CN118068924A - Server device - Google Patents

Abstract

A server comprises an outer mounting frame and a main board device. The outer mounting frame is provided with an air inlet and an air outlet. The main board device comprises a main board frame, a second fan module, an electronic element module and a heat dissipation module which is hermetically covered on the main board frame and covers the second fan module and the electronic element module. The heat dissipation module is provided with a first heat dissipation substrate, a second heat dissipation substrate, a first heat dissipation unit and a second heat dissipation unit. The second fan module drives the first air flow in the first space to flow through the electronic element module and flow out of the second fan module to a second space, and the second air flow flows back to the circulating flow field in the first space through the second heat radiating unit, so that the heat radiating efficiency of the inside of the main board device is actively increased by internal convection heat radiation, and the main air flow entering from the air inlet forms heat exchange through the first heat radiating unit and the heat radiating action flows out of the air outlet, thereby effectively ensuring the heat radiating efficiency.

Description

Server device

[ Field of technology ]

The present invention relates to an outdoor electronic system, and more particularly, to a server.

[ Background Art ]

In recent years, with the rapid development and growth of servers, it has been seen that the servers are installed outdoors, and in general, the outdoor servers are designed to be waterproof and dustproof to ensure the internal protection, so as to cope with the rainy situation or avoid the influence of external environmental factors such as accumulated pollution caused by the dust entering the interior. The outdoor heat dissipation mechanism of the server is usually a natural convection heat dissipation mechanism which is formed by arranging a vent on a server casing, cooling the inside of the server by using external air to enter the vent, and discharging hot air from another vent, but only cooling the electronic components with low power consumption in the server by using external air, if the host device in the server is provided with components such as a high-capacity storage, a memory, a PCIe card or a high-performance electronic chip, the heat cannot be effectively dissipated by using the natural convection heat dissipation mechanism of the external air, and damage such as downtime or faults of the server may be caused. Although a fan is installed outside the casing of the server to enhance the air flow of the external air entering the ventilation opening, the host device in the server can generate high temperature and high heat in the process of high-efficiency processing operation, and the host device in the server can not be cooled down quickly and effectively only by a heat dissipation mechanism for increasing the air flow entering the ventilation opening to perform natural convection, and the problem of downtime or failure of the server can still occur, so that how to efficiently dissipate the heat inside the server is needed to be further discussed and improved by practitioners.

[ Invention ]

Therefore, the present invention provides a server with good heat dissipation efficiency.

The server comprises an outer mounting frame, a first fan module arranged in the outer mounting frame, a main board device arranged in the outer mounting frame, and a heat dissipation module hermetically covered on the main board device. The heat dissipation module and the main board device define a sealed containing chamber together.

The outer mounting frame comprises a shell and a shell cover arranged on the shell. The shell is provided with an air inlet, an air outlet, a fan area which is positioned between the air inlet and the air outlet and is close to the air outlet, and a main board area which is positioned between the air inlet and the air outlet and is close to the air inlet. The first fan module is arranged in the shell.

The main board device is arranged in the shell and is positioned in the main board area of the shell, and comprises a main board frame which is arranged in the shell and is used for defining the sealed containing chamber together with the heat dissipation module, a main board which is arranged in the sealed containing chamber, a second fan module which is arranged in the sealed containing chamber and an electronic element module which is arranged on the main board.

The main board frame is provided with a first supporting plate close to the first fan module and a second supporting plate which is parallel to the first supporting plate and is spaced away from the first fan module. The second fan module is arranged in the main board frame and is close to the first supporting plate.

The heat dissipation module is hermetically covered on the main board frame and covers the second fan module and the electronic element module. The first fan module enables the main air flow entering from the air inlet to flow out from the air outlet through the heat dissipation module.

