CN207650734U - A kind of active radiator structure - Google Patents
A kind of active radiator structure Download PDFInfo
- Publication number
- CN207650734U CN207650734U CN201721499781.9U CN201721499781U CN207650734U CN 207650734 U CN207650734 U CN 207650734U CN 201721499781 U CN201721499781 U CN 201721499781U CN 207650734 U CN207650734 U CN 207650734U
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- fan
- conducting resinl
- plate
- radiating fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 239000003973 paint Substances 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 4
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of active radiator structures, including：Fan, cooling plate structure, thermally conductive sheet, conducting resinl, cooling plate structure include bottom plate, top plate and radiating fin, radiating fin is arranged on bottom plate, top plate is covered on radiating fin and forms independent ventiduct with radiating fin, and fan is arranged in fan slot, and entire cooling plate structure surface is coated with insulated paint, bottom plate lower surface is equipped with conducting resinl, bottom plate is in conductive state by laser carving with conducting resinl contact position, and top plate and bottom plate are equipped with button hole, and it is in conductive state that laser carving is passed through at top plate button hole.The heat dissipation wind channel of autonomous closure is formed by radiating fin overlying lid top panel, the air-flow of fan passes through the heat dissipation wind channel not lose too many energy, good heat dissipation effect；Cooling plate structure is coated with insulated paint and has flow-guiding channel in specific position laser carving, and the electrostatic on mainboard is transferred to cabinet designated position by conducting resinl and cooling plate structure, prevents electrostatic breakdown phenomenon.
Description
Technical field
The utility model is related to radiator field more particularly to a kind of active radiator structures for mainboard.
Background technology
Mainboard north bridge refers to " north bridge chips " on mainboard, be most important group to play a leading role in board chip set
At part.North bridge chips are responsible for contacting and control memory, PCI-E data in north bridge internal transmission with CPU, provide to CPU's
Type and the branch such as dominant frequency, the front-side bus frequency of system, the type of memory and maximum capacity, AGP/PCI-E slots, ECC error correction
It holds, because the data processing amount of north bridge chips is very big, calorific value is also increasing, so north bridge chips are all covered with cooling fin
For reinforcing the heat dissipation of north bridge chips, active radiator is generally used for high-end mainboard（I.e. fan coordinates cooling fin）To give
It cools down, and Chinese patent 2010205834149 discloses a kind of " computer radiator ", and turbofan is used to be placed on heat radiating fin
The cavity of piece radiates, but its air duct leaks outside, and for the wind of fan when flowing through heat dissipation wind channel, energy loss is larger, limit it
Heat dissipation effect, turbofan are directly anchored on heat dissipation board member, and the vibrations that when fan running generates can cause equipment negatively
It influences and the oil bearing of radiator fan is at a high temperature of long-term, be very easy to damage, got over so as to cause the noise of radiator fan
Come bigger, influences user experience；Mainboard will produce electrostatic in the long-term use, if export will produce static shock not in time
Phenomenon is worn, general radiator can not electrostatic water conservancy diversion.
Utility model content
In view of the deficiencies of the prior art, the utility model provides a kind of active radiator structure.
Technical solutions of the utility model are as follows：A kind of active radiator structure, including：Fan, cooling plate structure, heat conduction
Piece, conducting resinl, it is characterised in that：The cooling plate structure includes bottom plate, top plate and radiating fin, and the radiating fin is longitudinal
It is disposed in an evenly spaced relation on bottom plate, the top plate is covered on radiating fin and is surrounded with two panels adjacent heat radiation fin and bottom plate
Independent ventiduct is formed, there are fan slots, the fan to be arranged in fan slot among the cooling plate structure, the entire heat dissipation
Harden structure surface is coated with insulated paint, and the bottom plate lower surface is equipped with conducting resinl, and the bottom plate passes through laser carving with conducting resinl contact position
In conductive state, the top plate and bottom plate are equipped with button hole, by laser carving are in conductive state at the top plate button hole, the bottom plate with
Conducting resinl is electrically connected, and the bottom plate is thermally connected with thermally conductive sheet, and the thermally conductive sheet is thermally connected with mainboard.
