module to the second space, and flows through the second heat dissipation unit and then flows back to the first space. The internal forced convection heat dissipation effect is achieved to actively increase the overall heat dissipation efficiency of the mainboard device, and the main airflow entering from the air inlet through the first heat dissipation unit of the heat dissipation module forms heat exchange and flows out from the air outlet to perform the overall heat dissipation action outside the mainboard device, effectively ensuring the heat dissipation efficiency.

1: External mounting bracket

11: Shell

111: Air inlet

112: Air outlet

113: Fan area

114: Motherboard area

12: Shell

2: First fan module

21: First Fan

3: Motherboard device

4: Motherboard frame

41: The first support board

42: Second support board

5: Motherboard

6: Second fan module

61: Second Fan

7: Electronic component module

71:Connection plate

711:Port

72: High-temperature electronic chip

73: Electronic components

8: Heat dissipation module

80: Sealed chamber

81: First heat sink

82: Second heat sink

821: First Space

822: Second Space

83: First heat dissipation unit

831: First heat sink fin

832: First heat dissipation channel

84: Second heat dissipation unit

841: Second heat sink fin

842: Second heat dissipation channel

843: Open space

85: Heat dissipation boss

90: Waterproof and dustproof sealing sleeve

91: Air filter module

a1: Main airflow

a2: First airflow

Other features and effects of the present invention will be clearly presented in the implementation method with reference to the drawings, wherein: FIG. 1 is a three-dimensional diagram illustrating an implementation example of the server of the present invention; FIG. 2 is a three-dimensional schematic diagram illustrating the combination relationship between a fan module and a motherboard device in the implementation example; FIG. 3 is a three-dimensional diagram illustrating the connection relationship between a first heat dissipation substrate, a second heat dissipation substrate, a first heat dissipation unit, a second heat dissipation unit, and a heat dissipation boss of a heat dissipation module of the motherboard device in the implementation example from another perspective; and FIG. 4 is a side cross-sectional diagram, which is FIG. 1 (A-A cross-sectional diagram), and assists in explaining FIG. 1.

Before the present invention is described in detail, it should be noted that similar components are represented by the same numbers in the following description.

Referring to Figures 1, 2, 3 and 4, the server of the present invention comprises an external mounting frame 1, a first fan module 2 disposed in the external mounting frame 1, a motherboard device 3 disposed in the external mounting frame 1, and a heat dissipation module 8 sealedly covered on the motherboard device 3. The heat dissipation module 8 and the motherboard device 3 jointly define a sealed chamber 80.

The external mounting frame 1 includes a housing 11 and a housing cover 12 disposed on the housing 11. The housing 11 has an air inlet 111, an air outlet 112, a fan area 113 located between the air inlet 111 and the air outlet 112 and close to the air outlet 112, and a motherboard area 114 located between the air inlet 111 and the air outlet 112 and close to the air inlet 111. The first fan module 2 is disposed in the housing 11.

The motherboard device 3 is disposed in the housing 11 and located in the motherboard area 114 of the housing 11, and includes a motherboard frame 4 disposed on the housing 11 and defining the sealed chamber 80 together with the heat dissipation module 8, a motherboard 5 disposed in the sealed chamber 80, a second fan module 6 disposed in the sealed chamber 80, and an electronic component module 7 disposed on the motherboard 5. The motherboard frame 4 has a first support plate 41 close to the first fan module 2, and a second support plate 42 parallel to and spaced from the first support plate 41 and away from the first fan module 2. The second fan module 6 is disposed in the motherboard frame 4 and close to the first support plate 41.