The heat dissipation module comprises a first heat dissipation substrate, a second heat dissipation substrate, a first heat dissipation unit and a second heat dissipation unit, wherein the first heat dissipation substrate is hermetically covered and arranged on the first support plate and the second support plate to seal the main board frame, the first heat dissipation substrate and the main board frame are used for defining the sealed container, the second heat dissipation substrate is parallel to the first heat dissipation substrate and is arranged in the sealed container, the first heat dissipation unit is arranged outside the sealed container and is arranged on the upper surface of the first heat dissipation substrate, the second heat dissipation unit is arranged on the lower surface of the first heat dissipation substrate and extends from the first heat dissipation substrate to the direction of the second heat dissipation substrate, and the second heat dissipation unit is connected with the second heat dissipation substrate. The main air flow entering from the air inlet passes through the first heat radiating unit of the heat radiating module and flows out from the air outlet. The electronic component module is provided with a connecting plate for connecting the main board and a second radiating substrate of the radiating module, the second radiating substrate covers the second fan module and the electronic component module, the second radiating substrate, the second fan module and the connecting plate jointly define a first space, the first radiating substrate, the first supporting plate and the second supporting plate jointly define a second space, the second fan module enables first air flow in the first space to flow from the connecting plate to the electronic component module, the second radiating substrate and to the first supporting plate, and enables the first air flow to flow from the second fan module to the second space, and the first air flow flowing from the second fan module flows to the first radiating substrate, flows to the second supporting plate through the second radiating unit and flows back to the first space from the connecting plate.

Compared with the prior art, the invention has the beneficial effects that: the heat dissipation module is hermetically covered on the main board frame and covers the design of the second fan module and the electronic element module, and the second fan module is matched to drive the first air flow in the first space to flow through the electronic element module and the second heat dissipation substrate, flow out of the second fan module to the second space, flow through the second heat dissipation unit and flow back to the application of the internal circulation flow field in the first space, so that the effect of forced convection heat dissipation inside is achieved, the overall heat dissipation efficiency inside the main board device is actively increased, and the main air flow entering from the air inlet through the external air flows through the first heat dissipation unit of the heat dissipation module to form heat exchange and flows out of the air outlet to perform the overall heat dissipation outside the main board device, thereby effectively ensuring the heat dissipation efficiency.

[ Description of the drawings ]

Other features and advantages of the invention will be apparent from the following description of the embodiments with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating an embodiment of a server according to the present invention;

FIG. 2 is a schematic perspective view illustrating a combination of a fan module and a motherboard device in the embodiment;

Fig. 3 is a perspective view illustrating a connection relationship of a first heat dissipating substrate, a second heat dissipating substrate, a first heat dissipating unit, a second heat dissipating unit, and a heat dissipating boss of a heat dissipating module of the motherboard device according to another embodiment; and

Fig. 4 is a side cross-sectional view, which assists in explaining fig. 1.

[ Detailed description ] of the invention

Before the present invention is described in detail, it should be noted that in the following description, like elements are denoted by the same reference numerals.

Referring to fig. 1, 2, 3 and 4, the server of the present invention includes an outer mounting frame 1, a first fan module 2 disposed in the outer mounting frame 1, a main board device 3 disposed in the outer mounting frame 1, and a heat dissipation module 8 sealingly covering the main board device 3. The heat dissipation module 8 and the motherboard device 3 together define a sealed chamber 80.

The outer mounting frame 1 comprises a housing 11 and a cover 12 arranged on the housing 11. The housing 11 has an air inlet 111, an air outlet 112, an air sector 113 between the air inlet 111 and the air outlet 112 and adjacent to the air outlet 112, and a main board area 114 between the air inlet 111 and the air outlet 112 and adjacent to the air inlet 111. The first fan module 2 is disposed within the housing 11.

The motherboard device 3 is disposed in the housing 11 and located in a motherboard region 114 of the housing 11, and includes a motherboard frame 4 disposed on the housing 11 and defining the sealed chamber 80 with the heat dissipation module 8, a motherboard 5 disposed in the sealed chamber 80, a second fan module 6 disposed in the sealed chamber 80, and an electronic component module 7 disposed on the motherboard 5. The main board frame 4 has a first support plate 41 adjacent to the first fan module 2, and a second support plate 42 spaced apart from the first support plate 41 in parallel with the first support plate 2. The second fan module 6 is disposed in the main board frame 4 and close to the first support board 41.