Specifically：The cooling plate structure is fixedly connected by spring fastener with mainboard.
Specifically：The fan is screwed on bottom plate, and the fan is additionally provided with spring pad with mainboard junction
Piece.
Specifically：The fan is radial fan.
Specifically：The entire cooling plate structure is aluminum.
Specifically：The thermally conductive sheet is arranged among bottom plate lower surface.
Specifically：The conducting resinl has two panels and is arranged in bottom plate lower surface both sides.
The beneficial effects of the utility model are：Dissipating for autonomous closure is formed by way of radiating fin overlying lid top panel
The air-flow of hot-flow flue, fan passes through the heat dissipation wind channel not lose too many energy, good heat dissipation effect；Cooling plate structure is coated with insulation
It paints and has flow-guiding channel in specific position laser carving, the electrostatic on mainboard is transferred to cabinet by conducting resinl and cooling plate structure and refers to
Positioning is set, and prevents electrostatic breakdown phenomenon；The contact surface of fan and bottom plate is lined with spring shim, prevents fan oil bearing long-term
Being in direct contact heat source causes to damage, and spring can effectively slow down influence of the fan vibrations to equipment.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the utility model exploded perspective view.
Fig. 2 is the utility model three-dimensional structure diagram.
Fig. 3 is the utility model side view.
Fig. 4 is the utility model upward view.
Wherein：1, spring fastener 2, screw 3, fan 4, independent ventiduct 5, bottom plate 6, radiating fin 7, top plate 8, conducting resinl 9,
Thermally conductive sheet 10, fan slot 11, button hole.
Specific implementation mode
The utility model is described in further detail below in conjunction with the accompanying drawings.
A kind of active radiator structure refering to fig. 1, including：Fan 3, cooling plate structure, thermally conductive sheet 9, conducting resinl 8 are special
Sign is：The cooling plate structure includes bottom plate 5, top plate 7 and radiating fin 6, and the longitudinal uniform intervals of the radiating fin 6 are set
It sets on bottom plate 5, the top plate 7 is covered on radiating fin 6 and is surrounded with two panels adjacent heat radiation fin 6 and bottom plate 5 and formed
The air-flow of independent ventiduct 4, the heat dissipation wind channel of autonomous closure, fan 3 passes through the heat dissipation wind channel not lose too many energy, heat dissipation effect
Fruit is good, and there are fan slots 10, the fan 3 to be arranged in fan slot 10 among the cooling plate structure, the entire heat sink
Body structure surface is coated with insulated paint, and 5 lower surface of the bottom plate is equipped with conducting resinl 8, and the bottom plate 5 passes through radium with 8 contact position of conducting resinl
Carving is in conductive state, and the top plate 7 and bottom plate 5 are equipped with button hole 11, and it is in conductive state that laser carving is passed through at 7 button hole 11 of the top plate,
The bottom plate 5 is electrically connected with conducting resinl 8, and the bottom plate 5 is thermally connected with thermally conductive sheet 9, and the thermally conductive sheet 9 is thermally connected with mainboard.
Cooling plate structure described in the utility model is fixedly connected by spring fastener 1 with mainboard.
Fan 3 described in the utility model is fixed on by screw 25 on bottom plate, and the fan 3 is also set with mainboard junction
There is spring shim（It does not mark）, prevent fan oil bearing direct long term contact heat source from causing to damage, and spring shim can be effective
Slow down influence of the fan vibrations to equipment.
Fan 3 described in the utility model is radial fan.
Entire cooling plate structure described in the utility model is aluminum.
Thermally conductive sheet 9 described in the utility model is arranged among 5 lower surface of bottom plate.
Conducting resinl 8 described in the utility model has two panels and is arranged in 5 lower surface both sides of bottom plate.
