CN203840687U - Heat radiator, circuit board heat radiation structure, and electronic device - Google Patents
Heat radiator, circuit board heat radiation structure, and electronic device Download PDFInfo
- Publication number
- CN203840687U CN203840687U CN201420141731.3U CN201420141731U CN203840687U CN 203840687 U CN203840687 U CN 203840687U CN 201420141731 U CN201420141731 U CN 201420141731U CN 203840687 U CN203840687 U CN 203840687U
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- Prior art keywords
- heat radiation
- circuit board
- radiator
- heating panel
- heat
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Abstract
The utility model belongs to the heat radiator field, especially relates to a heat radiator, a circuit board heat radiation structure, and an electronic device. The object of the utility model is to guarantee the good heat radiation effect of the heat radiator on the high power consumption chip on the circuit board without additionally providing the fans or other heat radiation devices. The heat radiator comprises a heat radiation block, which is attached to the end surface of the chip far from the circuit board; and a heat radiation board, which is attached to the heat radiation block. The periphery of the heat radiation board can be used to cover the periphery of the heat radiation block, and an interval space is arranged between the heat radiation board and the circuit board. The chip on the circuit board is directly attached to the heat radiation block, and the heat radiation block is attached to the heat radiation board, and therefore the heat energy generated by the chip can be transmitted to the heat radiation board, and then can be transmitted to the space around the heat radiation board, and the good heat radiation effect of the heat radiator on the high power consumption chip on the circuit board can be guaranteed. No fans or other heat radiation devices are additionally provided, and therefore the problems such as noises and other potential faults caused by the fans or other heat radiation devices can be prevented. The heat radiator provided by the utility model has advantages of low costs, high heat radiation efficiency, uniform heat radiation, reliable working, and ability of overcoming the defect of the prior art that the passive heat radiation is only suitable for the occasion requiring the heat radiation of the low power consumption chip.
Description
Technical field
The utility model belongs to radiator field, relates in particular to a kind of radiator, circuit board cooling structure and electronic equipment.
Background technology
The radiating mode of circuit board can be divided into two kinds of passive heat radiation and active heat radiations.Passive heat radiation is exactly that the heat chip of circuit board being produced by fin is dispersed in air naturally.Because be nature distribute heat, effect is not fine, and the effect of its heat radiation is directly proportional to fin size.But the benefit of its maximum is exactly not need extra power consumption, and do not worry the danger that has fan to break down.This radiating mode is usually used in those not to be had in the military or professional equipment of special requirement space.Active heat radiation be exactly by the heat dissipation equipments such as fan mandatory heat that fin is sent take away, be characterized in that radiating efficiency is high, and equipment volume is little.
The passive heat radiation that prior art is provided and active heat radiation are applied to respectively on the circuit board of Set Top Box or other electronic equipments.Passive heat radiation cost is low, is applicable to low-power chip heat radiation.Active heat radiation high expensive, noise is large, and fan or other heat dissipation equipments likely there will be fault, thereby involve the normal use of electronic equipment.
Utility model content
The purpose of this utility model is to provide a kind of radiator, is intended to not increase in the situation of fan or other heat dissipation equipments ensure that radiator has good radiating effect to the high power consumption chip on circuit board.
The utility model is to realize like this, a kind of radiator, to the heat dissipation for circuit board of the chip that is sticked, described radiator comprise with described chip on the radiating block that fits away from the end face of described circuit board and the heating panel fitting with described radiating block, the outer rim of described heating panel covers the outer rim of described radiating block, between described heating panel and described circuit board, forms clearance space.
Further, on described heating panel, offer some through holes of being convenient to air heat radiation between described circuit board and described heating panel.
Further, described through hole is array distribution on described heating panel.
Further, described through hole is mounting hole.
Further, the shape of described radiating block and the shape of described chip are suitable.
Further, between described radiating block and described heating panel, be fixedly connected with.
Further, described radiating block and described heating panel are alumiaum article.
Another object of the present utility model is to provide a kind of circuit board cooling structure, described circuit board cooling structure comprises circuit board and the radiator of the chip that is sticked, between the described heating panel of described circuit board and described radiator, be fixedly connected with, between described chip and described radiating block, be provided with heat conductive silica gel.