The heat dissipation module 8 is hermetically disposed on the motherboard frame 4 and covers the second fan module 6 and the electronic component module 7. The first fan module 2 makes the main air flow a1 entering through the air inlet 111 pass through the heat dissipation module 8 and flow to the air outlet 112 and flow out from the air outlet 112. The heat dissipation module 8 includes a first heat dissipation substrate 81 hermetically covering the first support plate 41 and the second support plate 42 to seal the motherboard frame 4 and define the sealed chamber 80 with the motherboard frame 4, a second heat dissipation substrate 82 spaced apart from the first heat dissipation substrate 81 in parallel and located in the sealed chamber 80, a first heat dissipation unit 83 located outside the sealed chamber 80 and disposed on an upper surface of the first heat dissipation substrate 81, and a second heat dissipation unit 84 disposed on a lower surface of the first heat dissipation substrate 81 and extending from the first heat dissipation substrate 81 to the second heat dissipation substrate 82, and connected to the second heat dissipation substrate 82. The main air flow a1 entering through the air inlet 111 passes through the first heat dissipating unit 83 of the heat dissipating module 8 and flows out of the air outlet 112. The electronic component module 7 has a connection plate 71 for connecting the motherboard 5 and the second heat dissipating substrate 82 of the heat dissipating module 8. The second heat dissipation substrate 82 covers the second fan module 6 and the electronic component module 7. The second heat dissipation substrate 82, the second fan module 6 and the connecting plate 71 together define a first space 821. The first heat dissipation substrate 81, the first support plate 41 and the second support plate 42 together define a second space 822. The second fan module 6 flows the first air flow a2 in the first space 821 from the connection plate 71 through the electronic component module 7 and the second heat dissipation substrate 82 and toward the first support plate 41, and flows the first air flow a2 from the second fan module 6 to the second space 822, and the first air flow a2 from the second fan module 6 flows toward the first heat dissipation substrate 81 and toward the second support plate 42 through the second heat dissipation unit 84, and flows back from the connection plate 71 into the first space 821.

In use, in the sealed chamber 80, heat generated by the electronic component module 7 in the motherboard device 3 is transferred upward and is conducted through the second heat dissipating substrate 82, the second heat dissipating unit 84, the first heat dissipating substrate 81 and the first heat dissipating unit 83 of the heat dissipating module 8 sequentially. When the second fan module 6 in the main board device 3 passes the first air flow a2 in the first space 821 from the connection board 71 through the electronic component module 7 and the second heat dissipation substrate 82, the flowing first air flow a2 takes away the heat energy in the first space 821 to cool the electronic component module 7 and the second heat dissipation substrate 82. The second fan module 6 continues the warmed first air flow a2 to flow in the direction of the first support plate 41, and makes the first air flow a2 flow out of the second fan module 6 to flow into the second space 822, and the first air flow a2 flowing out of the second fan module 6 flows in the direction of the first heat dissipation substrate 81 and is guided to flow through the second heat dissipation unit 84, and the second heat dissipation unit 84 absorbs the heat energy of the first air flow a2 to cool the first air flow a2, and the cooled first air flow a2 continues to flow into the second support plate 42 and flows back into the first space 821 from the connecting plate 71, and then the flow action of the first air flow a2 in the first space 821 is repeated, so as to complete the flow mechanism of the circulation flow field in the main board device 3, that is, the circulation flow field in the sealed container 80 can perform forced convection to perform internal heat dissipation operation. The heat energy absorbed by the second heat dissipating unit 84 is transferred to the first heat dissipating unit 83 through the first heat dissipating substrate 81, so that the air flow of the external air is greatly increased by the first fan module 2, the main air flow a1 entering from the air inlet 111 flows into the air inlet 111 and passes through the first heat dissipating unit 83 of the heat dissipating module 8, the flowing main air flow a1 takes away the heat energy of the first heat dissipating unit 83 to cool the first heat dissipating unit 83, and the first fan module 2 can make the heated main air flow a1 continuously flow in the direction of the air outlet 112 and make the heated main air flow a1 flow out from the air outlet 112 to the outside. In other words, the air flow outside the sealed chamber 80 flows into the main air flow a1 from the air inlet 111 and flows out from the air outlet 112 to the outside to form an open flow field outside the sealed chamber 80, and the main air flow a1 flowing in passes through the first heat dissipating unit 83 to cool the first heat dissipating unit 83 so as to remove the heat energy in the sealed chamber 80, but not limited thereto. In the present embodiment, the first fan module 2 includes a plurality of first fans 21 disposed in the housing 11 and located in the fan area 113, but not limited thereto. The second fan module 6 of the main board device 3 includes a plurality of second fans 61 disposed in the main board frame 4 and close to the first supporting board 41, but not limited thereto. The first fan 21 of the first fan module 2 is an axial fan, and the second fan 61 of the second fan module 6 is an axial fan, but not limited thereto.

