CN209433343U - CPU heat radiation module for notebook - Google Patents
CPU heat radiation module for notebook Download PDFInfo
- Publication number
- CN209433343U CN209433343U CN201822008605.1U CN201822008605U CN209433343U CN 209433343 U CN209433343 U CN 209433343U CN 201822008605 U CN201822008605 U CN 201822008605U CN 209433343 U CN209433343 U CN 209433343U
- Authority
- CN
- China
- Prior art keywords
- fixed
- heat
- thermally conductive
- conducting pipe
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of CPU heat radiation modules for notebook, including heat absorbing sheet and radiating fin group, heat conducting pipe is provided between heat absorbing sheet and radiating fin group, installation trunnion is fixed on heat absorbing sheet, installation screw is fixed on installation trunnion, it is fixed on heat absorbing sheet fluted, thermally conductive sheet is fixed on the inner wall of groove, the thermally conductive slot matched with thermally conductive sheet position is fixed in one end of heat conducting pipe, when heat conducting pipe is in groove, thermally conductive sheet passes through thermally conductive slot and protrudes into heat conducting pipe, cylindrical hole is uniformly fixed in the other end of heat conducting pipe, heating column is uniformly fixed in the bottom surface of radiating fin, heating column and radiating fin are integrally formed, the heating column plug-in card of radiating fin is fixed in the cylindrical hole of heat conducting pipe.The structure setting of the utility model is reasonable, is not only conveniently connected and fixed, and is conducive to improve the reliability of thermally conductive stability and heat dissipation, occupies little space, suitable for the use in small space, strong applicability practicability is good.
Description
Technical field
The utility model belongs to technical field of heat dissipation, and in particular to a kind of CPU heat radiation module for notebook.
Background technique
With the development of electronic industry technology, the transistor density of all kinds of chips especially central processing unit increasingly increases,
Although the speed of data processing is getting faster, the power of consumption and the heat of generation also increasingly increase, in allowing
Central processor can stablize running, and efficient radiator also becomes current inevitable demand, in the limited electric appliance in some spaces
Such as laptop, it is conventional to drive air to flow through radiating fin using fan to radiate, but it needs to occupy
Biggish space, and heat dissipation effect is very limited, so applicability and practicability are restricted.
Summary of the invention
The purpose of the utility model is to provide the CPU for notebook that a kind of structure setting is reasonable and occupies little space to dissipate
Thermal module.
The technical solution for realizing the utility model aim is a kind of CPU heat radiation module for notebook, including heat absorbing sheet
With radiating fin group, it is provided with heat conducting pipe between the heat absorbing sheet and radiating fin group, is fixed with peace on the heat absorbing sheet
Fill trunnion, be fixed with installation screw on the installation trunnion, fixed on the heat absorbing sheet it is fluted, in the groove
It is fixed with thermally conductive sheet on wall, the thermally conductive slot matched with the thermally conductive sheet position, institute are fixed in one end of the heat conducting pipe
When stating heat conducting pipe and being in the groove, the thermally conductive sheet passes through thermally conductive slot and protrudes into the heat conducting pipe, described thermally conductive
The other end of pipe is uniformly fixed with cylindrical hole, is uniformly fixed with heating column in the bottom surface of the radiating fin, the heating column with
The radiating fin is integrally formed, and the heating column plug-in card of the radiating fin is fixed in the cylindrical hole of the heat conducting pipe.
In the heat conduction silicone that is coated with of the thermally conductive sheet, the thermally conductive sheet passes through when being inserted into the thermally conductive slot
Heat conduction silicone realizes sealing.
Thermal conductive silicon colloid is filled in the heat conducting pipe.
When the bottom surface of the heat absorbing sheet is provided with chip bit-avoiding slot, and the heat absorbing sheet is fixed, the top of chip is in core
In piece bit-avoiding slot.
The utility model has the effect of positive: the structure setting of the utility model is reasonable, is not only conveniently connected and fixed, and
And be conducive to improve the reliability of thermally conductive stability and heat dissipation, it occupies little space, suitable for the use in small space, strong applicability
It is good with practicability.
Detailed description of the invention
In order to be more likely to be clearly understood the content of the utility model, below according to specific embodiment and combine attached
Figure, is described in further detail the utility model, in which:
Fig. 1 is the structural schematic diagram of the utility model.
