CN205266113U - Sheet system fin - Google Patents

Sheet system fin Download PDF

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Publication number
CN205266113U
CN205266113U CN201521091827.4U CN201521091827U CN205266113U CN 205266113 U CN205266113 U CN 205266113U CN 201521091827 U CN201521091827 U CN 201521091827U CN 205266113 U CN205266113 U CN 205266113U
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CN
China
Prior art keywords
thin slice
heat radiation
sheet
heat
sheet material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521091827.4U
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Chinese (zh)
Inventor
罗明杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Xingtai Photoelectric Technology Co Ltd
Original Assignee
Huizhou Xingtai Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Xingtai Photoelectric Technology Co Ltd filed Critical Huizhou Xingtai Photoelectric Technology Co Ltd
Priority to CN201521091827.4U priority Critical patent/CN205266113U/en
Application granted granted Critical
Publication of CN205266113U publication Critical patent/CN205266113U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a sheet system fin, includes slice heat dissipation thin slice, the heat dissipation thin slice is hugged closely on outside heat -generating body, the heat dissipation thin slice have a pleated sheet, and be higher than heat dissipation thin slice surface. Compared with the prior art, this the utility model has the advantages of as follows: this fin can be attached in the unevenness surface, realizes the heat dissipation on unevenness surface. But design greatly increased heat radiating area's pleated sheet, the radiating effect is better. The soft material cost that adopts is lower. Receive space limitation little, more be suitable for microelectonic device like integrated IC's heat dissipation. Through directly paste be fixed in the heat -generating body on, simple to operate.

Description

A kind of sheet material fin processed
Technical field
The utility model relates to the technological improvement of heat radiation aspect.
Background technology
Along with the development of the electronic device becoming increasingly complex, comprise and can improve processing speed and frequency is higher, size is less, power requirement is more complicated and show those devices of other technical advance, as the memory element of the microprocessor in electronics and electrical equipment and integrated circuit, high power capacity and responsiveness as hard disk drive, electromagnet source as at digital projector and other device as the bulb in high power optical device, may produce relatively extreme temperature. But microprocessor, integrated circuit and other complicated electronic component can only effectively be worked conventionally within the scope of certain threshold temperature. In the course of work of these elements, produce excessive heat and not only damage they self performance, but also can reduce the Performance And Reliability of whole system, even may cause the system failure. The working environment scope of electronic system expection, comprises that temperature extremes widens day by day, has aggravated the negative effect of undue heat.
Along with the increase to heat dissipation from microelectronic devices demand, heat management becomes the factor becoming more and more important in design of electronic products. The stability of electronic equipment and life expectancy are all inversely proportional to the component temperature of equipment. For example, device reduces the increase that is equivalent to device processing speed, reliability and life expectancy as the operating temperature of typical silicon semiconductor. Therefore,, for the life and reliability that makes element maximizes, by designer, device operating temperature is controlled in set of limit very important.
The radiating element of microelectronic component has two kinds at present, one is to use the materials such as copper, aluminium and synthesize ceramic by modes such as casting, drawing, machineds, increase surface radiating area, reach the object of strengthening heat radiation, this class mode cost is high, require greatly for heat-dissipating space, and between radiator and electronic device, be rigid laminating, cannot use in microelectronic component. Another kind is to use graphite flake, Copper Foil, aluminium foil and various composite sheet, sheet material is attached to microelectronic component surface, by good heat conduction, the radiating effect of sheet material, reach heat conduction and strengthen the many objects of heat radiation, but this mode is because microelectronic component surface is limited, area of dissipation is less, cannot realize solid space heat radiation, and radiating effect is limited.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of sheet material fin processed of good heat dissipation effect.
For solving the problems of the technologies described above, the technical solution adopted in the utility model is as follows:
A kind of sheet material fin processed, comprises sheet heat radiation thin slice, and heat radiation thin slice is close on outside heater, and described heat radiation thin slice has pleated sheet, and higher than heat radiation sheet surface.
As the improvement to such scheme, described pleated sheet is by the overlapping local heat radiation thin slice bending integrative-structure being connected as a single entity with heat radiation thin slice that form.
As further improvement of these options, described pleated sheet is be set up in parallel multiple.
As the further improvement to such scheme, between described pleated sheet, there is the spacing of the heat radiation of being beneficial to.
And the lap of described pleated sheet, to two outside curve, forms the air duct that is beneficial to circulation of air in the middle of lap.
And described pleated sheet free end is closely fitted with an auxiliary heat dissipation thin slice.
And described heat radiation thin slice is the thin slice of soft thickness graphite flake or aluminium foil or Copper Foil or composite sheet material below 0.8mm.
Compared with prior art, originally the utlity model has following advantage:
1. this fin can be attached at out-of-flatness surface, realizes the heat radiation on out-of-flatness surface.
2. design can increase the pleated sheet of area of dissipation, better heat-radiation effect greatly.
3. the soft materials cost that adopted is lower.
4. be subject to spatial limitation little, be more suitable in microelectronic component as the heat radiation of integrated IC.
5. be fixed on heater by direct stickup, easy for installation.
Brief description of the drawings
Fig. 1 is the utility model embodiment mono-structural representation.
Fig. 2 is the utility model embodiment bis-structural representations.
Fig. 3 is that the utility model is installed on another version external cooling device structural representation.
Fig. 4 is for the utlity model has a pleated sheet structural representation.
Fig. 5 is pleated sheet design air channel design schematic diagram in the utility model.
Detailed description of the invention
For the ease of it will be appreciated by those skilled in the art that below in conjunction with accompanying drawing and specific embodiment, the utility model is conceived and is explained in further detail.
Embodiment mono-:
The sheet material fin processed that the present embodiment discloses is mainly used in the heat radiation of the microelectronic component such as IC, electronics internal components, and not affected by outer surface shape, sheet material fin processed can fit in microelectronic component surface according to surface configuration flexibility, has good radiating effect.
Specifically as shown in Figure 1, this sheet material fin processed comprises sheet heat radiation thin slice 1, and heat radiation thin slice 1 material can adopt the material such as graphite flake or aluminium foil or Copper Foil or composite sheet with certain suppleness, and thickness is below 0.8mm.
The outside heater 3(that this heat radiation thin slice 1 is close to needs heat radiations is as IC etc.) upper, the heat producing when heater 3 is worked can conduct on heat radiation thin slice 1 efficiently. In order to increase the contact area of heat radiation thin slice 1 and air, improve radiating effect, be provided with pleated sheet 2 at heat radiation thin slice 1, this pleated sheet 2 is higher than heat radiation thin slice 1 surface.
This pleated sheet 2 is for by overlapping local heat radiation thin slice 1 bending integrative-structure that form and that be connected as a single entity with heat radiation thin slice 1. In order to increase radiating effect, the quantity of pleated sheet 2 is multiple, is set up in parallel, and has the spacing that is necessarily beneficial to heat radiation. The thin slice 1 that dispels the heat under this structure increases greatly with air contact area, and radiating effect is better.
Embodiment bis-:
As shown in Figure 2. The present embodiment and embodiment mono-structure difference are to be closely fitted with an auxiliary heat dissipation thin slice 5 at the free end of pleated sheet 2. This auxiliary heat dissipation thin slice 5 is parallel with heat radiation thin slice 1, fits simultaneously, more further increased the contact area of whole fin and air with the free end of each pleated sheet 2, has also further improved radiating effect.
Other part-structure principles of this embodiment are consistent with embodiment mono-, and therefore not to repeat here.
In above-mentioned two embodiment, external cooling body 3 surface configurations can be arbitrary shape, as shown in Figure 3. This diagram peripheral radiator 3 is for posting A instruction place in heating IC(figure) FPC (B instruction place in figure), the arc that FPC is surface irregularity, heat radiation thin slice 1 is close to FPC and the contrary side of IC of generating heat. First the heat of heating IC conducts on FPC, then conducts to heat radiation on heat radiation thin slice 1 and pleated sheet 2 by FPC.
In addition,, except structure shown in above-mentioned accompanying drawing 1,2, the utility model can be according to radiating requirements, only designs a pleated sheet 2, as shown in Figure 4.
And, in order further to increase radiating effect, pleated sheet 2 laps can not be fitted, the reserved certain space of lap forms air duct 4, and air can be entered in air duct 4, as shown in Figure 5). This structure has also further increased the contact area of pleated sheet 2 with air, has further improved radiating effect.
The above embodiment has only expressed embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims. It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.

