CN204377320U - The computer heat radiation module assembly of stacking-type printed circuit board (PCB) - Google Patents
The computer heat radiation module assembly of stacking-type printed circuit board (PCB) Download PDFInfo
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- CN204377320U CN204377320U CN201520090658.6U CN201520090658U CN204377320U CN 204377320 U CN204377320 U CN 204377320U CN 201520090658 U CN201520090658 U CN 201520090658U CN 204377320 U CN204377320 U CN 204377320U
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Abstract
The utility model proposes a kind of computer heat radiation module assembly of stacking-type printed circuit board (PCB), described computer heat radiation module assembly is installed with multiple printed circuit board (PCB) set up by stacked manner; It is characterized in that: described computer heat radiation module assembly has one open and be installed with the fin framework of this printed circuit board (PCB), and in this fin framework wherein two corresponding surfaces have the equidistant positioning supporting frame of multiple symmetry; The heat-conducting plate of at least one heat energy being able to be produced by electronic building brick on this printed circuit board (PCB) to the conduction of this fin framework and by being located at this equidistant positioning supporting frame; And two in order to by this fin lower portion and the outside cover plate intercepted; In this way, the heat energy that namely electronic building brick on this printed circuit board (PCB) produces by this heat-conducting plate by the utility model conducts to this fin framework, and utilize the fin of this fin framework to form maximum surface area to increase heat conducting and radiating area, to reach noiselessness and more fast and effeciently radiating effect.
Description
Technical field
The utility model relates to a kind of computer heat radiation structure of printed circuit board (PCB), particularly a kind of computer heat radiation structure of stacking-type printed circuit board (PCB).
Background technology
Due to, the electronic building brick in computer operationally can produce heat, therefore must install heat abstractor, and with in the scope making its working temperature remain on to allow, the too high meeting of working temperature causes its degradation even to lose efficacy.But, the assembly that the middle heating of computer is higher includes central processing unit (the central processing unit be arranged on computer main board, CPU), display adapter and hard disk (Hard Disk Drive, be called for short HDD) etc. electronic building brick or parts, it all needs synchronous heat radiation in higher efficiency can continue normal running after enabling.In order to solve the problem of heat radiation, modal mode utilizes heat transfer and thermal convection two kinds of modes to dispel the heat exactly.In heat transfer, usually above above-mentioned heat generating component, radiating fin can be installed, and in thermal convection, then be use radiator fan, or use the cooling water pipe with heat transfer and thermal convection function to reach heat radiation.Therefore, after the heat produced when the heat generating component in computer or parts is delivered to radiating fin, the mode of convection current namely can be utilized to be fallen by heat dissipation.
It is worth mentioning that, because science and technology is maked rapid progress at present, so that central processing unit (central processing unit in the past, CPU), display adapter and hard disk (Hard Disk Drive, be called for short HDD) etc. electronic building brick or parts processing speed with the processing speed of current Related product cannot compared with, and simply can a world of difference be described, also because of so, the heat that this Related product produces also has been decades of times in the past or hundreds of times more than; But, utilize the prior art that heat transfer and thermal convection mode are dispelled the heat, mainly all designed and implemented in computer outer cover; That is, the prior art is prior to after connecing above the electronic building brick such as central processing unit, hard disk or parts and establishing a radiating fin, and the recycling radiator fan running be arranged in this computer outer cover produces convection current and by the environment beyond the heat dissipation of this radiating fin to this computer outer cover.But, because the space in this computer outer cover is very limited, so that the area of dissipation that formed of this radiating fin is inevitable relatively little, and this radiating fin is still and is sealed and placed in this computer outer cover, therefore will have a strong impact on the radiating effect of its heat transfer and thermal convection; In addition, because fan is also divided into two kinds, one is tube-axial fan, and another is centrifugal fan.This tube-axial fan is guided by air-flow to enter blade, then make air-flow parallel blowout along hub central axle via the rotation of blade, and its feature is that static pressure is little, air quantity is large; This centrifugal fan is then utilize driven disc type wheel hub to be sucked by fluid, via the power rotated, air-flow is blown out along runner to external radiation along blade again, being characterized in that static pressure comes compared to axial-flow type must be high, but the noise that this centrifugal fan produces then come compared to axial-flow type must be much bigger.No matter to sum up learn, be utilize this tube-axial fan or this centrifugal fan to dispel the heat to produce convection current, all has the problem made a noise and produce, be not inconsistent consumer demand in fact.