Specific embodiment
(embodiment 1)
Fig. 1 shows a kind of specific embodiment of the utility model, and wherein Fig. 1 is the structural representation of the utility model
Figure.
Fig. 1, a kind of CPU heat radiation module for notebook, including heat absorbing sheet 1 and radiating fin group 2 are seen, in the heat absorption
It is provided with heat conducting pipe 3 between piece and radiating fin group, installation trunnion 4 is fixed on the heat absorbing sheet, in the installation trunnion
On be fixed with installation screw 5, fluted 6 are fixed on the heat absorbing sheet, thermally conductive sheet 7 is fixed on the inner wall of the groove,
The thermally conductive slot 8 matched with the thermally conductive sheet position is fixed in one end of the heat conducting pipe, the heat conducting pipe is in described
When in groove, the thermally conductive sheet passes through thermally conductive slot and protrudes into the heat conducting pipe, uniformly solid in the other end of the heat conducting pipe
Surely there is cylindrical hole 9, be uniformly fixed with heating column 10, the heating column and the radiating fin one in the bottom surface of the radiating fin
Body formed, the heating column plug-in card of the radiating fin is fixed in the cylindrical hole of the heat conducting pipe.
It is coated with heat conduction silicone 11 in the thermally conductive sheet, the thermally conductive sheet is inserted into the thermally conductive slot Nei Shitong
It crosses heat conduction silicone and realizes sealing.
Thermal conductive silicon colloid 12 is filled in the heat conducting pipe.
When the bottom surface of the heat absorbing sheet is provided with chip bit-avoiding slot, and the heat absorbing sheet is fixed, the top of chip is in core
In piece bit-avoiding slot.
The structure setting of the utility model is reasonable, is not only conveniently connected and fixed, and is conducive to improve thermally conductive stability
It with the reliability of heat dissipation, occupies little space, suitable for the use in small space, strong applicability practicability is good.
Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and
It is not limitations of the embodiments of the present invention.For those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments
Exhaustion.And the obvious changes or variations that these connotations for belonging to the utility model are extended out still fall within it is practical
Novel protection scope.
Claims (4)
1. a kind of CPU heat radiation module for notebook, including heat absorbing sheet and radiating fin group, in the heat absorbing sheet and heat radiating fin
It is provided with heat conducting pipe between piece group, installation trunnion is fixed on the heat absorbing sheet, is fixed with installation on the installation trunnion
Screw hole, it is characterised in that: fixed on the heat absorbing sheet fluted, thermally conductive sheet is fixed on the inner wall of the groove, in institute
The one end for stating heat conducting pipe is fixed with the thermally conductive slot matched with the thermally conductive sheet position, and the heat conducting pipe is in the groove
When, the thermally conductive sheet passes through thermally conductive slot and protrudes into the heat conducting pipe, is uniformly fixed with circle in the other end of the heat conducting pipe
Post holes is uniformly fixed with heating column in the bottom surface of the radiating fin, and the heating column and the radiating fin are integrally formed, institute
The heating column plug-in card for stating radiating fin is fixed in the cylindrical hole of the heat conducting pipe.
2. the CPU heat radiation module according to claim 1 for notebook, it is characterised in that: in the table of the thermally conductive sheet
Bread is wrapped with heat conduction silicone, is realized and is sealed by heat conduction silicone when the thermally conductive sheet is inserted into the thermally conductive slot.
3. the CPU heat radiation module according to claim 2 for notebook, it is characterised in that: filled out in the heat conducting pipe
Filled with thermal conductive silicon colloid.
4. the CPU heat radiation module according to claim 3 for notebook, it is characterised in that: at the bottom of the heat absorbing sheet
Face is provided with chip bit-avoiding slot, and when the heat absorbing sheet is fixed, the top of chip is in chip bit-avoiding slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822008605.1U CN209433343U (en) | 2018-12-03 | 2018-12-03 | CPU heat radiation module for notebook |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822008605.1U CN209433343U (en) | 2018-12-03 | 2018-12-03 | CPU heat radiation module for notebook |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209433343U true CN209433343U (en) | 2019-09-24 |
Family
ID=67970476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822008605.1U Expired - Fee Related CN209433343U (en) | 2018-12-03 | 2018-12-03 | CPU heat radiation module for notebook |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209433343U (en) |
-
2018
- 2018-12-03 CN CN201822008605.1U patent/CN209433343U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190924 Termination date: 20191203 |