CN106550587A - A kind of air flows through the radiator structure inside sealed machine box - Google Patents

A kind of air flows through the radiator structure inside sealed machine box Download PDF

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Publication number
CN106550587A
CN106550587A CN201610963299.XA CN201610963299A CN106550587A CN 106550587 A CN106550587 A CN 106550587A CN 201610963299 A CN201610963299 A CN 201610963299A CN 106550587 A CN106550587 A CN 106550587A
Authority
CN
China
Prior art keywords
air channel
circuit function
interior air
function plate
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610963299.XA
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Chinese (zh)
Inventor
夏跃丰
程建
向华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Changan Industry Group Co Ltd
Original Assignee
Chongqing Changan Industry Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Changan Industry Group Co Ltd filed Critical Chongqing Changan Industry Group Co Ltd
Priority to CN201610963299.XA priority Critical patent/CN106550587A/en
Publication of CN106550587A publication Critical patent/CN106550587A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A kind of air flows through the radiator structure inside sealed machine box, is made up of case box (1), circuit substrate (2), circuit function plate (3), interior air channel (4), front shroud (5), back shroud (6), bottom plate (7), blower fan (8);Air channel (4) in installing on case box (1), circuit substrate (2) is installed in air channel in interior air channel (4) and case box (1), circuit function plate (3) space fully seals, circuit function plate (3) is by its cold drawing (10), wedge lock mechanism (11) is fastened between case box (1) slot and interior air channel (4) wall, the heat transfer that heater members are produced on the functional cards (9) of circuit function plate (3) is on the cold drawing (10) of circuit function plate (3), it is then passed on interior air channel (4) wall;Air outside cabinet is blasted air channel by blower fan (8), in the way of forced-convection heat transfer is taken away the heat on interior air channel (4) wall, is discharged outside cabinet.