The heat dissipation module 8 is sealedly mounted on the mainboard frame 4 and covers the second fan module 6 and the electronic component module 7. The first fan module 2 allows the main airflow a1 entering the air inlet 111 to pass through the heat dissipation module 8 and flow to the air outlet 112 and then flow out from the air outlet 112. The heat dissipation module 8 includes a first heat dissipation substrate 81 that is sealed to cover the first support plate 41 and the second support plate 42 to seal the mainboard frame 4 and define the sealed chamber 80 with the mainboard frame 4, a second heat dissipation substrate 82 that is parallel and spaced from the first heat dissipation substrate 81 and located in the sealed chamber 80, a first heat dissipation unit 83 that is located outside the sealed chamber 80 and is arranged on the upper surface of the first heat dissipation substrate 81, and a second heat dissipation unit 84 that is arranged on the lower surface of the first heat dissipation substrate 81 and extends from the first heat dissipation substrate 81 to the second heat dissipation substrate 82 and is connected to the second heat dissipation substrate 82. The main airflow a1 entering the air inlet 111 passes through the first heat dissipation unit 83 of the heat dissipation module 8 and flows out from the air outlet 112. The electronic component module 7 has a connecting plate 71 connecting the mainboard 5 and the second heat dissipation substrate 82 of the heat dissipation module 8. The second heat dissipation substrate 82 covers the second fan module 6 and the electronic component module 7. The second heat dissipation substrate 82, the second fan module 6 and the connecting plate 71 together define a first space 821. The first heat dissipation substrate 81, the first support plate 41 and the second support plate 42 together define a second space 822. The second fan module 6 directs the first airflow a2 in the first space 821 from the connecting plate 71 through the electronic component module 7 and the second heat dissipation substrate 82 and toward the first support plate 41, and causes the first airflow a2 to flow out of the second fan module 6 to the second space 822. The first airflow a2 flowing out of the second fan module 6 flows toward the first heat dissipation substrate 81 and flows toward the second support plate 42 through the second heat dissipation unit 84, and flows back into the first space 821 from the connecting plate 71.

When in use, in the sealed chamber 80, the heat energy generated by the electronic component module 7 in the motherboard device 3 is transferred upward and sequentially conducts heat through the second heat dissipation substrate 82, the second heat dissipation unit 84, the first heat dissipation substrate 81 and the first heat dissipation unit 83 of the heat dissipation module 8. When the second fan module 6 in the motherboard device 3 directs the first airflow a2 in the first space 821 from the connecting plate 71 through the electronic component module 7 and the second heat dissipation substrate 82, the flowing first airflow a2 takes away the heat energy in the first space 821 and cools down the electronic component module 7 and the second heat dissipation substrate 82. The second fan module 6 causes the heated first airflow a2 to continue to flow toward the first support plate 41, and causes the first airflow a2 to flow out of the second fan module 6 and flow into the second space 822. The first airflow a2 flowing out of the second fan module 6 flows toward the first heat dissipation substrate 81 and is guided to flow through the second heat dissipation unit 84. The second heat dissipation unit 84 absorbs the heat energy of the first airflow a2. The first airflow a2 is cooled, and the cooled first airflow a2 continues to flow to the second support plate 42 and flows back to the first space 821 from the connecting plate 71, and then the flow action of the first airflow a2 in the first space 821 is repeated to complete the flow mechanism of the circulating flow field in the mainboard device 3. In other words, the circulating flow field in the sealed chamber 80 can be forced to perform convection to perform internal heat dissipation. The heat energy absorbed by the second heat dissipation unit 84 will be transferred to the first heat dissipation unit 83 through the first heat dissipation substrate 81, so the first fan module 2 is cooperated with to greatly increase the airflow of the outside air flowing into the air inlet 111, and the main airflow a1 entering from the air inlet 111 will pass through the first heat dissipation unit 83 of the heat dissipation module 8, the flowing main airflow a1 will take away the heat energy of the first heat dissipation unit 83 and quickly cool down the first heat dissipation unit 83, and the first fan module 2 will make the heated main airflow a1 continue to flow toward the air outlet 112 and make the heated main airflow a1 flow out from the air outlet 112 to the outside. In other words, the airflow outside the sealed chamber 80 will flow into the main airflow a1 from the air inlet 111 and flow out from the air outlet 112 to the outside to form an open flow field outside the sealed chamber 80, and the inflowing main airflow a1 will pass through the first heat dissipation unit 83 to cool the first heat dissipation unit 83 and thus take away the heat energy in the sealed chamber 80, but not limited to this. In this embodiment, the first fan module 2 includes a plurality of first fans 21 disposed in the housing 11 and located in the fan area 113, but not limited to this. The second fan module 6 of the motherboard device 3 includes a plurality of second fans 61 disposed in the motherboard frame 4 and close to the first support plate 41, but not limited to this. The first fan 21 of the first fan module 2 is an axial flow fan, and the second fan 61 of the second fan module 6 is an axial flow fan, but not limited to this.