By means of the heat dissipation module 8 being hermetically covered on the main board frame 4 and covering the design of the second fan module 6 and the electronic component module 7, and the first air flow a2 in the first space 821 is driven by the second fan module 6 to flow through the electronic component module 7 and the second heat dissipation substrate 82, and flows out from the second fan module 6 to the second space 822, and flows through the second heat dissipation unit 84 and then flows back to the internal circulation flow field in the first space 821, the effect of internal forced convection heat dissipation is achieved, the overall heat dissipation efficiency of the inside of the main board device 3 is actively increased, and the main air flow a1 entering from the air inlet 111 forms heat exchange through the first heat dissipation unit 83 of the heat dissipation module 8 and flows out from the air outlet 112, so that the overall heat dissipation action of the outside of the main board device 3 is performed, and the heat dissipation efficiency is effectively ensured.

It should be noted that, in the present embodiment, the electronic device module 7 of the motherboard device 3 has a high thermal electronic chip 72 and a plurality of electronic devices 73. The heat dissipation module 8 further has a heat dissipation boss 85 disposed on the lower surface of the second heat dissipation substrate 82 and extending from the second heat dissipation substrate 82 toward the high thermal electron chip 72 and contacting the high thermal electron chip 72. In short, by the design that the heat dissipating boss 85 contacts the high thermal electron chip 72, the heat dissipating boss 85 can conduct the heat generated by the high thermal electron chip 72 through the second heat dissipating substrate 82, the second heat dissipating unit 84, the first heat dissipating substrate 81 and the first heat dissipating unit 83 of the heat dissipating module 8 in order of heat conduction in a rapid heat conduction manner, but not limited thereto. In the present embodiment, the number of the high thermal electron chips 72 is one, so a heat dissipating boss 85 corresponding to the high thermal electron chips 72 is designed, but not limited thereto, and a plurality of heat dissipating bosses 85 corresponding to the high thermal electron chips 72 can be designed according to the number of the high thermal electron chips 72 actually used. Incidentally, in the present embodiment, the heat dissipation module 8 is entirely made of metal, that is, the first heat dissipation substrate 81, the second heat dissipation substrate 82, the first heat dissipation unit 83 and the second heat dissipation unit 84 are all made of metal, and the metal has the advantages of fast heat transfer, but not limited thereto.