Description

A kind of air flows through the radiator structure inside sealed machine box
Technical field
The present invention relates to sealed machine box thermal design radiator structure, more particularly to a kind of air is flow through inside sealed machine box Radiator structure.
Background technology
As electronic technology constantly develops, electronic devices and components dense degree more and more higher in cabinet, the power density of cabinet It is increasing.As cabinet typically has environmental suitability and EMC Requirements, cabinet typically requires hermetically sealed.Particularly with collection Into the cabinet of polylith single board computer, by traditional heat-dissipating structure, on circuit board, heater members transfer heat to electricity by conduction Road plate cold drawing, is then delivered to cabinet side board from cold drawing, in the mode taken away heat using cross-ventilation heat exchange, it is difficult to meet The cooling requirements of cabinet.And other for example cold grade radiating modes of liquid are adopted, casing structure is complicated, and process specifications are high, typically Cost is higher.
The content of the invention
The present invention can not meet the situation of case radiation requirement for traditional heat-dissipating structure, it is proposed that a kind of air flows through entirely Radiator structure inside sealed cabinet, solves the heat dissipation problem of integrated polylith high-power circuit trigger case.
The present invention radiator structure, by case box 1, circuit substrate 2, circuit function plate 3, interior air channel 4, front shroud 5, Back shroud 6, bottom plate 7, blower fan 8 are constituted.Case box 1 is the agent structure of cabinet, acts the work for installing other each several parts of cabinet With;Circuit substrate 2 installs 1 interior position rearward of case box;Circuit function plate 3 is by functional cards 9, cold drawing 10, wedge lock Device 11 is constituted, and according to cabinet electric function, typically has polylith;Interior air channel 4 is arranged on case box 1, its quantity and circuit 3 quantity of function plate is identical, one piece of correspondence of circuit function plate 3, one interior air channel 4;Front shroud 5, back shroud 6, bottom plate 7 lead to Cross mode connects for screw to cover on case box 1;Blower fan 8 is arranged on bottom plate 7.
Case box 1 opens └ ┘ grooves on the top and bottom sidewall of 3 installation site of circuit function plate;In 4 installation position of interior air channel Put out energy and the through hole for passing through interior air channel 4 is installed, interior air channel 4 is arranged on lead to the hole site, and is guaranteed by welding or alternate manner interior Air channel 4 is fully sealed with circuit substrate 2 in case box 1 and the installing space of circuit function plate 3.Arrange on circuit substrate 2 The electric connector being connected with circuit function plate 3, acts primarily as the effect for being electrically connected each circuit plugboard.Circuit function plate 3 Functional cards 9 are connected with cold drawing 10 by screw, it is ensured that on functional cards 9 inside heater members (such as circuit chip) and cold drawing 10 Laminating is tight;Wedge lock mechanism 11 is arranged on 10 both sides of cold drawing.Interior air channel 4 is machined with the flat of array ventilation through hole for inside Plate, the shape of through hole of divulging information, size, array quantity are calculated according to the parameter such as forced-convection heat transfer and radiating Air Quantity Required and are determined. After opening in └ ┘ grooves on insertion 1 top and bottom sidewall of case box of circuit function plate 3, by wedge lock mechanism 11 thereon, make Its cold drawing 10 is locked between 1 └ ┘ grooves of case box and 4 wall of interior air channel, so that it is guaranteed that 3 overall locking of circuit plugboard is solid Fixed, cold drawing 10 is close to 4 wall of interior air channel;It is little with 4 wall thermal contact resistance of interior air channel to guarantee cold drawing 10, in cold drawing 10 and interior air channel 4 Wall contact area inlays softer material red copper sheet.Blower fan 8 is arranged on bottom plate 7, is risen and for cabinet extraneous air to be blasted air channel The effect of cooling air channel.
The operation principle of the present invention:
Compared with prior art, which has the technical effect that the present invention:
1st, compared with the cabinet that normal air flows into cabinet inside radiating, cabinet sealing of the present invention, Electro Magnetic Compatibility are good, ring Border adaptability is good.
2nd, compared with the radiator structure of traditional air-cooled sealed cabinet, air flows into cabinet inside, has abolished internal heat transfer The bottleneck of transmission, radiating effect are with the obvious advantage.
3rd, compared with the cabinet of the radiator structure such as cold using liquid, its mechanism is simple, and process specifications are low, and cost advantage is bright It is aobvious.
Description of the drawings
Fig. 1 is that a kind of air flows through the cabinet composition structure chart inside sealed machine box;
Fig. 2 is the composition structure chart of circuit function plate 3 in Fig. 1;
Fig. 3 is that a kind of air flows through the radiator structure schematic diagram inside sealed machine box;
In accompanying drawing:Air channel, 5- front shrouds, 6- bonnets in 1- case boxes, 2- circuit substrates, 3- circuit function plates, 4- Plate, 7- bottom plates, 8- blower fans, 9- functional cards, 10- cold drawings, 11- wedge lock mechanisms.
Specific embodiment
The radiator structure of the present invention.As shown in Figure 1 and Figure 2, by case box 1, circuit substrate 2, circuit function plate 3, interior Air channel 4, front shroud 5, back shroud 6, bottom plate 7, blower fan 8 are constituted.Case box 1 is the agent structure of cabinet, rises and installs cabinet The effect of other each several parts;Circuit substrate 2 installs 1 interior position rearward of case box;Circuit function plate 3 is by functional cards 9, cold Plate 10, wedge lock mechanism 11 are constituted, and according to cabinet electric function, typically have polylith;Interior air channel 4 is arranged on case box 1, Its quantity is identical with 3 quantity of circuit function plate, one piece of correspondence of circuit function plate 3, one interior air channel 4;Front shroud 5, back shroud 6th, bottom plate 7 is connected by screw and covers on case box 1;Blower fan 8 is arranged on bottom plate 7.
Case box 1 opens └ ┘ grooves on the top and bottom sidewall of 3 installation site of circuit function plate;In 4 installation position of interior air channel Put out energy and the through hole for passing through interior air channel 4 is installed, interior air channel 4 is arranged on lead to the hole site, and is guaranteed by welding or alternate manner interior Air channel 4 is fully sealed with circuit substrate 2 in case box 1 and the installing space of circuit function plate 3.Arrange on circuit substrate 2 The electric connector being connected with circuit function plate 3, acts primarily as the effect for being electrically connected each circuit plugboard.Circuit function plate 3 Functional cards 9 are connected with cold drawing 10 by screw, it is ensured that on functional cards 9 inside heater members (such as circuit chip) and cold drawing 10 Laminating is tight;Wedge lock mechanism 11 is arranged on 10 both sides of cold drawing.Interior air channel 4 is machined with the flat of array ventilation through hole for inside Plate, the shape of through hole of divulging information, size, array quantity are calculated according to the parameter such as forced-convection heat transfer and radiating Air Quantity Required and are determined. After opening in └ ┘ grooves on insertion 1 top and bottom sidewall of case box of circuit function plate 3, by wedge lock mechanism 11 thereon, make Its cold drawing 10 is locked between 1 └ ┘ grooves of case box and 4 wall of interior air channel, so that it is guaranteed that 3 overall locking of circuit plugboard is solid Fixed, cold drawing 10 is close to 4 wall of interior air channel;It is little with 4 wall thermal contact resistance of interior air channel to guarantee cold drawing 10, in cold drawing 10 and interior air channel 4 Wall contact area inlays softer material red copper sheet.Blower fan 8 is arranged on bottom plate 7, is risen and for cabinet extraneous air to be blasted air channel The effect of cooling air channel.
The operation principle of the present invention:
Operation principle of the present invention is shown in accompanying drawing 3.Heater members on the functional cards 9 of circuit function plate 3 (such as circuit chip) The heat of generation is delivered on the cold drawing 10 of circuit function plate 3 with conduction pattern, is then delivered to interior air channel 4 with conduction pattern On wall;Air outside cabinet is blasted air channel by the blower fan 8 on bottom plate 7, by interior wind in the way of forced-convection heat transfer Heat on 4 wall of road is taken away, and discharges outside cabinet, so as to realize case radiation.