Further, on described circuit board, offer some the first installing holes, on described heating panel, offer the second installing hole of the corresponding distribution of some and described the first installing hole, the quantity of described the first installing hole equates with the quantity of described the second installing hole, described in each the first installing hole and and described the second installing hole corresponding to this first installing hole between be fixedly connected with by rivet.
Another object of the present utility model is to provide a kind of electronic equipment, and described electronic equipment comprises housing and circuit board cooling structure, and described circuit board cooling structure is fixedly installed in the inside of described housing.
The utility model with respect to the technique effect of prior art is: because the chip on circuit board is direct and radiating block fits, and radiating block and heating panel fit, the heat that chip produces is passed in the surrounding space that heating panel is passed to heating panel again through radiating block, ensures that radiator has good radiating effect to the high power consumption chip on circuit board.Meanwhile, do not increase fan or other heat dissipation equipments, avoid fan or other heat dissipation equipments to produce noise and likely there will be the problem of fault.The radiator that the utility model provides has that cost is low, radiating efficiency is high, heat radiation is even, the feature of reliable operation, changes the occasion that passive heat radiation of the prior art can only be applicable to low-power chip heat radiation.
Brief description of the drawings
Fig. 1 is the installation diagram of the circuit board cooling structure that provides of the utility model embodiment.
Fig. 2 is the installation diagram at another visual angle of the circuit board cooling structure of Fig. 1.
Fig. 3 is the structure chart of the radiator that provides of the utility model embodiment.
Fig. 4 is the structure chart of the circuit board applied in the circuit board cooling structure of Fig. 1.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1 to Fig. 4, a kind of radiator 20 that the utility model embodiment provides, circuit board 10 to the chip 11 that is sticked dispels the heat, described radiator 20 comprise with described chip 11 on the radiating block 24 that fits away from the end face of described circuit board 10 and the heating panel 21 fitting with described radiating block 24, the outer rim of described heating panel 21 covers the outer rim of described radiating block 24, between described heating panel 21 and described circuit board 10, forms clearance space A.Chip 11 fits with radiating block 24, and radiating block 24 fits with heating panel 21, allows the heat that chip 11 produces effectively be passed to radiating block 24, is then passed on heating panel 21, then is passed in surrounding space by heating panel 21.In actual applications, radiating block 24 is solid blocks, be conducive to the heat of chip 11 to be delivered on radiating block 24, and heating panel 21 need to be made enough greatly, be conducive to the heat on radiating block 24 to be farthest delivered in surrounding space, thereby ensure that radiator 20 has good radiating effect to the high power consumption chip 11 on circuit board 10.The outer rim of heating panel 21 covers the outer rim of radiating block 24, consideration be polylith chip 11 and the configuring condition of radiator 20, allow a heating panel 21 coordinate with multiple radiating blocks 24, this Standard is easy, and can realize the heat radiation of polylith chip 11.In addition, between heating panel 21 and circuit board 10, due to the existence of radiating block 24, and make between heating panel 21 and circuit board 10 to form clearance space A, air-flow is more easily entered in clearance space and at each through hole 22 mesoscale eddies, realize better radiating effect.
Because the chip 11 on circuit board 10 is direct and radiating block 24 fits, and radiating block 24 fits with heating panel 21, heat that chip 11 produces is passed in the surrounding space that heating panel 21 is passed to heating panel 21 again through radiating block 24, ensures that radiator 20 has good radiating effect to the high power consumption chip 11 on circuit board 10.Meanwhile, do not increase fan or other heat dissipation equipments, avoid fan or other heat dissipation equipments to produce noise and likely there will be the problem of fault.The radiator 20 that the utility model provides has that cost is low, radiating efficiency is high, heat radiation is even, the feature of reliable operation, changes the occasion that passive heat radiation of the prior art can only be applicable to low-power chip heat radiation.
Further, on described heating panel 21, offer some through holes 22 of being convenient to air heat radiation between described circuit board 10 and described heating panel 21.In actual applications, heating panel 21 is not offered through hole 22 with the joint place of radiating block 24, allows radiating block 24 fully contact with heating panel 21, thereby allows the heat on radiating block 24 farthest be delivered on heating panel 21.And the setting of through hole 22 allows air flow, realize better radiating effect between circuit board 10 and heating panel 21.