In addition, in the present embodiment, the first heat dissipating unit 83 has a plurality of first heat dissipating fins 831 spaced apart from each other and extending upward from the first heat dissipating substrate 81, and the first heat dissipating fins 831 and the first heat dissipating substrate 81 cooperate to define a plurality of first heat dissipating channels 832. The first fan module 2 makes the main air flow a1 entering through the air inlet 111 exchange heat with the first heat dissipation channel 832 through the first heat dissipation fins 831 of the first heat dissipation unit 83 and flows out the heated main air flow a1 from the air outlet 112, but not limited thereto. In the present embodiment, the second heat dissipating unit 84 has a plurality of second heat dissipating fins 841 spaced apart from each other and extending downward from the first heat dissipating substrate 81 and connected to the second heat dissipating substrate 82, and the first heat dissipating substrate 81, the second heat dissipating fins 841 and the second heat dissipating substrate 82 cooperate to define a plurality of second heat dissipating channels 842. The first air flow a2 flowing out of the second fan module 6 is guided to flow through the second heat dissipation unit 84 and the second heat dissipation channel 842 to dissipate heat and cool the first air flow a2, and the cooled first air flow a2 continues to flow to the second support plate 42 and flows back into the first space 821 from the connection plate 71. It is further noted that, in the present embodiment, the second heat dissipating substrate 82 is smaller than the first heat dissipating substrate 81 as shown in fig. 3, and the second heat dissipating fins 841 extend beyond opposite sides of the second heat dissipating substrate 82 as shown in fig. 3. The first heat dissipation substrate 81, the second heat dissipation fins 841 and the second heat dissipation substrate 82 cooperate to define the second heat dissipation channel 842 and the open space 843 respectively located at two opposite sides of the second heat dissipation substrate 82 and communicated with the second heat dissipation channel 842. In other words, the first air flow a2 flowing out of the second fan module 6 is guided to flow through the open space 843 near the second fan module 6 and flows into the second heat dissipation channel 842 to dissipate heat and cool the first air flow a2 through the second heat dissipation unit 84, and the cooled first air flow a2 flows out of the other open space 843 and continues to flow to the second support plate 42 and flows back into the first space 821 from the connection plate 71, so that the air pressure drop can be reduced by the design that the open space 843 is located at two opposite sides of the second heat dissipation substrate 82, but not limited thereto. In particular, in the present embodiment, the direction of the first air flow a2 flowing from the second fan module 6 in the sealed chamber 80 toward the first heat dissipation substrate 81 and the direction of the second air flow flowing through the second heat dissipation unit 84 toward the second support plate 42 is opposite to the direction of the main air flow a1 entering from the air inlet 111 outside the sealed chamber 80. In short, as shown in fig. 4, the flow fields of the main air flow a1 entering from the air inlet 111 at the upper layer and the first air flow a2 flowing toward the first heat dissipation substrate 81 at the middle layer and flowing toward the second support plate 42 via the second heat dissipation unit 84 are opposite to each other. Further, in the present embodiment, as shown in fig. 4, the main air flow a1 flowing from the air inlet 111 in the upper layer and outside the closed chamber 80, the first air flow a2 flowing toward the first heat dissipation substrate 81 in the middle layer of the closed chamber 80 and flowing toward the second support plate 42 through the second heat dissipation unit 84, and the first air flow a2 flowing in the first space 821 of the lower layer of the closed chamber 80 are all reverse flow fields, and are reverse flow fields of hot and cold air, so that the heat dissipation effect is good.

Incidentally, in the present embodiment, an air filter module 91 is further included in the housing 11 and located between the first fan module 2 and the motherboard frame 4, but not limited thereto. The outer mounting frame 1 further comprises a waterproof and dustproof sealing sleeve 90 penetrating the housing 11 and the second support plate 42 of the main board frame 4 and communicating with the second space 822, and allowing a plurality of connecting wires (not shown) to penetrate. The connection board 71 of the electronic component module 7 has a plurality of ports 711 (only one shown in the view) for electrically connecting the electronic components 73 and the connection wires, but not limited thereto.

In summary, in the server of the present invention, by the design that the heat dissipation module 8 is hermetically disposed on the motherboard frame 4 and covers the second fan module 6 and the electronic component module 7, and the second fan module 6 is matched to drive the first air flow a2 in the first space 821 to flow through the electronic component module 7 and the second heat dissipation substrate 82, and flow from the second fan module 6 to the second space 822, and flow through the second heat dissipation unit 84 and flow back to the internal circulation flow field in the first space 821, the effect of internal forced convection heat dissipation is achieved, so that the overall heat dissipation efficiency of the inside of the motherboard device 3 is actively increased, and the main air flow a1 entering from the air inlet 111 forms heat exchange through the first heat dissipation unit 83 of the heat dissipation module 8 and flows out from the air outlet 112 to perform the overall heat dissipation operation of the outside of the motherboard device 3, so as to effectively ensure the heat dissipation efficiency.

The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims (10)

1. A server, comprising:

The outer mounting frame comprises a shell and a shell cover, wherein the shell cover is arranged on the shell, and the shell is provided with an air inlet, an air outlet, a fan area positioned between the air inlet and the air outlet and close to the air outlet, and a main board area positioned between the air inlet and the air outlet and close to the air inlet;

a first fan module disposed in the housing;

A main board device arranged in the shell and positioned in the main board area of the shell; and

A heat dissipation module hermetically covered on the main board device, wherein the heat dissipation module and the main board device jointly define a sealed containing chamber,

The main board device comprises a main board and a plurality of main boards,

A main board frame arranged in the shell and defining the sealed containing chamber together with the heat dissipation module, and having a first support plate close to the first fan module, a second support plate parallel to the first support plate and spaced apart from the first fan module,

A main board arranged in the sealed container,

A second fan module disposed in the sealed chamber and close to the first support plate, and

An electronic element module arranged on the main board and spaced from the second fan module,