Claims (1)

1. a kind of air flows through the radiator structure inside sealed machine box, it is characterized in that the radiator structure cabinet by case box (1), circuit substrate (2), circuit function plate (3), interior air channel (4), front shroud (5), back shroud (6), bottom plate (7), blower fan (8) constitute;Air channel (4) in installing on case box (1), installs circuit bottom in the air channel in interior air channel (4) and case box (1) Plate (2), circuit function plate (3) space fully seal, and circuit function plate (3) is by its cold drawing (10), wedge lock mechanism (11) it is fastened between case box (1) slot and interior air channel (4) wall, generates heat on the functional cards (9) of circuit function plate (3) The heat that device is produced is delivered on the cold drawing (10) of circuit function plate (3) with conduction pattern, is then transmitted with conduction pattern To on interior air channel (4) wall;Air outside cabinet is blasted air channel by the blower fan (8) on bottom plate (7), is changed with forced convection Heat on interior air channel (4) wall is taken away by the mode of heat, discharges outside cabinet.
CN201610963299.XA 2016-10-28 2016-10-28 A kind of air flows through the radiator structure inside sealed machine box Pending CN106550587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610963299.XA CN106550587A (en) 2016-10-28 2016-10-28 A kind of air flows through the radiator structure inside sealed machine box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610963299.XA CN106550587A (en) 2016-10-28 2016-10-28 A kind of air flows through the radiator structure inside sealed machine box

Publications (1)

Publication Number Publication Date
CN106550587A true CN106550587A (en) 2017-03-29

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CN201610963299.XA Pending CN106550587A (en) 2016-10-28 2016-10-28 A kind of air flows through the radiator structure inside sealed machine box

Country Status (1)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645887A (en) * 2017-09-25 2018-01-30 西安电子工程研究所 A kind of sealing electronic device heat dissipating method
CN109769367A (en) * 2017-11-09 2019-05-17 株洲中车时代电气股份有限公司 A kind of vehicle-mounted cabinet
CN110799017A (en) * 2019-10-12 2020-02-14 重庆长安工业(集团)有限责任公司 Fully-sealed case heat dissipation structure with cold plate provided with air duct
CN111447786A (en) * 2020-03-17 2020-07-24 中国电子科技集团公司第二十九研究所 Air-cooled case heat radiation structure applied to ASAAC module
CN113301780A (en) * 2021-05-25 2021-08-24 上海御微半导体技术有限公司 Board card box of semiconductor equipment and design method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201590983U (en) * 2010-01-04 2010-09-22 山东超越数控电子有限公司 Multi-air duct radiation device for ATR sealed case
CN103889179A (en) * 2014-04-03 2014-06-25 中航华东光电(上海)有限公司 On-board electronic cabinet
CN104113999A (en) * 2014-06-25 2014-10-22 陕西高华知本化工科技有限公司 High-heat density sealed cabinet
CN205454261U (en) * 2015-12-29 2016-08-10 北京信威通信技术股份有限公司 Electronic device case

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201590983U (en) * 2010-01-04 2010-09-22 山东超越数控电子有限公司 Multi-air duct radiation device for ATR sealed case
CN103889179A (en) * 2014-04-03 2014-06-25 中航华东光电(上海)有限公司 On-board electronic cabinet
CN104113999A (en) * 2014-06-25 2014-10-22 陕西高华知本化工科技有限公司 High-heat density sealed cabinet
CN205454261U (en) * 2015-12-29 2016-08-10 北京信威通信技术股份有限公司 Electronic device case

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645887A (en) * 2017-09-25 2018-01-30 西安电子工程研究所 A kind of sealing electronic device heat dissipating method
CN109769367A (en) * 2017-11-09 2019-05-17 株洲中车时代电气股份有限公司 A kind of vehicle-mounted cabinet
CN110799017A (en) * 2019-10-12 2020-02-14 重庆长安工业(集团)有限责任公司 Fully-sealed case heat dissipation structure with cold plate provided with air duct
CN111447786A (en) * 2020-03-17 2020-07-24 中国电子科技集团公司第二十九研究所 Air-cooled case heat radiation structure applied to ASAAC module
CN111447786B (en) * 2020-03-17 2022-02-01 中国电子科技集团公司第二十九研究所 Air-cooled case heat radiation structure applied to ASAAC module
CN113301780A (en) * 2021-05-25 2021-08-24 上海御微半导体技术有限公司 Board card box of semiconductor equipment and design method thereof

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Application publication date: 20170329