Further, described through hole 22 is array distribution on described heating panel 21.Through hole 22 is array distribution, easily processes and can obtain good radiating effect.
Further, described through hole 22 is mounting hole.Understandably, described through hole 22 is circle, rectangle or other shapes.
Further, the shape of the shape of described radiating block 24 and described chip 11 is suitable.Shape is suitable refers to that radiating block 24 is identical with the shape of chip 11 with the binding face shape of chip 11, is conducive to the heat of chip 11 to be delivered on radiating block 24.
Further, between described radiating block 24 and described heating panel 21, be fixedly connected with.Particularly, radiating block 24 can adopt screw 25 or interface arrangment or other structure to achieve a fixed connection with heating panel 21.In the present embodiment, radiating block 24 adopts screw 25 to be fixedly connected with heating panel 21, and radiating block 24 separates with heating panel 21, can achieve a fixed connection by screw 25.Heating panel 21 is mold moulding in addition, easy to process, and assembling is simple.Understandably, described radiating block 24 is formed in one with described heating panel 21.
Further, described radiating block 24 is alumiaum article with described heating panel 21.Understandably, radiating block 24 is other Heat Conduction Materials with heating panel 21.
A kind of circuit board cooling structure that the utility model embodiment provides, described circuit board cooling structure comprises circuit board 10 and the radiator 20 of the chip 11 that is sticked, between described circuit board 10 and the described heating panel 21 of described radiator 20, be fixedly connected with, between described chip 11 and described radiating block 24, be provided with heat conductive silica gel (not shown).In the present embodiment, the quantity of chip 11 is two, on the position corresponding with two chips 11, has two heat-conducting blocks, and two heat-conducting blocks are all fixedly connected with heating panel 21.Between circuit board 10 and radiator 20, be provided with four rivets 26, wherein two rivets 26 are distributed in circuit board 10 one end in the longitudinal direction, and two other rivet 26 is distributed in circuit board 10 other one end in the longitudinal direction, the rivet 26 that two ends distribute is conducive to being fixedly connected with between circuit board 10 and radiator 20.Heat conductive silica gel is heat conduction compound, and the characteristic that having not can solidification, can not conduct electricity, can avoid such as short circuit equivalent risk.Heat conductive silica gel is set and can allows the heat that chip 11 produces directly be passed to heat-conducting block, be then passed to heating panel 21, thereby ensure that radiator 20 has good radiating effect to the high power consumption chip 11 on circuit board 10.
Further, on described circuit board 10, offer some the first installing holes 12, on described heating panel 21, offer the second installing hole 23 of the corresponding distribution of some and described the first installing hole 12, the quantity of described the first installing hole 12 equates with the quantity of described the second installing hole 23, described in each the first installing hole 12 and and described the second installing hole 23 corresponding to this first installing hole 12 between be fixedly connected with by rivet 26.Rivet 26 is fixedly connected with, and easily, compact conformation, connects reliable in assembling.
A kind of electronic equipment (not shown) that the utility model embodiment provides, described electronic equipment comprises housing (not shown) and circuit board cooling structure, described circuit board cooling structure is fixedly installed in the inside of described housing.In an embodiment, the quantity of chip 11 is two, on the position corresponding with two chips 11, has two heat-conducting blocks, and two heat-conducting blocks are all fixedly connected with heating panel 21.The heat of two chips 11 is after radiating block 24 is delivered to heating panel 21, and the heat of heating panel 21 is more even, does not have the too high problem of amount of localized heat, and it is better that user touches the body sense of housing.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a radiator, to the heat dissipation for circuit board of the chip that is sticked, it is characterized in that: described radiator comprise with described chip on the radiating block that fits away from the end face of described circuit board and the heating panel fitting with described radiating block, the outer rim of described heating panel covers the outer rim of described radiating block, between described heating panel and described circuit board, forms clearance space.
2. radiator as claimed in claim 1, is characterized in that: on described heating panel, offer some through holes of being convenient to air heat radiation between described circuit board and described heating panel.
3. radiator as claimed in claim 2, is characterized in that: described through hole is array distribution on described heating panel.