The heat dissipation module is hermetically covered on the main board frame and covers the second fan module and the electronic element module, the first fan module enables the main air flow entering from the air inlet to flow out from the air outlet through the heat dissipation module, the heat dissipation module comprises,

A first heat dissipation substrate hermetically covering and combining the first support plate and the second support plate, wherein the first heat dissipation substrate seals the main board frame and defines the sealed accommodating chamber with the main board frame,

A second heat dissipation substrate parallel to and spaced from the first heat dissipation substrate and located in the sealed chamber,

A first heat dissipation unit disposed outside the sealed chamber and on the upper surface of the first heat dissipation substrate, wherein the main air flow entering from the air inlet passes through the first heat dissipation unit of the heat dissipation module and flows out from the air outlet, and

The second heat dissipation unit is arranged on the lower surface of the first heat dissipation substrate, extends from the first heat dissipation substrate to the second heat dissipation substrate and is connected with the second heat dissipation substrate, the electronic element module is provided with a connecting plate which is connected with the main board and the second heat dissipation substrate of the heat dissipation module, the second heat dissipation substrate covers the second fan module and the electronic element module, the second heat dissipation substrate, the second fan module and the connecting plate jointly define a first space, the first heat dissipation substrate, the first supporting plate and the second supporting plate jointly define a second space, the second fan module enables first air flow in the first space to flow from the connecting plate to the second heat dissipation substrate and to the first supporting plate, enables first air flow to flow from the second fan module, enables first air flow from the second fan module to flow to the first heat dissipation substrate, flows from the second cooling unit to the second supporting plate and flows from the connecting plate back to the first space.

2. The server according to claim 1, wherein the electronic device module of the motherboard device has a high thermal electron chip and a plurality of electronic devices, and the heat dissipation module further has a heat dissipation boss disposed on the lower surface of the second heat dissipation substrate and extending from the second heat dissipation substrate toward the high thermal electron chip and contacting the high thermal electron chip.

3. The server according to claim 2, wherein the first heat dissipating unit has a plurality of first heat dissipating fins spaced from each other and extending upward from the first heat dissipating substrate, the first heat dissipating fins and the first heat dissipating substrate cooperate to define a plurality of first heat dissipating channels, and the first fan module causes the main air flow entering the air inlet to exchange heat with the first heat dissipating channels through the first heat dissipating fins of the first heat dissipating unit and causes the heated main air flow to flow out from the air outlet.

4. The server according to claim 3, wherein the second heat dissipating unit has a plurality of second heat dissipating fins spaced apart from each other and extending downward from the first heat dissipating substrate and connected to the second heat dissipating substrate, and the first heat dissipating substrate, the second heat dissipating fins and the second heat dissipating substrate cooperate to define a plurality of second heat dissipating channels.

5. The server according to claim 4, wherein the second heat dissipating substrate is smaller than the first heat dissipating substrate, the second heat dissipating fins extend beyond two opposite sides of the second heat dissipating substrate, and the first heat dissipating substrate, the second heat dissipating fins and the second heat dissipating substrate cooperate to define the second heat dissipating channel and an open space respectively located on two opposite sides of the second heat dissipating substrate and communicating with the second heat dissipating channel.

6. The server according to claim 2, wherein the outer mounting frame further comprises a waterproof and dustproof sealing sleeve penetrating through the housing and the second support plate of the main board frame and communicating with the second space, and allowing a plurality of connecting wires to penetrate therethrough, and the connecting plate of the electronic component module has a plurality of ports electrically connected to the electronic components and allowing the connecting wires to be electrically connected.

7. The server of claim 1, wherein the first fan module comprises a plurality of first fans disposed in the housing and located in the fan zone, and the second fan module of the motherboard device comprises a plurality of second fans disposed in the motherboard frame and located adjacent to the first support plate.

8. The server of claim 7, wherein the first fan of the first fan module is an axial fan and the second fan of the second fan module is an axial fan.

9. The server of claim 1, further comprising an air screen module disposed within the housing between the first fan module and the motherboard frame.

10. The server according to claim 1, wherein the direction of the first air flow flowing out of the second fan module in the sealed container toward the first heat dissipating substrate and the direction of the second air flow flowing through the second heat dissipating unit toward the second supporting plate is opposite to the direction of the main air flow entering from the air inlet outside the sealed container.