Utility model content
Main purpose of the present utility model is the problem solving above-mentioned prior art, not only effectively can solve area of dissipation not enough and affect the problem of radiating effect, a kind of noiselessness is also provided and there is the radiator structure of larger heat conducting and radiating area, to accord with needed for consumer.
According to above-mentioned purpose, the utility model proposes a kind of computer heat radiation module assembly of stacking-type printed circuit board (PCB), described computer heat radiation module assembly is installed with multiple printed circuit board (PCB) set up by stacked manner; It is characterized in that: described computer heat radiation module assembly has one open and be installed with the fin framework of this printed circuit board (PCB), and in this fin framework wherein two corresponding surfaces have the equidistant positioning supporting frame of multiple symmetry; The heat-conducting plate of at least one heat energy being able to be produced by electronic building brick on this printed circuit board (PCB) to the conduction of this fin framework and by being located at this equidistant positioning supporting frame; And two in order to by this fin lower portion and the outside cover plate intercepted.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), is characterized in that, has a cooling water pipe between described fin framework and this cover plate.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), is characterized in that, described fin framework and this cover plate are respectively arranged with one with half cambered surface according to this cooling water pipe shape respectively and compress groove in order to the conduit mounting groove and conduit connecting this cooling water pipe.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), is characterized in that, described printed circuit board (PCB) have one must with storehouse up or the connector that is electrically connected of another this printed circuit board (PCB) of below; Described heat-conducting plate then offers at least one connector fluting providing this connector to penetrate.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), is characterized in that, described fin framework also has at least one signal connecting interface in order to transmit this printed circuit board signal; Described heat-conducting plate then offers at least one wire fluting providing the wire of this signal connecting interface to penetrate.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), is characterized in that, has at least one positioning lock firmware this heat-conducting plate must fixed between described heat-conducting plate and this equidistant positioning supporting frame.
Further, the computer heat radiation module assembly of described stacking-type printed circuit board (PCB), is characterized in that, described fin framework inner bottom part also has a conducting mount contacted with this heat-conducting plate; And have at least one in order to conduct on this printed circuit board (PCB) electronic building brick heat energy to the conduction pad of this heat-conducting plate between this heat-conducting plate and this printed circuit board (PCB).
Known by technique scheme, the beneficial effect that the utility model is reached compared to prior art essence is: the heat energy that one, electronic building brick on this printed circuit board (PCB) produces by this heat-conducting plate by the utility model conducts to this fin framework, and utilize the fin of this fin framework to form maximum surface area to increase heat conducting and radiating area, to reach noiselessness and more fast and effeciently radiating effect; Two moreover, the utility model also can to coordinate between this fin framework and this cover plate set cooling water pipe, reaches more fast and essence radiating effect effectively.
Accompanying drawing explanation
Fig. 1 is the stereoscopic schematic diagram of the utility model preferred embodiment.
Fig. 2 is the decomposing schematic representation of the utility model Fig. 1.
Fig. 3 ~ Figure 16 is sectional perspective and the floor map of the continuous action of the utility model Fig. 1 assembled inside.
