CN204929519U - Integration heat radiation structure - Google Patents
Integration heat radiation structure Download PDFInfo
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- CN204929519U CN204929519U CN201520661163.4U CN201520661163U CN204929519U CN 204929519 U CN204929519 U CN 204929519U CN 201520661163 U CN201520661163 U CN 201520661163U CN 204929519 U CN204929519 U CN 204929519U
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- fin
- fan
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- frame
- heat dissipation
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an integration heat radiation structure for machine case heat dissipation field, include cooling fin structure and the fan that is connected with the cooling fin structure rear side, cooling fin structure includes integrated into one piece's fin and circuit plate structure frame, the fin is located circuit plate structure frame, and the fin includes little fin array and fin base that the law was arranged, the vent of fan corresponds the passageway that little fin array formed. Adopt this integration heat radiation structure can effectively increase thermal current return circuit distance, improve the radiating efficiency.
Description
Technical field
The utility model relates to case radiation field, is particularly useful for the cabinet equipment under aviation field small space, complex electromagnetic environment.
Background technology
Along with the development of avionics, small size, the factors such as high density are the trend of current circuit application and development, in small-sized machine box equipment, the integrated level of integrated circuit greatly improves, equipment volume but significantly reduces, the multiple high-power electronic device of device interior integrated installation, bring the increase of energy consumption, whole device temperature is brought to raise thus, have impact on the overall performance of various electronic equipment, traditional radiator structure fin is placed according to parallel mode, marshalling, the auxiliary heat dissipation facility of natural environment state or device interior cannot be utilized completely to take away inside configuration heat, inside modules is made to occur heat accumulation, affect electric property, increase power consumption, can not meet the demands, need the version improving fin.Meanwhile, in designing and employing process, design and produce if module and radiator structure separate and also can affect heat dispersion together with being installed to, the structure of integration is more suitable for structure heat radiation.Further, existing radiator structure and cabinet position are fixed, and can not change, and for the functional module independent assortment occurred in R&D process, the situations such as functional module increase can not adapt to very well.
Summary of the invention
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of integral heat dissipation structure, can the heat dispersion of hoisting module, is convenient to combination and the installation of intermodule.
The technical scheme realizing the utility model object is as follows:
A kind of integral heat dissipation structure, comprise the heat radiating fin structure that is positioned at circuit board and with the fan be connected on rear side of heat radiating fin structure, described heat radiating fin structure comprises integrated fin and board structure of circuit frame, described fin is positioned at board structure of circuit frame, fin comprises small heat dissipating plate array and the cooling fin fin base of aligned transfer, the passage of the corresponding small heat dissipating plate array formation of ventilating opening of described fan.
Further, described small heat dissipating plate arrayed rule is rule staggered between row and row.
Further, described fan is installed in fan frame, and is connected with heat radiating fin structure by fan frame.
Further, the two side of described board structure of circuit frame and board structure of circuit frame one, in heat radiation groove shapes, not only weight reduction but also increase cooling surface area.
Further, also comprise the front and back panels be fixedly connected with board structure of circuit frame respectively, described front and back panels is all provided with the connector of external input and output, the top, two side of described board structure of circuit frame is provided with exposed buckle, is provided with embedded draw-in groove bottom the two side of described board structure of circuit frame.
Further, described heat radiating fin structure material is aluminium alloy.
The beneficial effects of the utility model are: by changing traditional fin form under identical volume weight, effectively can increase hot-fluid loop distance, radiating effect is improved; And the fin structure integrated with board structure of circuit frame can eliminate structure and interstructural air layer, promotes heat-transfer effect further; Also heat-transfer effect can be promoted; Meanwhile, each structural frames by exposed buckle, embedded draw-in groove and upper and lower structural frames physical connection, then is electrically connected by the connector of rear board, is conducive to functional module independent assortment, thus has saved design investment and resource consumption.
Accompanying drawing explanation
Fig. 1 is a kind of integral heat dissipation structure three-dimensional schematic diagram;
Fig. 2 is a kind of integral heat dissipation structure two-dimensional representation;
Wherein, 1-fin; 2-fan frame; 3-fan; 4-connector; 5-front panel; The exposed buckle of 6-; The embedded draw-in groove of 7-; 8-rear board; 9-board structure of circuit frame.
Embodiment
Further illustrate the utility model below in conjunction with accompanying drawing how to realize:
As shown in Figure 1, a kind of integral heat dissipation structure, comprise fan 3, fan frame 2 and heat radiating fin structure, comprise fin 1 and board structure of circuit frame 9, described fin 1 be positioned at board structure of circuit frame 9 and and board structure of circuit frame 9 be integrated, described fin 1 comprise according to row with arrange staggered small heat dissipating plate array and heat dissipation base; The below corresponding circuits plate of described board structure of circuit frame 9; Described fan 3 is installed in fan frame 2, and described fan frame 2 is installed on board structure of circuit frame 9 rear and is screwed with it; Described fan 3 and the rear side of fin have the space of certain distance, can place interconnected cable; The heat dissipation channel of the corresponding small heat dissipating plate array formation of ventilation hole of described fan 3.Install firmly under prerequisite in guarantee structural strength and radiator fan, change traditional fin form into small heat dissipating plate array format according to aligned transfer, not only increase hot-fluid loop distance but also the heat of body structure surface can be made by the volatilization of unobstructed heat dissipation channel, greatly improve the heat-sinking capability of this structure.Described fin 1 adopts integrated molding technology to process with board structure of circuit frame 9, can eliminate structure and interstructural air layer, promote heat-transfer effect further.
As illustrated in fig. 1 and 2, described heat radiating fin structure adopts monoblock 2A12 aluminium alloy to be processed by CNC milling machine, and two side and the board structure of circuit frame of described board structure of circuit frame 9 are integrated, and adopts heat radiation groove design, increases cooling surface area and loss of weight, be individually fixed in the connector 4 front panel 5 of described board structure of circuit frame 9 and rear board 8 being equipped with external input and output, by cable and other modules interconnected, the connector of front and back panels is excellent to select the connector of EMC excellent performance, to prevent electromagnetic radiation, interference, the top of described two side is provided with exposed buckle 6, be 90 degree of angles with board structure of circuit, the interconnection with the embedded draw-in groove of the structural frames of other functional modules of top can be realized by buckle 6, and be fixed by screw, in like manner, the bottom of described two side is provided with embedded draw-in groove 7, can realize interconnecting with the exposed buckle of the structural frames of other functional modules of below by embedded draw-in groove 7, and be fixed by screw, width and the mounting hole site of embedded draw-in groove and exposed buckle should be mated mutually, when making the smooth lower structural member of structural member, draw-in groove and buckle can be locked, hole potential energy is aimed at and be there will not be up-down structure mutually to rock when mechanical oscillation.
In use procedure, when multiple module is combined by the identical embedded draw-in groove of standard and exposed buckle time, can seal up by plate place shielding cover board below, so just can meet the mechanical property requirements needed for cabinet, greatly can increase again the antijamming capability of module.After casing structure machines, need first through surface conductance oxidation processes (Ct.Ocd), and then spray the anti-paint of sub-light black three (PVF), which adds the ability such as anti-oxidant, anticorrosive of module.
Claims (6)
1. an integral heat dissipation structure, comprise circuit board, heat radiating fin structure and fan, it is characterized in that, heat radiating fin structure is positioned at circuit board, and fan is connected with on rear side of heat radiating fin structure, described heat radiating fin structure comprises integrated fin and board structure of circuit frame, described fin is positioned at board structure of circuit frame, and fin comprises small heat dissipating plate array and the cooling fin fin base of aligned transfer, the passage of the corresponding small heat dissipating plate array formation of ventilating opening of described fan.
2. integral heat dissipation structure according to claim 1, is characterized in that, described small heat dissipating plate arrayed rule is rule staggered between row and row.
3. integral heat dissipation structure according to claim 1, is characterized in that, described fan is installed in fan frame, and is connected with on rear side of heat radiating fin structure by fan frame.
4. integral heat dissipation structure according to claim 1, is characterized in that, the two side of described board structure of circuit frame and board structure of circuit frame one, in heat radiation groove shapes.
5. integral heat dissipation structure according to claim 1, it is characterized in that, also comprise the front and back panels be fixedly connected with board structure of circuit frame respectively, described front and back panels is all provided with the connector of external input and output, the top, two side of described board structure of circuit frame is provided with exposed buckle, is provided with embedded draw-in groove bottom the two side of described board structure of circuit frame.
6. integral heat dissipation structure according to claim 1, is characterized in that, described heat radiating fin structure material is aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520661163.4U CN204929519U (en) | 2015-08-28 | 2015-08-28 | Integration heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520661163.4U CN204929519U (en) | 2015-08-28 | 2015-08-28 | Integration heat radiation structure |
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| Publication Number | Publication Date |
|---|---|
| CN204929519U true CN204929519U (en) | 2015-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520661163.4U Active CN204929519U (en) | 2015-08-28 | 2015-08-28 | Integration heat radiation structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN204929519U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112099607A (en) * | 2020-09-27 | 2020-12-18 | 中原工学院 | Heat abstractor based on big data cloud computing equipment |
| CN113115562A (en) * | 2021-03-30 | 2021-07-13 | 四川砚香科技有限公司 | Video projection music box |
-
2015
- 2015-08-28 CN CN201520661163.4U patent/CN204929519U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112099607A (en) * | 2020-09-27 | 2020-12-18 | 中原工学院 | Heat abstractor based on big data cloud computing equipment |
| CN113115562A (en) * | 2021-03-30 | 2021-07-13 | 四川砚香科技有限公司 | Video projection music box |
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| GR01 | Patent grant |