The heat dissipation module 8 is sealed and covered on the mainboard frame 4 and covers the second fan module 6 and the electronic component module 7. The second fan module 6 drives the first airflow a2 in the first space 821 to flow through the electronic component module 7 and the second heat dissipation substrate 82 and then flows out from the second fan module 6 to the second space 822, and flows through the second heat dissipation unit 84 and then flows back to the first space 821. The internal circulation flow field is applied to achieve the effect of forced convection heat dissipation inside and actively increase the overall heat dissipation efficiency inside the mainboard device 3. The main airflow a1 entering from the air inlet 111 through the external air passes through the first heat dissipation unit 83 of the heat dissipation module 8 to form heat exchange and flows out from the air outlet 112, thereby performing the overall heat dissipation action outside the mainboard device 3, effectively ensuring the heat dissipation efficiency.

It should be particularly noted that in this embodiment, the electronic component module 7 of the motherboard device 3 has a high-heat electronic chip 72 and a plurality of electronic components 73. The heat dissipation module 8 also has a heat dissipation boss 85 disposed on the lower surface of the second heat dissipation substrate 82 and extending from the second heat dissipation substrate 82 toward the high-heat electronic chip 72 and contacting the high-heat electronic chip 72. In short, through the design of the heat dissipation boss 85 contacting the high-heat electronic chip 72, the heat dissipation boss 85 will directly conduct the heat energy generated by the high-heat electronic chip 72 in a fast heat conduction manner through the second heat dissipation substrate 82 of the heat dissipation module 8, the second heat dissipation unit 84, the first heat dissipation substrate 81 and the first heat dissipation unit 83, but it is not limited to this. In this embodiment, the number of the high-heat electronic chip 72 is one, so a heat dissipation boss 85 corresponding to the high-heat electronic chip 72 is designed, but it is not limited to this. According to the number of high-heat electronic chips 72 actually used, multiple heat dissipation bosses 85 corresponding to the high-heat electronic chips 72 can be designed. By the way, in this embodiment, the heat dissipation module 8 is made of metal material as a whole, that is, the first heat dissipation substrate 81, the second heat dissipation substrate 82, the first heat dissipation unit 83 and the second heat dissipation unit 84 are all made of metal material. Metal has advantages such as fast heat transfer speed, but it is not limited to this.

In addition, it should be noted that, in this embodiment, the first heat dissipation unit 83 has a plurality of first heat dissipation fins 831 that are spaced apart from each other and extend upward from the first heat dissipation substrate 81, and the first heat dissipation fins 831 cooperate with the first heat dissipation substrate 81 to define a plurality of first heat dissipation channels 832. The first fan module 2 allows the main airflow a1 entering the air inlet 111 to exchange heat with the first heat dissipation channels 832 through the first heat dissipation fins 831 of the first heat dissipation unit 83, and the heated main airflow a1 flows out from the air outlet 112, but is not limited thereto. In this embodiment, the second heat dissipation unit 84 has a plurality of second heat dissipation fins 841 which are spaced from each other and extend downward from the first heat dissipation substrate 81 and are connected to the second heat dissipation substrate 82. The first heat dissipation substrate 81, the second heat dissipation fins 841 and the second heat dissipation substrate 82 cooperate to define a plurality of second heat dissipation channels 842. The first airflow a2 flowing out of the second fan module 6 is guided to flow through the second heat dissipation unit 84 and the second heat dissipation channels 842 to dissipate heat and cool the first airflow a2. The cooled first airflow a2 continues to flow to the second support plate 42 and flows back to the first space 821 from the connecting plate 71. It should be further explained that, in this embodiment, the second heat dissipation substrate 82 is smaller than the first heat dissipation substrate 81 as shown in FIG3 , and the second heat dissipation fins 841 extend beyond two opposite sides of the second heat dissipation substrate 82 as shown in FIG3 . The first heat dissipation substrate 81, the second heat dissipation fins 841 and the second heat dissipation substrate 82 cooperate to define the second heat dissipation channel 842 and two open spaces 843 located at two opposite sides of the second heat dissipation substrate 82 and connected to the second heat dissipation channel 842. In other words, the first air flow a2 flowing out of the second fan module 6 will be guided to flow through the open space 843 near the second fan module 6 and flow into the second heat dissipation channel 842 and flow through the second heat dissipation unit 84 to dissipate heat and cool the first air flow a2. The cooled first air flow a2 flows out from another open space 843 and continues to flow to the second support plate 42 and flows back to the first space 821 from the connecting plate 71. The design of the open space 843 being located on two opposite sides of the second heat dissipation substrate 82 can reduce the air pressure drop, but is not limited to this. In particular, in this embodiment, the airflow direction of the first airflow a2 flowing out from the second fan module 6 in the sealed chamber 80 flows in the direction of the first heat dissipation substrate 81 and flows through the second heat dissipation unit 84 to the second support plate 42 is opposite to the airflow direction of the main airflow a1 entering from the air inlet 111 outside the sealed chamber 80. In short, as shown in FIG. 4, the airflow direction of the main airflow a1 entering from the air inlet 111 at the upper layer and the flow field of the first airflow a2 located in the middle layer flowing in the direction of the first heat dissipation substrate 81 and flowing through the second heat dissipation unit 84 to the second support plate 42 are opposite to each other. Furthermore, in this embodiment, as shown in FIG. 4 , the airflow direction of the main airflow a1 located in the upper layer and outside the closed chamber 80 flows in from the air inlet 111, the airflow direction of the first airflow a2 located in the middle layer of the closed chamber 80 flows toward the first heat dissipation substrate 81 and flows toward the second support plate 42 through the second heat dissipation unit 84, and the airflow direction of the first airflow a2 flowing in the first space 821 of the closed chamber 80 located in the lower layer are all reverse airflow flow field designs, and are reverse flow fields of cold and hot air, and the temperature difference of heat exchange is large to achieve a good heat dissipation effect.

Incidentally, in this embodiment, an air filter module 91 is also included, which is disposed in the housing 11 and between the first fan module 2 and the mainboard frame 4, but the invention is not limited thereto. The external mounting frame 1 also includes a second support plate 42 that penetrates the housing 11 and the mainboard frame 4 and is connected to the second space 822, and a waterproof and dustproof sealing sleeve 90 that can be penetrated by multiple connecting wires (not shown). The connecting plate 71 of the electronic component module 7 has multiple connecting ports 711 (only one is shown due to the viewing angle of the figure) that are electrically connected to the electronic components 73 and can be electrically connected to the connecting wires, but the invention is not limited thereto.

In summary, the server of the present invention is designed that the heat dissipation module 8 is sealedly mounted on the mainboard frame 4 and covers the second fan module 6 and the electronic component module 7, and cooperates with the second fan module 6 to drive the first airflow a2 in the first space 821 to flow through the electronic component module 7 and the second heat dissipation substrate 82 and then flow out from the second fan module 6 to the second space 822, and then flow through the second heat dissipation unit 84 and then The application of the internal circulation flow field flowing back into the first space 821 achieves the effect of forced convection heat dissipation inside and actively increases the overall heat dissipation efficiency inside the motherboard device 3. The main airflow a1 entering from the air inlet 111 forms heat exchange through the first heat dissipation unit 83 of the heat dissipation module 8 and flows out from the air outlet 112 to perform the overall heat dissipation action outside the motherboard device 3, effectively ensuring the heat dissipation efficiency.

However, the above is only an example of the implementation of the present invention, and it cannot be used to limit the scope of the implementation of the present invention. All simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still within the scope of the patent of the present invention.

1: External mounting bracket

11: Shell

111: Air inlet

112: Air outlet

113: Fan area

114: Motherboard area

12: Shell

2: First fan module

21: First Fan

3: Motherboard device

4: Motherboard frame

41: The first support board

42: Second support board

5: Motherboard

6: Second fan module

61: Second Fan

7: Electronic component module

71:Connection plate

711:Port

72: High-temperature electronic chip

73: Electronic components

8: Heat dissipation module

80: Sealed chamber

81: First heat sink

82: Second heat sink

821: First Space

822: Second Space

83: First heat dissipation unit

831: First heat sink fin

84: Second heat dissipation unit

841: Second heat sink fin

843: Open space

85: Heat dissipation boss

90: Waterproof and dustproof sealing sleeve

91: Air filter module

a1: Main airflow

a2: First airflow

Claims (10)