Claims (6)

1. a sheet material fin processed, comprise sheet heat radiation thin slice (1), heat radiation thin slice is close on outside heater, it is characterized in that, described heat radiation thin slice has pleated sheet (2), and higher than heat radiation sheet surface, described pleated sheet is by the overlapping local heat radiation thin slice bending integrative-structure being connected as a single entity with heat radiation thin slice that form.
2. sheet material according to claim 1 fin processed, is characterized in that, described pleated sheet is be set up in parallel multiple.
3. sheet material according to claim 2 fin processed, is characterized in that, has the spacing of the heat radiation of being beneficial between described pleated sheet.
4. sheet material according to claim 3 fin processed, is characterized in that, the lap of described pleated sheet, to two outside curve, forms the air duct (4) that is beneficial to circulation of air in the middle of lap.
5. sheet material according to claim 4 fin processed, is characterized in that, described pleated sheet free end is closely fitted with an auxiliary heat dissipation thin slice (5).
6. according to the fin processed of the sheet material described in any one in claim 1~5, it is characterized in that, described heat radiation thin slice is the graphite flake of soft thickness below 0.8mm or the thin slice of aluminium foil or Copper Foil or composite sheet material.
CN201521091827.4U 2015-12-25 2015-12-25 Sheet system fin Expired - Fee Related CN205266113U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521091827.4U CN205266113U (en) 2015-12-25 2015-12-25 Sheet system fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521091827.4U CN205266113U (en) 2015-12-25 2015-12-25 Sheet system fin

Publications (1)

Publication Number Publication Date
CN205266113U true CN205266113U (en) 2016-05-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521091827.4U Expired - Fee Related CN205266113U (en) 2015-12-25 2015-12-25 Sheet system fin

Country Status (1)

Country Link
CN (1) CN205266113U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI620497B (en) * 2016-11-30 2018-04-01 仁寶電腦工業股份有限公司 Folding-type heat dissipation device and method thereof
CN110260280A (en) * 2019-06-19 2019-09-20 厦门普为光电科技有限公司 Lamps and lanterns heat dissipation appurtenance
WO2020252685A1 (en) * 2019-06-19 2020-12-24 厦门普为光电科技有限公司 Lamp heat dissipation assistant tool

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI620497B (en) * 2016-11-30 2018-04-01 仁寶電腦工業股份有限公司 Folding-type heat dissipation device and method thereof
CN110260280A (en) * 2019-06-19 2019-09-20 厦门普为光电科技有限公司 Lamps and lanterns heat dissipation appurtenance
WO2020252685A1 (en) * 2019-06-19 2020-12-24 厦门普为光电科技有限公司 Lamp heat dissipation assistant tool

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160525

Termination date: 20161225

CF01 Termination of patent right due to non-payment of annual fee