Embodiment
About the computer heat radiation module assembly of stacking-type printed circuit board (PCB) described in the utility model, its preferred embodiment and detailed technology content, hereby coordinate graphic explanation as after.First, please refer to shown in Fig. 1 and Fig. 2; For stereoscopic and the decomposing schematic representation of the utility model preferred embodiment.Can know as shown in the figure and find out, described computer heat radiation module assembly 10 is installed with multiple printed circuit board (PCB) 15 set up by stacked manner; Have one open and be installed with the fin framework 11 of this printed circuit board (PCB) 15, the outer surface of this fin framework 11 is provided with multiple fin at (comprising bottom surface), and in this fin framework 11 wherein two corresponding surfaces have the equidistant positioning supporting frame 111 of multiple symmetry; At least one heat energy being able to be produced by electronic building brick on this printed circuit board (PCB) 15 is also had to conduct and heat-conducting plate 13 by being located at this equidistant positioning supporting frame 111 to this fin framework 11; Wherein, at least one positioning lock firmware 14 this heat-conducting plate 13 must fixed is had between described heat-conducting plate 13 and this equidistant positioning supporting frame 111; Moreover described fin framework 11 inner bottom part also has a conducting mount 12 contacted with this heat-conducting plate 13, conduct to this fin framework 11 bottom surface in order to by the heat energy of this heat-conducting plate 13 of bottom; And have at least one in order to conduct on this printed circuit board (PCB) 15 electronic building brick heat energy to the conduction pad 121 of this heat-conducting plate 13 between this heat-conducting plate 13 and this printed circuit board (PCB) 15; And described computer heat radiation module assembly 10 also has two in order to the cover plate 17 intercepted that this fin framework 11 is inner and outside; A cooling water pipe 16 is then had between wherein said fin framework 11 and this cover plate 17, this cooling water pipe 16 is made by high elongated, the hollow of heat conductivity, two closed metal tubes, this cooling water pipe 16 pipe is built with a little liquid, and the inwall of this cooling water pipe 16 application technology process can make it have capillary structure; After pyrotoxin is touched in the local of this cooling water pipe 16, namely reach boiling point after heated liquid in pipe and vaporize and evaporate, gas after evaporation moves towards this cooling water pipe 16 upper portion displacement, then can by tube wall by thermal release, again revert back to liquid state and be attached to tube wall, because inside pipe wall has capillary structure, now liquid then can use capillary principle to start down to reflux, and again flows back to the position close to pyrotoxin below this cooling water pipe 16 again; So namely form the cooling system of a natural circulation; In brief, this cooling water pipe 16 liquid in pipe is evaporation after vaporization, and gas starts to flow with convection type and coordinates tube wall to carry out heat conducting and radiating, condenses into liquid again after the condensation of gas after heat radiation, just can capillary mode reflux once again; Heat transfer rate due to this cooling water pipe 16 can reach hundreds of times of copper and silver, and without the noise problem that radiator fan produces, therefore can really effectively make user obtain the operating environment of peace and quiet, low temperature; In addition, described fin framework 11 and this cover plate 17 are respectively arranged with one with half cambered surface according to this cooling water pipe 16 shape respectively and compress groove 171 in order to the conduit mounting groove 113 connecting this cooling water pipe 16 with conduit; In addition, described printed circuit board (PCB) 15 have one must with storehouse up or the connector 151 that is electrically connected of another this printed circuit board (PCB) 15 of below; Described heat-conducting plate 13 then offers at least one this connector that connector 151 penetrates that provides and slots 132; And described fin framework 11 also has at least one signal connecting interface 112 in order to transmit this printed circuit board (PCB) 15 signal; Described heat-conducting plate 13 then offers at least one wire fluting 131 providing the wire of this signal connecting interface 112 to penetrate.
In order to the computer heat radiation module assembly of the utility model stacking-type printed circuit board (PCB) more can be clearly demonstrated, then please refer to shown in Fig. 3 ~ Figure 16; For sectional perspective and the floor map of the assembled inside continuous action of the utility model preferred embodiment.First, can know as shown in Figure 3 and Figure 4 and find out, in described fin framework 11, wherein two corresponding surfaces have the equidistant positioning supporting frame 111 of multiple symmetry; And this fin framework 11 inner bottom part first can arrange a conducting mount 12 contacted with this heat-conducting plate 13, equidistant positioning supporting frame 111 again above this conducting mount 12 is arranged a heat-conducting plate 13, and with multiple positioning lock firmwares 14 by fixing as shown in figs. 5 and 6 for equidistant to this heat-conducting plate 13 and this positioning supporting frame 111; Because this conducting mount 12 just can contact with this heat-conducting plate 13, therefore