4. radiator as claimed in claim 3, is characterized in that: described through hole is mounting hole.
5. the radiator as described in claim 1 to 4 any one, is characterized in that: the shape of described radiating block and the shape of described chip are suitable.
6. the radiator as described in claim 1 to 4 any one, is characterized in that: between described radiating block and described heating panel, be fixedly connected with.
7. the radiator as described in claim 1 to 4 any one, is characterized in that: described radiating block and described heating panel are alumiaum article.
8. a circuit board cooling structure, it is characterized in that: described circuit board cooling structure comprises the circuit board of the chip that is sticked and the radiator as described in claim 1 to 7 any one, between the described heating panel of described circuit board and described radiator, be fixedly connected with, between described chip and described radiating block, be provided with heat conductive silica gel.
9. circuit board cooling structure as claimed in claim 8, it is characterized in that: on described circuit board, offer some the first installing holes, on described heating panel, offer the second installing hole of the corresponding distribution of some and described the first installing hole, the quantity of described the first installing hole equates with the quantity of described the second installing hole, described in each the first installing hole and and described the second installing hole corresponding to this first installing hole between be fixedly connected with by rivet.
10. an electronic equipment, is characterized in that: described electronic equipment comprises housing and circuit board cooling structure as claimed in claim 8 or 9, and described circuit board cooling structure is fixedly installed in the inside of described housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420141731.3U CN203840687U (en) | 2014-03-26 | 2014-03-26 | Heat radiator, circuit board heat radiation structure, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420141731.3U CN203840687U (en) | 2014-03-26 | 2014-03-26 | Heat radiator, circuit board heat radiation structure, and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203840687U true CN203840687U (en) | 2014-09-17 |
Family
ID=51518478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420141731.3U Expired - Fee Related CN203840687U (en) | 2014-03-26 | 2014-03-26 | Heat radiator, circuit board heat radiation structure, and electronic device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203840687U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104936389A (en) * | 2015-06-12 | 2015-09-23 | 徐州云意科技发展有限公司 | Power-driven four-wheeler controller |
| CN105957847A (en) * | 2016-06-29 | 2016-09-21 | 深圳市九洲电器有限公司 | Chip heat dissipation structure and set-top box |
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN109634392A (en) * | 2018-12-27 | 2019-04-16 | 华为技术有限公司 | A kind of shell mechanism and terminal device |
| CN114302586A (en) * | 2021-11-24 | 2022-04-08 | 深圳半岛医疗有限公司 | Multi-channel radio frequency power supply |
| WO2023098751A1 (en) * | 2021-12-03 | 2023-06-08 | Oppo广东移动通信有限公司 | Chip heat dissipation structure and electronic device |
-
2014
- 2014-03-26 CN CN201420141731.3U patent/CN203840687U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104936389A (en) * | 2015-06-12 | 2015-09-23 | 徐州云意科技发展有限公司 | Power-driven four-wheeler controller |
| CN105957847A (en) * | 2016-06-29 | 2016-09-21 | 深圳市九洲电器有限公司 | Chip heat dissipation structure and set-top box |
| CN105957847B (en) * | 2016-06-29 | 2019-02-15 | 深圳市九洲电器有限公司 | A kind of chip cooling structure and set-top box |
| CN106686880A (en) * | 2016-12-30 | 2017-05-17 | 株洲中车时代电气股份有限公司 | Onboard electronic part device for rail transit |
| CN109634392A (en) * | 2018-12-27 | 2019-04-16 | 华为技术有限公司 | A kind of shell mechanism and terminal device |
| CN114265475A (en) * | 2018-12-27 | 2022-04-01 | 荣耀终端有限公司 | Shell structure and terminal equipment |
| US11630494B2 (en) | 2018-12-27 | 2023-04-18 | Honor Device Co., Ltd. | Housing structure and terminal device |
| CN114302586A (en) * | 2021-11-24 | 2022-04-08 | 深圳半岛医疗有限公司 | Multi-channel radio frequency power supply |
| WO2023098751A1 (en) * | 2021-12-03 | 2023-06-08 | Oppo广东移动通信有限公司 | Chip heat dissipation structure and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140917 Termination date: 20190326 |
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| CF01 | Termination of patent right due to non-payment of annual fee |