CN108493172A - A kind of soaking plate heat dissipating device of intelligent control - Google Patents
A kind of soaking plate heat dissipating device of intelligent control Download PDFInfo
- Publication number
- CN108493172A CN108493172A CN201810586274.1A CN201810586274A CN108493172A CN 108493172 A CN108493172 A CN 108493172A CN 201810586274 A CN201810586274 A CN 201810586274A CN 108493172 A CN108493172 A CN 108493172A
- Authority
- CN
- China
- Prior art keywords
- soaking plate
- heat
- heat dissipating
- fin body
- wind turbine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002791 soaking Methods 0.000 title claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 238000007664 blowing Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 238000001816 cooling Methods 0.000 abstract description 9
- 230000004907 flux Effects 0.000 abstract description 7
- 230000035939 shock Effects 0.000 abstract description 6
- 230000007774 longterm Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This programme can pass through the testing result of temperature sensor, and then control the rotating speed that wind turbine is dried to fin body, soaking plate contact waits for radiating electronic product, while ensure that heat dissipation effect, avoid the heat dissipation effect that wind turbine generates heat influence device because of long-term high load capacity high speed rotational operation, reduce heat to generate, and improves service life of fan.The soaking plate heat dissipating device of the intelligent control of this programme is suitable for the occasion of high heat flux density cooling requirements, and heat is quickly spread, and can effectively improve the ability of electronic component heat shock resistance.
Description
Technical field
The present invention relates to cooling electronic component technical fields, in particular to a kind of soaking plate of intelligent control
Radiator.
Background technology
As 21 century enters the portable and micromation age, people it is expected to obtain outside efficient processing speed, also uncommon
Product is hoped to become frivolous, to meet high speed, portable, the requirement of mobile working.The integrated level of electron process chip is more and more thus
Height, volume but more become smaller, and what is caused therefrom is the heat dissipation problem of high heat flux density, and the failure mode of a large amount of electronic equipments is
Due to crossing cause thermal damage.
Currently used settling mode is the combination collocation for adding fin and fan using copper sheet or heat pipe.Due to heat pipe with
Heat source-contacting surface product is limited, and the reasons such as copper sheet thermal resistance is excessive, the technology is difficult to meet demand.It is air-cooled to dissipate to ensure heat dissipation effect
The fan of hot device needs to carry out high speed rotation, but the heat that generates of prolonged high speed rotation can influence again CPU heat dissipation and
Consume excessive electricity.
Therefore, existing heat pipe or copper sheet and the heat dissipation technology of fin and fan how to be overcome to be difficult to meet radiating requirements
Defect, provide it is a kind of adaptation there is the occasion of high heat flux density cooling requirements, heat quickly to spread, electronics member device can be effectively improved
The radiator of the ability of part heat shock resistance, is a technical problem that technical personnel in the field need to solve at present.
Invention content
In view of this, the present invention provides a kind of soaking plate heat dissipating device of intelligent control, adaptation has high heat flux density to dissipate
The occasion of heat request, heat are quickly spread, and can effectively improve the ability of electronic component heat shock resistance.
To achieve the above object, the present invention provides the following technical solutions：
A kind of soaking plate heat dissipating device of intelligent control, including：
Wind turbine；
The fin body being set to below the fan outlet；
It is set to the soaking plate of the fin body bottom；
Temperature sensor for detecting the fin temperature；
It is electrically connected the controller of the temperature sensor and the wind turbine, the controller is according to the temperature sensor
Testing result controls the blowing rotating speed of the wind turbine.
Preferably, in above-mentioned soaking plate heat dissipating device, the wind turbine is fan or plasma wind turbine.
Preferably, in above-mentioned soaking plate heat dissipating device, the fin body bottom offers and the soaking plate upper surface
The fin body bottom groove of cooperation.
Preferably, in above-mentioned soaking plate heat dissipating device, the temperature sensor is fixed on the fin structure base board upper table
Face.
Preferably, in above-mentioned soaking plate heat dissipating device, the fin body is to open reeded fluting fin.
Preferably, in above-mentioned soaking plate heat dissipating device, the width of the groove notch is equal with the fin body thickness.
Preferably, in above-mentioned soaking plate heat dissipating device, the upper surface of the fin structure base board is conical surface.
Preferably, in above-mentioned soaking plate heat dissipating device, the soaking plate with the contact position that waits for heat dissipating electronic equipment
Upper setting heat-conducting silicone grease.
It can be seen via above technical scheme that this programme can be by the testing result of temperature sensor, and then control wind turbine
To fin body dry rotating speed, soaking plate contact wait for radiating electronic product, while ensure that heat dissipation effect, avoid wind turbine because
Long-term high load capacity high speed rotational operation and generating heat influences the heat dissipation effect of device, reducing heat generates, and improves wind turbine and make
Use the service life.The soaking plate heat dissipating device of the intelligent control of this programme is suitable for the occasion of high heat flux density cooling requirements, heat
Quickly diffusion, can effectively improve the ability of electronic component heat shock resistance.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the soaking plate heat dissipating device of intelligent control provided in an embodiment of the present invention；
Fig. 2 is the partial enlarged view of fin body provided in an embodiment of the present invention；
Fig. 3 is the bottom schematic view of fin body provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of fin body provided in an embodiment of the present invention and temperature sensor；
Fig. 5 is the sectional view of fin structure base board provided in an embodiment of the present invention.