the heat energy of this heat-conducting plate 13 of bottom can be conducive to conduct to this fin framework 11 bottom surface; Then, after again a conduction pad 121 being set above this heat-conducting plate 13, again printed circuit board (PCB) 15 screw lock is fixed on this conduction pad 121, this conduction pad 121 can in order to conduct on this printed circuit board (PCB) 15 electronic building brick heat energy to this heat-conducting plate 13 as illustrated in figs. 7 and 8; Then, the heat-conducting plate 13 offering connector fluting 132 with another is again arranged on this equidistant positioning supporting frame 111 above this printed circuit board (PCB) 15, to make the connector 151 on this printed circuit board (PCB) 15 can penetrate by this connector fluting 132, and make the heat energy of electronic building brick above this printed circuit board (PCB) 15 can conduct to this fin framework 11 as shown in Figures 9 and 10 via this heat-conducting plate 13; Then, importantly with positioning lock firmware 14, this heat-conducting plate 13 to be fixed with this equidistant positioning supporting frame 111 equally, separately can lock erection another printed circuit board (PCB) 15 again above this heat-conducting plate 13, and utilize this connector 151 to be electrically connected as shown in Figure 11 and Figure 12 with this printed circuit board (PCB) 15 below; Same, can set up again on this printed circuit board (PCB) 15 another offer connector fluting 132 with wire slot 131 heat-conducting plate 13, this wire fluting 131 can provide the wire of this signal connecting interface 112 to penetrate this heat-conducting plate 13 to be electrically connected with this printed circuit board (PCB) 15 of below, and the heat energy that electronic building brick above this this printed circuit board (PCB) 15 is produced to this fin framework 11 side face as shown in figures 13 and 14; Similarly, fixed with this equidistant positioning supporting frame 111 with positioning lock firmware 14 this heat-conducting plate 13 by the top again, and above this heat-conducting plate 13, just admittedly can lock other printed circuit board (PCB) 15 again conducted heat energy to this fin framework that below this printed circuit board (PCB) 15, electronic building brick produces and look like shown in Figure 15 and Figure 16 in 11 weeks; After the heat energy produced by electronic building brick on each layer printed circuit board 15 when the heat-conducting plate 13 of the above each layer conducts to this fin framework 11, cooling water pipe 16 set between this fin framework 11 and this cover plate 17 just can play its function again and accelerate the radiating rate of fin on this fin framework 11; In this way, the heat energy that electronic building brick on this printed circuit board (PCB) 15 not only produces by this heat-conducting plate 13 by the utility model conducts to this fin framework 11, and utilize the fin of this fin framework 11 to form maximum surface area to increase heat conducting and radiating area, to reach noiselessness and more fast and effeciently radiating effect; The utility model also can coordinate cooling water pipe 16 set between this fin framework 11 and this cover plate 17, reaches more fast and essence radiating effect effectively.
Below the utility model is described in detail, only as described above, be only preferred embodiment of the present utility model, when can not limit the scope of the utility model enforcement with this, namely all equalizations done according to the utility model claims change and modify, and all should still belong in patent covering scope of the present utility model.
Claims (10)
1. a computer heat radiation module assembly for stacking-type printed circuit board (PCB), described computer heat radiation module assembly (10) is installed with multiple printed circuit board (PCB) (15) set up by stacked manner; It is characterized in that:
Described computer heat radiation module assembly (10) has one open and be installed with the fin framework (11) of this printed circuit board (PCB) (15), and in this fin framework (11) wherein two corresponding surfaces have the equidistant positioning supporting frame (111) of multiple symmetry; The heat-conducting plate (13) of at least one heat energy being able to be produced by upper for this printed circuit board (PCB) (15) electronic building brick to the conduction of this fin framework (11) and by being located at this equidistant positioning supporting frame (111); And two in order to the cover plate (17) intercepted that this fin framework (11) is inner and outside.
2. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 1, is characterized in that, have a cooling water pipe (16) between described fin framework (11) and this cover plate (17).
3. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 2, it is characterized in that, described fin framework (11) and this cover plate (17) are respectively arranged with one with half cambered surface according to this cooling water pipe (16) shape respectively and compress groove (171) in order to the conduit mounting groove (113) connecting this cooling water pipe (16) with conduit.
4. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 1,2 or 3, it is characterized in that, described printed circuit board (PCB) (15) have one with storehouse up or the connector (151) that is electrically connected of another this printed circuit board (PCB) (15) of below; Described heat-conducting plate (13) then offers at least one this connector connector that (151) penetrate that provides and slots (132).
5. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 1,2 or 3, it is characterized in that, described fin framework (11) also has at least one signal connecting interface (112) in order to transmit this printed circuit board (PCB) (15) signal; Described heat-conducting plate (13) then offers at least one wire fluting (131) providing the wire of this signal connecting interface (112) to penetrate.
6. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 4, it is characterized in that, described fin framework (11) also has at least one signal connecting interface (112) in order to transmit this printed circuit board (PCB) (15) signal; Described heat-conducting plate (13) then offers at least one wire fluting (131) providing the wire of this signal connecting interface (112) to penetrate.
7. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 1,2 or 3, it is characterized in that, between described heat-conducting plate (13) and this equidistant positioning supporting frame (111), have at least one positioning lock firmware (14) this heat-conducting plate (13) must fixed.
8. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 6, it is characterized in that, between described heat-conducting plate (13) and this equidistant positioning supporting frame (111), have at least one positioning lock firmware (14) this heat-conducting plate (13) must fixed.
9. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 1,2 or 3, it is characterized in that, described fin framework (11) inner bottom part also has a conducting mount (12) contacted with this heat-conducting plate (13); And have at least one in order to conduct the conduction pad (121) of the upper electronic building brick heat energy of this printed circuit board (PCB) (15) to this heat-conducting plate (13) between this heat-conducting plate (13) and this printed circuit board (PCB) (15).
10. the computer heat radiation module assembly of stacking-type printed circuit board (PCB) according to claim 8, it is characterized in that, described fin framework (11) inner bottom part also has a conducting mount (12) contacted with this heat-conducting plate (13); And have at least one in order to conduct the conduction pad (121) of the upper electronic building brick heat energy of this printed circuit board (PCB) (15) to this heat-conducting plate (13) between this heat-conducting plate (13) and this printed circuit board (PCB) (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520090658.6U CN204377320U (en) | 2015-02-09 | 2015-02-09 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520090658.6U CN204377320U (en) | 2015-02-09 | 2015-02-09 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
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| CN204377320U true CN204377320U (en) | 2015-06-03 |
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| CN201520090658.6U Expired - Fee Related CN204377320U (en) | 2015-02-09 | 2015-02-09 | The computer heat radiation module assembly of stacking-type printed circuit board (PCB) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992492A (en) * | 2015-02-09 | 2016-10-05 | 丁彥允 | Computer heat radiation module assembly of stack type printed circuit boards |
| CN107645886A (en) * | 2017-09-21 | 2018-01-30 | 中国科学院长春光学精密机械与物理研究所 | A kind of high-power high integration signal processing component structure in space |
| CN109862755A (en) * | 2019-03-08 | 2019-06-07 | 闽南理工学院 | A kind of control system in Fundamentals of Machine Design experimental real-training platform |
-
2015
- 2015-02-09 CN CN201520090658.6U patent/CN204377320U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105992492A (en) * | 2015-02-09 | 2016-10-05 | 丁彥允 | Computer heat radiation module assembly of stack type printed circuit boards |
| CN107645886A (en) * | 2017-09-21 | 2018-01-30 | 中国科学院长春光学精密机械与物理研究所 | A kind of high-power high integration signal processing component structure in space |
| CN107645886B (en) * | 2017-09-21 | 2019-05-14 | 中国科学院长春光学精密机械与物理研究所 | A kind of high-power high integration signal processing component structure in space |
| CN109862755A (en) * | 2019-03-08 | 2019-06-07 | 闽南理工学院 | A kind of control system in Fundamentals of Machine Design experimental real-training platform |
| CN109862755B (en) * | 2019-03-08 | 2020-05-26 | 闽南理工学院 | Control system in mechanical design basic experiment training platform |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20160525 Address after: Daan District, Taiwan city of Taipei China road 3 217 Lane 8 Lane 14, 7 floor Patentee after: Ding Yanyun Address before: Zhongxing Road, Xindian District, New Taipei City Chinese Taiwan 2 No. 190 2 floor Patentee before: TAIWAN BRANCH, THE BRITISH VIRGIN ISLANDS SHANGBAIWEI YUZHI CO., LTD. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150603 Termination date: 20200209 |