A server comprises: An external mounting frame, including a housing, and a housing cover disposed on the housing, the housing having an air inlet, an air outlet, a fan area between the air inlet and the air outlet and close to the air outlet, and a motherboard area between the air inlet and the air outlet and close to the air inlet; A first fan module disposed in the housing; A motherboard device disposed in the housing and located in the motherboard area of the housing; and A heat dissipation module sealedly covered on the motherboard device, the heat dissipation module and the motherboard device jointly define a sealed chamber, The motherboard device comprises, A mainboard frame is arranged in the housing and defines the sealed chamber together with the heat dissipation module, and has a first support plate close to the first fan module, and a second support plate parallel to and spaced from the first support plate and away from the first fan module, a mainboard is arranged in the sealed chamber, a second fan module is arranged in the sealed chamber and close to the first support plate, and an electronic component module is arranged on the mainboard and spaced from the second fan module, the heat dissipation module is sealedly covered on the mainboard frame and covers the second fan module and the electronic component module, the first fan module allows the main airflow entering the air inlet to pass through the heat dissipation module and flow out to the air outlet, the heat dissipation module includes, A first heat dissipation substrate is sealed and covers the first support plate and the second support plate, the first heat dissipation substrate seals the mainboard frame and defines the sealed chamber with the mainboard frame, a second heat dissipation substrate is parallel and spaced from the first heat dissipation substrate and is located in the sealed chamber, a first heat dissipation unit is located outside the sealed chamber and is arranged on the upper surface of the first heat dissipation substrate, the main airflow entering the air inlet passes through the first heat dissipation unit of the heat dissipation module and flows out from the air outlet, and A second heat dissipation unit is arranged on the lower surface of the first heat dissipation substrate and extends from the first heat dissipation substrate to the second heat dissipation substrate and is connected to the second heat dissipation substrate. The electronic component module has a connecting plate connecting the main board and the second heat dissipation substrate of the heat dissipation module. The second heat dissipation substrate covers the second fan module and the electronic component module. The second heat dissipation substrate, the second fan module and the connecting plate jointly define a first space. The first heat dissipation substrate, the first support The first support plate and the second support plate jointly define a second space. The second fan module directs the first airflow in the first space from the connecting plate through the electronic component module and the second heat dissipation substrate to the first support plate, and causes the first airflow to flow out of the second fan module. The first airflow flowing out of the second fan module flows toward the first heat dissipation substrate and flows toward the second support plate through the second heat dissipation unit, and flows back to the first space from the connecting plate. A server as described in claim 1, wherein the electronic component module of the mainboard device has a high-heat electronic chip and multiple electronic components, and the heat dissipation module also has a heat dissipation boss arranged on the lower surface of the second heat dissipation substrate and extending from the second heat dissipation substrate toward the high-heat electronic chip and contacting the high-heat electronic chip. A server as described in claim 2, wherein the first heat dissipation unit has a plurality of first heat dissipation fins that are spaced apart from each other and extend upward from a first heat dissipation substrate, the first heat dissipation fins cooperate with the first heat dissipation substrate to define a plurality of first heat dissipation channels, and the first fan module allows the main airflow entering the air inlet to pass through the first heat dissipation fins of the first heat dissipation unit to exchange heat with the first heat dissipation channels and the heated main airflow flows out from the air outlet. A server as described in claim 3, wherein the second heat dissipation unit has a plurality of second heat dissipation fins that are spaced apart from each other and extend downward from the first heat dissipation substrate and are connected to the second heat dissipation substrate, and the first heat dissipation substrate, the second heat dissipation fins and the second heat dissipation substrate cooperate to define a plurality of second heat dissipation channels. A server as described in claim 4, wherein the second heat dissipation substrate is smaller than the first heat dissipation substrate, the second heat dissipation fin extends beyond two opposite sides of the second heat dissipation substrate, and the first heat dissipation substrate, the second heat dissipation fin and the second heat dissipation substrate cooperate to define the second heat dissipation channel and two open spaces located at two opposite sides of the second heat dissipation substrate and connected to the second heat dissipation channel. A server as described in claim 2, wherein the external mounting frame further includes a second supporting plate that passes through the shell and the mainboard frame and is connected to the second space, and a waterproof and dustproof sealing sleeve that can allow multiple connecting wires to pass through, and the connecting plate of the electronic component module has multiple connection ports that are electrically connected to the electronic components and can be electrically connected to the connecting wires. A server as described in claim 1, wherein the first fan module includes a plurality of first fans disposed in the casing and located in the fan area, and the second fan module of the motherboard device includes a plurality of second fans disposed in the motherboard frame and close to the first supporting plate. A server as described in claim 7, wherein the first fan of the first fan module is an axial flow fan, and the second fan of the second fan module is an axial flow fan. The server as described in claim 1 further comprises an air filter module disposed in the casing and located between the first fan module and the motherboard frame. A server as described in claim 1, wherein the direction of the first airflow flowing out from the second fan module in the sealed chamber toward the first heat dissipation substrate and flowing through the second heat dissipation unit toward the second support plate is opposite to the direction of the main airflow entering from the air inlet outside the sealed chamber.