In figure：1 soaking plate, 2 fin bodies, 2-1 fluting fins, 2-2 fin body bottom grooves, 2-3 fin structure base board upper tables
Face structure, 3 wind turbines, 4 controllers, 5 temperature sensors.
Specific implementation mode
Core of the invention is to provide a kind of soaking plate heat dissipating device of intelligent control, and adaptation has high heat flux density heat dissipation to want
The occasion asked, heat are quickly spread, and can effectively improve the ability of electronic component heat shock resistance.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As Figure 1-Figure 5, the defect of current radiating requirements cannot be met in order to solve the heat dissipation technologys such as existing heat pipe, this
A kind of soaking plate heat dissipating device of intelligent control of disclosure of the invention include wind turbine 3, fin body 2, soaking plate 1, temperature sensor 5 with
And controller 4.
Wherein, fin body 2 is set to below 3 air outlet of wind turbine, and wind turbine 3 is dried to fin body 2.Soaking plate 1 is set to wing
2 bottom of sheet body.Since soaking plate has the characteristics that rapid cooling, suitable for needing small size or need to quickly dissipate the electronic product of high fever.Temperature
Degree sensor 5 is electrically connected temperature sensor 5 and wind turbine 3 for detecting 2 temperature of fin body, controller 4, and controller 4 is according to temperature
The blowing rotating speed of the testing result control wind turbine 3 of sensor 5.Specifically, temperature sensor 5 is by signal wire access controller 4,
Controller 4 accesses wind turbine 3 by signal wire.
Wind turbine 3 dries to the air duct of fin body 2 in this programme, the convection velocity of enhanced fin body and air, enhancing heat dissipation
Effect, and by the testing result of temperature sensor 5, and then the rotating speed that wind turbine 3 is dried to fin body 2 is controlled, soaking plate connects
It touches and waits for that radiating electronic product carries out heat exchange, thus while ensure that heat dissipation effect, avoid wind turbine 3 because of long-term high load capacity
High speed rotational operation and generating heat influences the heat dissipation effect of device, reducing heat generates, and improves service life of fan.We
The soaking plate heat dissipating device of the intelligent control of case is suitable for the occasion of high heat flux density cooling requirements, and heat is quickly spread, can
Effectively improve the ability of electronic component heat shock resistance.
Wind turbine 3 can be fan or plasma wind turbine.Particularly, it is also equipped with while plasma wind machine has air blowing function good
Good destatics performance.
For the ease of connection setting soaking plate 1 and fin body 2,2 bottom of fin body is offered to be coordinated with 1 upper surface of soaking plate
Fin body bottom groove 2-2.The size of fin body bottom groove 2-2 is matched with depth with the size of soaking plate 1 with thickness,
Keep cooling fin bottom smooth.
Temperature sensor 5 is fixed on 2 upper surface of base plate of fin body, that is, fin body upper surface of base plate structure as shown in Figure 4
On 2-3, the temperature of fin body 2 can be preferably detected.
Preferably, fin body 2 is to open reeded fluting fin 2-1, is conducive to improve heat dissipation effect.Especially
, the width of groove notch is equal with 2 thickness of fin body, that is, 2 surface area of fin body after slotting and 2 table of fin body before fluting
Area equation can reduce the weight of fin body, and, in the case where ensureing that surface area is constant, otch can cut off gas side
The continuous development of interlayer increases the disturbance in fluid, to strengthen convection current heat transfer.
Preferably, the upper surface of 2 substrate of fin body is conical surface.Preferably, highest among conical surface, to
Surrounding continuously decreases.The structure can accelerate flowing velocity of the convected air on 2 substrate of fin body, strengthen radiating efficiency, together
When, which can increase the heat dissipation area of substrate.
Soaking plate 1 with wait for heat dissipating electronic equipment contact position on heat-conducting silicone grease is set, to generate heat electronic component
Provide splendid heat-conducting effect.Heat-conducting silicone grease is a kind of high heat conductive insulating organosilicon material, is almost never cured, can-
Fat state when keeping using for a long time at a temperature of 50 DEG C -+230 DEG C.Not only there is excellent electrical insulating property, but also have excellent lead
It is hot, while there is low freedom, high-low temperature resistant, water-fast, ozone, weather-resistant.It can be coated on various electronic products extensively,
Heater (power tube, silicon-controlled, electric heating heap etc.) in electrical equipment and cooling facilities (cooling fin, heat sink strip, shell etc.) it
Between contact surface, play heat transfer and the performances such as moisture-proof, dust-proof, anticorrosion, shockproof.
Each embodiment is described by the way of progressive in this specification, the highlights of each of the examples are with other
The difference of embodiment, just to refer each other for identical similar portion between each embodiment.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest range caused.
Claims (8)
1. a kind of soaking plate heat dissipating device of intelligent control, which is characterized in that including：
Wind turbine (3)；
The fin body (2) being set to below the wind turbine (3) air outlet；
It is set to the soaking plate (1) of the fin body (2) bottom；
Temperature sensor (5) for detecting the fin body (2) temperature；
It is electrically connected the controller (4) of the temperature sensor (5) and the wind turbine (3), the controller (4) is according to the temperature
The testing result of sensor (5) controls the blowing rotating speed of the wind turbine (3).
2. soaking plate heat dissipating device according to claim 1, which is characterized in that the wind turbine (3) is fan or plasma
Wind turbine.
3. soaking plate heat dissipating device according to claim 1, which is characterized in that fin body (2) bottom offer with
The fin body bottom groove (2-2) of soaking plate (1) the upper surface cooperation.
4. soaking plate heat dissipating device according to claim 1, which is characterized in that the temperature sensor (5) is fixed on institute
State fin body (2) upper surface of base plate.
5. according to claim 1-4 any one of them soaking plate heat dissipating devices, which is characterized in that the fin body (2) is to open
Reeded fluting fin (2-1).
6. soaking plate heat dissipating device according to claim 5, which is characterized in that the width of the groove notch and the wing
Sheet body (2) thickness is equal.
7. soaking plate heat dissipating device according to claim 1, which is characterized in that the upper surface of fin body (2) substrate
For conical surface.
8. soaking plate heat dissipating device according to claim 1, which is characterized in that the soaking plate (1) with wait for heat dissipation electricity
Heat-conducting silicone grease is set on the contact position of sub- equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810586274.1A CN108493172A (en) | 2018-06-08 | 2018-06-08 | A kind of soaking plate heat dissipating device of intelligent control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810586274.1A CN108493172A (en) | 2018-06-08 | 2018-06-08 | A kind of soaking plate heat dissipating device of intelligent control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108493172A true CN108493172A (en) | 2018-09-04 |
Family
ID=63342262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810586274.1A Pending CN108493172A (en) | 2018-06-08 | 2018-06-08 | A kind of soaking plate heat dissipating device of intelligent control |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108493172A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958813A (en) * | 2019-12-09 | 2020-04-03 | 华南理工大学 | Water-cooling and air-cooling double cooler for server and control method |
| CN111065248A (en) * | 2020-01-09 | 2020-04-24 | 芜湖宏景电子股份有限公司 | Radiating aluminum structure for enhancing radiating effect |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201503860U (en) * | 2009-07-10 | 2010-06-09 | 邹城市技工学校 | CUP heat radiator |
| CN102122647A (en) * | 2010-01-08 | 2011-07-13 | 精碳科技股份有限公司 | Carbon interface composite heat radiation structure |
| CN105407684A (en) * | 2014-07-16 | 2016-03-16 | 中车大连电力牵引研发中心有限公司 | Locomotive electrical cabinet cooling device and locomotive electrical cabinet |
| CN105571014A (en) * | 2014-11-11 | 2016-05-11 | 海信（山东）空调有限公司 | Air conditioner heat radiator and variable-frequency air conditioner |
| CN206136543U (en) * | 2016-09-05 | 2017-04-26 | 北京能高自动化技术股份有限公司 | Samming type forced air cooling radiator |
| CN208400837U (en) * | 2018-06-08 | 2019-01-18 | 广东工业大学 | A kind of soaking plate heat dissipating device of intelligent control |
-
2018
- 2018-06-08 CN CN201810586274.1A patent/CN108493172A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201503860U (en) * | 2009-07-10 | 2010-06-09 | 邹城市技工学校 | CUP heat radiator |
| CN102122647A (en) * | 2010-01-08 | 2011-07-13 | 精碳科技股份有限公司 | Carbon interface composite heat radiation structure |
| CN105407684A (en) * | 2014-07-16 | 2016-03-16 | 中车大连电力牵引研发中心有限公司 | Locomotive electrical cabinet cooling device and locomotive electrical cabinet |
| CN105571014A (en) * | 2014-11-11 | 2016-05-11 | 海信（山东）空调有限公司 | Air conditioner heat radiator and variable-frequency air conditioner |
| CN206136543U (en) * | 2016-09-05 | 2017-04-26 | 北京能高自动化技术股份有限公司 | Samming type forced air cooling radiator |
| CN208400837U (en) * | 2018-06-08 | 2019-01-18 | 广东工业大学 | A kind of soaking plate heat dissipating device of intelligent control |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110958813A (en) * | 2019-12-09 | 2020-04-03 | 华南理工大学 | Water-cooling and air-cooling double cooler for server and control method |
| CN111065248A (en) * | 2020-01-09 | 2020-04-24 | 芜湖宏景电子股份有限公司 | Radiating aluminum structure for enhancing radiating effect |
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