During practical set, first passes through screw 2 and spring shim and fan 3 is mounted on fan slot 10, then entire
Cooling plate structure is mounted on by fastener 1 on mainboard, and bottom plate 5 is thermally connected with thermally conductive sheet 9, and thermally conductive sheet 9 is thermally connected with mainboard chip,
5 lower surface both sides of bottom plate are equipped with conducting resinl 8, and it is in conductive state to be handled through laser carving in conducting resinl 8 and 5 contact position of bottom plate, is pushed up simultaneously
It is in conductive state that laser carving processing is also passed through at 7 button hole 11 of plate, and installation is complete for entire radiator structure；In practical radiation processes, mainboard
The heat of chip sends entire bottom plate 5 to by thermally conductive sheet 11, and entire bottom plate 5 delivers heat to radiating fin 6 and top again
Plate 7, radial fan 3 take away heat by independent ventiduct 4, at the same the electrostatic on mainboard also pass through conducting resinl send to it is scattered
At the button hole of hot plate structure, then cabinet designated position is transferred to by specific guiding device.
Above-mentioned accompanying drawings and embodiments are merely to illustrate the utility model, and any technical field those of ordinary skill is to it
The appropriate changes or modifications done all should be regarded as not departing from the utility model patent scope.
Claims (7)
1. a kind of active radiator structure, including：Fan, cooling plate structure, thermally conductive sheet, conducting resinl, it is characterised in that：It is described to dissipate
Hot plate structure includes bottom plate, top plate and radiating fin, and the radiating fin is longitudinally disposed in an evenly spaced relation on bottom plate, the top
Plate is covered on radiating fin and surrounds to form independent ventiduct with two panels adjacent heat radiation fin and bottom plate, the cooling plate structure
There are fan slot, the fans to be arranged in fan slot for centre, and the entire cooling plate structure surface is coated with insulated paint, the bottom
Plate lower surface is equipped with conducting resinl, and the bottom plate and conducting resinl contact position are in conductive state by laser carving, on the top plate and bottom plate
Equipped with button hole, by laser carving in conductive state at the top plate button hole, the bottom plate is electrically connected with conducting resinl, the bottom plate and heat conduction
Piece is thermally connected, and the thermally conductive sheet is thermally connected with mainboard.
2. a kind of active radiator structure according to claim 1, it is characterised in that：The cooling plate structure passes through snak link
Tool is fixedly connected with mainboard.
3. a kind of active radiator structure according to claim 1, it is characterised in that：The fan is screwed in bottom
On plate, the fan is additionally provided with spring shim with mainboard junction.
4. a kind of active radiator structure according to claim 1, it is characterised in that：The fan is radial fan.
5. a kind of active radiator structure according to claim 1, it is characterised in that：The entire cooling plate structure is aluminium
System.
6. a kind of active radiator structure according to claim 1, it is characterised in that：The thermally conductive sheet is arranged in bottom plate following table
Among face.
7. a kind of active radiator structure according to claim 1, it is characterised in that：The conducting resinl has two panels and setting exists
Bottom plate lower surface both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721499781.9U CN207650734U (en) | 2017-11-13 | 2017-11-13 | A kind of active radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721499781.9U CN207650734U (en) | 2017-11-13 | 2017-11-13 | A kind of active radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207650734U true CN207650734U (en) | 2018-07-24 |
Family
ID=62890607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721499781.9U Active CN207650734U (en) | 2017-11-13 | 2017-11-13 | A kind of active radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207650734U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110313226A (en) * | 2018-08-16 | 2019-10-08 | 深圳市大疆创新科技有限公司 | Heat dissipation assembly, heat dissipation module and unmanned aerial vehicle |
-
2017
- 2017-11-13 CN CN201721499781.9U patent/CN207650734U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110313226A (en) * | 2018-08-16 | 2019-10-08 | 深圳市大疆创新科技有限公司 | Heat dissipation assembly, heat dissipation module and unmanned aerial vehicle |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |